DE3650697T2 - Wafertransferarm und Wafertransfermethode - Google Patents

Wafertransferarm und Wafertransfermethode

Info

Publication number
DE3650697T2
DE3650697T2 DE3650697T DE3650697T DE3650697T2 DE 3650697 T2 DE3650697 T2 DE 3650697T2 DE 3650697 T DE3650697 T DE 3650697T DE 3650697 T DE3650697 T DE 3650697T DE 3650697 T2 DE3650697 T2 DE 3650697T2
Authority
DE
Germany
Prior art keywords
wafer
arm
transport arm
transport
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3650697T
Other languages
German (de)
English (en)
Other versions
DE3650697D1 (de
Inventor
Duane E. Plano Texas 75023 Carter
Cecil Greenville Texas 75401 Davis
Randall C. Richardson Texas 75080 Hildenbrand
Robert Plano Texas 75075 Matthews
John E. Plano Texas 75075 Spencer
Timothy A. Richardson Texas 75080 Wooldridge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/790,924 external-priority patent/US4687542A/en
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of DE3650697D1 publication Critical patent/DE3650697D1/de
Publication of DE3650697T2 publication Critical patent/DE3650697T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
  • Manipulator (AREA)
  • Chemical Vapour Deposition (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Specific Conveyance Elements (AREA)
  • Drying Of Semiconductors (AREA)
DE3650697T 1985-10-24 1986-10-17 Wafertransferarm und Wafertransfermethode Expired - Fee Related DE3650697T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US79070885A 1985-10-24 1985-10-24
US06/790,924 US4687542A (en) 1985-10-24 1985-10-24 Vacuum processing system

Publications (2)

Publication Number Publication Date
DE3650697D1 DE3650697D1 (de) 1998-10-08
DE3650697T2 true DE3650697T2 (de) 1999-04-15

Family

ID=27121066

Family Applications (3)

Application Number Title Priority Date Filing Date
DE3650697T Expired - Fee Related DE3650697T2 (de) 1985-10-24 1986-10-17 Wafertransferarm und Wafertransfermethode
DE3650057T Expired - Fee Related DE3650057T2 (de) 1985-10-24 1986-10-17 System für Vakuumbehandlung.
DE3650710T Expired - Fee Related DE3650710T2 (de) 1985-10-24 1986-10-17 System und Methode für Vakuum-Behandlung

Family Applications After (2)

Application Number Title Priority Date Filing Date
DE3650057T Expired - Fee Related DE3650057T2 (de) 1985-10-24 1986-10-17 System für Vakuumbehandlung.
DE3650710T Expired - Fee Related DE3650710T2 (de) 1985-10-24 1986-10-17 System und Methode für Vakuum-Behandlung

Country Status (3)

Country Link
EP (3) EP0555891B1 (https=)
JP (5) JPS62181440A (https=)
DE (3) DE3650697T2 (https=)

Families Citing this family (40)

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US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
GB2194500B (en) * 1986-07-04 1991-01-23 Canon Kk A wafer handling apparatus
EP0303030A1 (en) * 1987-07-16 1989-02-15 Texas Instruments Incorporated Processing apparatus and method
JPS6428912A (en) * 1987-07-24 1989-01-31 Hitachi Electr Eng Wafer handling device
DE3735449A1 (de) * 1987-10-20 1989-05-03 Convac Gmbh Fertigungssystem fuer halbleitersubstrate
JP2926593B2 (ja) * 1988-02-12 1999-07-28 東京エレクトロン株式会社 基板処理装置及びレジスト処理装置及び基板処理方法及びレジスト処理方法
US4949783A (en) * 1988-05-18 1990-08-21 Veeco Instruments, Inc. Substrate transport and cooling apparatus and method for same
IL86514A0 (https=) * 1988-05-26 1988-11-15
DE3822598C2 (de) * 1988-07-04 1997-09-04 Siemens Ag Justieranordnung und Verfahren zum Justieren einer Greifvorrichtung eines Roboterarms zum Handhaben einer Halbleiterscheibe
EP0367423A3 (en) * 1988-10-31 1991-01-09 Eaton Corporation Vacuum deposition system
US6989228B2 (en) 1989-02-27 2006-01-24 Hitachi, Ltd Method and apparatus for processing samples
US5868854A (en) * 1989-02-27 1999-02-09 Hitachi, Ltd. Method and apparatus for processing samples
JP2528962B2 (ja) * 1989-02-27 1996-08-28 株式会社日立製作所 試料処理方法及び装置
US6077788A (en) * 1989-02-27 2000-06-20 Hitachi, Ltd. Method and apparatus for processing samples
NL8901630A (nl) * 1989-06-28 1991-01-16 Philips Nv Vacuuem systeem.
JP2767142B2 (ja) * 1989-10-18 1998-06-18 東京エレクトロン株式会社 真空処理装置用ユニット
JP2525284B2 (ja) * 1990-10-22 1996-08-14 ティーディーケイ株式会社 クリ―ン搬送方法及び装置
JPH05251408A (ja) * 1992-03-06 1993-09-28 Ebara Corp 半導体ウェーハのエッチング装置
US5398481A (en) * 1992-05-19 1995-03-21 Ebara Corporation Vacuum processing system
KR100303075B1 (ko) * 1992-11-06 2001-11-30 조셉 제이. 스위니 집적회로 웨이퍼 이송 방법 및 장치
EP0596536A1 (en) * 1992-11-06 1994-05-11 Applied Materials, Inc. Transport system and method of using same
US5643366A (en) * 1994-01-31 1997-07-01 Applied Materials, Inc. Wafer handling within a vacuum chamber using vacuum
GB2320135A (en) * 1996-12-04 1998-06-10 Smiths Industries Plc Semiconductor wafer processing apparatus
JP3850951B2 (ja) * 1997-05-15 2006-11-29 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
WO2004001817A1 (en) 2002-06-21 2003-12-31 Applied Materials, Inc. Transfer chamber for vacuum processing system
US7258520B2 (en) 2002-08-31 2007-08-21 Applied Materials, Inc. Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing
US6955197B2 (en) 2002-08-31 2005-10-18 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
TW200524073A (en) 2003-11-13 2005-07-16 Applied Materials Inc Kinematic pin with shear member and substrate carrier for use therewith
DE10359464A1 (de) * 2003-12-17 2005-07-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zum Erzeugen von insbesondere EUV-Strahlung und/oder weicher Röntgenstrahlung
US7720558B2 (en) 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
TWI367539B (en) 2006-01-11 2012-07-01 Applied Materials Inc Methods and apparatus for purging a substrate carrier
US7849889B2 (en) * 2006-05-31 2010-12-14 Philip Morris Usa Inc. Applicator wheel for filling cavities with metered amounts of particulate material
JP5329853B2 (ja) 2008-06-25 2013-10-30 ティアック株式会社 光ディスク装置及びこれを備える光ディスク処理システム
JP5329854B2 (ja) 2008-06-25 2013-10-30 ティアック株式会社 光ディスク装置及びこれを備える光ディスク処理システム
DE112010005550B4 (de) 2010-05-11 2017-01-05 Toyota Jidosha Kabushiki Kaisha Fahrzeugschaltungssteuerungsvorrichtung
KR102139673B1 (ko) * 2013-07-04 2020-07-31 엘지디스플레이 주식회사 평판표시장치 제조용 장비 및 그의 동작방법
JP2017204608A (ja) * 2016-05-13 2017-11-16 信越ポリマー株式会社 基板収納容器
EP4006195A4 (en) * 2019-07-22 2023-07-12 ULVAC, Inc. VACUUM TREATMENT DEVICE
CN113728422B (zh) * 2020-03-24 2024-01-09 株式会社日立高新技术 真空处理装置
JP7617745B2 (ja) * 2021-01-05 2025-01-20 東京エレクトロン株式会社 プロセスモジュール、基板処理システムおよび処理方法

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JPS5337546U (https=) * 1976-09-06 1978-04-01
JPS5337456U (https=) * 1976-09-07 1978-04-01
US4181161A (en) * 1977-02-02 1980-01-01 Balzers Aktiengesellschaft Fur Hochvakuumtechnik Und Dunne Schichten Method of producing a high vacuum in a container
JPS5480086A (en) * 1977-12-09 1979-06-26 Hitachi Ltd Mask aligner
US4293249A (en) * 1980-03-03 1981-10-06 Texas Instruments Incorporated Material handling system and method for manufacturing line
JPS5730341A (en) * 1980-07-30 1982-02-18 Anelva Corp Substrate processing device
JPS5739914A (en) * 1980-08-25 1982-03-05 Shimizu Construction Co Ltd Method of controlling moisture of high slump concrete
JPS57113245A (en) * 1980-12-29 1982-07-14 Fujitsu Ltd Sample conveying method into vacuum device
US4433951A (en) * 1981-02-13 1984-02-28 Lam Research Corporation Modular loadlock
JPS57145321A (en) * 1981-03-03 1982-09-08 Nec Corp Dry etching device
JPS57149748A (en) * 1981-03-12 1982-09-16 Anelva Corp Treating device for substrate
US4466766A (en) * 1981-05-20 1984-08-21 Ruska Instrument Corporation Transfer apparatus
JPS57194531A (en) * 1981-05-26 1982-11-30 Toshiba Corp Electron beam transfer device
JPS58292U (ja) * 1981-06-26 1983-01-05 同和機器工業株式会社 冷却兼冷凍装置
JPS58127341A (ja) * 1982-01-25 1983-07-29 Hitachi Ltd 自動ウエハハンドリング装置
JPS58170028A (ja) * 1982-03-31 1983-10-06 Fujitsu Ltd 真空処理装置
DE3214256A1 (de) * 1982-04-17 1983-10-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Vorrichtung zur handhabung eines substrates
JPS58204347A (ja) * 1982-05-24 1983-11-29 Nippon Jido Seigyo Kk パタ−ンの欠陥検査装置に用いる被検体の自動装填装置
DE3219502C2 (de) * 1982-05-25 1990-04-19 Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar Vorrichtung zum automatischen Transport scheibenförmiger Objekte
JPS5956739A (ja) * 1982-09-27 1984-04-02 Ulvac Corp ウエハ装填装置
JPS5994435A (ja) * 1982-11-20 1984-05-31 Tokuda Seisakusho Ltd 真空処理装置
JPS59186326A (ja) * 1983-04-06 1984-10-23 Hitachi Ltd プラズマ処理装置
JPS59208837A (ja) * 1983-05-13 1984-11-27 Nec Kyushu Ltd プラズマエツチング装置
US4534695A (en) * 1983-05-23 1985-08-13 Eaton Corporation Wafer transport system
JPS6020515A (ja) * 1983-07-14 1985-02-01 Ulvac Corp 真空処理装置
JPS6054449A (ja) * 1983-09-05 1985-03-28 Toshiba Corp 半導体ウエハ搬送治具
EP0151336B1 (en) * 1983-09-28 1991-01-02 Hewlett-Packard Company System for integrated circuit processing
JPS60102744A (ja) * 1983-11-09 1985-06-06 Hitachi Ltd 真空処理装置
US4584045A (en) * 1984-02-21 1986-04-22 Plasma-Therm, Inc. Apparatus for conveying a semiconductor wafer
JPS60175411A (ja) * 1984-02-22 1985-09-09 Hitachi Ltd 半導体薄膜の製造方法及びその製造装置

Also Published As

Publication number Publication date
JPH0658931B1 (https=) 1994-08-03
JPH0629369A (ja) 1994-02-04
JPH04226049A (ja) 1992-08-14
EP0555890B1 (en) 1998-09-02
DE3650710D1 (de) 1999-03-04
DE3650057T2 (de) 1995-02-16
JPH0658932B1 (https=) 1994-08-03
EP0555891A2 (en) 1993-08-18
JP2693352B2 (ja) 1997-12-24
JPH0658931B2 (ja) 1994-08-03
DE3650710T2 (de) 1999-08-19
EP0555891A3 (en) 1993-09-15
JPH0556859B2 (https=) 1993-08-20
EP0555891B1 (en) 1999-01-20
JPH0645425A (ja) 1994-02-18
JPS62181440A (ja) 1987-08-08
EP0555890A3 (en) 1993-09-15
DE3650057D1 (de) 1994-10-13
EP0219826B1 (en) 1994-09-07
JPH0640517A (ja) 1994-02-15
EP0219826A2 (en) 1987-04-29
JPH0658932B2 (ja) 1994-08-03
EP0555890A2 (en) 1993-08-18
DE3650697D1 (de) 1998-10-08
EP0219826A3 (en) 1989-07-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee