TWI279456B - Regeneration method for a plating solution - Google Patents
Regeneration method for a plating solution Download PDFInfo
- Publication number
- TWI279456B TWI279456B TW091113655A TW91113655A TWI279456B TW I279456 B TWI279456 B TW I279456B TW 091113655 A TW091113655 A TW 091113655A TW 91113655 A TW91113655 A TW 91113655A TW I279456 B TWI279456 B TW I279456B
- Authority
- TW
- Taiwan
- Prior art keywords
- tin
- regeneration
- metal
- auxiliary cathode
- auxiliary
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10132478A DE10132478C1 (de) | 2001-07-03 | 2001-07-03 | Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung |
Publications (1)
Publication Number | Publication Date |
---|---|
TWI279456B true TWI279456B (en) | 2007-04-21 |
Family
ID=7690626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW091113655A TWI279456B (en) | 2001-07-03 | 2002-06-21 | Regeneration method for a plating solution |
Country Status (16)
Country | Link |
---|---|
US (1) | US20040245108A1 (es) |
EP (1) | EP1427869B1 (es) |
JP (1) | JP4157838B2 (es) |
KR (1) | KR100827259B1 (es) |
CN (1) | CN1232677C (es) |
AT (1) | ATE289633T1 (es) |
AU (1) | AU2002321069A1 (es) |
BR (1) | BR0210829B1 (es) |
CA (1) | CA2450258A1 (es) |
DE (2) | DE10132478C1 (es) |
ES (1) | ES2236552T3 (es) |
HK (1) | HK1062926A1 (es) |
MX (1) | MXPA03011772A (es) |
MY (1) | MY130423A (es) |
TW (1) | TWI279456B (es) |
WO (1) | WO2003004725A2 (es) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GEP20105122B (en) | 2003-07-16 | 2010-11-25 | Interdigital Tech Corp | Method and system for transferring information between network management entities of a wireless communication system |
EP1630252A1 (de) * | 2004-08-27 | 2006-03-01 | ATOTECH Deutschland GmbH | Verfahren zur beschichtung von Substraten enthaltend Antimonverbindungen mit Zinn und Zinnlegierungen |
JP4998704B2 (ja) | 2007-01-22 | 2012-08-15 | 上村工業株式会社 | 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法 |
EP2298960A1 (en) | 2009-08-24 | 2011-03-23 | ATOTECH Deutschland GmbH | Method for electroless plating of tin and tin alloys |
DE102009060676B4 (de) | 2009-12-28 | 2015-07-23 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum nasschemischen Behandeln von Behandlungsgut |
CN102586851B (zh) * | 2011-01-06 | 2015-03-04 | 宝山钢铁股份有限公司 | 一种缓解并减少镀锡溶液产生锡泥的电解方法 |
EP2671968B1 (en) * | 2012-06-05 | 2014-11-26 | ATOTECH Deutschland GmbH | Method and regeneration apparatus for regenerating a plating composition |
CN106811773B (zh) * | 2015-05-12 | 2018-06-08 | 江苏理工学院 | 一种超临界复合电铸体系回收利用装置 |
CN106011810B (zh) * | 2016-06-02 | 2019-01-11 | 东莞市智源电子科技有限公司 | 铜基材的化学锡镀液中四价锡的去除工艺 |
WO2018077874A1 (en) * | 2016-10-24 | 2018-05-03 | Atotech Deutschland Gmbh | A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method |
CN110387540A (zh) * | 2019-08-30 | 2019-10-29 | 江苏上达电子有限公司 | 一种化锡槽内二价锡的补充系统及方法 |
CN111676470A (zh) * | 2020-05-29 | 2020-09-18 | 广东天承科技有限公司 | 一种简易可溶性的高价锡的还原方法 |
CN114232030B (zh) * | 2021-12-23 | 2023-04-18 | 广东鑫菱环境科技有限公司 | 一种pcb甲基磺酸退锡废液循环再生方法 |
WO2024116456A1 (ja) * | 2022-11-28 | 2024-06-06 | 株式会社村田製作所 | めっき組成物の再生方法および再生装置 |
CN116288292A (zh) * | 2023-03-20 | 2023-06-23 | 聂柱根 | 一种化学锡药水锡还原再生除铜装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1527576A (en) * | 1923-02-19 | 1925-02-24 | Wheeling Steel & Iron Company | Process of coating conducting materials with tin |
US3784455A (en) * | 1971-12-28 | 1974-01-08 | Western Electric Co | Methods of electrolytic regenerative etching and metal recovery |
DE2401719B2 (de) * | 1974-01-15 | 1978-01-19 | Vereinigte Aluminium Werke Ag, 5300 Bonn | Verfahren zur regenerierung und standzeiterhoehung von zinnhaltigen metallsalzloesungen, die zur elektrolytischen faerbung von anodisiertem aluminium unter einwirkung von wechselstrom eingesetzt werden |
JPS5226315A (en) * | 1975-08-25 | 1977-02-26 | Fuji Photo Film Co Ltd | Process for the recovery of silver from fixer |
DE2742718C2 (de) * | 1977-09-22 | 1984-04-19 | ESTEL HOOGOVENS B.V., 1970 Ijmuiden | Verfahren und Vorrichtung zur Regenerierung eines Verzinnungselektrolyten |
US4432844A (en) * | 1982-01-28 | 1984-02-21 | Fujisash Company | Process for regeneration of electrolyte containing tin salts by reducing the same |
US4715894A (en) * | 1985-08-29 | 1987-12-29 | Techno Instruments Investments 1983 Ltd. | Use of immersion tin and tin alloys as a bonding medium for multilayer circuits |
DE3634710A1 (de) * | 1986-10-11 | 1988-04-21 | Ver Glaswerke Gmbh | Vorrichtung zum vakuumbeschichten einer glasscheibe durch reaktive kathodenzerstaeubung |
CA2083196C (en) * | 1991-11-27 | 1998-02-17 | Randal D. King | Process for extending the life of a displacement plating bath |
JPH06256999A (ja) * | 1993-03-05 | 1994-09-13 | Kawasaki Steel Corp | 錫めっき液を回収再生する方法 |
US6280596B1 (en) * | 1995-05-23 | 2001-08-28 | Weirton Steel Corporation | Electrolytic tinplating of steel substrate and apparatus |
US5705048A (en) * | 1996-03-27 | 1998-01-06 | Oxley Research, Inc. | Apparatus and a process for regenerating a CUCl2 etchant |
DE19719020A1 (de) * | 1997-05-07 | 1998-11-12 | Km Europa Metal Ag | Verfahren und Vorrichtung zum Regenerieren von Verzinnungslösungen |
US6251255B1 (en) * | 1998-12-22 | 2001-06-26 | Precision Process Equipment, Inc. | Apparatus and method for electroplating tin with insoluble anodes |
JP3455709B2 (ja) * | 1999-04-06 | 2003-10-14 | 株式会社大和化成研究所 | めっき方法とそれに用いるめっき液前駆体 |
-
2001
- 2001-07-03 DE DE10132478A patent/DE10132478C1/de not_active Expired - Fee Related
-
2002
- 2002-06-17 KR KR1020037017284A patent/KR100827259B1/ko active IP Right Grant
- 2002-06-17 AT AT02754692T patent/ATE289633T1/de active
- 2002-06-17 DE DE60203050T patent/DE60203050T2/de not_active Expired - Lifetime
- 2002-06-17 BR BRPI0210829-1A patent/BR0210829B1/pt not_active IP Right Cessation
- 2002-06-17 EP EP02754692A patent/EP1427869B1/en not_active Expired - Lifetime
- 2002-06-17 US US10/494,217 patent/US20040245108A1/en not_active Abandoned
- 2002-06-17 MX MXPA03011772A patent/MXPA03011772A/es active IP Right Grant
- 2002-06-17 ES ES02754692T patent/ES2236552T3/es not_active Expired - Lifetime
- 2002-06-17 WO PCT/EP2002/006654 patent/WO2003004725A2/en active IP Right Grant
- 2002-06-17 AU AU2002321069A patent/AU2002321069A1/en not_active Abandoned
- 2002-06-17 CA CA002450258A patent/CA2450258A1/en not_active Abandoned
- 2002-06-17 CN CNB028135822A patent/CN1232677C/zh not_active Expired - Lifetime
- 2002-06-17 JP JP2003510478A patent/JP4157838B2/ja not_active Expired - Lifetime
- 2002-06-21 TW TW091113655A patent/TWI279456B/zh not_active IP Right Cessation
- 2002-06-26 MY MYPI20022395A patent/MY130423A/en unknown
-
2004
- 2004-08-03 HK HK04105703A patent/HK1062926A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE10132478C1 (de) | 2003-04-30 |
KR100827259B1 (ko) | 2008-05-07 |
HK1062926A1 (en) | 2004-12-03 |
WO2003004725A2 (en) | 2003-01-16 |
EP1427869B1 (en) | 2005-02-23 |
ATE289633T1 (de) | 2005-03-15 |
CN1524132A (zh) | 2004-08-25 |
US20040245108A1 (en) | 2004-12-09 |
DE60203050D1 (de) | 2005-03-31 |
MY130423A (en) | 2007-06-29 |
DE60203050T2 (de) | 2006-02-23 |
BR0210829B1 (pt) | 2011-07-26 |
JP4157838B2 (ja) | 2008-10-01 |
CN1232677C (zh) | 2005-12-21 |
AU2002321069A1 (en) | 2003-01-21 |
WO2003004725A3 (en) | 2004-04-15 |
MXPA03011772A (es) | 2004-04-02 |
CA2450258A1 (en) | 2003-01-16 |
KR20040030725A (ko) | 2004-04-09 |
ES2236552T3 (es) | 2005-07-16 |
JP2004534151A (ja) | 2004-11-11 |
BR0210829A (pt) | 2005-05-03 |
EP1427869A2 (en) | 2004-06-16 |
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Legal Events
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MK4A | Expiration of patent term of an invention patent |