BR0210829A - Processo de regeneração para uma solução de revestimento - Google Patents
Processo de regeneração para uma solução de revestimentoInfo
- Publication number
- BR0210829A BR0210829A BR0210829-1A BR0210829A BR0210829A BR 0210829 A BR0210829 A BR 0210829A BR 0210829 A BR0210829 A BR 0210829A BR 0210829 A BR0210829 A BR 0210829A
- Authority
- BR
- Brazil
- Prior art keywords
- tin
- ions
- solution
- regeneration
- serving
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
"PROCESSO DE REGENERAçãO PARA UMA SOLUçãO DE REVESTIMENTO". A presente invenção refere-se a um processo de deposição de uma camada de metal e um processo de regeneração de uma solução contendo íons de metal em um estado de alta oxidação. Para regenerar íons de estanho consumidos a partir de uma solução de revestimento de estanho através de deposição de metal, é conhecido na técnica carrear a solução de revestimento sobre estanho metálico para causar formação de íons estanho (II). Entretanto, a quantidade de estanho contida nos banhos assim regenerados aumenta lenta e continuamente. A solução para este problema é utilizar uma célula de regeneração eletrolítica que é provida com pelo menos um catodo auxiliar e com pelo menos um anodo auxiliar. Estanho servindo para regeneração é eletroliticamente depositado a partir da solução sobre o pelo menos um catodo auxiliar na célula de regeneração eletrolítica. A solução é carreada sobre o estanho servindo para regeneração a fim de se reduzir íons estanho (IV) formados a íons estanho (II).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10132478.2 | 2001-07-03 | ||
| DE10132478A DE10132478C1 (de) | 2001-07-03 | 2001-07-03 | Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung |
| PCT/EP2002/006654 WO2003004725A2 (en) | 2001-07-03 | 2002-06-17 | Regeneration method for a plating solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BR0210829A true BR0210829A (pt) | 2005-05-03 |
| BR0210829B1 BR0210829B1 (pt) | 2011-07-26 |
Family
ID=7690626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0210829-1A BR0210829B1 (pt) | 2001-07-03 | 2002-06-17 | processo de regeneraÇço de um banho de revestimento contendo Íons em um estado de alta oxidaÇço durante a deposiÇço de uma camada metÁlica. |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US20040245108A1 (pt) |
| EP (1) | EP1427869B1 (pt) |
| JP (1) | JP4157838B2 (pt) |
| KR (1) | KR100827259B1 (pt) |
| CN (1) | CN1232677C (pt) |
| AT (1) | ATE289633T1 (pt) |
| AU (1) | AU2002321069A1 (pt) |
| BR (1) | BR0210829B1 (pt) |
| CA (1) | CA2450258A1 (pt) |
| DE (2) | DE10132478C1 (pt) |
| ES (1) | ES2236552T3 (pt) |
| HK (1) | HK1062926A1 (pt) |
| MX (1) | MXPA03011772A (pt) |
| MY (1) | MY130423A (pt) |
| TW (1) | TWI279456B (pt) |
| WO (1) | WO2003004725A2 (pt) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GEP20105122B (en) | 2003-07-16 | 2010-11-25 | Interdigital Tech Corp | Method and system for transferring information between network management entities of a wireless communication system |
| EP1630252A1 (de) * | 2004-08-27 | 2006-03-01 | ATOTECH Deutschland GmbH | Verfahren zur beschichtung von Substraten enthaltend Antimonverbindungen mit Zinn und Zinnlegierungen |
| JP4998704B2 (ja) | 2007-01-22 | 2012-08-15 | 上村工業株式会社 | 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法 |
| EP2298960A1 (en) | 2009-08-24 | 2011-03-23 | ATOTECH Deutschland GmbH | Method for electroless plating of tin and tin alloys |
| DE102009060676B4 (de) | 2009-12-28 | 2015-07-23 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum nasschemischen Behandeln von Behandlungsgut |
| CN102586851B (zh) * | 2011-01-06 | 2015-03-04 | 宝山钢铁股份有限公司 | 一种缓解并减少镀锡溶液产生锡泥的电解方法 |
| EP2671968B1 (en) * | 2012-06-05 | 2014-11-26 | ATOTECH Deutschland GmbH | Method and regeneration apparatus for regenerating a plating composition |
| CN106811773B (zh) * | 2015-05-12 | 2018-06-08 | 江苏理工学院 | 一种超临界复合电铸体系回收利用装置 |
| CN106011810B (zh) * | 2016-06-02 | 2019-01-11 | 东莞市智源电子科技有限公司 | 铜基材的化学锡镀液中四价锡的去除工艺 |
| WO2018077874A1 (en) * | 2016-10-24 | 2018-05-03 | Atotech Deutschland Gmbh | A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method |
| CN110387540A (zh) * | 2019-08-30 | 2019-10-29 | 江苏上达电子有限公司 | 一种化锡槽内二价锡的补充系统及方法 |
| CN111676470A (zh) * | 2020-05-29 | 2020-09-18 | 广东天承科技有限公司 | 一种简易可溶性的高价锡的还原方法 |
| CN114232030B (zh) * | 2021-12-23 | 2023-04-18 | 广东鑫菱环境科技有限公司 | 一种pcb甲基磺酸退锡废液循环再生方法 |
| WO2024116456A1 (ja) * | 2022-11-28 | 2024-06-06 | 株式会社村田製作所 | めっき組成物の再生方法および再生装置 |
| CN116288292A (zh) * | 2023-03-20 | 2023-06-23 | 聂柱根 | 一种化学锡药水锡还原再生除铜装置 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1527576A (en) * | 1923-02-19 | 1925-02-24 | Wheeling Steel & Iron Company | Process of coating conducting materials with tin |
| US3784455A (en) * | 1971-12-28 | 1974-01-08 | Western Electric Co | Methods of electrolytic regenerative etching and metal recovery |
| DE2401719B2 (de) * | 1974-01-15 | 1978-01-19 | Vereinigte Aluminium Werke Ag, 5300 Bonn | Verfahren zur regenerierung und standzeiterhoehung von zinnhaltigen metallsalzloesungen, die zur elektrolytischen faerbung von anodisiertem aluminium unter einwirkung von wechselstrom eingesetzt werden |
| JPS5226315A (en) * | 1975-08-25 | 1977-02-26 | Fuji Photo Film Co Ltd | Process for the recovery of silver from fixer |
| DE2742718C2 (de) * | 1977-09-22 | 1984-04-19 | ESTEL HOOGOVENS B.V., 1970 Ijmuiden | Verfahren und Vorrichtung zur Regenerierung eines Verzinnungselektrolyten |
| US4432844A (en) * | 1982-01-28 | 1984-02-21 | Fujisash Company | Process for regeneration of electrolyte containing tin salts by reducing the same |
| US4715894A (en) * | 1985-08-29 | 1987-12-29 | Techno Instruments Investments 1983 Ltd. | Use of immersion tin and tin alloys as a bonding medium for multilayer circuits |
| DE3634710A1 (de) * | 1986-10-11 | 1988-04-21 | Ver Glaswerke Gmbh | Vorrichtung zum vakuumbeschichten einer glasscheibe durch reaktive kathodenzerstaeubung |
| CA2083196C (en) * | 1991-11-27 | 1998-02-17 | Randal D. King | Process for extending the life of a displacement plating bath |
| JPH06256999A (ja) * | 1993-03-05 | 1994-09-13 | Kawasaki Steel Corp | 錫めっき液を回収再生する方法 |
| US6280596B1 (en) * | 1995-05-23 | 2001-08-28 | Weirton Steel Corporation | Electrolytic tinplating of steel substrate and apparatus |
| US5705048A (en) * | 1996-03-27 | 1998-01-06 | Oxley Research, Inc. | Apparatus and a process for regenerating a CUCl2 etchant |
| DE19719020A1 (de) * | 1997-05-07 | 1998-11-12 | Km Europa Metal Ag | Verfahren und Vorrichtung zum Regenerieren von Verzinnungslösungen |
| US6251255B1 (en) * | 1998-12-22 | 2001-06-26 | Precision Process Equipment, Inc. | Apparatus and method for electroplating tin with insoluble anodes |
| JP3455709B2 (ja) * | 1999-04-06 | 2003-10-14 | 株式会社大和化成研究所 | めっき方法とそれに用いるめっき液前駆体 |
-
2001
- 2001-07-03 DE DE10132478A patent/DE10132478C1/de not_active Expired - Fee Related
-
2002
- 2002-06-17 KR KR1020037017284A patent/KR100827259B1/ko active IP Right Grant
- 2002-06-17 AT AT02754692T patent/ATE289633T1/de active
- 2002-06-17 DE DE60203050T patent/DE60203050T2/de not_active Expired - Lifetime
- 2002-06-17 BR BRPI0210829-1A patent/BR0210829B1/pt not_active IP Right Cessation
- 2002-06-17 EP EP02754692A patent/EP1427869B1/en not_active Expired - Lifetime
- 2002-06-17 US US10/494,217 patent/US20040245108A1/en not_active Abandoned
- 2002-06-17 MX MXPA03011772A patent/MXPA03011772A/es active IP Right Grant
- 2002-06-17 ES ES02754692T patent/ES2236552T3/es not_active Expired - Lifetime
- 2002-06-17 WO PCT/EP2002/006654 patent/WO2003004725A2/en active IP Right Grant
- 2002-06-17 AU AU2002321069A patent/AU2002321069A1/en not_active Abandoned
- 2002-06-17 CA CA002450258A patent/CA2450258A1/en not_active Abandoned
- 2002-06-17 CN CNB028135822A patent/CN1232677C/zh not_active Expired - Lifetime
- 2002-06-17 JP JP2003510478A patent/JP4157838B2/ja not_active Expired - Lifetime
- 2002-06-21 TW TW091113655A patent/TWI279456B/zh not_active IP Right Cessation
- 2002-06-26 MY MYPI20022395A patent/MY130423A/en unknown
-
2004
- 2004-08-03 HK HK04105703A patent/HK1062926A1/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE10132478C1 (de) | 2003-04-30 |
| KR100827259B1 (ko) | 2008-05-07 |
| HK1062926A1 (en) | 2004-12-03 |
| WO2003004725A2 (en) | 2003-01-16 |
| EP1427869B1 (en) | 2005-02-23 |
| ATE289633T1 (de) | 2005-03-15 |
| CN1524132A (zh) | 2004-08-25 |
| US20040245108A1 (en) | 2004-12-09 |
| DE60203050D1 (de) | 2005-03-31 |
| MY130423A (en) | 2007-06-29 |
| DE60203050T2 (de) | 2006-02-23 |
| BR0210829B1 (pt) | 2011-07-26 |
| JP4157838B2 (ja) | 2008-10-01 |
| CN1232677C (zh) | 2005-12-21 |
| AU2002321069A1 (en) | 2003-01-21 |
| WO2003004725A3 (en) | 2004-04-15 |
| MXPA03011772A (es) | 2004-04-02 |
| CA2450258A1 (en) | 2003-01-16 |
| TWI279456B (en) | 2007-04-21 |
| KR20040030725A (ko) | 2004-04-09 |
| ES2236552T3 (es) | 2005-07-16 |
| JP2004534151A (ja) | 2004-11-11 |
| EP1427869A2 (en) | 2004-06-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
| B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
| B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
| B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 17/06/2002, OBSERVADAS AS CONDICOES LEGAIS. |
|
| B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE A 14A ANUIDADE. |
|
| B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2385 DE 20-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |