DE10120253A1 - Elektrisches Bauelement, Verfahren zu dessen Herstellung und dessen Verwendung - Google Patents
Elektrisches Bauelement, Verfahren zu dessen Herstellung und dessen VerwendungInfo
- Publication number
- DE10120253A1 DE10120253A1 DE10120253A DE10120253A DE10120253A1 DE 10120253 A1 DE10120253 A1 DE 10120253A1 DE 10120253 A DE10120253 A DE 10120253A DE 10120253 A DE10120253 A DE 10120253A DE 10120253 A1 DE10120253 A1 DE 10120253A1
- Authority
- DE
- Germany
- Prior art keywords
- resistance
- component
- ceramic
- electrode layers
- base body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 239000002243 precursor Substances 0.000 claims description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 23
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 239000010941 cobalt Substances 0.000 claims description 5
- 229910017052 cobalt Inorganic materials 0.000 claims description 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052596 spinel Inorganic materials 0.000 claims description 4
- 239000011029 spinel Substances 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052845 zircon Inorganic materials 0.000 claims description 2
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 abstract description 4
- 239000011572 manganese Substances 0.000 description 14
- 238000010276 construction Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 229910010293 ceramic material Inorganic materials 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 230000007774 longterm Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000007792 addition Methods 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 102000020897 Formins Human genes 0.000 description 1
- 108091022623 Formins Proteins 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000012799 electrically-conductive coating Substances 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed as one or more layers or coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1413—Terminals or electrodes formed on resistive elements having negative temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/042—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient mainly consisting of inorganic non-metallic substances
- H01C7/043—Oxides or oxidic compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49004—Electrical device making including measuring or testing of device or component part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49087—Resistor making with envelope or housing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49087—Resistor making with envelope or housing
- Y10T29/49098—Applying terminal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Filters And Equalizers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10120253A DE10120253A1 (de) | 2000-04-25 | 2001-04-25 | Elektrisches Bauelement, Verfahren zu dessen Herstellung und dessen Verwendung |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10020224 | 2000-04-25 | ||
| DE10120253A DE10120253A1 (de) | 2000-04-25 | 2001-04-25 | Elektrisches Bauelement, Verfahren zu dessen Herstellung und dessen Verwendung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE10120253A1 true DE10120253A1 (de) | 2001-11-29 |
Family
ID=7639870
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE50114953T Expired - Lifetime DE50114953D1 (de) | 2000-04-25 | 2001-04-25 | Elektrisches bauelement, verfahren zu dessen herstellung und dessen verwendung |
| DE10120253A Ceased DE10120253A1 (de) | 2000-04-25 | 2001-04-25 | Elektrisches Bauelement, Verfahren zu dessen Herstellung und dessen Verwendung |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE50114953T Expired - Lifetime DE50114953D1 (de) | 2000-04-25 | 2001-04-25 | Elektrisches bauelement, verfahren zu dessen herstellung und dessen verwendung |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US7215236B2 (enExample) |
| EP (1) | EP1277215B1 (enExample) |
| JP (2) | JP2003532284A (enExample) |
| CN (1) | CN1426588A (enExample) |
| AT (1) | ATE434823T1 (enExample) |
| AU (1) | AU6205001A (enExample) |
| DE (2) | DE50114953D1 (enExample) |
| WO (1) | WO2001082314A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004086432A1 (de) * | 2003-03-27 | 2004-10-07 | Epcos Ag | Elektrisches vielschichtbauelement |
| DE102004014753B3 (de) * | 2004-03-25 | 2005-11-24 | Epcos Ag | Keramisches Bauelement mit verbesserter Korrosionsbeständigkeit und Verfahren zur Herstellung |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10159451A1 (de) * | 2001-12-04 | 2003-06-26 | Epcos Ag | Elektrisches Bauelement mit einem negativen Temperaturkoeffizienten |
| WO2006085507A1 (ja) * | 2005-02-08 | 2006-08-17 | Murata Manufacturing Co., Ltd. | 表面実装型負特性サーミスタ |
| DE102007046907B4 (de) * | 2007-09-28 | 2015-02-26 | Heraeus Sensor Technology Gmbh | Schichtwiderstand und Verfahren zu dessen Herstellung |
| US20100218372A1 (en) * | 2007-10-25 | 2010-09-02 | Osram Gesellschaft Mit Beschraenkter Haftung | Method of soldering components on circuit boards and corresponding circuit board |
| DE102008029192A1 (de) | 2008-03-13 | 2009-09-24 | Epcos Ag | Fühler zum Erfassen einer physikalischen Größe und Verfahren zur Herstellung des Fühlers |
| JP5347553B2 (ja) * | 2009-02-20 | 2013-11-20 | Ｔｄｋ株式会社 | サーミスタ素子 |
| JP5678520B2 (ja) * | 2010-08-26 | 2015-03-04 | Tdk株式会社 | サーミスタ素子 |
| DE102010044856A1 (de) | 2010-09-09 | 2012-03-15 | Epcos Ag | Widerstandsbauelement und Verfahren zur Herstellung eines Widerstandsbauelements |
| JP2013541852A (ja) * | 2010-11-03 | 2013-11-14 | エプコス アーゲー | 積層セラミック部品及び積層セラミック部品の製造方法 |
| TWI473122B (zh) * | 2011-01-21 | 2015-02-11 | Murata Manufacturing Co | Semiconductor ceramics and semiconductor ceramic components |
| JP5510479B2 (ja) * | 2012-03-03 | 2014-06-04 | 株式会社村田製作所 | Ｎｔｃサーミスタ用半導体磁器組成物 |
| DE102012110849A1 (de) * | 2012-11-12 | 2014-05-15 | Epcos Ag | Temperaturfühler und Verfahren zur Herstellung eines Temperaturfühlers |
| DE102014107450A1 (de) | 2014-05-27 | 2015-12-03 | Epcos Ag | Elektronisches Bauelement |
| US10126165B2 (en) * | 2015-07-28 | 2018-11-13 | Carrier Corporation | Radiation sensors |
| JP7654576B2 (ja) * | 2019-09-20 | 2025-04-01 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフト | センサーデバイス及びセンサーデバイスの製造方法 |
| CN113744942B (zh) * | 2020-05-29 | 2023-11-21 | 东电化电子元器件(珠海保税区)有限公司 | 包括电阻器的电气部件以及包括该电气部件的电气电路 |
| US12387860B2 (en) | 2020-05-29 | 2025-08-12 | Tdk Electronics Ag | Electrical component comprising an electrical resistor |
Family Cites Families (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1337929A (en) | 1972-05-04 | 1973-11-21 | Standard Telephones Cables Ltd | Thermistors |
| US4146957A (en) * | 1977-01-17 | 1979-04-03 | Engelhard Minerals & Chemicals Corporation | Thick film resistance thermometer |
| JPS5823921B2 (ja) * | 1978-02-10 | 1983-05-18 | 日本電気株式会社 | 電圧非直線抵抗器 |
| US4324702A (en) * | 1979-11-02 | 1982-04-13 | Matsushita Electric Industrial Co., Ltd. | Oxide thermistor compositions |
| JPS56164514A (en) * | 1980-05-21 | 1981-12-17 | Nippon Electric Co | Method of producing laminated porcelain capacitor |
| US4712085A (en) * | 1984-10-30 | 1987-12-08 | Tdk Corporation | Thermistor element and method of manufacturing the same |
| JPS62137804A (ja) * | 1985-12-12 | 1987-06-20 | 株式会社村田製作所 | 負特性積層チップ型サーミスタ |
| DE3625265A1 (de) | 1986-07-25 | 1988-02-04 | Basf Ag | Umhuellte passive keramische bauelemente fuer die elektronik |
| US4786888A (en) * | 1986-09-20 | 1988-11-22 | Murata Manufacturing Co., Ltd. | Thermistor and method of producing the same |
| DE3733192C1 (de) * | 1987-10-01 | 1988-10-06 | Bosch Gmbh Robert | PTC-Temperaturfuehler sowie Verfahren zur Herstellung von PTC-Temperaturfuehlerelementen fuer den PTC-Temperaturfuehler |
| DE3725455A1 (de) | 1987-07-31 | 1989-02-09 | Siemens Ag | Elektrisches vielschichtbauelement mit einem gesinterten, monolithischen keramikkoerper und verfahren zur herstellung des elektrischen vielschichtbauelementes |
| JPH01171201A (ja) * | 1987-12-25 | 1989-07-06 | Okazaki Seisakusho:Kk | 薄膜抵抗測温体および測温体 |
| JPH01225307A (ja) * | 1988-03-05 | 1989-09-08 | Murata Mfg Co Ltd | 積層セラミックコンデンサの製造方法 |
| JPH01253204A (ja) * | 1988-03-31 | 1989-10-09 | Matsushita Electric Ind Co Ltd | 積層形チップサーミスタ |
| US4951028A (en) * | 1989-03-03 | 1990-08-21 | Massachusetts Institute Of Technology | Positive temperature coefficient resistor |
| JP2863189B2 (ja) * | 1989-03-22 | 1999-03-03 | 松下電器産業株式会社 | ガラス封入形正特性サーミスタ |
| JPH02276203A (ja) * | 1989-04-18 | 1990-11-13 | Matsushita Electric Ind Co Ltd | 積層型サーミスタの製造方法 |
| US4953273A (en) * | 1989-05-25 | 1990-09-04 | American Technical Ceramics Corporation | Process for applying conductive terminations to ceramic components |
| US5160912A (en) * | 1989-06-19 | 1992-11-03 | Dale Electronics, Inc. | Thermistor |
| JPH03157902A (ja) * | 1989-11-16 | 1991-07-05 | Murata Mfg Co Ltd | ノイズフイルタ |
| EP0476657A1 (de) * | 1990-09-21 | 1992-03-25 | Siemens Aktiengesellschaft | Thermistor mit negativem Temperaturkoeffizienten in Vielschicht-Technologie |
| JP2976244B2 (ja) * | 1991-02-04 | 1999-11-10 | 株式会社村田製作所 | Ｎｔｃサーミスタ素子の製造方法 |
| JP2833242B2 (ja) * | 1991-03-12 | 1998-12-09 | 株式会社村田製作所 | Ｎｔｃサーミスタ素子 |
| US5355112A (en) * | 1992-02-07 | 1994-10-11 | Murata Mfg., Co., Ltd. | Fixed resistor |
| JP2888020B2 (ja) * | 1992-02-27 | 1999-05-10 | 株式会社村田製作所 | 負特性積層サーミスタ |
| JP2882951B2 (ja) * | 1992-09-18 | 1999-04-19 | ローム株式会社 | チップ型電子部品における端子電極の形成方法 |
| DE4420657A1 (de) | 1994-06-14 | 1995-12-21 | Siemens Matsushita Components | Sinterkeramik für hochstabile Thermistoren und Verfahren zu ihrer Herstellung |
| JP3661159B2 (ja) * | 1995-06-15 | 2005-06-15 | 株式会社大泉製作所 | 高温用ガラス封止型サーミスタ |
| JP3687696B2 (ja) * | 1996-02-06 | 2005-08-24 | 株式会社村田製作所 | 半導体磁器組成物とそれを用いた半導体磁器素子 |
| DE19622112A1 (de) * | 1996-06-01 | 1997-12-04 | Philips Patentverwaltung | Indiumhaltiger, oxidkeramischer Thermistor |
| US5936513A (en) * | 1996-08-23 | 1999-08-10 | Thermometrics, Inc. | Nickel-iron-manganese oxide single crystals |
| JP3393524B2 (ja) * | 1997-03-04 | 2003-04-07 | 株式会社村田製作所 | Ｎｔｃサーミスタ素子 |
| JPH1154301A (ja) | 1997-08-07 | 1999-02-26 | Murata Mfg Co Ltd | チップ型サーミスタ |
| US6514453B2 (en) * | 1997-10-21 | 2003-02-04 | Nanoproducts Corporation | Thermal sensors prepared from nanostructureed powders |
| JP3286906B2 (ja) * | 1997-10-21 | 2002-05-27 | 株式会社村田製作所 | 負の抵抗温度特性を有する半導体セラミック素子 |
| JP3381780B2 (ja) * | 1997-10-24 | 2003-03-04 | 株式会社村田製作所 | サーミスタの製造方法 |
| TW412755B (en) * | 1998-02-10 | 2000-11-21 | Murata Manufacturing Co | Resistor elements and methods of producing same |
| JPH11307069A (ja) * | 1998-04-21 | 1999-11-05 | Murata Mfg Co Ltd | 電子部品および二次電池パック |
| JP2000082603A (ja) * | 1998-07-08 | 2000-03-21 | Murata Mfg Co Ltd | チップ型サ―ミスタおよびその製造方法 |
| US6411192B1 (en) * | 1998-12-28 | 2002-06-25 | Lansense, Llc | Method and apparatus for sensing and measuring plural physical properties, including temperature |
| US6549136B2 (en) * | 2001-09-13 | 2003-04-15 | Lansense, Llc | Sensing and switching circuit employing a positive-temperature-coefficient sensing device |
| US20030062984A1 (en) * | 2001-09-28 | 2003-04-03 | Ishizuka Electronics Corporation | Thin film thermistor and method of adjusting reisistance of the same |
| JPWO2003052777A1 (ja) * | 2001-12-14 | 2005-04-28 | 信越ポリマー株式会社 | 有機ｎｔｃ組成物、有機ｎｔｃ素子、及びその製造方法 |
| JP4378941B2 (ja) * | 2002-12-09 | 2009-12-09 | 株式会社村田製作所 | 電子部品の製造方法 |
| TWI260670B (en) * | 2003-05-28 | 2006-08-21 | Futaba Denshi Kogyo Kk | Conductive sintered compact for fixing electrodes in electronic device envelope |
| US7669313B2 (en) * | 2005-07-11 | 2010-03-02 | Texas Instruments Incorporated | Method for fabricating a thin film resistor semiconductor structure |
| JP2007281400A (ja) * | 2006-04-04 | 2007-10-25 | Taiyo Yuden Co Ltd | 表面実装型セラミック電子部品 |
-
2001
- 2001-04-25 US US10/240,300 patent/US7215236B2/en not_active Expired - Fee Related
- 2001-04-25 EP EP01935992A patent/EP1277215B1/de not_active Expired - Lifetime
- 2001-04-25 DE DE50114953T patent/DE50114953D1/de not_active Expired - Lifetime
- 2001-04-25 AU AU62050/01A patent/AU6205001A/en not_active Abandoned
- 2001-04-25 AT AT01935992T patent/ATE434823T1/de not_active IP Right Cessation
- 2001-04-25 CN CN01808565A patent/CN1426588A/zh active Pending
- 2001-04-25 DE DE10120253A patent/DE10120253A1/de not_active Ceased
- 2001-04-25 WO PCT/DE2001/001564 patent/WO2001082314A1/de not_active Ceased
- 2001-04-25 JP JP2001579314A patent/JP2003532284A/ja active Pending
-
2007
- 2007-04-09 US US11/697,844 patent/US7524337B2/en not_active Expired - Fee Related
-
2011
- 2011-11-07 JP JP2011243269A patent/JP2012064960A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004086432A1 (de) * | 2003-03-27 | 2004-10-07 | Epcos Ag | Elektrisches vielschichtbauelement |
| US7710233B2 (en) | 2003-03-27 | 2010-05-04 | Epcos Ag | Electric multilayer component |
| DE102004014753B3 (de) * | 2004-03-25 | 2005-11-24 | Epcos Ag | Keramisches Bauelement mit verbesserter Korrosionsbeständigkeit und Verfahren zur Herstellung |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2001082314A1 (de) | 2001-11-01 |
| AU6205001A (en) | 2001-11-07 |
| EP1277215B1 (de) | 2009-06-24 |
| US20040172807A1 (en) | 2004-09-09 |
| CN1426588A (zh) | 2003-06-25 |
| ATE434823T1 (de) | 2009-07-15 |
| JP2003532284A (ja) | 2003-10-28 |
| EP1277215A1 (de) | 2003-01-22 |
| US20070175019A1 (en) | 2007-08-02 |
| DE50114953D1 (de) | 2009-08-06 |
| US7215236B2 (en) | 2007-05-08 |
| JP2012064960A (ja) | 2012-03-29 |
| US7524337B2 (en) | 2009-04-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| 8131 | Rejection |