MXPA03011772A - Metodo de regeneracion para una solucion de galvanoplastia. - Google Patents
Metodo de regeneracion para una solucion de galvanoplastia.Info
- Publication number
- MXPA03011772A MXPA03011772A MXPA03011772A MXPA03011772A MXPA03011772A MX PA03011772 A MXPA03011772 A MX PA03011772A MX PA03011772 A MXPA03011772 A MX PA03011772A MX PA03011772 A MXPA03011772 A MX PA03011772A MX PA03011772 A MXPA03011772 A MX PA03011772A
- Authority
- MX
- Mexico
- Prior art keywords
- tin
- ions
- solution
- regeneration
- plating solution
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
La invencion se refiere a un metodo para depositar una capa de metal y a un metodo para regenerar una solucion que contiene iones de metal en un estado de oxidacion alto. Para regenerar iones de estano consumidos de una solucion de estanado por medio de deposicion de metal, se ha conocido en la tecnica llevar a cabo la solucion de galvanoplastia sobre estano metalico, para provocar se formen iones de estano (II). Sin embargo, la cantidad de estano contenido en los banos asi regenerados, se incrementa lenta y continuamente. La solucion a este problema es utilizar una celda de regeneracion electrolitica que esta provista con al menos un catodo auxiliar y con al menos un anodo auxiliar. El estano que sirve para regenerar, es depositado en forma electrolitica a partir de la solucion dentro de al menos un catodo auxiliar en la celda de regeneracion electrolitica. La solucion se lleva sobre el estano que sirve para regeneracion a fin de reducir los iones de estana (IV) formados a iones de estano (II).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10132478A DE10132478C1 (de) | 2001-07-03 | 2001-07-03 | Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung |
PCT/EP2002/006654 WO2003004725A2 (en) | 2001-07-03 | 2002-06-17 | Regeneration method for a plating solution |
Publications (1)
Publication Number | Publication Date |
---|---|
MXPA03011772A true MXPA03011772A (es) | 2004-04-02 |
Family
ID=7690626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MXPA03011772A MXPA03011772A (es) | 2001-07-03 | 2002-06-17 | Metodo de regeneracion para una solucion de galvanoplastia. |
Country Status (16)
Country | Link |
---|---|
US (1) | US20040245108A1 (es) |
EP (1) | EP1427869B1 (es) |
JP (1) | JP4157838B2 (es) |
KR (1) | KR100827259B1 (es) |
CN (1) | CN1232677C (es) |
AT (1) | ATE289633T1 (es) |
AU (1) | AU2002321069A1 (es) |
BR (1) | BR0210829B1 (es) |
CA (1) | CA2450258A1 (es) |
DE (2) | DE10132478C1 (es) |
ES (1) | ES2236552T3 (es) |
HK (1) | HK1062926A1 (es) |
MX (1) | MXPA03011772A (es) |
MY (1) | MY130423A (es) |
TW (1) | TWI279456B (es) |
WO (1) | WO2003004725A2 (es) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130093154A (ko) | 2003-07-16 | 2013-08-21 | 인터디지탈 테크날러지 코포레이션 | 무선 통신 시스템의 네트워크 관리 엔티티들간의 정보 전송 방법 및 시스템 |
EP1630252A1 (de) * | 2004-08-27 | 2006-03-01 | ATOTECH Deutschland GmbH | Verfahren zur beschichtung von Substraten enthaltend Antimonverbindungen mit Zinn und Zinnlegierungen |
JP4998704B2 (ja) | 2007-01-22 | 2012-08-15 | 上村工業株式会社 | 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法 |
EP2298960A1 (en) | 2009-08-24 | 2011-03-23 | ATOTECH Deutschland GmbH | Method for electroless plating of tin and tin alloys |
DE102009060676B4 (de) | 2009-12-28 | 2015-07-23 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum nasschemischen Behandeln von Behandlungsgut |
CN102586851B (zh) * | 2011-01-06 | 2015-03-04 | 宝山钢铁股份有限公司 | 一种缓解并减少镀锡溶液产生锡泥的电解方法 |
EP2671968B1 (en) * | 2012-06-05 | 2014-11-26 | ATOTECH Deutschland GmbH | Method and regeneration apparatus for regenerating a plating composition |
CN106868577B (zh) * | 2015-05-12 | 2018-06-08 | 江苏理工学院 | 减少污染的超临界复合电铸体系回收利用装置 |
CN106011810B (zh) * | 2016-06-02 | 2019-01-11 | 东莞市智源电子科技有限公司 | 铜基材的化学锡镀液中四价锡的去除工艺 |
US20190271093A1 (en) * | 2016-10-24 | 2019-09-05 | Atotech Deutschland Gmbh | A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method |
CN110387540A (zh) * | 2019-08-30 | 2019-10-29 | 江苏上达电子有限公司 | 一种化锡槽内二价锡的补充系统及方法 |
CN111676470A (zh) * | 2020-05-29 | 2020-09-18 | 广东天承科技有限公司 | 一种简易可溶性的高价锡的还原方法 |
CN114232030B (zh) * | 2021-12-23 | 2023-04-18 | 广东鑫菱环境科技有限公司 | 一种pcb甲基磺酸退锡废液循环再生方法 |
WO2024116456A1 (ja) * | 2022-11-28 | 2024-06-06 | 株式会社村田製作所 | めっき組成物の再生方法および再生装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1527576A (en) * | 1923-02-19 | 1925-02-24 | Wheeling Steel & Iron Company | Process of coating conducting materials with tin |
US3784455A (en) * | 1971-12-28 | 1974-01-08 | Western Electric Co | Methods of electrolytic regenerative etching and metal recovery |
DE2401719B2 (de) * | 1974-01-15 | 1978-01-19 | Vereinigte Aluminium Werke Ag, 5300 Bonn | Verfahren zur regenerierung und standzeiterhoehung von zinnhaltigen metallsalzloesungen, die zur elektrolytischen faerbung von anodisiertem aluminium unter einwirkung von wechselstrom eingesetzt werden |
JPS5226315A (en) * | 1975-08-25 | 1977-02-26 | Fuji Photo Film Co Ltd | Process for the recovery of silver from fixer |
DE2742718C2 (de) * | 1977-09-22 | 1984-04-19 | ESTEL HOOGOVENS B.V., 1970 Ijmuiden | Verfahren und Vorrichtung zur Regenerierung eines Verzinnungselektrolyten |
US4432844A (en) * | 1982-01-28 | 1984-02-21 | Fujisash Company | Process for regeneration of electrolyte containing tin salts by reducing the same |
US4715894A (en) * | 1985-08-29 | 1987-12-29 | Techno Instruments Investments 1983 Ltd. | Use of immersion tin and tin alloys as a bonding medium for multilayer circuits |
DE3634710A1 (de) * | 1986-10-11 | 1988-04-21 | Ver Glaswerke Gmbh | Vorrichtung zum vakuumbeschichten einer glasscheibe durch reaktive kathodenzerstaeubung |
CA2083196C (en) * | 1991-11-27 | 1998-02-17 | Randal D. King | Process for extending the life of a displacement plating bath |
JPH06256999A (ja) * | 1993-03-05 | 1994-09-13 | Kawasaki Steel Corp | 錫めっき液を回収再生する方法 |
US6280596B1 (en) * | 1995-05-23 | 2001-08-28 | Weirton Steel Corporation | Electrolytic tinplating of steel substrate and apparatus |
US5705048A (en) * | 1996-03-27 | 1998-01-06 | Oxley Research, Inc. | Apparatus and a process for regenerating a CUCl2 etchant |
DE19719020A1 (de) * | 1997-05-07 | 1998-11-12 | Km Europa Metal Ag | Verfahren und Vorrichtung zum Regenerieren von Verzinnungslösungen |
US6251255B1 (en) * | 1998-12-22 | 2001-06-26 | Precision Process Equipment, Inc. | Apparatus and method for electroplating tin with insoluble anodes |
JP3455709B2 (ja) * | 1999-04-06 | 2003-10-14 | 株式会社大和化成研究所 | めっき方法とそれに用いるめっき液前駆体 |
-
2001
- 2001-07-03 DE DE10132478A patent/DE10132478C1/de not_active Expired - Fee Related
-
2002
- 2002-06-17 AU AU2002321069A patent/AU2002321069A1/en not_active Abandoned
- 2002-06-17 BR BRPI0210829-1A patent/BR0210829B1/pt not_active IP Right Cessation
- 2002-06-17 MX MXPA03011772A patent/MXPA03011772A/es active IP Right Grant
- 2002-06-17 AT AT02754692T patent/ATE289633T1/de active
- 2002-06-17 US US10/494,217 patent/US20040245108A1/en not_active Abandoned
- 2002-06-17 ES ES02754692T patent/ES2236552T3/es not_active Expired - Lifetime
- 2002-06-17 DE DE60203050T patent/DE60203050T2/de not_active Expired - Lifetime
- 2002-06-17 KR KR1020037017284A patent/KR100827259B1/ko active IP Right Grant
- 2002-06-17 CN CNB028135822A patent/CN1232677C/zh not_active Expired - Lifetime
- 2002-06-17 EP EP02754692A patent/EP1427869B1/en not_active Expired - Lifetime
- 2002-06-17 CA CA002450258A patent/CA2450258A1/en not_active Abandoned
- 2002-06-17 JP JP2003510478A patent/JP4157838B2/ja not_active Expired - Lifetime
- 2002-06-17 WO PCT/EP2002/006654 patent/WO2003004725A2/en active IP Right Grant
- 2002-06-21 TW TW091113655A patent/TWI279456B/zh not_active IP Right Cessation
- 2002-06-26 MY MYPI20022395A patent/MY130423A/en unknown
-
2004
- 2004-08-03 HK HK04105703A patent/HK1062926A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
BR0210829B1 (pt) | 2011-07-26 |
ES2236552T3 (es) | 2005-07-16 |
EP1427869B1 (en) | 2005-02-23 |
BR0210829A (pt) | 2005-05-03 |
EP1427869A2 (en) | 2004-06-16 |
DE10132478C1 (de) | 2003-04-30 |
JP4157838B2 (ja) | 2008-10-01 |
TWI279456B (en) | 2007-04-21 |
KR20040030725A (ko) | 2004-04-09 |
DE60203050D1 (de) | 2005-03-31 |
KR100827259B1 (ko) | 2008-05-07 |
HK1062926A1 (en) | 2004-12-03 |
JP2004534151A (ja) | 2004-11-11 |
MY130423A (en) | 2007-06-29 |
CA2450258A1 (en) | 2003-01-16 |
US20040245108A1 (en) | 2004-12-09 |
DE60203050T2 (de) | 2006-02-23 |
WO2003004725A3 (en) | 2004-04-15 |
WO2003004725A2 (en) | 2003-01-16 |
CN1232677C (zh) | 2005-12-21 |
CN1524132A (zh) | 2004-08-25 |
ATE289633T1 (de) | 2005-03-15 |
AU2002321069A1 (en) | 2003-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration |