DE60032129D1 - Elektrisch programmierbares speicherelement mit verbesserten kontakten - Google Patents

Elektrisch programmierbares speicherelement mit verbesserten kontakten

Info

Publication number
DE60032129D1
DE60032129D1 DE60032129T DE60032129T DE60032129D1 DE 60032129 D1 DE60032129 D1 DE 60032129D1 DE 60032129 T DE60032129 T DE 60032129T DE 60032129 T DE60032129 T DE 60032129T DE 60032129 D1 DE60032129 D1 DE 60032129D1
Authority
DE
Germany
Prior art keywords
storage element
electrically programmable
programmable storage
improved contacts
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60032129T
Other languages
English (en)
Other versions
DE60032129T2 (de
Inventor
Tyler Lowrey
R Ovshinsky
C Wicker
J Klersy
Boil Pashmakov
Wolodymyr Czubatyj
Sergey Kostylev
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ovonyx Inc
Original Assignee
Ovonyx Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/276,273 external-priority patent/US6969866B1/en
Application filed by Ovonyx Inc filed Critical Ovonyx Inc
Publication of DE60032129D1 publication Critical patent/DE60032129D1/de
Application granted granted Critical
Publication of DE60032129T2 publication Critical patent/DE60032129T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B99/00Subject matter not provided for in other groups of this subclass
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • G11C11/5678Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using amorphous/crystalline phase transition storage elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/30Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/80Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
    • H10B63/82Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays the switching components having a common active material layer
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011Manufacture or treatment of multistable switching devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011Manufacture or treatment of multistable switching devices
    • H10N70/061Shaping switching materials
    • H10N70/063Shaping switching materials by etching of pre-deposited switching material layers, e.g. lithography
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/231Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/826Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/841Electrodes
    • H10N70/8413Electrodes adapted for resistive heating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828Tellurides, e.g. GeSbTe
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0004Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Semiconductor Memories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
DE60032129T 1999-03-25 2000-03-22 Elektrisch programmierbares speicherelement mit verbesserten kontakten Expired - Fee Related DE60032129T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/276,273 US6969866B1 (en) 1997-10-01 1999-03-25 Electrically programmable memory element with improved contacts
US276273 1999-03-25
PCT/US2000/007666 WO2000057498A1 (en) 1999-03-25 2000-03-22 Electrically programmable memory element with improved contacts

Publications (2)

Publication Number Publication Date
DE60032129D1 true DE60032129D1 (de) 2007-01-11
DE60032129T2 DE60032129T2 (de) 2007-09-27

Family

ID=23055972

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60032129T Expired - Fee Related DE60032129T2 (de) 1999-03-25 2000-03-22 Elektrisch programmierbares speicherelement mit verbesserten kontakten

Country Status (13)

Country Link
US (2) US6815705B2 (de)
EP (2) EP1760797A1 (de)
JP (1) JP4558950B2 (de)
KR (1) KR100441692B1 (de)
CN (1) CN1210819C (de)
AU (1) AU3769900A (de)
BR (1) BR0009308A (de)
CA (1) CA2367365A1 (de)
DE (1) DE60032129T2 (de)
MX (1) MXPA01009609A (de)
NO (1) NO20014633D0 (de)
TW (1) TW475262B (de)
WO (1) WO2000057498A1 (de)

Families Citing this family (179)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7935951B2 (en) * 1996-10-28 2011-05-03 Ovonyx, Inc. Composite chalcogenide materials and devices
WO2000057498A1 (en) * 1999-03-25 2000-09-28 Energy Conversion Devices, Inc. Electrically programmable memory element with improved contacts
US7247876B2 (en) * 2000-06-30 2007-07-24 Intel Corporation Three dimensional programmable device and method for fabricating the same
US6563156B2 (en) 2001-03-15 2003-05-13 Micron Technology, Inc. Memory elements and methods for making same
US6440837B1 (en) * 2000-07-14 2002-08-27 Micron Technology, Inc. Method of forming a contact structure in a semiconductor device
US6696355B2 (en) * 2000-12-14 2004-02-24 Ovonyx, Inc. Method to selectively increase the top resistance of the lower programming electrode in a phase-change memory
US6433310B1 (en) * 2001-01-31 2002-08-13 International Business Machines Corporation Assembly suitable for reading/writing/erasing information on a media based on thermal coupling
US6514788B2 (en) * 2001-05-29 2003-02-04 Bae Systems Information And Electronic Systems Integration Inc. Method for manufacturing contacts for a Chalcogenide memory device
US7365354B2 (en) * 2001-06-26 2008-04-29 Ovonyx, Inc. Programmable resistance memory element and method for making same
US6764894B2 (en) * 2001-08-31 2004-07-20 Ovonyx, Inc. Elevated pore phase-change memory
US6545287B2 (en) * 2001-09-07 2003-04-08 Intel Corporation Using selective deposition to form phase-change memory cells
US7319057B2 (en) * 2001-10-30 2008-01-15 Ovonyx, Inc. Phase change material memory device
EP1318552A1 (de) * 2001-12-05 2003-06-11 STMicroelectronics S.r.l. Kleinflächige Kontaktzone, hocheffizientes Phasenwechsel-Speicherelement und dessen Verfahren zur Herstellung
CN1311553C (zh) * 2001-12-12 2007-04-18 松下电器产业株式会社 非易失性存储器及其制造方法
US6512241B1 (en) * 2001-12-31 2003-01-28 Intel Corporation Phase change material memory device
US7116593B2 (en) * 2002-02-01 2006-10-03 Hitachi, Ltd. Storage device
DE60220015T2 (de) * 2002-02-20 2008-01-10 Stmicroelectronics S.R.L., Agrate Brianza Kontaktstruktur, Phasenwechsel-Speicherzelle und deren Herstellungsverfahren mit Elimination von Doppelkontakten
US6972430B2 (en) 2002-02-20 2005-12-06 Stmicroelectronics S.R.L. Sublithographic contact structure, phase change memory cell with optimized heater shape, and manufacturing method thereof
US6891747B2 (en) 2002-02-20 2005-05-10 Stmicroelectronics S.R.L. Phase change memory cell and manufacturing method thereof using minitrenches
US6930913B2 (en) 2002-02-20 2005-08-16 Stmicroelectronics S.R.L. Contact structure, phase change memory cell, and manufacturing method thereof with elimination of double contacts
DE60226839D1 (de) * 2002-02-20 2008-07-10 St Microelectronics Srl Phasenwechsel-Speicherzelle sowie deren Herstellungsverfahren mittels Minigräben
DE60222373T2 (de) * 2002-02-20 2008-06-12 Stmicroelectronics S.R.L., Agrate Brianza Sublithographische Kontaktstruktur, Phasenwechsel-Speicherzelle mit optimierter Heizstruktur sowie deren Herstellungsverfahren
WO2003085741A1 (fr) * 2002-04-10 2003-10-16 Matsushita Electric Industrial Co., Ltd. Bascule bistable non volatile
KR100437457B1 (ko) * 2002-04-11 2004-06-23 삼성전자주식회사 보이드를 갖는 상변환 기억 셀들 및 그 제조방법들
US6717234B2 (en) * 2002-05-01 2004-04-06 Hewlett-Packard Development Company, L.P. Resistive memory for data storage devices
US6846683B2 (en) * 2002-05-10 2005-01-25 Infineon Technologies Ag Method of forming surface-smoothing layer for semiconductor devices with magnetic material layers
DE10236439B3 (de) * 2002-08-08 2004-02-26 Infineon Technologies Ag Speicher-Anordnung, Verfahren zum Betreiben einer Speicher-Anordnung und Verfahren zum Herstellen einer Speicher-Anordnung
US6583003B1 (en) * 2002-09-26 2003-06-24 Sharp Laboratories Of America, Inc. Method of fabricating 1T1R resistive memory array
JP4928045B2 (ja) * 2002-10-31 2012-05-09 大日本印刷株式会社 相変化型メモリ素子およびその製造方法
JP4509467B2 (ja) 2002-11-08 2010-07-21 シャープ株式会社 不揮発可変抵抗素子、及び記憶装置
DE10255117A1 (de) * 2002-11-26 2004-06-17 Infineon Technologies Ag Halbleiterspeichereinrichtung sowie Verfahren zu deren Herstellung
US6867425B2 (en) 2002-12-13 2005-03-15 Intel Corporation Lateral phase change memory and method therefor
DE60335208D1 (de) 2002-12-19 2011-01-13 Nxp Bv Elektrisches bauelement mit einer schicht aus phasenwechsel-material und verfahren zur seiner herstellung
CN100521277C (zh) * 2002-12-19 2009-07-29 Nxp股份有限公司 包含相变材料的电器件
USRE48202E1 (en) 2002-12-19 2020-09-08 Iii Holdings 6, Llc Electric device comprising phase change material
DE60312040T2 (de) * 2002-12-19 2007-12-13 Koninklijke Philips Electronics N.V. Elektrische vorrichtung mit phasenwechselmaterial und parallelheizung
EP1439583B1 (de) 2003-01-15 2013-04-10 STMicroelectronics Srl Sub-lithographische Kontaktstruktur, insbesondere für ein Phasenwechsel-Speicherelement, und deren Herstellungsverfahren
US7129560B2 (en) * 2003-03-31 2006-10-31 International Business Machines Corporation Thermal memory cell and memory device including the thermal memory cell
DE60328960D1 (de) * 2003-04-16 2009-10-08 St Microelectronics Srl Selbstausrichtendes Verfahren zur Herstellung einer Phasenwechsel-Speicherzelle und dadurch hergestellte Phasenwechsel-Speicherzelle
EP1475840B1 (de) * 2003-05-07 2006-07-19 STMicroelectronics S.r.l. Verfahren zur Herstellung einer elektrischen Speichereinrichtung mit Auswahltransistoren für Speicherelemente sowie entsprechend hergestellte Speichereinrichtung
JP4634014B2 (ja) 2003-05-22 2011-02-16 株式会社日立製作所 半導体記憶装置
KR100979710B1 (ko) * 2003-05-23 2010-09-02 삼성전자주식회사 반도체 메모리 소자 및 제조방법
TWI365914B (en) * 2003-07-03 2012-06-11 Mitsubishi Materials Corp Phase change recording film having high electrical resistance and sputtering target for forming phase change recording film
US7308067B2 (en) * 2003-08-04 2007-12-11 Intel Corporation Read bias scheme for phase change memories
US20050032269A1 (en) * 2003-08-04 2005-02-10 Daniel Xu Forming planarized semiconductor structures
EP1505656B1 (de) 2003-08-05 2007-01-03 STMicroelectronics S.r.l. Verfahren zur Herstellung einer Anordnung von Phasenwechselspeichern in Kupfer-Damaszenertechnologie sowie entsprechend hergestellte Anordnungen von Phasenwechselspeichern
DE10340405B3 (de) * 2003-09-02 2004-12-23 Infineon Technologies Ag Integrierter Halbleiterspeicher
US6906359B2 (en) * 2003-10-22 2005-06-14 Skyworks Solutions, Inc. BiFET including a FET having increased linearity and manufacturability
DE20321085U1 (de) * 2003-10-23 2005-12-29 Commissariat à l'Energie Atomique Phasenwechselspeicher, Phasenwechselspeicheranordnung, Phasenwechselspeicherzelle, 2D-Phasenwechselspeicherzellen-Array, 3D-Phasenwechselspeicherzellen-Array und Elektronikbaustein
JP2005183557A (ja) * 2003-12-18 2005-07-07 Canon Inc 半導体集積回路とその動作方法、該回路を備えたicカード
DE102004011430B4 (de) * 2004-03-09 2008-06-19 Qimonda Ag Halbleiterspeichereinrichtung
DE102004015899B4 (de) * 2004-03-31 2009-01-02 Qimonda Ag Herstellungsverfahren für ein PCM-Speicherelement
KR101029339B1 (ko) 2004-05-14 2011-04-13 르네사스 일렉트로닉스 가부시키가이샤 반도체 기억장치
WO2005117118A1 (ja) 2004-05-25 2005-12-08 Renesas Technology Corp. 半導体装置
KR100668825B1 (ko) * 2004-06-30 2007-01-16 주식회사 하이닉스반도체 상변화 기억 소자 및 그 제조방법
KR100626381B1 (ko) * 2004-07-19 2006-09-20 삼성전자주식회사 상변화 기억 소자 및 그 형성 방법
KR100655796B1 (ko) * 2004-08-17 2006-12-11 삼성전자주식회사 상변화 메모리 장치 및 그 제조 방법
KR100623181B1 (ko) * 2004-08-23 2006-09-19 삼성전자주식회사 상변화 메모리 장치 및 이의 제조 방법
KR100626388B1 (ko) * 2004-10-19 2006-09-20 삼성전자주식회사 상변환 메모리 소자 및 그 형성 방법
JP2008518373A (ja) 2004-10-21 2008-05-29 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 相変化メモリセルを有する集積回路および相変化メモリセルのアドレス指定方法
US7135727B2 (en) * 2004-11-10 2006-11-14 Macronix International Co., Ltd. I-shaped and L-shaped contact structures and their fabrication methods
KR100827653B1 (ko) * 2004-12-06 2008-05-07 삼성전자주식회사 상변화 기억 셀들 및 그 제조방법들
EP1677357A1 (de) * 2004-12-30 2006-07-05 STMicroelectronics S.r.l. Phasenübergangsspeichereinrichtung mit einer Haftschicht und Herstellungsverfahren dafür
EP1677371A1 (de) * 2004-12-30 2006-07-05 STMicroelectronics S.r.l. Zweiteiliger Widerstandsheizer für Phasenwechselspeicher und Herstellungsmethode
US20080277642A1 (en) * 2005-01-25 2008-11-13 Nxp B.V. Fabrication of Phase-Change Resistor Using a Backend Process
US7214958B2 (en) * 2005-02-10 2007-05-08 Infineon Technologies Ag Phase change memory cell with high read margin at low power operation
US7348590B2 (en) * 2005-02-10 2008-03-25 Infineon Technologies Ag Phase change memory cell with high read margin at low power operation
US7361925B2 (en) * 2005-02-10 2008-04-22 Infineon Technologies Ag Integrated circuit having a memory including a low-k dielectric material for thermal isolation
US8022382B2 (en) * 2005-03-11 2011-09-20 Taiwan Semiconductor Manufacturing Company, Ltd. Phase change memory devices with reduced programming current
EP1710850B1 (de) 2005-04-08 2010-01-06 STMicroelectronics S.r.l. Lateraler Phasenwechselspeicher
KR100645064B1 (ko) * 2005-05-23 2006-11-10 삼성전자주식회사 금속 산화물 저항 기억소자 및 그 제조방법
US7786460B2 (en) 2005-11-15 2010-08-31 Macronix International Co., Ltd. Phase change memory device and manufacturing method
US7394088B2 (en) 2005-11-15 2008-07-01 Macronix International Co., Ltd. Thermally contained/insulated phase change memory device and method (combined)
US7635855B2 (en) * 2005-11-15 2009-12-22 Macronix International Co., Ltd. I-shaped phase change memory cell
US7449710B2 (en) 2005-11-21 2008-11-11 Macronix International Co., Ltd. Vacuum jacket for phase change memory element
JP4860249B2 (ja) * 2005-11-26 2012-01-25 エルピーダメモリ株式会社 相変化メモリ装置および相変化メモリ装置の製造方法
JP4860248B2 (ja) * 2005-11-26 2012-01-25 エルピーダメモリ株式会社 相変化メモリ装置および相変化メモリ装置の製造方法
US7688619B2 (en) 2005-11-28 2010-03-30 Macronix International Co., Ltd. Phase change memory cell and manufacturing method
US7459717B2 (en) 2005-11-28 2008-12-02 Macronix International Co., Ltd. Phase change memory cell and manufacturing method
TWI291745B (en) * 2005-11-30 2007-12-21 Ind Tech Res Inst Lateral phase change memory with spacer electrodes and method of manufacturing the same
US7606056B2 (en) 2005-12-22 2009-10-20 Stmicroelectronics S.R.L. Process for manufacturing a phase change memory array in Cu-damascene technology and phase change memory array thereby manufactured
US7531825B2 (en) 2005-12-27 2009-05-12 Macronix International Co., Ltd. Method for forming self-aligned thermal isolation cell for a variable resistance memory array
US8062833B2 (en) 2005-12-30 2011-11-22 Macronix International Co., Ltd. Chalcogenide layer etching method
US7741636B2 (en) 2006-01-09 2010-06-22 Macronix International Co., Ltd. Programmable resistive RAM and manufacturing method
US7560337B2 (en) 2006-01-09 2009-07-14 Macronix International Co., Ltd. Programmable resistive RAM and manufacturing method
US7714315B2 (en) * 2006-02-07 2010-05-11 Qimonda North America Corp. Thermal isolation of phase change memory cells
JP4691454B2 (ja) * 2006-02-25 2011-06-01 エルピーダメモリ株式会社 相変化メモリ装置およびその製造方法
US7910907B2 (en) * 2006-03-15 2011-03-22 Macronix International Co., Ltd. Manufacturing method for pipe-shaped electrode phase change memory
US20070252127A1 (en) * 2006-03-30 2007-11-01 Arnold John C Phase change memory element with a peripheral connection to a thin film electrode and method of manufacture thereof
JP4437297B2 (ja) 2006-06-22 2010-03-24 エルピーダメモリ株式会社 半導体記憶装置及び半導体記憶装置の製造方法
US7785920B2 (en) 2006-07-12 2010-08-31 Macronix International Co., Ltd. Method for making a pillar-type phase change memory element
US20080019257A1 (en) * 2006-07-18 2008-01-24 Jan Boris Philipp Integrated circuit with resistivity changing material having a step-like programming characteristitic
WO2008021912A2 (en) * 2006-08-08 2008-02-21 Nantero, Inc. Nonvolatile resistive memories, latch circuits, and operation circuits having scalable two-terminal nanotube switches
JP4257352B2 (ja) * 2006-08-22 2009-04-22 エルピーダメモリ株式会社 半導体記憶装置及び半導体記憶装置の製造方法
US7504653B2 (en) 2006-10-04 2009-03-17 Macronix International Co., Ltd. Memory cell device with circumferentially-extending memory element
US7863655B2 (en) 2006-10-24 2011-01-04 Macronix International Co., Ltd. Phase change memory cells with dual access devices
US7541609B2 (en) * 2006-11-17 2009-06-02 International Business Machines Corporation Phase change memory cell having a sidewall contact
US20080137400A1 (en) * 2006-12-06 2008-06-12 Macronix International Co., Ltd. Phase Change Memory Cell with Thermal Barrier and Method for Fabricating the Same
US7476587B2 (en) 2006-12-06 2009-01-13 Macronix International Co., Ltd. Method for making a self-converged memory material element for memory cell
US7903447B2 (en) 2006-12-13 2011-03-08 Macronix International Co., Ltd. Method, apparatus and computer program product for read before programming process on programmable resistive memory cell
US8188569B2 (en) * 2006-12-15 2012-05-29 Qimonda Ag Phase change random access memory device with transistor, and method for fabricating a memory device
US7718989B2 (en) * 2006-12-28 2010-05-18 Macronix International Co., Ltd. Resistor random access memory cell device
TW200832771A (en) * 2007-01-25 2008-08-01 Ind Tech Res Inst Phase change memory device and method of fabricating the same
CN101257084B (zh) * 2007-02-26 2014-05-14 茂德科技股份有限公司 相变化存储器及其制造方法
US7956344B2 (en) 2007-02-27 2011-06-07 Macronix International Co., Ltd. Memory cell with memory element contacting ring-shaped upper end of bottom electrode
US7786461B2 (en) 2007-04-03 2010-08-31 Macronix International Co., Ltd. Memory structure with reduced-size memory element between memory material portions
US7745231B2 (en) 2007-04-17 2010-06-29 Micron Technology, Inc. Resistive memory cell fabrication methods and devices
US8237149B2 (en) 2007-06-18 2012-08-07 Samsung Electronics Co., Ltd. Non-volatile memory device having bottom electrode
KR100911473B1 (ko) 2007-06-18 2009-08-11 삼성전자주식회사 상변화 메모리 유닛, 이의 제조 방법, 이를 포함하는상변화 메모리 장치 및 그 제조 방법
US7729161B2 (en) * 2007-08-02 2010-06-01 Macronix International Co., Ltd. Phase change memory with dual word lines and source lines and method of operating same
US7906772B2 (en) * 2007-09-04 2011-03-15 Ovonyx, Inc. Memory device
US7919766B2 (en) 2007-10-22 2011-04-05 Macronix International Co., Ltd. Method for making self aligning pillar memory cell device
US7804083B2 (en) * 2007-11-14 2010-09-28 Macronix International Co., Ltd. Phase change memory cell including a thermal protect bottom electrode and manufacturing methods
US8426838B2 (en) * 2008-01-25 2013-04-23 Higgs Opl. Capital Llc Phase-change memory
US8084842B2 (en) 2008-03-25 2011-12-27 Macronix International Co., Ltd. Thermally stabilized electrode structure
US8030634B2 (en) 2008-03-31 2011-10-04 Macronix International Co., Ltd. Memory array with diode driver and method for fabricating the same
US7825398B2 (en) 2008-04-07 2010-11-02 Macronix International Co., Ltd. Memory cell having improved mechanical stability
US7791057B2 (en) 2008-04-22 2010-09-07 Macronix International Co., Ltd. Memory cell having a buried phase change region and method for fabricating the same
US8077505B2 (en) 2008-05-07 2011-12-13 Macronix International Co., Ltd. Bipolar switching of phase change device
US7701750B2 (en) 2008-05-08 2010-04-20 Macronix International Co., Ltd. Phase change device having two or more substantial amorphous regions in high resistance state
JP2008252112A (ja) * 2008-05-15 2008-10-16 Renesas Technology Corp 不揮発性半導体記憶装置および不揮発性メモリセル
US8415651B2 (en) 2008-06-12 2013-04-09 Macronix International Co., Ltd. Phase change memory cell having top and bottom sidewall contacts
US8134857B2 (en) 2008-06-27 2012-03-13 Macronix International Co., Ltd. Methods for high speed reading operation of phase change memory and device employing same
US7932506B2 (en) 2008-07-22 2011-04-26 Macronix International Co., Ltd. Fully self-aligned pore-type memory cell having diode access device
US9263126B1 (en) 2010-09-01 2016-02-16 Nantero Inc. Method for dynamically accessing and programming resistive change element arrays
US7903457B2 (en) 2008-08-19 2011-03-08 Macronix International Co., Ltd. Multiple phase change materials in an integrated circuit for system on a chip application
CN101661992B (zh) * 2008-08-29 2014-05-28 中国科学院上海微系统与信息技术研究所 相变存储单元器件的复合电极结构
US7719913B2 (en) 2008-09-12 2010-05-18 Macronix International Co., Ltd. Sensing circuit for PCRAM applications
US8324605B2 (en) 2008-10-02 2012-12-04 Macronix International Co., Ltd. Dielectric mesh isolated phase change structure for phase change memory
US7897954B2 (en) 2008-10-10 2011-03-01 Macronix International Co., Ltd. Dielectric-sandwiched pillar memory device
US8036014B2 (en) * 2008-11-06 2011-10-11 Macronix International Co., Ltd. Phase change memory program method without over-reset
US8604457B2 (en) * 2008-11-12 2013-12-10 Higgs Opl. Capital Llc Phase-change memory element
US7869270B2 (en) 2008-12-29 2011-01-11 Macronix International Co., Ltd. Set algorithm for phase change memory cell
US8089137B2 (en) 2009-01-07 2012-01-03 Macronix International Co., Ltd. Integrated circuit memory with single crystal silicon on silicide driver and manufacturing method
US8107283B2 (en) 2009-01-12 2012-01-31 Macronix International Co., Ltd. Method for setting PCRAM devices
US8030635B2 (en) 2009-01-13 2011-10-04 Macronix International Co., Ltd. Polysilicon plug bipolar transistor for phase change memory
US8064247B2 (en) * 2009-01-14 2011-11-22 Macronix International Co., Ltd. Rewritable memory device based on segregation/re-absorption
US8933536B2 (en) 2009-01-22 2015-01-13 Macronix International Co., Ltd. Polysilicon pillar bipolar transistor with self-aligned memory element
US8084760B2 (en) 2009-04-20 2011-12-27 Macronix International Co., Ltd. Ring-shaped electrode and manufacturing method for same
US8173987B2 (en) 2009-04-27 2012-05-08 Macronix International Co., Ltd. Integrated circuit 3D phase change memory array and manufacturing method
US8097871B2 (en) 2009-04-30 2012-01-17 Macronix International Co., Ltd. Low operational current phase change memory structures
US7933139B2 (en) 2009-05-15 2011-04-26 Macronix International Co., Ltd. One-transistor, one-resistor, one-capacitor phase change memory
US7968876B2 (en) 2009-05-22 2011-06-28 Macronix International Co., Ltd. Phase change memory cell having vertical channel access transistor
US8350316B2 (en) * 2009-05-22 2013-01-08 Macronix International Co., Ltd. Phase change memory cells having vertical channel access transistor and memory plane
US8809829B2 (en) * 2009-06-15 2014-08-19 Macronix International Co., Ltd. Phase change memory having stabilized microstructure and manufacturing method
US8406033B2 (en) * 2009-06-22 2013-03-26 Macronix International Co., Ltd. Memory device and method for sensing and fixing margin cells
US8238149B2 (en) * 2009-06-25 2012-08-07 Macronix International Co., Ltd. Methods and apparatus for reducing defect bits in phase change memory
US8363463B2 (en) * 2009-06-25 2013-01-29 Macronix International Co., Ltd. Phase change memory having one or more non-constant doping profiles
US7894254B2 (en) * 2009-07-15 2011-02-22 Macronix International Co., Ltd. Refresh circuitry for phase change memory
US8110822B2 (en) * 2009-07-15 2012-02-07 Macronix International Co., Ltd. Thermal protect PCRAM structure and methods for making
US8198619B2 (en) 2009-07-15 2012-06-12 Macronix International Co., Ltd. Phase change memory cell structure
US20110049456A1 (en) * 2009-09-03 2011-03-03 Macronix International Co., Ltd. Phase change structure with composite doping for phase change memory
US8064248B2 (en) * 2009-09-17 2011-11-22 Macronix International Co., Ltd. 2T2R-1T1R mix mode phase change memory array
US8178387B2 (en) * 2009-10-23 2012-05-15 Macronix International Co., Ltd. Methods for reducing recrystallization time for a phase change material
US8729521B2 (en) 2010-05-12 2014-05-20 Macronix International Co., Ltd. Self aligned fin-type programmable memory cell
US8310864B2 (en) 2010-06-15 2012-11-13 Macronix International Co., Ltd. Self-aligned bit line under word line memory array
US10249379B2 (en) * 2010-08-20 2019-04-02 Attopsemi Technology Co., Ltd One-time programmable devices having program selector for electrical fuses with extended area
US8395935B2 (en) 2010-10-06 2013-03-12 Macronix International Co., Ltd. Cross-point self-aligned reduced cell size phase change memory
US8497705B2 (en) 2010-11-09 2013-07-30 Macronix International Co., Ltd. Phase change device for interconnection of programmable logic device
US8467238B2 (en) 2010-11-15 2013-06-18 Macronix International Co., Ltd. Dynamic pulse operation for phase change memory
US8486743B2 (en) 2011-03-23 2013-07-16 Micron Technology, Inc. Methods of forming memory cells
US8994489B2 (en) 2011-10-19 2015-03-31 Micron Technology, Inc. Fuses, and methods of forming and using fuses
US8723155B2 (en) 2011-11-17 2014-05-13 Micron Technology, Inc. Memory cells and integrated devices
US9252188B2 (en) 2011-11-17 2016-02-02 Micron Technology, Inc. Methods of forming memory cells
US8987700B2 (en) 2011-12-02 2015-03-24 Macronix International Co., Ltd. Thermally confined electrode for programmable resistance memory
US9136467B2 (en) 2012-04-30 2015-09-15 Micron Technology, Inc. Phase change memory cells and methods of forming phase change memory cells
US8765555B2 (en) 2012-04-30 2014-07-01 Micron Technology, Inc. Phase change memory cells and methods of forming phase change memory cells
US8890105B2 (en) * 2012-08-29 2014-11-18 Kabushiki Kaisha Toshiba Nonvolatile memory
US20140117302A1 (en) * 2012-11-01 2014-05-01 Micron Technology, Inc. Phase Change Memory Cells, Methods Of Forming Phase Change Memory Cells, And Methods Of Forming Heater Material For Phase Change Memory Cells
US9553262B2 (en) 2013-02-07 2017-01-24 Micron Technology, Inc. Arrays of memory cells and methods of forming an array of memory cells
CN103500795B (zh) * 2013-09-30 2015-07-22 上海新安纳电子科技有限公司 一种相变存储器电极结构的制备方法
TWI549229B (zh) 2014-01-24 2016-09-11 旺宏電子股份有限公司 應用於系統單晶片之記憶體裝置內的多相變化材料
JP2015185792A (ja) * 2014-03-26 2015-10-22 セイコーエプソン株式会社 配線構造及びその製造方法
US9881971B2 (en) 2014-04-01 2018-01-30 Micron Technology, Inc. Memory arrays
US9559113B2 (en) 2014-05-01 2017-01-31 Macronix International Co., Ltd. SSL/GSL gate oxide in 3D vertical channel NAND
US9362494B2 (en) 2014-06-02 2016-06-07 Micron Technology, Inc. Array of cross point memory cells and methods of forming an array of cross point memory cells
US9343506B2 (en) 2014-06-04 2016-05-17 Micron Technology, Inc. Memory arrays with polygonal memory cells having specific sidewall orientations
US9672906B2 (en) 2015-06-19 2017-06-06 Macronix International Co., Ltd. Phase change memory with inter-granular switching
US11711989B2 (en) 2021-03-23 2023-07-25 International Business Machines Corporation Phase change memory

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5414271A (en) * 1991-01-18 1995-05-09 Energy Conversion Devices, Inc. Electrically erasable memory elements having improved set resistance stability
US5714768A (en) * 1995-10-24 1998-02-03 Energy Conversion Devices, Inc. Second-layer phase change memory array on top of a logic device
US5683930A (en) * 1995-12-06 1997-11-04 Micron Technology Inc. SRAM cell employing substantially vertically elongated pull-up resistors and methods of making, and resistor constructions and methods of making
US5687112A (en) * 1996-04-19 1997-11-11 Energy Conversion Devices, Inc. Multibit single cell memory element having tapered contact
US5814527A (en) * 1996-07-22 1998-09-29 Micron Technology, Inc. Method of making small pores defined by a disposable internal spacer for use in chalcogenide memories
US5998244A (en) * 1996-08-22 1999-12-07 Micron Technology, Inc. Memory cell incorporating a chalcogenide element and method of making same
US6147395A (en) * 1996-10-02 2000-11-14 Micron Technology, Inc. Method for fabricating a small area of contact between electrodes
JPH10125865A (ja) * 1996-10-15 1998-05-15 Fujitsu Ltd 半導体装置、半導体記憶装置、およびその製造方法
US5952671A (en) * 1997-05-09 1999-09-14 Micron Technology, Inc. Small electrode for a chalcogenide switching device and method for fabricating same
US6031287A (en) * 1997-06-18 2000-02-29 Micron Technology, Inc. Contact structure and memory element incorporating the same
US5933365A (en) * 1997-06-19 1999-08-03 Energy Conversion Devices, Inc. Memory element with energy control mechanism
WO2000057498A1 (en) * 1999-03-25 2000-09-28 Energy Conversion Devices, Inc. Electrically programmable memory element with improved contacts

Also Published As

Publication number Publication date
US20050062132A1 (en) 2005-03-24
EP1760797A1 (de) 2007-03-07
KR20020007341A (ko) 2002-01-26
JP2002540605A (ja) 2002-11-26
AU3769900A (en) 2000-10-09
JP4558950B2 (ja) 2010-10-06
EP1171920B1 (de) 2006-11-29
US20020017701A1 (en) 2002-02-14
CN1210819C (zh) 2005-07-13
MXPA01009609A (es) 2002-07-02
EP1171920A1 (de) 2002-01-16
BR0009308A (pt) 2001-12-18
EP1171920A4 (de) 2005-10-19
US6815705B2 (en) 2004-11-09
DE60032129T2 (de) 2007-09-27
WO2000057498A1 (en) 2000-09-28
NO20014633D0 (no) 2001-09-24
US7253429B2 (en) 2007-08-07
TW475262B (en) 2002-02-01
KR100441692B1 (ko) 2004-07-27
CA2367365A1 (en) 2000-09-28
CN1352808A (zh) 2002-06-05

Similar Documents

Publication Publication Date Title
DE60032129D1 (de) Elektrisch programmierbares speicherelement mit verbesserten kontakten
DE60110297D1 (de) Speichervorrichtung mit elektrisch programmierbaren Sicherungen
DE60121114D1 (de) Batterieklemme mit Stromsensor
DE59915200D1 (de) Elektrisch programmierbare, nichtflüchtige Speicherzellenanordnung
DE50013299D1 (de) Piezoaktor mit verbesserten elektrodenanschlüssen
DE60034247D1 (de) Elektrisch leitfähige filterpatrone
DE60108050D1 (de) Batterieklemme mit Stromsensor
DE50001167D1 (de) Strombegrenzende kontaktanordnung
DE60016477D1 (de) Schaltungsanordnung mit Schwachstromdetektion
DE69933038D1 (de) Leitfähiger kontakt
DE60030078D1 (de) Leistungsschutzschalter mit Drehkontaktanordnung
DE60045279D1 (de) Koaxialstecker mit schalter
DE60044839D1 (de) Schutzschalter mit programmierbarem Verstärker
DE69909973D1 (de) Kontakttoaster mit unbegrenzter regelung
DE60012678D1 (de) Elektrisches Kontaktelement
DE69509581T2 (de) Elektrisch programmierbare Speicherzelle
DE59808504D1 (de) Elektrisches Kontaktelement
DE69823982D1 (de) Monolithisch integrierter Umschalter für elektrisch programmierbare Speicherzellenvorrichtungen
DE59807185D1 (de) Elektrisches Kontaktelement
DE29806869U1 (de) Elektrisches Anschlußelement
DE29902455U1 (de) Elektrisch isolierte Umschaltratsche
JP2000150263A5 (ja) 接触子
DE50000596D1 (de) Elektro-Speicherheizgerät
DE60041033D1 (de) Elektrisch leitendes element
DE29818571U1 (de) Kontaktelement

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee