JP4157838B2 - めっき溶液の再生方法 - Google Patents
めっき溶液の再生方法 Download PDFInfo
- Publication number
- JP4157838B2 JP4157838B2 JP2003510478A JP2003510478A JP4157838B2 JP 4157838 B2 JP4157838 B2 JP 4157838B2 JP 2003510478 A JP2003510478 A JP 2003510478A JP 2003510478 A JP2003510478 A JP 2003510478A JP 4157838 B2 JP4157838 B2 JP 4157838B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- tin
- ions
- auxiliary cathode
- oxidation state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title claims abstract description 81
- 238000011069 regeneration method Methods 0.000 title claims abstract description 35
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 132
- 229910052751 metal Inorganic materials 0.000 claims abstract description 62
- 239000002184 metal Substances 0.000 claims abstract description 62
- 238000000034 method Methods 0.000 claims abstract description 51
- 230000008929 regeneration Effects 0.000 claims abstract description 31
- 229910021645 metal ion Inorganic materials 0.000 claims abstract description 27
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 24
- 230000003647 oxidation Effects 0.000 claims abstract description 23
- 238000000151 deposition Methods 0.000 claims abstract description 20
- 230000001172 regenerating effect Effects 0.000 claims abstract description 8
- 150000002500 ions Chemical class 0.000 claims description 74
- 239000010949 copper Substances 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 238000006243 chemical reaction Methods 0.000 claims description 27
- 239000002253 acid Substances 0.000 claims description 21
- 230000008021 deposition Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 7
- 239000012528 membrane Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 239000003011 anion exchange membrane Substances 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 239000003014 ion exchange membrane Substances 0.000 claims description 2
- -1 tin (II) ions Chemical class 0.000 abstract description 9
- 238000001465 metallisation Methods 0.000 abstract description 2
- 229910001432 tin ion Inorganic materials 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 82
- UMGDCJDMYOKAJW-UHFFFAOYSA-N aminothiocarboxamide Natural products NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 27
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 23
- 150000001875 compounds Chemical class 0.000 description 15
- 238000004090 dissolution Methods 0.000 description 10
- 150000003839 salts Chemical class 0.000 description 10
- 238000012545 processing Methods 0.000 description 9
- 229910001128 Sn alloy Inorganic materials 0.000 description 7
- 239000003638 chemical reducing agent Substances 0.000 description 7
- 238000001556 precipitation Methods 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000004202 carbamide Substances 0.000 description 5
- 239000008139 complexing agent Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 239000011593 sulfur Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 229910002065 alloy metal Inorganic materials 0.000 description 3
- 239000010953 base metal Substances 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 3
- 150000003672 ureas Chemical class 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- IOUCSUBTZWXKTA-UHFFFAOYSA-N dipotassium;dioxido(oxo)tin Chemical compound [K+].[K+].[O-][Sn]([O-])=O IOUCSUBTZWXKTA-UHFFFAOYSA-N 0.000 description 2
- TVQLLNFANZSCGY-UHFFFAOYSA-N disodium;dioxido(oxo)tin Chemical compound [Na+].[Na+].[O-][Sn]([O-])=O TVQLLNFANZSCGY-UHFFFAOYSA-N 0.000 description 2
- 235000019253 formic acid Nutrition 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000007086 side reaction Methods 0.000 description 2
- 229940079864 sodium stannate Drugs 0.000 description 2
- 229940071182 stannate Drugs 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical class NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 2
- 150000003460 sulfonic acids Chemical class 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 159000000032 aromatic acids Chemical class 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- KYRUBSWVBPYWEF-UHFFFAOYSA-N copper;iron;sulfane;tin Chemical compound S.S.S.S.[Fe].[Cu].[Cu].[Sn] KYRUBSWVBPYWEF-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003411 electrode reaction Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10132478A DE10132478C1 (de) | 2001-07-03 | 2001-07-03 | Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung |
| PCT/EP2002/006654 WO2003004725A2 (fr) | 2001-07-03 | 2002-06-17 | Procede de regeneration pour solution de placage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004534151A JP2004534151A (ja) | 2004-11-11 |
| JP4157838B2 true JP4157838B2 (ja) | 2008-10-01 |
Family
ID=7690626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003510478A Expired - Lifetime JP4157838B2 (ja) | 2001-07-03 | 2002-06-17 | めっき溶液の再生方法 |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US20040245108A1 (fr) |
| EP (1) | EP1427869B1 (fr) |
| JP (1) | JP4157838B2 (fr) |
| KR (1) | KR100827259B1 (fr) |
| CN (1) | CN1232677C (fr) |
| AT (1) | ATE289633T1 (fr) |
| AU (1) | AU2002321069A1 (fr) |
| BR (1) | BR0210829B1 (fr) |
| CA (1) | CA2450258A1 (fr) |
| DE (2) | DE10132478C1 (fr) |
| ES (1) | ES2236552T3 (fr) |
| HK (1) | HK1062926A1 (fr) |
| MX (1) | MXPA03011772A (fr) |
| MY (1) | MY130423A (fr) |
| TW (1) | TWI279456B (fr) |
| WO (1) | WO2003004725A2 (fr) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MXPA06000603A (es) | 2003-07-16 | 2006-04-11 | Interdigital Tech Corp | Metodo y sistema para transferir informacion entre entidades de gestion de red de un sistema de comunicacion inalambrica. |
| EP1630252A1 (fr) * | 2004-08-27 | 2006-03-01 | ATOTECH Deutschland GmbH | Procédé de dépot d'etain ou d'alliages d'etain sur des substrats contenant de l'antimoine |
| JP4998704B2 (ja) | 2007-01-22 | 2012-08-15 | 上村工業株式会社 | 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法 |
| EP2298960A1 (fr) | 2009-08-24 | 2011-03-23 | ATOTECH Deutschland GmbH | Procédé de placage anélectrolytique pour l'étain et les alliages d'étain |
| DE102009060676B4 (de) | 2009-12-28 | 2015-07-23 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum nasschemischen Behandeln von Behandlungsgut |
| CN102586851B (zh) * | 2011-01-06 | 2015-03-04 | 宝山钢铁股份有限公司 | 一种缓解并减少镀锡溶液产生锡泥的电解方法 |
| EP2671968B1 (fr) * | 2012-06-05 | 2014-11-26 | ATOTECH Deutschland GmbH | Procédé et appareil de régénération pour régénérer un composition de placage |
| CN106801235B (zh) * | 2015-05-12 | 2018-06-08 | 江苏理工学院 | 降低加工成本的超临界复合电铸体系回收利用装置 |
| CN106011810B (zh) * | 2016-06-02 | 2019-01-11 | 东莞市智源电子科技有限公司 | 铜基材的化学锡镀液中四价锡的去除工艺 |
| WO2018077874A1 (fr) * | 2016-10-24 | 2018-05-03 | Atotech Deutschland Gmbh | Procédé de dépôt d'une couche d'étain sur un substrat métallique et utilisation d'une structure comprenant une sous-couche d'alliage nickel/phosphore et ladite couche d'étain préparée par ledit procédé |
| CN110387540A (zh) * | 2019-08-30 | 2019-10-29 | 江苏上达电子有限公司 | 一种化锡槽内二价锡的补充系统及方法 |
| CN111676470A (zh) * | 2020-05-29 | 2020-09-18 | 广东天承科技有限公司 | 一种简易可溶性的高价锡的还原方法 |
| CN114232030B (zh) * | 2021-12-23 | 2023-04-18 | 广东鑫菱环境科技有限公司 | 一种pcb甲基磺酸退锡废液循环再生方法 |
| WO2024116456A1 (fr) * | 2022-11-28 | 2024-06-06 | 株式会社村田製作所 | Procédé et dispositif de régénération de composition de placage |
| CN116288292A (zh) * | 2023-03-20 | 2023-06-23 | 聂柱根 | 一种化学锡药水锡还原再生除铜装置 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1527576A (en) * | 1923-02-19 | 1925-02-24 | Wheeling Steel & Iron Company | Process of coating conducting materials with tin |
| US3784455A (en) * | 1971-12-28 | 1974-01-08 | Western Electric Co | Methods of electrolytic regenerative etching and metal recovery |
| DE2401719B2 (de) * | 1974-01-15 | 1978-01-19 | Vereinigte Aluminium Werke Ag, 5300 Bonn | Verfahren zur regenerierung und standzeiterhoehung von zinnhaltigen metallsalzloesungen, die zur elektrolytischen faerbung von anodisiertem aluminium unter einwirkung von wechselstrom eingesetzt werden |
| JPS5226315A (en) * | 1975-08-25 | 1977-02-26 | Fuji Photo Film Co Ltd | Process for the recovery of silver from fixer |
| DE2742718C2 (de) * | 1977-09-22 | 1984-04-19 | ESTEL HOOGOVENS B.V., 1970 Ijmuiden | Verfahren und Vorrichtung zur Regenerierung eines Verzinnungselektrolyten |
| US4432844A (en) * | 1982-01-28 | 1984-02-21 | Fujisash Company | Process for regeneration of electrolyte containing tin salts by reducing the same |
| US4715894A (en) * | 1985-08-29 | 1987-12-29 | Techno Instruments Investments 1983 Ltd. | Use of immersion tin and tin alloys as a bonding medium for multilayer circuits |
| DE3634710A1 (de) * | 1986-10-11 | 1988-04-21 | Ver Glaswerke Gmbh | Vorrichtung zum vakuumbeschichten einer glasscheibe durch reaktive kathodenzerstaeubung |
| CA2083196C (fr) * | 1991-11-27 | 1998-02-17 | Randal D. King | Procede pour prolonger la duree de vie d'un bain de galvanoplastie par jet mobile |
| JPH06256999A (ja) * | 1993-03-05 | 1994-09-13 | Kawasaki Steel Corp | 錫めっき液を回収再生する方法 |
| US6280596B1 (en) * | 1995-05-23 | 2001-08-28 | Weirton Steel Corporation | Electrolytic tinplating of steel substrate and apparatus |
| US5705048A (en) * | 1996-03-27 | 1998-01-06 | Oxley Research, Inc. | Apparatus and a process for regenerating a CUCl2 etchant |
| DE19719020A1 (de) * | 1997-05-07 | 1998-11-12 | Km Europa Metal Ag | Verfahren und Vorrichtung zum Regenerieren von Verzinnungslösungen |
| US6251255B1 (en) * | 1998-12-22 | 2001-06-26 | Precision Process Equipment, Inc. | Apparatus and method for electroplating tin with insoluble anodes |
| JP3455709B2 (ja) * | 1999-04-06 | 2003-10-14 | 株式会社大和化成研究所 | めっき方法とそれに用いるめっき液前駆体 |
-
2001
- 2001-07-03 DE DE10132478A patent/DE10132478C1/de not_active Expired - Fee Related
-
2002
- 2002-06-17 DE DE60203050T patent/DE60203050T2/de not_active Expired - Lifetime
- 2002-06-17 CA CA002450258A patent/CA2450258A1/fr not_active Abandoned
- 2002-06-17 US US10/494,217 patent/US20040245108A1/en not_active Abandoned
- 2002-06-17 CN CNB028135822A patent/CN1232677C/zh not_active Expired - Lifetime
- 2002-06-17 MX MXPA03011772A patent/MXPA03011772A/es active IP Right Grant
- 2002-06-17 WO PCT/EP2002/006654 patent/WO2003004725A2/fr active IP Right Grant
- 2002-06-17 JP JP2003510478A patent/JP4157838B2/ja not_active Expired - Lifetime
- 2002-06-17 ES ES02754692T patent/ES2236552T3/es not_active Expired - Lifetime
- 2002-06-17 EP EP02754692A patent/EP1427869B1/fr not_active Expired - Lifetime
- 2002-06-17 BR BRPI0210829-1A patent/BR0210829B1/pt not_active IP Right Cessation
- 2002-06-17 AT AT02754692T patent/ATE289633T1/de active
- 2002-06-17 AU AU2002321069A patent/AU2002321069A1/en not_active Abandoned
- 2002-06-17 KR KR1020037017284A patent/KR100827259B1/ko active IP Right Grant
- 2002-06-21 TW TW091113655A patent/TWI279456B/zh not_active IP Right Cessation
- 2002-06-26 MY MYPI20022395A patent/MY130423A/en unknown
-
2004
- 2004-08-03 HK HK04105703A patent/HK1062926A1/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1524132A (zh) | 2004-08-25 |
| US20040245108A1 (en) | 2004-12-09 |
| CA2450258A1 (fr) | 2003-01-16 |
| MY130423A (en) | 2007-06-29 |
| DE60203050D1 (de) | 2005-03-31 |
| HK1062926A1 (en) | 2004-12-03 |
| EP1427869A2 (fr) | 2004-06-16 |
| BR0210829A (pt) | 2005-05-03 |
| BR0210829B1 (pt) | 2011-07-26 |
| AU2002321069A1 (en) | 2003-01-21 |
| CN1232677C (zh) | 2005-12-21 |
| ATE289633T1 (de) | 2005-03-15 |
| MXPA03011772A (es) | 2004-04-02 |
| TWI279456B (en) | 2007-04-21 |
| KR100827259B1 (ko) | 2008-05-07 |
| ES2236552T3 (es) | 2005-07-16 |
| DE10132478C1 (de) | 2003-04-30 |
| WO2003004725A2 (fr) | 2003-01-16 |
| KR20040030725A (ko) | 2004-04-09 |
| EP1427869B1 (fr) | 2005-02-23 |
| WO2003004725A3 (fr) | 2004-04-15 |
| DE60203050T2 (de) | 2006-02-23 |
| JP2004534151A (ja) | 2004-11-11 |
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