DE112019006358T5 - Hochfrequenzmehrschichtfilter - Google Patents

Hochfrequenzmehrschichtfilter Download PDF

Info

Publication number
DE112019006358T5
DE112019006358T5 DE112019006358.8T DE112019006358T DE112019006358T5 DE 112019006358 T5 DE112019006358 T5 DE 112019006358T5 DE 112019006358 T DE112019006358 T DE 112019006358T DE 112019006358 T5 DE112019006358 T5 DE 112019006358T5
Authority
DE
Germany
Prior art keywords
inductor
multilayer filter
high frequency
filter according
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112019006358.8T
Other languages
German (de)
English (en)
Inventor
Kwang Choi
Marianne Berolini
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera AVX Components Corp
Original Assignee
AVX Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AVX Corp filed Critical AVX Corp
Publication of DE112019006358T5 publication Critical patent/DE112019006358T5/de
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01Frequency selective two-port networks
    • H03H7/0115Frequency selective two-port networks comprising only inductors and capacitors
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01Frequency selective two-port networks
    • H03H7/17Structural details of sub-circuits of frequency selective networks
    • H03H7/1716Comprising foot-point elements
    • H03H7/1725Element to ground being common to different shunt paths, i.e. Y-structure
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01Frequency selective two-port networks
    • H03H7/17Structural details of sub-circuits of frequency selective networks
    • H03H7/1741Comprising typical LC combinations, irrespective of presence and location of additional resistors
    • H03H7/1766Parallel LC in series path
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01Frequency selective two-port networks
    • H03H7/17Structural details of sub-circuits of frequency selective networks
    • H03H7/1741Comprising typical LC combinations, irrespective of presence and location of additional resistors
    • H03H7/1775Parallel LC in shunt or branch path
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021Constructional details
    • H03H2001/0085Multilayer, e.g. LTCC, HTCC, green sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Filters And Equalizers (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
DE112019006358.8T 2018-12-20 2019-12-18 Hochfrequenzmehrschichtfilter Pending DE112019006358T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862782464P 2018-12-20 2018-12-20
US62/782,464 2018-12-20
PCT/US2019/067083 WO2020132011A1 (en) 2018-12-20 2019-12-18 High frequency multilayer filter

Publications (1)

Publication Number Publication Date
DE112019006358T5 true DE112019006358T5 (de) 2021-10-28

Family

ID=71098093

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112019006358.8T Pending DE112019006358T5 (de) 2018-12-20 2019-12-18 Hochfrequenzmehrschichtfilter

Country Status (6)

Country Link
US (2) US11114993B2 (https=)
JP (2) JP7652693B2 (https=)
CN (1) CN113228504B (https=)
DE (1) DE112019006358T5 (https=)
TW (1) TWI799671B (https=)
WO (1) WO2020132011A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020132183A1 (en) 2018-12-20 2020-06-25 Avx Corporation Multilayer electronic device including a capacitor having a precisely controlled capacitive area
US11509276B2 (en) 2018-12-20 2022-11-22 KYOCERA AVX Components Corporation Multilayer filter including a return signal reducing protrusion
CN113273029B (zh) 2018-12-20 2022-08-02 京瓷Avx元器件公司 包括电容器的多层滤波器和形成多层滤波器的方法
JP7288056B2 (ja) 2018-12-20 2023-06-06 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 高精度インダクタを含む多層電子デバイス
TWI776290B (zh) * 2020-11-27 2022-09-01 財團法人工業技術研究院 電容器以及包含所述電容器的濾波器與重佈線層結構
CN112953455B (zh) * 2021-02-22 2023-11-07 安徽安努奇科技有限公司 滤波器结构
CN113381715B (zh) 2021-06-21 2024-06-28 安徽安努奇科技有限公司 3d滤波电路与3d滤波器
JP2023031964A (ja) * 2021-08-26 2023-03-09 株式会社村田製作所 フィルタ装置
JP2024032223A (ja) 2022-08-29 2024-03-12 Tdk株式会社 積層フィルタ
CN117294269B (zh) * 2023-11-27 2024-03-26 华南理工大学 一种集成电容式带通滤波器
CN117791064A (zh) * 2023-12-14 2024-03-29 四川航天燎原科技有限公司 一种通用多频段滤波嵌入式集成接口及其制造方法

Family Cites Families (86)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05136644A (ja) * 1991-11-11 1993-06-01 Tdk Corp Lc共振器
US5357227A (en) 1992-04-16 1994-10-18 Murata Mfg. Co., Ltd. Laminated high-frequency low-pass filter
JPH05311010A (ja) * 1992-05-07 1993-11-22 Hitachi Chem Co Ltd 複合高誘電率基板
JPH09266430A (ja) * 1996-03-28 1997-10-07 Sumitomo Kinzoku Electro Device:Kk 積層フィルタ
JP4121550B2 (ja) 1998-07-01 2008-07-23 日本ポリプロ株式会社 ホットメルト接着剤組成物
JP3395754B2 (ja) 2000-02-24 2003-04-14 株式会社村田製作所 デュアルモード・バンドパスフィルタ
JP2001345661A (ja) * 2000-05-31 2001-12-14 Kyocera Corp 高周波回路基板
JP3567885B2 (ja) 2000-11-29 2004-09-22 株式会社村田製作所 積層型lcフィルタ
DE10064445A1 (de) 2000-12-22 2002-07-11 Epcos Ag Elektrisches Vielschichtbauelement und Anordnung mit dem Bauelement
JP2002203720A (ja) * 2000-12-28 2002-07-19 Tdk Corp インダクタを含む複合電子部品およびその製造方法
JP2002217667A (ja) * 2001-01-22 2002-08-02 Sumitomo Metal Electronics Devices Inc 積層lcフィルタ
JP2003068571A (ja) 2001-08-27 2003-03-07 Nec Corp 可変コンデンサおよび可変インダクタ並びにそれらを備えた高周波回路モジュール
US7239219B2 (en) 2001-12-03 2007-07-03 Microfabrica Inc. Miniature RF and microwave components and methods for fabricating such components
JP2003198308A (ja) 2001-12-25 2003-07-11 Ngk Spark Plug Co Ltd 積層型lcフィルタ
US6734755B2 (en) 2002-05-16 2004-05-11 Corning Incorporated Broadband uniplanar coplanar transition
US6900708B2 (en) 2002-06-26 2005-05-31 Georgia Tech Research Corporation Integrated passive devices fabricated utilizing multi-layer, organic laminates
CN1669177A (zh) 2002-06-27 2005-09-14 微制造公司 小型射频和微波构件以及这些构件的制造方法
JP2004304761A (ja) 2003-03-18 2004-10-28 Murata Mfg Co Ltd チップ型共振部品
DE10335331A1 (de) 2003-08-01 2005-03-03 Epcos Ag Elektrisches Bauelement mit überlappenden Elektroden und Verfahren zur Herstellung
JP3866231B2 (ja) 2003-09-04 2007-01-10 Tdk株式会社 積層型バンドパスフィルタ
JP2005109951A (ja) 2003-09-30 2005-04-21 Sony Corp 共振器および誘電体フィルタ
JP2007523574A (ja) * 2004-02-23 2007-08-16 ジョージア テック リサーチ コーポレイション 液晶性ポリマー及び多層ポリマーベースの無線周波/無線マルチバンド用途の受動信号処理コンポーネント
US6970057B2 (en) 2004-04-02 2005-11-29 Chi Mei Communication Systems, Inc. Lowpass filter formed in a multi-layer ceramic
JP2006121445A (ja) * 2004-10-21 2006-05-11 Ngk Spark Plug Co Ltd 積層型フィルタ
JPWO2006054601A1 (ja) 2004-11-19 2008-05-29 松下電器産業株式会社 コンデンサ内蔵多層基板とその製造方法、及び冷陰極管点灯装置
US7606184B2 (en) * 2005-01-04 2009-10-20 Tdk Corporation Multiplexers employing bandpass-filter architectures
JP4539422B2 (ja) 2005-04-27 2010-09-08 株式会社村田製作所 チップ型多段フィルタ装置
JP4523478B2 (ja) 2005-04-28 2010-08-11 京セラ株式会社 帯域通過フィルタ及び高周波モジュール、並びにこれを用いた無線通信機器
JP4246716B2 (ja) 2005-05-02 2009-04-02 Tdk株式会社 積層型フィルタ
KR100863792B1 (ko) 2005-06-13 2008-10-16 다이요 유덴 가부시키가이샤 적층 필터 및 전자부품
US7312676B2 (en) 2005-07-01 2007-12-25 Tdk Corporation Multilayer band pass filter
JP4441886B2 (ja) 2006-03-31 2010-03-31 Tdk株式会社 高周波モジュール
JP2008004768A (ja) 2006-06-22 2008-01-10 Tdk Corp 積層電子部品の製造方法
JP4505440B2 (ja) * 2006-08-04 2010-07-21 東光株式会社 積層型ハイパスフィルタ
JP2008099060A (ja) * 2006-10-13 2008-04-24 Taiyo Yuden Co Ltd 積層型誘電体帯域通過フィルタ
DE102007020783A1 (de) 2007-05-03 2008-11-06 Epcos Ag Elektrisches Vielschichtbauelement
TW200908430A (en) 2007-05-18 2009-02-16 Murata Manufacturing Co Stacked bandpass filter
US20090027141A1 (en) 2007-06-22 2009-01-29 Taiyo Yuden Co., Ltd. Filter circuit, filter circuit device, multilayered circuit board, and circuit module each including the filter circuit
JP4550915B2 (ja) * 2007-06-22 2010-09-22 太陽誘電株式会社 フィルタ回路及びフィルタ回路素子、これを備えた多層回路基板並びに回路モジュール
WO2009052621A1 (en) 2007-10-22 2009-04-30 D-Wave Systems Inc. Systems, methods, and apparatus for electrical filters and input/output systems
WO2009060696A1 (ja) 2007-11-05 2009-05-14 Murata Manufacturing Co., Ltd. チップ型フィルタ部品
JP2009153106A (ja) * 2007-11-29 2009-07-09 Hitachi Metals Ltd バンドパスフィルタ、高周波部品および通信装置
EP2068393A1 (en) 2007-12-07 2009-06-10 Panasonic Corporation Laminated RF device with vertical resonators
JP2009159328A (ja) * 2007-12-26 2009-07-16 Ngk Spark Plug Co Ltd マルチプレクサ、トリプレクサ及びダイプレクサ
JP5288903B2 (ja) * 2008-06-26 2013-09-11 京セラ株式会社 バンドパスフィルタならびにそれを用いた無線通信モジュールおよび無線通信機器
JP4995231B2 (ja) 2008-05-30 2012-08-08 キヤノン株式会社 光学フィルタ
US9287845B2 (en) 2008-08-11 2016-03-15 Hitachi Metals, Ltd. Bandpass filter, high-frequency device and communications apparatus
US8446705B2 (en) 2008-08-18 2013-05-21 Avx Corporation Ultra broadband capacitor
US8106722B2 (en) 2008-08-20 2012-01-31 Panasonic Corporation Multi-layered device and electronic equipment using thereof
JP2010147320A (ja) * 2008-12-19 2010-07-01 Alps Electric Co Ltd 高周波回路モジュール
JP5261258B2 (ja) * 2009-03-30 2013-08-14 京セラ株式会社 バンドパスフィルタ
TWI394189B (zh) 2009-06-04 2013-04-21 Ind Tech Res Inst 電容基板結構
JP5035319B2 (ja) 2009-10-23 2012-09-26 Tdk株式会社 積層型コンデンサ
US9142342B2 (en) 2010-05-17 2015-09-22 Ronald Lambert Haner Compact-area capacitive plates for use with spiral inductors having more than one turn
TWI442622B (zh) 2010-11-11 2014-06-21 Murata Manufacturing Co Laminated bandpass filter
CN102354777A (zh) 2011-07-18 2012-02-15 西安瓷芯电子科技有限责任公司 一种ltcc低通滤波器
EP2618421A1 (en) 2012-01-19 2013-07-24 Huawei Technologies Co., Ltd. Surface Mount Microwave System
JP5817925B2 (ja) * 2012-05-02 2015-11-18 株式会社村田製作所 高周波モジュール
JP5618027B2 (ja) 2012-09-28 2014-11-05 株式会社村田製作所 インピーダンス変換回路およびアンテナ装置
KR20140071724A (ko) 2012-12-04 2014-06-12 삼성전기주식회사 적층 세라믹 전자부품
KR20140081360A (ko) 2012-12-21 2014-07-01 삼성전기주식회사 적층 세라믹 커패시터, 그 제조방법 및 적층 세라믹 커패시터가 실장된 회로기판
US9349788B2 (en) 2013-08-08 2016-05-24 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Thin film capacitors embedded in polymer dielectric
US10014843B2 (en) 2013-08-08 2018-07-03 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Multilayer electronic structures with embedded filters
US20150296617A1 (en) 2014-04-09 2015-10-15 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Interposer frame with polymer matrix and methods of fabrication
US9240392B2 (en) 2014-04-09 2016-01-19 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co., Ltd. Method for fabricating embedded chips
KR102273027B1 (ko) 2014-06-09 2021-07-05 삼성전자주식회사 위치정보를 사용하여 설정된 관심영역을 사용하여 영상데이터를 생성하는 방법 및 장치
JP6502684B2 (ja) * 2015-01-29 2019-04-17 京セラ株式会社 フィルタ素子および通信モジュール
WO2016136295A1 (ja) * 2015-02-23 2016-09-01 株式会社村田製作所 電子部品
KR101640907B1 (ko) 2015-03-17 2016-07-20 주식회사 모다이노칩 적층칩 소자
JP6428917B2 (ja) 2015-03-25 2018-11-28 株式会社村田製作所 ダイプレクサ
JP6578719B2 (ja) * 2015-04-14 2019-09-25 Tdk株式会社 コイルとコンデンサを含む積層複合電子部品
KR20170004238A (ko) 2015-07-01 2017-01-11 주식회사 이엠따블유 광대역 모듈 및 이를 포함하는 통신 장치
JP6380315B2 (ja) * 2015-09-26 2018-08-29 株式会社村田製作所 積層型lcフィルタ
JP6504021B2 (ja) 2015-11-04 2019-04-24 株式会社村田製作所 電子部品
US10063211B2 (en) 2016-02-03 2018-08-28 Qualcomm Incorporated Compact bypass and decoupling structure for millimeter-wave circuits
JP6547707B2 (ja) * 2016-07-29 2019-07-24 株式会社村田製作所 積層フィルタ
JP2018067612A (ja) 2016-10-19 2018-04-26 Tdk株式会社 差動伝送回路
US10389329B2 (en) 2017-02-03 2019-08-20 Murata Manufacturing Co., Ltd. Multilayer electronic component and multilayer LC filter
US10283566B2 (en) 2017-06-01 2019-05-07 Sandisk Technologies Llc Three-dimensional memory device with through-stack contact via structures and method of making thereof
JP6791107B2 (ja) 2017-12-08 2020-11-25 株式会社村田製作所 積層帯域通過フィルタ
JP2019205122A (ja) 2018-05-25 2019-11-28 ルネサスエレクトロニクス株式会社 半導体装置
CN113273029B (zh) 2018-12-20 2022-08-02 京瓷Avx元器件公司 包括电容器的多层滤波器和形成多层滤波器的方法
US11114994B2 (en) 2018-12-20 2021-09-07 Avx Corporation Multilayer filter including a low inductance via assembly
WO2020132183A1 (en) 2018-12-20 2020-06-25 Avx Corporation Multilayer electronic device including a capacitor having a precisely controlled capacitive area
US11509276B2 (en) 2018-12-20 2022-11-22 KYOCERA AVX Components Corporation Multilayer filter including a return signal reducing protrusion
JP7288056B2 (ja) 2018-12-20 2023-06-06 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 高精度インダクタを含む多層電子デバイス

Also Published As

Publication number Publication date
WO2020132011A1 (en) 2020-06-25
JP2024056900A (ja) 2024-04-23
CN113228504B (zh) 2024-10-25
US20200204141A1 (en) 2020-06-25
CN113228504A (zh) 2021-08-06
TWI799671B (zh) 2023-04-21
TW202042502A (zh) 2020-11-16
US11114993B2 (en) 2021-09-07
JP7652693B2 (ja) 2025-03-27
JP2022515134A (ja) 2022-02-17
US11838002B2 (en) 2023-12-05
US20210391842A1 (en) 2021-12-16

Similar Documents

Publication Publication Date Title
DE112019006358T5 (de) Hochfrequenzmehrschichtfilter
DE112019006352T5 (de) Mehrschichtfilter, umfassend einen rückführsignalreduzierungsvorsprung
DE112019006353T5 (de) Mehrschichtfilter mit einem kondensator; der mit mindestens zwei durchkontaktierungen verbunden ist
DE112019006351T5 (de) Mehrschichtfilter, umfassend eine durchkontaktierung mit geringer induktivität
DE60005342T2 (de) Verfahren und vorrichtung zur reduzierung von resonanzen und rauschübertragung in leistungsverteilungsschaltungen unter verwendung von flachen leitern
DE69122748T2 (de) Hochfrequenzvorrichtung
DE102008002507B4 (de) Leiterplatte mit elektromagnetischer Bandabstandstruktur
DE19655266B4 (de) Elektronisches Bauelement
DE602005002547T2 (de) Passive signalverarbeitungskomponenten auf flüssigkristallpolymer- und mehrschichtpolymerbasis für hf-/drahtlos-mehrband-anwendungen
DE69933682T2 (de) Wellenleitungsfilter vom dämpfungstyp mit mehreren dielektrischen schichten
DE112019006378T5 (de) Mehrschicht-elektronikvorrichtung mit einem hochpräzisen induktor
DE69936827T2 (de) Baugruppe und verfahren zur herstellung
DE4008507A1 (de) Laminiertes lc-filter
DE69932899T2 (de) Übertragungsleitung und Übertragungsleitungsresonator
DE10133660A1 (de) Hochintegriertes mehrschichtiges Schaltkreismodul mit keramischen Substraten mit eingebetteten passiven Komponenten
DE112019006334T5 (de) Mehrschicht-elektronikvorrichtung mit einem kondensator mit einer präzise geregelten kapazitiven fläche
DE69729030T2 (de) Dielektrische Mehrschichtvorrichtung und dazugehöriges Herstellungsverfahren
DE10207957A1 (de) Verfahren für hochdichtes Entkoppeln einer Kondensatorplazierung mit geringer Anzahl von Kontaktlöchern
DE3416107A1 (de) Busleitungsanordnung mit hoher kapazitaet in schichtbauweise
EP2215900B1 (de) Filter in einem mehrlagensubstrat mit einer elektrischen schaltungsanordnung umfassend konzentrierten elemente
DE3937183A1 (de) Verfahren zu stoerstrahlungsdaempfung an leiterplatten
DE102020133161A1 (de) Drosselmodul und Verfahren zur Herstellung eines Drosselmoduls
DE10155393A1 (de) Planarer Polymer-Kondensator
DE112019004661T5 (de) Oberflächenmontierter Hochleistungsfilter
DE112004002978T5 (de) Chipelement

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R081 Change of applicant/patentee

Owner name: KYOCERA AVX COMPONENTS CORPORATION (N. D. GES., US

Free format text: FORMER OWNER: AVX CORPORATION, FOUNTAIN INN, SC, US

R016 Response to examination communication