DE10238782A1 - Dünnfilm-Magnetspeichervorrichtung mit Redundanzreparaturfunktion - Google Patents

Dünnfilm-Magnetspeichervorrichtung mit Redundanzreparaturfunktion

Info

Publication number
DE10238782A1
DE10238782A1 DE10238782A DE10238782A DE10238782A1 DE 10238782 A1 DE10238782 A1 DE 10238782A1 DE 10238782 A DE10238782 A DE 10238782A DE 10238782 A DE10238782 A DE 10238782A DE 10238782 A1 DE10238782 A1 DE 10238782A1
Authority
DE
Germany
Prior art keywords
program
memory cells
cells
storage device
magnetic storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10238782A
Other languages
German (de)
English (en)
Inventor
Jun Ohtani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE10238782A1 publication Critical patent/DE10238782A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
    • G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165—Auxiliary circuits
    • G11C11/1653—Address circuits or decoders
    • G11C11/1657—Word-line or row circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70—Masking faults in memories by using spares or by reconfiguring
    • G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
    • G11C29/785—Masking faults in memories by using spares or by reconfiguring using programmable devices with redundancy programming schemes
    • G11C29/789—Masking faults in memories by using spares or by reconfiguring using programmable devices with redundancy programming schemes using non-volatile cells or latches
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • G11C5/143—Detection of memory cassette insertion or removal; Continuity checks of supply or ground lines; Detection of supply variations, interruptions or levels ; Switching between alternative supplies

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Hall/Mr Elements (AREA)
  • Semiconductor Memories (AREA)
DE10238782A 2002-01-15 2002-08-23 Dünnfilm-Magnetspeichervorrichtung mit Redundanzreparaturfunktion Withdrawn DE10238782A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002006424A JP2003208796A (ja) 2002-01-15 2002-01-15 薄膜磁性体記憶装置

Publications (1)

Publication Number Publication Date
DE10238782A1 true DE10238782A1 (de) 2003-07-31

Family

ID=19191226

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10238782A Withdrawn DE10238782A1 (de) 2002-01-15 2002-08-23 Dünnfilm-Magnetspeichervorrichtung mit Redundanzreparaturfunktion

Country Status (6)

Country Link
US (1) US6671213B2 (enExample)
JP (1) JP2003208796A (enExample)
KR (1) KR100501126B1 (enExample)
CN (1) CN1302482C (enExample)
DE (1) DE10238782A1 (enExample)
TW (1) TW569239B (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197769A (ja) * 2001-12-21 2003-07-11 Mitsubishi Electric Corp 半導体記憶装置
JP4208507B2 (ja) * 2002-02-04 2009-01-14 株式会社ルネサステクノロジ 薄膜磁性体記憶装置
AU2003243244A1 (en) * 2002-05-16 2003-12-02 Micron Technology, Inc. STACKED 1T-nMEMORY CELL STRUCTURE
US6940748B2 (en) * 2002-05-16 2005-09-06 Micron Technology, Inc. Stacked 1T-nMTJ MRAM structure
US7209378B2 (en) 2002-08-08 2007-04-24 Micron Technology, Inc. Columnar 1T-N memory cell structure
US6882553B2 (en) * 2002-08-08 2005-04-19 Micron Technology Inc. Stacked columnar resistive memory structure and its method of formation and operation
JP4405162B2 (ja) * 2003-02-14 2010-01-27 株式会社ルネサステクノロジ 薄膜磁性体記憶装置
US20050086471A1 (en) * 2003-10-20 2005-04-21 Spencer Andrew M. Removable information storage device that includes a master encryption key and encryption keys
JP4641726B2 (ja) * 2004-01-07 2011-03-02 パナソニック株式会社 半導体記憶装置
JP4607685B2 (ja) * 2005-06-30 2011-01-05 富士通セミコンダクター株式会社 半導体メモリ
JP4822828B2 (ja) * 2005-12-13 2011-11-24 ルネサスエレクトロニクス株式会社 不揮発性記憶装置
US7362644B2 (en) * 2005-12-20 2008-04-22 Magic Technologies, Inc. Configurable MRAM and method of configuration
TWI316712B (en) * 2006-06-27 2009-11-01 Silicon Motion Inc Non-volatile memory, repair circuit, and repair method thereof
KR100933839B1 (ko) * 2008-03-10 2009-12-24 주식회사 하이닉스반도체 불휘발성 메모리 소자 및 그 동작 방법
TWI408697B (zh) 2009-08-05 2013-09-11 Etron Technology Inc 記憶體裝置與記憶體控制方法
CN101916214B (zh) * 2010-07-28 2013-03-20 钰创科技股份有限公司 存储器装置与存储器控制方法
US8638596B2 (en) * 2011-07-25 2014-01-28 Qualcomm Incorporated Non-volatile memory saving cell information in a non-volatile memory array
KR20130021760A (ko) 2011-08-23 2013-03-06 삼성전자주식회사 자기터널접합 브레이크 다운을 이용한 안티퓨즈 회로, 및 이를 포함하는 반도체 장치
JP2012119058A (ja) * 2012-02-13 2012-06-21 Fujitsu Semiconductor Ltd 不揮発性半導体メモリ
KR102003851B1 (ko) * 2012-08-31 2019-10-01 에스케이하이닉스 주식회사 메모리 및 이를 포함하는 메모리 시스템
US9543041B2 (en) * 2014-08-29 2017-01-10 Everspin Technologies, Inc. Configuration and testing for magnetoresistive memory to ensure long term continuous operation
US9799412B2 (en) * 2014-09-30 2017-10-24 Sony Semiconductor Solutions Corporation Memory having a plurality of memory cells and a plurality of word lines
JP7310302B2 (ja) * 2019-05-24 2023-07-19 富士通セミコンダクターメモリソリューション株式会社 半導体記憶装置
EP4030436B1 (en) 2020-10-20 2024-05-29 Changxin Memory Technologies, Inc. Repair circuit and memory

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5452251A (en) * 1992-12-03 1995-09-19 Fujitsu Limited Semiconductor memory device for selecting and deselecting blocks of word lines
JP2914171B2 (ja) * 1994-04-25 1999-06-28 松下電器産業株式会社 半導体メモリ装置およびその駆動方法
JPH08279299A (ja) 1995-04-04 1996-10-22 Toshiba Microelectron Corp 半導体集積回路および半導体メモリ
US6259644B1 (en) * 1997-11-20 2001-07-10 Hewlett-Packard Co Equipotential sense methods for resistive cross point memory cell arrays
JPH11232895A (ja) * 1998-02-18 1999-08-27 Matsushita Electric Ind Co Ltd 不揮発性メモリ
JP3848004B2 (ja) * 1999-03-11 2006-11-22 株式会社東芝 半導体メモリ装置及び半導体メモリ装置搭載システム
JP3701160B2 (ja) * 1999-12-24 2005-09-28 シャープ株式会社 冗長機能を有する不揮発性半導体メモリ装置
US6256237B1 (en) * 1999-12-28 2001-07-03 United Microelectronics Corp. Semiconductor device and method for repairing failed memory cell by directly programming fuse memory cell

Also Published As

Publication number Publication date
CN1433023A (zh) 2003-07-30
CN1302482C (zh) 2007-02-28
KR20030062210A (ko) 2003-07-23
JP2003208796A (ja) 2003-07-25
US20030133334A1 (en) 2003-07-17
US6671213B2 (en) 2003-12-30
TW569239B (en) 2004-01-01
KR100501126B1 (ko) 2005-07-18

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Legal Events

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OP8 Request for examination as to paragraph 44 patent law
8130 Withdrawal