CN1751275A - 水溶性树脂组合物、图形形成方法和检查抗蚀图形的方法 - Google Patents
水溶性树脂组合物、图形形成方法和检查抗蚀图形的方法 Download PDFInfo
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- CN1751275A CN1751275A CNA2004800048240A CN200480004824A CN1751275A CN 1751275 A CN1751275 A CN 1751275A CN A2004800048240 A CNA2004800048240 A CN A2004800048240A CN 200480004824 A CN200480004824 A CN 200480004824A CN 1751275 A CN1751275 A CN 1751275A
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Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/115—Cationic or anionic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/165—Thermal imaging composition
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
水溶性树脂组合物 | 缩小率 | ||
实施例3 | A | 21.8 | 19.0 |
实施例4 | B | 10.5 | 11.4 |
对比例1 | AZ R500 | 2.5 | 4.0 |
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003045599A JP4235466B2 (ja) | 2003-02-24 | 2003-02-24 | 水溶性樹脂組成物、パターン形成方法及びレジストパターンの検査方法 |
JP045599/2003 | 2003-02-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1751275A true CN1751275A (zh) | 2006-03-22 |
CN100562806C CN100562806C (zh) | 2009-11-25 |
Family
ID=32905530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800048240A Expired - Fee Related CN100562806C (zh) | 2003-02-24 | 2004-02-16 | 水溶性树脂组合物、图形形成方法和检查抗蚀图形的方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7335464B2 (zh) |
EP (1) | EP1602983B1 (zh) |
JP (1) | JP4235466B2 (zh) |
KR (1) | KR101049373B1 (zh) |
CN (1) | CN100562806C (zh) |
TW (1) | TWI309756B (zh) |
WO (1) | WO2004074941A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101523296B (zh) * | 2006-10-19 | 2012-05-30 | Az电子材料(日本)株式会社 | 精细图案形成方法及用于此法的抗蚀基板处理溶液 |
CN106226998A (zh) * | 2008-09-15 | 2016-12-14 | 台湾积体电路制造股份有限公司 | 光刻方法 |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4235466B2 (ja) | 2003-02-24 | 2009-03-11 | Azエレクトロニックマテリアルズ株式会社 | 水溶性樹脂組成物、パターン形成方法及びレジストパターンの検査方法 |
JP4012480B2 (ja) * | 2003-03-28 | 2007-11-21 | Azエレクトロニックマテリアルズ株式会社 | 微細パターン形成補助剤及びその製造法 |
JP4485241B2 (ja) * | 2004-04-09 | 2010-06-16 | Azエレクトロニックマテリアルズ株式会社 | 水溶性樹脂組成物およびそれを用いたパターン形成方法 |
JP4679997B2 (ja) * | 2004-08-31 | 2011-05-11 | Azエレクトロニックマテリアルズ株式会社 | 微細パターン形成方法 |
JP4583860B2 (ja) | 2004-10-04 | 2010-11-17 | 富士通株式会社 | レジストパターン厚肉化材料、レジストパターンの形成方法、並びに、半導体装置及びその製造方法 |
US7595141B2 (en) * | 2004-10-26 | 2009-09-29 | Az Electronic Materials Usa Corp. | Composition for coating over a photoresist pattern |
JP4731193B2 (ja) * | 2005-03-31 | 2011-07-20 | 富士通株式会社 | 半導体装置における導電層を形成する方法 |
GB2429332A (en) * | 2005-08-18 | 2007-02-21 | Filtronic Compound Semiconduct | A method of producing a trench with a coating of a cross linked polymer |
JP4566862B2 (ja) | 2005-08-25 | 2010-10-20 | 富士通株式会社 | レジストパターン厚肉化材料、レジストパターンの形成方法、半導体装置及びその製造方法 |
KR100688570B1 (ko) * | 2005-08-31 | 2007-03-02 | 삼성전자주식회사 | 식각 마스크 패턴 형성용 코팅 조성물 및 이를 이용한반도체 소자의 미세 패턴 형성 방법 |
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2004
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- 2004-02-16 EP EP04711490.5A patent/EP1602983B1/en not_active Expired - Lifetime
- 2004-02-16 KR KR1020057015498A patent/KR101049373B1/ko active IP Right Grant
- 2004-02-16 TW TW093103585A patent/TWI309756B/zh not_active IP Right Cessation
- 2004-02-16 WO PCT/JP2004/001612 patent/WO2004074941A1/ja active Application Filing
- 2004-02-16 US US10/546,334 patent/US7335464B2/en not_active Expired - Lifetime
Cited By (3)
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CN101523296B (zh) * | 2006-10-19 | 2012-05-30 | Az电子材料(日本)株式会社 | 精细图案形成方法及用于此法的抗蚀基板处理溶液 |
CN106226998A (zh) * | 2008-09-15 | 2016-12-14 | 台湾积体电路制造股份有限公司 | 光刻方法 |
CN106226998B (zh) * | 2008-09-15 | 2020-01-14 | 台湾积体电路制造股份有限公司 | 光刻方法 |
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US20060160015A1 (en) | 2006-07-20 |
EP1602983B1 (en) | 2017-08-30 |
KR101049373B1 (ko) | 2011-07-14 |
US7335464B2 (en) | 2008-02-26 |
EP1602983A1 (en) | 2005-12-07 |
JP2004264373A (ja) | 2004-09-24 |
KR20050115866A (ko) | 2005-12-08 |
TWI309756B (en) | 2009-05-11 |
EP1602983A4 (en) | 2009-12-16 |
CN100562806C (zh) | 2009-11-25 |
WO2004074941A1 (ja) | 2004-09-02 |
TW200428165A (en) | 2004-12-16 |
JP4235466B2 (ja) | 2009-03-11 |
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