DE3850807D1 - Schutzsystem für CMOS-integrierte Schaltungen. - Google Patents

Schutzsystem für CMOS-integrierte Schaltungen.

Info

Publication number
DE3850807D1
DE3850807D1 DE3850807T DE3850807T DE3850807D1 DE 3850807 D1 DE3850807 D1 DE 3850807D1 DE 3850807 T DE3850807 T DE 3850807T DE 3850807 T DE3850807 T DE 3850807T DE 3850807 D1 DE3850807 D1 DE 3850807D1
Authority
DE
Germany
Prior art keywords
power supply
low impedance
bus structure
supply bus
integrated circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3850807T
Other languages
English (en)
Other versions
DE3850807T2 (de
Inventor
Glen Gilfeather
Joe W Peterson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Application granted granted Critical
Publication of DE3850807D1 publication Critical patent/DE3850807D1/de
Publication of DE3850807T2 publication Critical patent/DE3850807T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H01L27/11898—Input and output buffer/driver structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
DE3850807T 1987-05-15 1988-05-06 Schutzsystem für CMOS-integrierte Schaltungen. Expired - Fee Related DE3850807T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/050,979 US4819047A (en) 1987-05-15 1987-05-15 Protection system for CMOS integrated circuits

Publications (2)

Publication Number Publication Date
DE3850807D1 true DE3850807D1 (de) 1994-09-01
DE3850807T2 DE3850807T2 (de) 1995-02-16

Family

ID=21968652

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3850807T Expired - Fee Related DE3850807T2 (de) 1987-05-15 1988-05-06 Schutzsystem für CMOS-integrierte Schaltungen.

Country Status (5)

Country Link
US (1) US4819047A (de)
EP (1) EP0291242B1 (de)
JP (1) JP2591983B2 (de)
AT (1) ATE109308T1 (de)
DE (1) DE3850807T2 (de)

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JP2569053B2 (ja) * 1987-06-26 1997-01-08 キヤノン株式会社 イメ−ジセンサ
JPH01289138A (ja) * 1988-05-16 1989-11-21 Toshiba Corp マスタースライス型半導体集積回路
US5162893A (en) * 1988-05-23 1992-11-10 Fujitsu Limited Semiconductor integrated circuit device with an enlarged internal logic circuit area
JPH07105472B2 (ja) * 1988-07-29 1995-11-13 株式会社東芝 入力保護回路
JPH02119262A (ja) * 1988-10-28 1990-05-07 Toshiba Corp 半導体装置
JP2549726B2 (ja) * 1989-01-30 1996-10-30 株式会社東芝 半導体集積回路とその製造方法
US4930037A (en) * 1989-02-16 1990-05-29 Advaced Micro Devices, Inc. Input voltage protection system
US5124877A (en) * 1989-07-18 1992-06-23 Gazelle Microcircuits, Inc. Structure for providing electrostatic discharge protection
JPH065705B2 (ja) * 1989-08-11 1994-01-19 株式会社東芝 半導体集積回路装置
US5063429A (en) * 1990-09-17 1991-11-05 Ncr Corporation High density input/output cell arrangement for integrated circuits
US5087953A (en) * 1990-10-05 1992-02-11 Unisys Corporation Flexible gate array system for combinatorial logic
US5272586A (en) * 1991-01-29 1993-12-21 National Semiconductor Corporation Technique for improving ESD immunity
EP0517391A1 (de) * 1991-06-05 1992-12-09 STMicroelectronics, Inc. ESD-Schutzschaltung
US5301084A (en) * 1991-08-21 1994-04-05 National Semiconductor Corporation Electrostatic discharge protection for CMOS integrated circuits
US5229635A (en) * 1991-08-21 1993-07-20 Vlsi Technology, Inc. ESD protection circuit and method for power-down application
KR940009605B1 (ko) * 1991-09-16 1994-10-15 삼성전자 주식회사 반도체 메모리의 정전방전 보호장치
US5272371A (en) * 1991-11-19 1993-12-21 Sgs-Thomson Microelectronics, Inc. Electrostatic discharge protection structure
US5291051A (en) * 1992-09-11 1994-03-01 National Semiconductor Corporation ESD protection for inputs requiring operation beyond supply voltages
US5218222A (en) * 1992-09-16 1993-06-08 Micron Semiconductor, Inc. Output ESD protection circuit
US5268588A (en) * 1992-09-30 1993-12-07 Texas Instruments Incorporated Semiconductor structure for electrostatic discharge protection
GB2273831B (en) * 1992-12-24 1997-03-26 Motorola Semiconducteurs Voltage protection circuit
US5477414A (en) * 1993-05-03 1995-12-19 Xilinx, Inc. ESD protection circuit
US5500552A (en) * 1993-07-26 1996-03-19 T.I.F. Co., Ltd. LC element, semiconductor device and LC element manufacturing method
FR2708788B1 (fr) * 1993-08-06 1995-10-27 Sgs Thomson Microelectronics Protection d'un circuit intégré à l'encontre de surcharges électrostatiques.
US5521783A (en) * 1993-09-17 1996-05-28 Analog Devices, Inc. Electrostatic discharge protection circuit
US5594611A (en) * 1994-01-12 1997-01-14 Lsi Logic Corporation Integrated circuit input/output ESD protection circuit with gate voltage regulation and parasitic zener and junction diode
US5473500A (en) * 1994-01-13 1995-12-05 Atmel Corporation Electrostatic discharge circuit for high speed, high voltage circuitry
FR2715504B1 (fr) * 1994-01-25 1996-04-05 Sgs Thomson Microelectronics Circuit intégré incorporant une protection contre les décharges électrostatiques.
JPH08274184A (ja) * 1995-03-31 1996-10-18 Toshiba Microelectron Corp 半導体集積回路の保護回路装置
JP2822915B2 (ja) * 1995-04-03 1998-11-11 日本電気株式会社 半導体装置
US5745323A (en) * 1995-06-30 1998-04-28 Analog Devices, Inc. Electrostatic discharge protection circuit for protecting CMOS transistors on integrated circuit processes
JP2904071B2 (ja) * 1995-10-04 1999-06-14 日本電気株式会社 半導体装置
JP2751898B2 (ja) * 1995-11-17 1998-05-18 日本電気株式会社 半導体装置
JP3400215B2 (ja) * 1995-11-21 2003-04-28 沖電気工業株式会社 半導体装置
US5751525A (en) * 1996-01-05 1998-05-12 Analog Devices, Inc. EOS/ESD Protection circuit for an integrated circuit with operating/test voltages exceeding power supply rail voltages
US6172590B1 (en) 1996-01-22 2001-01-09 Surgx Corporation Over-voltage protection device and method for making same
JP3464340B2 (ja) * 1996-04-19 2003-11-10 沖電気工業株式会社 半導体集積回路装置
US5715127A (en) * 1996-05-06 1998-02-03 Winbond Electronics Corp. Method for preventing electrostatic discharge failure in an integrated circuit package
US5712753A (en) * 1996-05-06 1998-01-27 Winbond Electronics Corp. Method for preventing electrostatic discharge failure in an integrated circuit package
US5917689A (en) * 1996-09-12 1999-06-29 Analog Devices, Inc. General purpose EOS/ESD protection circuit for bipolar-CMOS and CMOS integrated circuits
US5796570A (en) * 1996-09-19 1998-08-18 National Semiconductor Corporation Electrostatic discharge protection package
US5838146A (en) * 1996-11-12 1998-11-17 Analog Devices, Inc. Method and apparatus for providing ESD/EOS protection for IC power supply pins
US5917220A (en) 1996-12-31 1999-06-29 Stmicroelectronics, Inc. Integrated circuit with improved overvoltage protection
US5991134A (en) * 1997-06-19 1999-11-23 Advanced Micro Devices, Inc. Switchable ESD protective shunting circuit for semiconductor devices
JPH1140686A (ja) * 1997-07-23 1999-02-12 Rohm Co Ltd 半導体集積回路装置
US6130459A (en) 1998-03-10 2000-10-10 Oryx Technology Corporation Over-voltage protection device for integrated circuits
US6064094A (en) * 1998-03-10 2000-05-16 Oryx Technology Corporation Over-voltage protection system for integrated circuits using the bonding pads and passivation layer
US6369994B1 (en) 1998-07-31 2002-04-09 International Business Machines Corporation Method and apparatus for handling an ESD event on an SOI integrated circuit
US6388857B1 (en) * 1999-07-23 2002-05-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor circuit device with improved surge resistance
JP2001308282A (ja) * 2000-04-19 2001-11-02 Nec Corp 半導体装置
US6538304B1 (en) * 2000-11-16 2003-03-25 Texas Instruments Incorporated Corner bonding to lead frame
JP2002313947A (ja) * 2001-04-12 2002-10-25 Fuji Electric Co Ltd 半導体装置
CN1579018A (zh) * 2001-08-29 2005-02-09 皇家飞利浦电子股份有限公司 具有凸起桥的集成电路器件及其制造方法
JP3794368B2 (ja) * 2002-10-29 2006-07-05 セイコーエプソン株式会社 Ｅｌ表示装置
US7408269B2 (en) * 2004-06-14 2008-08-05 International Business Machines Corporation Multi-level power supply system for a complementary metal oxide semiconductor circuit
JP5015509B2 (ja) * 2006-07-27 2012-08-29 ルネサスエレクトロニクス株式会社 静電保護回路および半導体装置
US8018002B2 (en) 2009-06-24 2011-09-13 Globalfoundries Inc. Field effect resistor for ESD protection
US20120069479A1 (en) * 2010-09-17 2012-03-22 Richtek Technology Corporation Power transistor device with electrostatic discharge protection and low dropout regulator using same

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Publication number Priority date Publication date Assignee Title
JPS52128081A (en) * 1976-04-21 1977-10-27 Hitachi Ltd Protection circuit for c-mos ic
JPS5925381B2 (ja) * 1977-12-30 1984-06-16 富士通株式会社 半導体集積回路装置
US4476476A (en) * 1979-04-05 1984-10-09 National Semiconductor Corporation CMOS Input and output protection circuit
JPS60777B2 (ja) * 1979-05-25 1985-01-10 株式会社東芝 Ｍｏｓ半導体集積回路
JPS55165682A (en) * 1979-06-11 1980-12-24 Mitsubishi Electric Corp Mos field effect semiconductor device
JPS5799766A (en) * 1980-12-11 1982-06-21 Mitsubishi Electric Corp Semiconductor integrated circuit
JPS57109375A (en) * 1980-12-26 1982-07-07 Fujitsu Ltd Mis type transistor protection circuit
NL8100347A (nl) * 1981-01-26 1982-08-16 Philips Nv Halfgeleiderinrichting met een beveiligingsinrichting.
JPS58123763A (ja) * 1982-01-19 1983-07-23 Nissan Motor Co Ltd 半導体集積回路のゲ−ト保護回路
JPS58157155A (ja) * 1982-03-15 1983-09-19 Ricoh Co Ltd マスタスライスｌｓｉ
US4571505A (en) * 1983-11-16 1986-02-18 Inmos Corporation Method and apparatus of reducing latch-up susceptibility in CMOS integrated circuits
JPS60128653A (ja) * 1983-12-16 1985-07-09 Hitachi Ltd 半導体集積回路装置
JPS60192359A (ja) * 1984-03-14 1985-09-30 Nec Corp 半導体メモリ装置
JPH0622270B2 (ja) * 1984-08-22 1994-03-23 株式会社日立製作所 半導体集積回路装置
EP0177336B1 (de) * 1984-10-03 1992-07-22 Fujitsu Limited Integrierte Gate-Matrixstruktur

Also Published As

Publication number Publication date
DE3850807T2 (de) 1995-02-16
EP0291242B1 (de) 1994-07-27
JP2591983B2 (ja) 1997-03-19
JPS63304656A (ja) 1988-12-12
ATE109308T1 (de) 1994-08-15
EP0291242A3 (en) 1990-09-12
US4819047A (en) 1989-04-04
EP0291242A2 (de) 1988-11-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee