HK1062926A1 - Regeneration method for a plating solution. - Google Patents
Regeneration method for a plating solution.Info
- Publication number
- HK1062926A1 HK1062926A1 HK04105703A HK04105703A HK1062926A1 HK 1062926 A1 HK1062926 A1 HK 1062926A1 HK 04105703 A HK04105703 A HK 04105703A HK 04105703 A HK04105703 A HK 04105703A HK 1062926 A1 HK1062926 A1 HK 1062926A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- tin
- ions
- solution
- regeneration
- plating solution
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
The invention relates to a method of depositing a layer of metal and to a method of regenerating a solution containing metal ions in a high oxidation state. To regenerate tin ions consumed from a tin plating solution by metal deposition, it has been known in the art to carry the plating solution over metallic tin to cause tin (II) ions to form. However, the amount of tin contained in thus regenerated baths slowly and continuously increases. The solution to this problem is to utilize an electrolytic regeneration cell that is provided with at least one auxiliary cathode and with at least one auxiliary anode. Tin serving for regeneration is electrolytically deposited from the solution onto the at least one auxiliary cathode in the electrolytic regeneration cell. The solution is carried over the tin serving for regeneration in order to reduce formed tin (IV) ions to tin (II) ions.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10132478A DE10132478C1 (en) | 2001-07-03 | 2001-07-03 | Process for depositing a metal layer and process for regenerating a solution containing metal ions in a high oxidation state |
PCT/EP2002/006654 WO2003004725A2 (en) | 2001-07-03 | 2002-06-17 | Regeneration method for a plating solution |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1062926A1 true HK1062926A1 (en) | 2004-12-03 |
Family
ID=7690626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK04105703A HK1062926A1 (en) | 2001-07-03 | 2004-08-03 | Regeneration method for a plating solution. |
Country Status (16)
Country | Link |
---|---|
US (1) | US20040245108A1 (en) |
EP (1) | EP1427869B1 (en) |
JP (1) | JP4157838B2 (en) |
KR (1) | KR100827259B1 (en) |
CN (1) | CN1232677C (en) |
AT (1) | ATE289633T1 (en) |
AU (1) | AU2002321069A1 (en) |
BR (1) | BR0210829B1 (en) |
CA (1) | CA2450258A1 (en) |
DE (2) | DE10132478C1 (en) |
ES (1) | ES2236552T3 (en) |
HK (1) | HK1062926A1 (en) |
MX (1) | MXPA03011772A (en) |
MY (1) | MY130423A (en) |
TW (1) | TWI279456B (en) |
WO (1) | WO2003004725A2 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101357385B1 (en) | 2003-07-16 | 2014-02-03 | 인터디지탈 테크날러지 코포레이션 | Method and system for transferring information between network management entities of a wireless communication system |
EP1630252A1 (en) * | 2004-08-27 | 2006-03-01 | ATOTECH Deutschland GmbH | Process for coating antimony containing substrate with tin or tin alloys |
JP4998704B2 (en) | 2007-01-22 | 2012-08-15 | 上村工業株式会社 | Method for forming substituted tin alloy plating film, substituted tin alloy plating bath, and method for maintaining plating performance |
EP2298960A1 (en) | 2009-08-24 | 2011-03-23 | ATOTECH Deutschland GmbH | Method for electroless plating of tin and tin alloys |
DE102009060676B4 (en) | 2009-12-28 | 2015-07-23 | Atotech Deutschland Gmbh | Process and device for wet-chemical treatment of items to be treated |
CN102586851B (en) * | 2011-01-06 | 2015-03-04 | 宝山钢铁股份有限公司 | Electrolytic method for relieving and reducing tin sludge generated in tin plating solution |
EP2671968B1 (en) * | 2012-06-05 | 2014-11-26 | ATOTECH Deutschland GmbH | Method and regeneration apparatus for regenerating a plating composition |
CN106811773B (en) * | 2015-05-12 | 2018-06-08 | 江苏理工学院 | Supercritical composite electroforming system recycling device |
CN106011810B (en) * | 2016-06-02 | 2019-01-11 | 东莞市智源电子科技有限公司 | Stannic removal technique in the chemical tinning solution of Copper base material |
KR102404045B1 (en) * | 2016-10-24 | 2022-05-30 | 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 | Method for depositing a tin layer on a metal substrate and use of a structure comprising the tin layer and a nickel/phosphorus alloy underlayer by the method |
CN110387540A (en) * | 2019-08-30 | 2019-10-29 | 江苏上达电子有限公司 | Stannous replenishment system and method in a kind of tin dissolving slot |
CN111676470A (en) * | 2020-05-29 | 2020-09-18 | 广东天承科技有限公司 | Simple and soluble high-valence tin reduction method |
CN114232030B (en) * | 2021-12-23 | 2023-04-18 | 广东鑫菱环境科技有限公司 | PCB methanesulfonic acid tin stripping waste liquid recycling method |
WO2024116456A1 (en) * | 2022-11-28 | 2024-06-06 | 株式会社村田製作所 | Method and device for regenerating plating composition |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1527576A (en) * | 1923-02-19 | 1925-02-24 | Wheeling Steel & Iron Company | Process of coating conducting materials with tin |
US3784455A (en) * | 1971-12-28 | 1974-01-08 | Western Electric Co | Methods of electrolytic regenerative etching and metal recovery |
DE2401719B2 (en) * | 1974-01-15 | 1978-01-19 | Vereinigte Aluminium Werke Ag, 5300 Bonn | METHOD FOR REGENERATING AND INCREASING THE SERVICE LIFE OF TIN-CONTAINING METAL SALT SOLUTIONS USED FOR THE ELECTROLYTIC COLORING OF ANODISED ALUMINUM UNDER THE ACTION OF AC |
JPS5226315A (en) * | 1975-08-25 | 1977-02-26 | Fuji Photo Film Co Ltd | Process for the recovery of silver from fixer |
DE2742718C2 (en) * | 1977-09-22 | 1984-04-19 | ESTEL HOOGOVENS B.V., 1970 Ijmuiden | Method and device for regenerating a tin-plating electrolyte |
US4432844A (en) * | 1982-01-28 | 1984-02-21 | Fujisash Company | Process for regeneration of electrolyte containing tin salts by reducing the same |
US4715894A (en) * | 1985-08-29 | 1987-12-29 | Techno Instruments Investments 1983 Ltd. | Use of immersion tin and tin alloys as a bonding medium for multilayer circuits |
DE3634710A1 (en) * | 1986-10-11 | 1988-04-21 | Ver Glaswerke Gmbh | DEVICE FOR VACUUM COATING A GLASS DISC BY REACTIVE CATHODAL SPRAYING |
CA2083196C (en) * | 1991-11-27 | 1998-02-17 | Randal D. King | Process for extending the life of a displacement plating bath |
JPH06256999A (en) * | 1993-03-05 | 1994-09-13 | Kawasaki Steel Corp | Method for recovering and regenerating tin plating liquid |
US6280596B1 (en) * | 1995-05-23 | 2001-08-28 | Weirton Steel Corporation | Electrolytic tinplating of steel substrate and apparatus |
US5705048A (en) * | 1996-03-27 | 1998-01-06 | Oxley Research, Inc. | Apparatus and a process for regenerating a CUCl2 etchant |
DE19719020A1 (en) * | 1997-05-07 | 1998-11-12 | Km Europa Metal Ag | Method and device for regenerating tinning solutions |
US6251255B1 (en) * | 1998-12-22 | 2001-06-26 | Precision Process Equipment, Inc. | Apparatus and method for electroplating tin with insoluble anodes |
JP3455709B2 (en) * | 1999-04-06 | 2003-10-14 | 株式会社大和化成研究所 | Plating method and plating solution precursor used for it |
-
2001
- 2001-07-03 DE DE10132478A patent/DE10132478C1/en not_active Expired - Fee Related
-
2002
- 2002-06-17 WO PCT/EP2002/006654 patent/WO2003004725A2/en active IP Right Grant
- 2002-06-17 BR BRPI0210829-1A patent/BR0210829B1/en not_active IP Right Cessation
- 2002-06-17 US US10/494,217 patent/US20040245108A1/en not_active Abandoned
- 2002-06-17 JP JP2003510478A patent/JP4157838B2/en not_active Expired - Lifetime
- 2002-06-17 KR KR1020037017284A patent/KR100827259B1/en active IP Right Grant
- 2002-06-17 CN CNB028135822A patent/CN1232677C/en not_active Expired - Lifetime
- 2002-06-17 AU AU2002321069A patent/AU2002321069A1/en not_active Abandoned
- 2002-06-17 AT AT02754692T patent/ATE289633T1/en active
- 2002-06-17 ES ES02754692T patent/ES2236552T3/en not_active Expired - Lifetime
- 2002-06-17 CA CA002450258A patent/CA2450258A1/en not_active Abandoned
- 2002-06-17 MX MXPA03011772A patent/MXPA03011772A/en active IP Right Grant
- 2002-06-17 DE DE60203050T patent/DE60203050T2/en not_active Expired - Lifetime
- 2002-06-17 EP EP02754692A patent/EP1427869B1/en not_active Expired - Lifetime
- 2002-06-21 TW TW091113655A patent/TWI279456B/en not_active IP Right Cessation
- 2002-06-26 MY MYPI20022395A patent/MY130423A/en unknown
-
2004
- 2004-08-03 HK HK04105703A patent/HK1062926A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE10132478C1 (en) | 2003-04-30 |
KR20040030725A (en) | 2004-04-09 |
CN1232677C (en) | 2005-12-21 |
JP2004534151A (en) | 2004-11-11 |
WO2003004725A2 (en) | 2003-01-16 |
JP4157838B2 (en) | 2008-10-01 |
CA2450258A1 (en) | 2003-01-16 |
CN1524132A (en) | 2004-08-25 |
MY130423A (en) | 2007-06-29 |
BR0210829B1 (en) | 2011-07-26 |
DE60203050D1 (en) | 2005-03-31 |
DE60203050T2 (en) | 2006-02-23 |
ES2236552T3 (en) | 2005-07-16 |
EP1427869B1 (en) | 2005-02-23 |
US20040245108A1 (en) | 2004-12-09 |
MXPA03011772A (en) | 2004-04-02 |
BR0210829A (en) | 2005-05-03 |
EP1427869A2 (en) | 2004-06-16 |
AU2002321069A1 (en) | 2003-01-21 |
KR100827259B1 (en) | 2008-05-07 |
TWI279456B (en) | 2007-04-21 |
WO2003004725A3 (en) | 2004-04-15 |
ATE289633T1 (en) | 2005-03-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20150617 |