DE10132478C1 - Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung - Google Patents

Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung

Info

Publication number
DE10132478C1
DE10132478C1 DE10132478A DE10132478A DE10132478C1 DE 10132478 C1 DE10132478 C1 DE 10132478C1 DE 10132478 A DE10132478 A DE 10132478A DE 10132478 A DE10132478 A DE 10132478A DE 10132478 C1 DE10132478 C1 DE 10132478C1
Authority
DE
Germany
Prior art keywords
metal
tin
ions
solution
auxiliary cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10132478A
Other languages
German (de)
English (en)
Inventor
Thomas Beck
Hans-Juergen Schreier
Sven Lamprecht
Rolf Schroeder
Kai-Jens Matejat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE10132478A priority Critical patent/DE10132478C1/de
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Priority to ES02754692T priority patent/ES2236552T3/es
Priority to EP02754692A priority patent/EP1427869B1/fr
Priority to BRPI0210829-1A priority patent/BR0210829B1/pt
Priority to CA002450258A priority patent/CA2450258A1/fr
Priority to US10/494,217 priority patent/US20040245108A1/en
Priority to KR1020037017284A priority patent/KR100827259B1/ko
Priority to AU2002321069A priority patent/AU2002321069A1/en
Priority to MXPA03011772A priority patent/MXPA03011772A/es
Priority to PCT/EP2002/006654 priority patent/WO2003004725A2/fr
Priority to AT02754692T priority patent/ATE289633T1/de
Priority to JP2003510478A priority patent/JP4157838B2/ja
Priority to CNB028135822A priority patent/CN1232677C/zh
Priority to DE60203050T priority patent/DE60203050T2/de
Priority to TW091113655A priority patent/TWI279456B/zh
Priority to MYPI20022395A priority patent/MY130423A/en
Application granted granted Critical
Publication of DE10132478C1 publication Critical patent/DE10132478C1/de
Priority to HK04105703A priority patent/HK1062926A1/xx
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Electrolytic Production Of Metals (AREA)
DE10132478A 2001-07-03 2001-07-03 Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung Expired - Fee Related DE10132478C1 (de)

Priority Applications (17)

Application Number Priority Date Filing Date Title
DE10132478A DE10132478C1 (de) 2001-07-03 2001-07-03 Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung
AT02754692T ATE289633T1 (de) 2001-07-03 2002-06-17 Regenerationsverfahren für eine plattierungslösung
BRPI0210829-1A BR0210829B1 (pt) 2001-07-03 2002-06-17 processo de regeneraÇço de um banho de revestimento contendo Íons em um estado de alta oxidaÇço durante a deposiÇço de uma camada metÁlica.
CA002450258A CA2450258A1 (fr) 2001-07-03 2002-06-17 Procede de regeneration pour solution de placage
US10/494,217 US20040245108A1 (en) 2001-07-03 2002-06-17 Regeneration method for a plating solution
KR1020037017284A KR100827259B1 (ko) 2001-07-03 2002-06-17 금속층의 침착방법 및 용액의 재생방법
AU2002321069A AU2002321069A1 (en) 2001-07-03 2002-06-17 Regeneration method for a plating solution
MXPA03011772A MXPA03011772A (es) 2001-07-03 2002-06-17 Metodo de regeneracion para una solucion de galvanoplastia.
ES02754692T ES2236552T3 (es) 2001-07-03 2002-06-17 Metodo para regenerar una solucion de chapado.
EP02754692A EP1427869B1 (fr) 2001-07-03 2002-06-17 Procede de regeneration pour solution de plaquage
JP2003510478A JP4157838B2 (ja) 2001-07-03 2002-06-17 めっき溶液の再生方法
CNB028135822A CN1232677C (zh) 2001-07-03 2002-06-17 电镀液的再生方法
DE60203050T DE60203050T2 (de) 2001-07-03 2002-06-17 Regenerationsverfahren für eine plattierungslösung
PCT/EP2002/006654 WO2003004725A2 (fr) 2001-07-03 2002-06-17 Procede de regeneration pour solution de placage
TW091113655A TWI279456B (en) 2001-07-03 2002-06-21 Regeneration method for a plating solution
MYPI20022395A MY130423A (en) 2001-07-03 2002-06-26 Regeneration method for a plating solution
HK04105703A HK1062926A1 (en) 2001-07-03 2004-08-03 Regeneration method for a plating solution.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10132478A DE10132478C1 (de) 2001-07-03 2001-07-03 Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung

Publications (1)

Publication Number Publication Date
DE10132478C1 true DE10132478C1 (de) 2003-04-30

Family

ID=7690626

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10132478A Expired - Fee Related DE10132478C1 (de) 2001-07-03 2001-07-03 Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung
DE60203050T Expired - Lifetime DE60203050T2 (de) 2001-07-03 2002-06-17 Regenerationsverfahren für eine plattierungslösung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60203050T Expired - Lifetime DE60203050T2 (de) 2001-07-03 2002-06-17 Regenerationsverfahren für eine plattierungslösung

Country Status (16)

Country Link
US (1) US20040245108A1 (fr)
EP (1) EP1427869B1 (fr)
JP (1) JP4157838B2 (fr)
KR (1) KR100827259B1 (fr)
CN (1) CN1232677C (fr)
AT (1) ATE289633T1 (fr)
AU (1) AU2002321069A1 (fr)
BR (1) BR0210829B1 (fr)
CA (1) CA2450258A1 (fr)
DE (2) DE10132478C1 (fr)
ES (1) ES2236552T3 (fr)
HK (1) HK1062926A1 (fr)
MX (1) MXPA03011772A (fr)
MY (1) MY130423A (fr)
TW (1) TWI279456B (fr)
WO (1) WO2003004725A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009060676A1 (de) 2009-12-28 2011-06-30 Atotech Deutschland GmbH, 10553 Verfahren und Vorrichtung zum nasschemischen Behandeln von Behandlungsgut

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GEP20105122B (en) 2003-07-16 2010-11-25 Interdigital Tech Corp Method and system for transferring information between network management entities of a wireless communication system
EP1630252A1 (fr) * 2004-08-27 2006-03-01 ATOTECH Deutschland GmbH Procédé de dépot d'etain ou d'alliages d'etain sur des substrats contenant de l'antimoine
JP4998704B2 (ja) 2007-01-22 2012-08-15 上村工業株式会社 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法
EP2298960A1 (fr) 2009-08-24 2011-03-23 ATOTECH Deutschland GmbH Procédé de placage anélectrolytique pour l'étain et les alliages d'étain
CN102586851B (zh) * 2011-01-06 2015-03-04 宝山钢铁股份有限公司 一种缓解并减少镀锡溶液产生锡泥的电解方法
EP2671968B1 (fr) * 2012-06-05 2014-11-26 ATOTECH Deutschland GmbH Procédé et appareil de régénération pour régénérer un composition de placage
CN106868577B (zh) * 2015-05-12 2018-06-08 江苏理工学院 减少污染的超临界复合电铸体系回收利用装置
CN106011810B (zh) * 2016-06-02 2019-01-11 东莞市智源电子科技有限公司 铜基材的化学锡镀液中四价锡的去除工艺
US20190271093A1 (en) * 2016-10-24 2019-09-05 Atotech Deutschland Gmbh A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method
CN110387540A (zh) * 2019-08-30 2019-10-29 江苏上达电子有限公司 一种化锡槽内二价锡的补充系统及方法
CN111676470A (zh) * 2020-05-29 2020-09-18 广东天承科技有限公司 一种简易可溶性的高价锡的还原方法
CN114232030B (zh) * 2021-12-23 2023-04-18 广东鑫菱环境科技有限公司 一种pcb甲基磺酸退锡废液循环再生方法
WO2024116456A1 (fr) * 2022-11-28 2024-06-06 株式会社村田製作所 Procédé et dispositif de régénération de composition de placage

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
EP0545216A2 (fr) * 1991-11-27 1993-06-09 Mcgean-Rohco, Inc. Procédé pour prolonger la durée de vie d'un bain de métallisation par déplacement
JPH06256999A (ja) * 1993-03-05 1994-09-13 Kawasaki Steel Corp 錫めっき液を回収再生する方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1527576A (en) * 1923-02-19 1925-02-24 Wheeling Steel & Iron Company Process of coating conducting materials with tin
US3784455A (en) * 1971-12-28 1974-01-08 Western Electric Co Methods of electrolytic regenerative etching and metal recovery
DE2401719B2 (de) * 1974-01-15 1978-01-19 Vereinigte Aluminium Werke Ag, 5300 Bonn Verfahren zur regenerierung und standzeiterhoehung von zinnhaltigen metallsalzloesungen, die zur elektrolytischen faerbung von anodisiertem aluminium unter einwirkung von wechselstrom eingesetzt werden
JPS5226315A (en) * 1975-08-25 1977-02-26 Fuji Photo Film Co Ltd Process for the recovery of silver from fixer
DE2742718C2 (de) * 1977-09-22 1984-04-19 ESTEL HOOGOVENS B.V., 1970 Ijmuiden Verfahren und Vorrichtung zur Regenerierung eines Verzinnungselektrolyten
US4432844A (en) * 1982-01-28 1984-02-21 Fujisash Company Process for regeneration of electrolyte containing tin salts by reducing the same
DE3634710A1 (de) * 1986-10-11 1988-04-21 Ver Glaswerke Gmbh Vorrichtung zum vakuumbeschichten einer glasscheibe durch reaktive kathodenzerstaeubung
US6280596B1 (en) * 1995-05-23 2001-08-28 Weirton Steel Corporation Electrolytic tinplating of steel substrate and apparatus
US5705048A (en) * 1996-03-27 1998-01-06 Oxley Research, Inc. Apparatus and a process for regenerating a CUCl2 etchant
DE19719020A1 (de) * 1997-05-07 1998-11-12 Km Europa Metal Ag Verfahren und Vorrichtung zum Regenerieren von Verzinnungslösungen
US6251255B1 (en) * 1998-12-22 2001-06-26 Precision Process Equipment, Inc. Apparatus and method for electroplating tin with insoluble anodes
JP3455709B2 (ja) * 1999-04-06 2003-10-14 株式会社大和化成研究所 めっき方法とそれに用いるめっき液前駆体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
EP0545216A2 (fr) * 1991-11-27 1993-06-09 Mcgean-Rohco, Inc. Procédé pour prolonger la durée de vie d'un bain de métallisation par déplacement
JPH06256999A (ja) * 1993-03-05 1994-09-13 Kawasaki Steel Corp 錫めっき液を回収再生する方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009060676A1 (de) 2009-12-28 2011-06-30 Atotech Deutschland GmbH, 10553 Verfahren und Vorrichtung zum nasschemischen Behandeln von Behandlungsgut
WO2011079950A1 (fr) 2009-12-28 2011-07-07 Atotech Deutschland Gmbh Procédé et dispositif de traitement chimique humide de produits à traiter

Also Published As

Publication number Publication date
JP4157838B2 (ja) 2008-10-01
WO2003004725A3 (fr) 2004-04-15
BR0210829B1 (pt) 2011-07-26
US20040245108A1 (en) 2004-12-09
ATE289633T1 (de) 2005-03-15
MXPA03011772A (es) 2004-04-02
HK1062926A1 (en) 2004-12-03
KR100827259B1 (ko) 2008-05-07
ES2236552T3 (es) 2005-07-16
JP2004534151A (ja) 2004-11-11
EP1427869B1 (fr) 2005-02-23
BR0210829A (pt) 2005-05-03
EP1427869A2 (fr) 2004-06-16
DE60203050T2 (de) 2006-02-23
WO2003004725A2 (fr) 2003-01-16
CN1524132A (zh) 2004-08-25
TWI279456B (en) 2007-04-21
DE60203050D1 (de) 2005-03-31
CA2450258A1 (fr) 2003-01-16
AU2002321069A1 (en) 2003-01-21
MY130423A (en) 2007-06-29
KR20040030725A (ko) 2004-04-09
CN1232677C (zh) 2005-12-21

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Legal Events

Date Code Title Description
8100 Publication of patent without earlier publication of application
8304 Grant after examination procedure
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee