CN1393920A - 识别装置、接合装置及电路装置的制造方法 - Google Patents
识别装置、接合装置及电路装置的制造方法 Download PDFInfo
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- CN1393920A CN1393920A CN02123176A CN02123176A CN1393920A CN 1393920 A CN1393920 A CN 1393920A CN 02123176 A CN02123176 A CN 02123176A CN 02123176 A CN02123176 A CN 02123176A CN 1393920 A CN1393920 A CN 1393920A
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Abstract
一种识别装置、接合装置及电路装置的制造方法,在进行导线接合工序时,为防止基板氧化而采用的非活性气体因接合时的温差产生闪晃,使图形识别精度恶化。具有本发明识别装置的接合装置21,在环状照明25上下部及镜筒29下部设置着遮蔽盖31、32、33。因此,从操作孔24喷出的氮气的闪晃37特别是可以利用环状照明25下部的遮蔽盖31,防止侵入环状照明25内。其结果是,可以提高识别照相机的识别精度,而且可以提高μm级标准的导线接合精度。
Description
技术领域
本发明涉及一种识别装置、接合装置及电路装置的制造方法,特别是涉及一种能提高识别装置的识别精度,另外,能提高接合装置的接合精度,采用这些的电路装置的制造方法。
背景技术
在目前的半导体装置中,在形成于导线架上的搭载部进行导线接合时,对每个搭载部进行,作为其一实施例,例如特开昭63-29535号公报公开了该识别装置、接合装置。
如图17所示,在热部件1上载置着装有芯片10的晶体管导线架2。而且在热部件1上的导线架2上部设置着接合臂3,在接合臂3前端设置着毛细管4。在该毛细管4设置着导线5,在毛细管4旁边设置着用于形成导线5的焊球的喷嘴6。
而且在该热压型的接合装置,设置着导线接合位置识别部7、焊接头驱动部8,还设置有局部加热装置9,该局部加热装置9设置为与焊接头驱动部8向X、Y方向的运转联动地进行工作。作为该局部加热装置9例如可以采用激光光线装置。
然后说明动作。在利用热部件1加热的导线架2上,利用导线接合位置识别部7的信息预先编程,使焊接头驱动部8移动,同时使局部加热装置9只在接合中运动,补充芯片10上的热不足,同时进行球形接合,之后使毛细管4向导线架2侧运转,再次使局部加热装置9只在接合中运转,补充导线架侧的热不足,同时进行针脚形接合,之后利用喷嘴6在切断的导线5的前端形成焊球部。
然后在芯片10上的另一侧的电极,使局部加热装置9只在接合中运转,补充芯片10上的热不足,同时进行球形接合,之后使毛细管4向导线架侧运转,再次使局部加热装置9只在接合中运转,补充导线架侧的热不足,同时进行针脚形接合,之后利用喷嘴6在切断的导线5的前端形成焊球部。如以上这样补充接合部的热不足,同时进行接合,因此可以得到优质导线接合。而且如果与超声波并用,还能得到更加优质的导线接合。
另外在上述实施例中,表示晶体管芯片的情况,但是,芯片不限于此,二极管、IC等也可以,本发明适合于任意半导体装置的导线接合。
发明内容
如上所述,在完全穿透的导线架2上形成搭载部时,导线接合时只是该搭载部例如加热到大致250℃就可以。也就是,通常不是导线架2的整体处于高温状态,而是局部加热即可,所以特别是在上述的接合装置、识别装置中,不会有误识别、识别状况恶化等问题。
但是,如在本发明的实施例中所详述的,在小面积具有多个搭载部的集成块形成于导电箔、导线架等之上时,在一个集成块的全部导线接合工序结束之前,导电箔、导线架等一直维持高温状态。因此,具有集成块的导电箔、导线架等,由于长时间放置在所述高温状态而被氧化。
另外,为了防止所述的导线架等氧化,处于高温状态下的导线架上放置在充满非活性气体例如氮气的填充空间就可以防止。但是由于形成该空时,要在载置导线架的操作台上形成非活性气体填充空间,而且此空间上部必须形成识别及导线接合用的操作孔。这时非活性气体在空间内被高温加热,从操作孔出到外部时,由于与室温的温度差会产生波动(闪晃)。而且具有下述问题,该波动侵入到识别区域,使识别照相机产生误识别,因此欠缺高集成的微小导电图形的识别精度。
本发明是鉴于上述现有问题而开发的,本发明的识别装置包括:具有加热功能的基板载置台;在所述基板载置台上覆盖操作区域的罩;所述罩上方设置的操作孔;所述操作孔上方设置的照明;在配置于所述照明上方的镜筒内设置的图形识别用照相机,通过至少在所述照明下端设置透明的遮蔽盖,防止吹入所述罩内的非活性气体因所述基板载置台的加热产生的上升气流的波动侵入所述照明内。
本发明的识别装置理想的是,所述遮蔽盖设置在所述镜筒下端。由此,可以防止向所述波动侵入所述镜筒内及来自所述镜筒内的尘埃侵入所述照明内。
本发明的识别装置理想的是,所述遮蔽盖由透明的薄膜或透明的基板构成。
本发明的识别装置理想的是,以所述罩和所述基板载置台形成的空间内有所述非活性气体流动。
本发明的识别装置理想的是,所述罩的一部分以箝位器形成。
本发明的识别装置理想的是,所述箝位器具有所述非活性气体进气孔。
本发明的识别装置理想的是,所述非活性气体由氮气组成。
本发明的识别装置理想的是,所述照明是设置在所述镜筒部下方的环状照明。
为了解决上述课题,本发明的识别装置包括:具有加热功能的基板载置台;在所述基板载置台上覆盖操作区域的罩;所述罩上方设置的操作孔;所述操作孔上方设置的照明;在配置于所述照明上方的镜筒内设置的图形识别用照相机,通过至少在所述照明上端或从照明上端到下端之中任一位置,设置透明的遮蔽盖,防止吹入所述罩内的非活性气体因所述基板载置台的加热而产生的上升气流的波动侵入所述照明内。
为了解决上述课题,本发明的接合装置包括:具有加热功能的基板载置台;在所述基板载置台上覆盖操作区域的罩;所述罩上方设置的操作孔;所述操作孔上方设置的照明;在所述照明侧面设置的毛细管;在配置于所述照明上方的镜筒内设置的图形识别用照相机;通过至少在所述照明下端设置透明的遮蔽盖,防止吹入所述罩内的非活性气体因所述基板载置台的加热而产生的上升气流的波动侵入所述照明内;由所述图形识别用照相机识别后,将所述毛细管移动到所述操作孔上,通过所述操作孔接合。
本发明的接合装置理想的是,在以所述罩和所述基板载置台形成的空间充满所述非活性气体。
本发明的接合装置理想的是,所述非活性气体由氮气组成。
本发明的接合装置理想的是,所述照明是设置在所述镜筒部下方的环状照明。
另外,为了解决上述课题,本发明的接合装置包括:具有加热功能的基板载置台;在所述基板载置台上覆盖操作区域的罩;所述罩上方设置的操作孔;所述操作孔上方设置的照明;在所述照明侧面设置的毛细管;在配置于所述照明上方的镜筒内设置的图形识别用照相机;通过至少在所述照明上端或从照明上端到下端之中任一位置设置透明的遮蔽盖,防止吹入所述罩内的非活性气体因所述基板载置台的加热而产生的上升气流的波动侵入所述照明内;由所述图形识别用照相机识别后,将所述毛细管移动到所述操作孔上,通过所述操作孔接合。
另外,为了解决上述课题,电路装置的制造方法包括下述工序:准备块基板的工序,该块基板具有小面积集成有多个搭载部及导线的导电图形,并在所述搭载部固定电路元件;在将所述基板向基板载置台的全部所述搭载部组装结束期间,载置所述固定基板的工序;利用加热功能加热所述基板载置台,并使罩内充满所述非活性气体的工序;至少在照明下端设置透明的遮蔽盖,防止吹入所述罩内的非活性气体因所述基板载置台的加热而产生的上升气流的波动侵入所述照明内,利用设置在镜筒内的识别用照相机识别所述各搭载部的所述电路元件,将所述各搭载部的所述电路元件和所述导电图形导线接合的工序。
本发明的电路装置的制造方法理想的是,所述遮蔽盖由透明的薄膜或透明的基板构成。
本发明的电路装置的制造方法理想的是,所述非活性气体由氮气组成。
本发明的电路装置的制造方法理想的是,所述电路元件是固定半导体裸片、芯片电路部件中的任一个或两个。
另外,为了解决上述课题,电路装置的制造方法包括:准备块基板的工序,该块基板具有小面积上集成多个搭载部及导线的导电图形,在所述各搭载部固定电路元件;在将所述基板向基板载置台的全部的所述搭载部组装结束期间,载置所述基板块的工序;由加热功能加热所述载置台,并使罩内充满非活性气体的工序;至少在所述照明上端或从照明上端到下端之中任一位置,设置透明的遮蔽盖,防止吹入所述罩内的非活性气体因所述基板载置台的加热而产生的上升气流的波动侵入所述照明内,利用设置在镜筒内的识别用照相机识别所述各搭载部的所述电路元件,将所述各搭载部的所述电路元件和所述导电图形导线接合的工序。
附图说明
图1是说明具有本发明第一实施例的识别装置的接合装置的图;
图2是说明具有本发明第一实施例识别装置的接合装置的图;
图3是简化说明具有本发明第一实施例的识别装置的接合装置的图;
图4是说明具有本发明第二实施例的识别装置的接合装置的图;
图5是说明具有本发明第二实施例的识别装置的接合装置的图;
图6是简化说明具有将本发明第二实施例的识别装置的接合装置的图;
图7是说明本发明第一及第二实施例的电路装置的制造方法的图;
图8是说明本发明第一及第二实施例的电路装置的制造方法的图;
图9是说明本发明第一及第二实施例的电路装置的制造方法的图;
图10是说明本发明第一及第二实施例的电路装置的制造方法的图;
图11是说明本发明第一及第二实施例的电路装置的制造方法的图;
图12是说明本发明第一及第二实施例的电路装置的制造方法的图;
图13是说明本发明第一及第二实施例的电路装置的制造方法的图;
图14是说明本发明第一及第二实施例的电路装置的制造方法的图;
图15是说明本发明第一及第二实施例的电路装置的制造方法的图;
图16是说明本发明第一及第二实施例的电路装置的制造方法的图;
图17是说明具有现有识别装置的接合装置的图。
具体实施方式
就本发明的识别装置、接合装置及电路装置的制造方法,首先详细说明第一实施例
首先,参照图1-图3说明本发明的识别装置及接合装置。
在本发明的实施例中,识别装置与接合装置联动,形成具有一台识别装置的接合装置21。
如图1所示,接合装置21的主要结构由以下形成,载置台22;在基板载置台22上覆盖操作空间的罩23;罩23上面设置的操作孔24;操作孔24上方设置的环状照明25;在环状照明25侧面设置的接合臂26,在接合臂26前端设置的毛细管27。在毛细管27近旁设置的喷嘴28;在环状照明25上方设置的镜筒29;没有图示但设置在镜筒29内的识别照相机。
其次,说明其各自的结构特征,其动作后叙。
首先载置台22载置具有多个搭载部的导线架34,由于通过将导线架34加热提高导线接合性,因此,具有加热器30机能。由载置台22及罩23构成的操作空间内,利用该加热器30在导线接合工序中,例如能够维持230℃程度的高温状态。
其次在图1中没有显示,罩23的一部分由箝位器60(参照图12)形成,该箝位器60上面以不锈钢板67(参照图12)制作盖,构成该罩23。而且由箝位器60,作为非活性气体,例如罩23内吹入4公升/分的氮气。该吹入量根据操作用途可变。而且在罩23的上面设置操作孔24。操作孔24的大小例如以5mm×32mm形成,通过该操作孔24导线接合工序时,进行图形识别、导线接合。
因此在导线架34,例如搭载部作为一个10行5列1个集成块形成,形成多个该集成块。而且操作孔24的大小相对于1个集成块,例如2行分配20个的搭载部具有能从上面识别的大小。后面叙述,但是该操作孔24在图形识别等可以活用。另外该操作孔24的大小应该是没有特别的规定,利用接合装置21的识别图形方法等,根据其每次操作目的决定。
其次说明环状照明25及镜筒29。在环状照明25上方设置着镜筒29。而且通过操作孔24,由环状照明25,由被照射的导线架34及半导体元件35的反射率不同,就可以识别。利用设置在镜筒29内的识别照相机识别该反射光,能够将导线架34上进行图形识别。这时,通过作为照明采用环状照明25,对导线架、半导体元件能不偏不倚的照射,能够更精密地进行不产生影子的图形识别。另外没有图示,但是镜筒29在途中相对于载置台22表面弯曲90度,在该弯曲部的前端设置识别照相机。而且在该弯曲部相对于载置台22表面,设置具有45度角的镜,利用该结构能够进行图形识别。
而且,具有本发明特征的识别装置的接合装置中21包括:在上述环状照明25上下端及镜筒29下端,设置遮蔽盖31、32、33。该遮蔽盖31、32、33由透明的薄膜和透明的玻璃板等构成,上述环状照明25上下端及镜筒29下端,也不妨设置图形识别装置。
作为该遮蔽盖31、32、33的作用,主要是防止从操作孔24流出的氮气与室温之差构构成的闪晃37侵入环状照明25及镜筒29。而且闪晃37由以下操作产生。首先在罩23内,氮气以例如4公升/分吹入。一方面由组装在载置台22的加热器30维持罩内例如230℃。之后吹入的氮气例如为70℃,但利用加热器30的热量加热到230℃。
而且被加热的氮气从操作孔24向外流出,但是由于这时的室温例如为20℃,利用氮气与室温的温度差产生大致由氮气构成的闪晃37。其结果是,不用遮蔽盖31、32、33时,环状照明25内的笼罩闪晃37,而且通过环状照明25内时波动,识别照相机的识别精度恶化,导线接合精度下降。
但是在本发明中如图3所示,环状照明25内的上下端及镜筒29下端设置着遮蔽盖31、32、33。由此特别是利用环状照明25下端的遮蔽盖31,可以防止环状照明25和操作孔24间的闪晃37侵入到环状照明25内。一方面环状照明25上端的遮蔽盖32及镜筒29下端的遮蔽盖33防止闪晃37侵入环状照明25及镜筒29内另外,能防止从镜筒29向环状照明25的灰尘掉落及向环状照明25的灰尘堆积,其结果是,具有本发明识别装置的接合装置21,即使导线架长时间载置在载置台上也不被氧化,导线接合工序间能充满氮气。
而且,利用在罩内加热的氮气通过操作孔24流出外部时与室温的差别产生的闪晃37,即使在环状照明25周围产生也能利用遮蔽盖31、32、33防止向环状照明25内的侵入,所以利用识别照相机能以μm级高精度地进行图形识别,由此导线接合也能高精度进行。
而且,通过环状照明25的上下端及镜筒29下端设置着遮蔽盖31、32、33,环状照明25下端的遮蔽盖31没有堆积灰尘等,所以利用识别照相机能将图形识别及导线接合高精度进行。
而且导线架34表面氧化以后,例如到150℃对应的抗氧化剂膜脱落,与树脂的结合性恶化,但是对此也能处理,也能形成提高耐湿性、耐剥离性的接合装置。
另外,在本实施例中,说明环状照明25上下端及镜筒29下端设置遮蔽盖31、32、33的情况。不必特别的限制,即使最低在环状照明25的下端设置遮蔽盖31,也能得到上述效果。
另外没有图示,但在稍微离开环状照明25、镜筒29的位置,例如利用配置圆筒状的送风装置从这里的送风,能防止流向镜筒29的闪晃。
最后说明接合臂26、毛细管27及喷嘴28。如图2所示,图形识别之后,环状照明25及接合臂26、毛细管27移动,毛细管27位于操作孔24上。而且利用识别照相机根据得到的数据进行导线接合,但是毛细管27从操作孔24进入到罩23内,导线接合半导体元件的电极座及所需的电极图形。这时喷嘴28进行针脚形接合,在切断的金属线的前端形成球。
另外,在本实施例中,详细地说明了导线接合,但具有光学识别装置的接合等也能取得同样的效果。另外,载置于载置台的不限于导线架,如果是防止后述的导电箔的氧化所需要的,就可取得同样的效果。而且将金属基板、印刷基板、陶瓷基板等芯片焊接、导线接合时,另外如果在将锡焊部分局部涂敷的装置中也具有光学识别装置,就可以应用。
其次参照图7-图16说明本发明电路装置的制造方法。
首先,本发明的第一工序在于,如图7到图9所示,准备导电箔50,在导电箔50,除去至少形成多个电路元件42的搭载部的导电图形41区域,利用腐蚀形成比导电箔50的厚度浅的分离沟51,形成导电图形41。
在本工序中,首先如图7(A)所示,准备薄片状的导电箔50。该导电箔50要考虑下面材料的附着性、接合性、电镀性来选择其材料,作为其材料采用由以铜为主要材料的导电箔、以Al为主要材料的导电箔或Fe-Ni等的合金组成的导电箔等。
导电箔的厚度,如果考虑后面的电镀最好为10μm-300μm的程度,在此採用70μm(2盎司)的铜箔。但是300μm以上或10μm以下基本上都可以。如後續那檬,也可以形成比导电箔50的厚度薄浅的分离层51。
另外薄片状的导电箔50准备以规定的宽度例如45mm卷成滚筒状,其传送到后续工序也可以,准备剪成规定大小的短片状的导电箔50,传送到后续工序也可以。
具体地说,如图7(B)所示,在短片状的导电箔50,形成多个搭载部的基板52多个间隔(在此4-5个)排列。在各基板52之间设置着狭缝53,以造膜工序的热处理吸收产生的导电箔50的应力。另外在导电箔50的两侧以一定间隔设置引导孔54,用于决定在各工序的位置。
然后形成导电图形。
首先,如图8所示,在铜箔50之上形成感光树脂(耐腐蚀保护膜)PR,为了露出除去形成导电图形41的区域的导电箔50,将感光树脂PR形成图形。而且如图9(A)所示,通过感光树脂PR将导电箔50进行选择性地腐蚀。
在本工序中,为了使以腐蚀形成的分离沟51的深度均一且精度高,如图9(A)所示,使分离沟51的开口向下,从设置在导电箔50的下方的腐蚀液供给管70向上方将腐蚀液形成簇射环。其结果是,腐蚀液接触的分离沟51的部分被腐蚀,腐蚀液在分离沟51内不积存立即排出,所以分离沟51的深度能以腐蚀处理时间控制,形成均匀的、高精度的分离沟。另外腐蚀液主要采用二氯化铁或二氯化铜。
图9(B)表示具体的导电图形41。本图对应以图7(B)表示的基板52的1个扩大的图。以实线表示的部分是一个搭载部55,构成导电图形41,在一个基板52多个搭载部55,配列为5行10列矩阵状各搭载部55每一个都设置为相同的导电图形41,各极板的周边设置着框状图形56,与其稍微有间隔,在其内侧设置着切断时位置配合的标记57。框状图形56与金属模具嵌合使用,另外导电箔50的内面腐蚀后具有绝缘树脂40补强的功能。
其次,本发明的第二工序在于,如图10所示,在所需的导电图形51的各搭载部55固定电路元件42。
作为电路元件42,有晶体管、二极管、IC芯片等半导体元件、片电容、片电阻等无源元件。另外厚度变厚,但还能安装CPS、BGA等表面向下的半导体元件。
在此,裸的半导体芯片42A与导电图形41A芯片接合,片电容或无源元件42B以焊锡等的下边材料或导电粘合剂45B固定。
其次作为本发明电路装置特征的第三工序在于,如图11及图12所示,以导线接合各搭载部55的电路元件42的电极和所需的导电图形41。
在本工序中,采用具有图1表示的识别装置的接合装置21进行导线接合,。而且在接合装置21的载置台22上如图12(A)所示,设置着箝位器60,由箝位器60压住导电箔50的基板52的周端,使导电箔50与载置台22表面的加热板64紧密粘贴。
而且将固定于加热板64上的导电箔50通过操作孔24,利用镜筒29内的识别照相机进行图形识别。图形识别后,如图11所示,将基板52内的各搭载部55的发射极和导电图形41B、基极和导电图形41B进行热压球粘接和超声波契接合。
因此箝位器60如图12(A)所示,具有与基板52大致同等大小的开口部61,在导电箔50的接触部分设置着凹凸部63。根据以凹凸部63压住基板52的周端,将基板52的内面紧密粘贴在加热板64而且设置着为了在箝位器60的内部流过氮气的路径65和66。
另外如图12(B)所示,罩23由箝位器60和不锈钢板67构成。该板67嵌入箝位器上部的凹部68,在与箝位器60水平方向,导电箔50的移动方向和向直角方向的移动是自由的。而且在板67形成操作孔24,该操作孔24与铜箔50上的行走方向的搭载部对应移动,对基板52进行图形识别、导线接合。
而且,在本工序中,基板52内具有多个搭载部,该每一个基板52进行一并导线接合,所以与目前的电路装置的制造方法相比,加热基板52的时间变长,应考虑基板52氧化。为解决这一问题,作为接合装置21的罩23的一部分具有箝位器60,从箝位器60到基板52的表面吹过氮气,同时将罩23内以氮气来解决这一问题。
一方面,罩内利用在载置台22内藏的加热器30功能,维持例如230℃,另外吹入的氮气例如以70℃吹入。而且氮气在罩23内利用加热器30加热到230℃。氮气在罩23内例如4公升/分吹入且被加热,从操作孔24流出。这时氮气为230℃,室温例如为20℃,因此利用该温度差形成从操作孔24流出的闪晃37。而且如图3所示,流出的闪晃37笼罩在环状照明25内,而且通过环状照明25内时波动,图形识别精度恶化。
但是,在本发明的接合装置21,是实现一种电路装置的制造方法,环状照明25上下部及镜筒29设置着遮蔽盖31、32、33。而且特别是利用环形照明25下部的遮蔽盖31,可以防止闪晃37侵入环状照明25内。因此环状照明25的照明,由于闪晃37不波动,利用识别照相机能以μm级高精度地进行图形识别,所以也能进行高精度的导线接合。其结果是,如集成块52那样,对于小面积集成型的导电图形,也能进行高精度的导线接合。
而且如上所述,通过解决防止导电箔50表面氧化的氮气的问题,导线接合之间能采用氮气。由此电箔50表面不氧化,所以如果电箔50表面氧化,例如到150℃,能防止与对应的抗氧化剂剥落的树脂结合性的恶化。其结果是,实现下述电路装置的制造方法,提高导电箔50与绝缘性树脂40结合面的耐湿性、耐脱落性。
其次本发明的第四工序在于,如图13所示,将各搭载部55的电气元件42一并覆盖,为填充分离沟51,以绝缘性树脂40共同造膜。
在本工序中,如图13(A)所示,绝缘性树脂40将电路元件42A、42B及多个导电图形41A、41B、41C完全覆盖,在导电图形41之间的分离沟51填充绝缘性树脂40,与导电图形41A、41B、41C侧面的弯曲结构嵌合而牢固地结合。而且利用绝缘性树脂支承导电图形41。
另外本工序利用传递模、注入模或罐封实现。作为树脂材料,环氧树脂等的热硬性树脂能以传递模实现,聚酰亚胺树脂、聚苯基硫醚等的热塑性树脂能以注入模实现。
覆盖在导电箔50表面的绝缘性树脂40的厚度,从电路元件42的接合导线45A的最顶部,覆盖大约100μm程度可以调整。该厚度考虑强度,厚一些薄一些都可以。
本工序的特征是;覆盖绝缘树脂40之前,构成导电图形41的导电箔50是形成的支承基板,构成支承基板的导电箔50,作为电极材料是必需的材料。因此,具有非常节约材料、可操作的优点,还能实现低成本化。
另外分离沟51形成比导电箔的厚度浅,因此导电箔50作为导电图形41,不能每个都分离。因此作为薄片状的导电箔50安装为一体,将绝缘性树脂40造模时,传送到金属模具、向金属膜具安装的操作都很简单。
其次本发明的第5工序在于,如图14所示,除去没有设置分离沟51的厚度部分的导电箔50。
本工序是化学性地及/或物理性地除去导电箔50的内面,作为导电图形41是可以分离的部分。该工序利用研磨、研削、腐蚀、激光金属蒸镀实施
在实验中,利用研磨装置或研削装置将整个面削去30μm的程度,使绝缘树脂40从分离沟51露出。在图13(A)中,将该露出的图面以实线表示。其结果是,形成约40μm厚的导电图形41被分离。另外到露出绝缘树脂40的这一边之前,将导电箔50整个面薄片腐蚀,之后可以利用研磨或研削削去整个面,使绝缘树脂40露出。而且到将导电箔50以实线表示的位置,可以整个面薄片腐蚀,使绝缘树脂40露出。
其结果具有以下特征,形成在绝缘树脂40露出导电图形41内面的结构。即,填充到分离沟51的绝缘树脂40表面和导电图形41表面实质性地形成一致的结构。因此本发明的电路装置42安装时,以焊锡等的表面张力直接水平移动,可以自动调整。
而且进行导电图形41的表面处理,得到图14表示的最终结构,即,根据需要在露出的导电图形41,覆盖焊锡等导电材料,完成电路装置。
其次本发明的第六工序在于,如图15所示,以绝缘树脂40一并,测定造膜的各搭载部55电路元件42的特性。
在前工序,导电箔50的内面腐蚀之后,从导电箔50切开分离各基板52。该基板52以绝缘树脂40与导电箔50的剩余部分接合,所以不用切断金属模具,机械性地从导电箔50的剩余部分剥落完成。
在各基板52的内面,如图15所示,露出导电图形41的内面,各搭载部55与导电图形41形成时完全一样,排列成矩阵状。在从该导电图形41的绝缘树脂40露出的内面电极46,接触传感器48,个别测定各搭载部55的电路元件42的特性参数等,判断好坏,不良品以磁墨水进行标记。
在本工序中,各搭载部55的电路装置43用绝缘树脂40与每个基板52以一体支承,所以不个别地零散地分离。因此置于检测台的基板52只是搭载部55的尺寸部分,如箭头所示,在纵方向及横方向进行间距进给,极早地、大量地测定基板52的各搭载部55的电路装置43。即,由于不需要目前必要的电路装置的内外判断、电极位置的识别等,所以能谋求测定时间大幅缩短。
其次本发明的第七工序在于,如图16所示,利用芯片接合,将绝缘树脂40与每个各搭载部55分离。
在本工序中,以真空将基板52吸附在切断装置的载置台,以切断托板59沿各搭载部55间的切断线58将分离沟51的绝缘树脂40切开,与个别的电路装置43分离。
在本工序中,切断托板59大致以切断绝缘树脂40的切削深度进行,从切断装置取出基板52后,可以以滚筒来断裂。切断时预先识别位置组合标记57,在以所述第一工序设置的各极片周边框状图形56内侧相对向以此为基准进行切断。众所周知,切断在纵方向将全部的切断线58切断后,将载置台旋转90度,根据横方向的切断线58进行切断。
利用上述制造工序完成电路装置43。
另外在本发明的制造方法中,说明在导电箔上形成集成块的情况,特别是不必限于这种情况,对于象由导线架之类的导电材料构成的基板,也能得到同样的效果。另外不限于电路装置的制造方法,在半导体装置的制造方法中也能得到同样的效果。其他的在没有脱离本发明宗旨的范围内,可以有种种变形。
其次详细说明本发明的识别装置、接合装置及电路装置的制造方法,详细说明第二实施例。另外关于电路装置的制造方法与利用第一实施例同样的方法进行,所以以第一实施例为参考,省略说明。
参照图4-图6,说明本发明的识别装置及接合装置。
在本发明的实施例中,识别装置与接合装置联动,形成具有一台识别装置的接合装置121。
如图4所示,接合装置121的主要结构由以下形成:载置台122;在基板载置台122上覆盖操作空间的罩123;罩123上面设置的操作孔124;操作孔124上方设置的环状照明125;在环状照明125侧面设置的接合臂126,在接合臂126前端设置着毛细管127。在该毛细管127近旁设置的喷嘴128;在环状照明125上方设置的镜筒129;没有图示但设置在镜筒129内的识别照相机。
其次说明各自的结构特征,其动作后面叙述。
首先载置台122载置具有多个搭载部的导线架134,通过将导线架134加热提高导线接合性,因此,具有加热器130机能。由载置台122及罩123构成的操作空间内,利用加热器130在导线接合工序中,例如能够维持230℃程度的高温状态。
其次在图4中没有显示,但罩123的一部分由箝位器60(参照图12)组成,该将箝位器60上面,例如以不锈钢板67(参照图12)制作盖,构成该罩123。而且由箝位器60通过非活性气体,例如罩123内吹入4公升/分的氮气。该吹入量根据操作用途可变。而且在罩123的上面设置操作孔124。操作孔124的大小例如以5mm×32mm形成,通过该操作孔124导线接合工序时进行图形识别、导线接合。
因此在导线架133上,例如搭载部作为10行5列的一个集成块形成,该集成块形成多个。而且操作孔124的大小相对于1个集成块,具有例如2行分配20个的搭载部能从上面识别的大小。后面叙述,但是该操作孔124在图形识别等可以活用。另外该操作孔124的大小应该是没有特别的规定,利用接合装置121的识别图形方法等,根据每次操作目的决定。
其次环状照明125及镜筒129与第一实施例同样,所以参照第一实施例的说明,在此省略说明。
而且,具有本发明特征的识别装置的接合装置121包括,在上述环状照明125上端及镜筒129下端设置着遮蔽盖131、132。该遮蔽盖131、132由透明的薄膜和透明的玻璃板等构成,环状照明125上端及镜筒129下端也不妨设置图形识别装置。
作为该遮蔽盖131、132的作用,主要是防止由于从操作孔124流出的氮气与室温的温差形成的闪晃133侵入环状照明125及镜筒129。而且闪晃136由以下操作产生。首先在罩123内,氮气以例如4公升/分吹入。而由组装在载置台122的加热器130维持罩内例如230℃。之后吹入的氮气例如为70℃,但利用加该热器130的热量加热到230℃。
被加热的氮气从操作孔124向外流出,但是这时的室温例如为20℃,所以由于氮气与室温的温度差产生大致由氮气构成的闪晃136。其结果是,不用遮蔽盖131、132时,环状照明125内笼罩闪晃136,而且通过环状照明125内时波动,使识别装置的识别精度恶化,导线接合精度下降。
但是在本发明中如图6所示,环状照明125上端及镜筒129下端设置有遮蔽盖131、132。由此特别是由于环状照明125上端的遮蔽盖131,环状照明125和操作孔124间的闪晃135虽然最初会侵入环状照明125内,但可以防止其通过环状照明125。另一方面镜筒129下端的遮蔽盖132防止闪晃135侵入镜筒129内,另外,能防止从镜筒129内向环状照明125的灰尘掉落。其结果是,具有本发明识别装置的接合装置121,导线接合工序间能充满氮气,即使导线架长时间载置在载置台上,也不会氧化。
而且,利用在罩123内加热的氮气通过操作孔124流出外部时的与室温的温度差产生的闪晃135,在环状照明125周围产生。而且闪晃135利用遮蔽盖131最初侵入环状照明25内,但环状照明125内充满闪晃135后,闪晃135就不能侵入。其结果是,闪晃135继续侵入环状照明125内,另外,能够防止通过环状照明125内。因此在环状照明125下端没有设置遮蔽盖,但可以取得与设置时同样的效果,利用识别照相机能以μm级高精度地进行图形识别,因此导线接合也能高精度进行。
而且导线架133表面氧化以后,例如到150℃,对应的抗氧化剂膜脱落,与树脂的结合性恶化,但是对此也能处理,形成能提高耐湿性、耐剥离性的接合装置。
另外在本实施例中,说明环状照明125上端及镜筒129下端设置遮蔽盖131、132的情况。没有特别的限制,即使最低在环状照明125上端设置遮蔽盖131,也能得到上述效果。
另外,在上述第二实施例,说明环状照明125的上端设置遮蔽盖131的情况,但不必特别限于该实施例。例如遮蔽盖131如果设置在环状照明125内的从上端到下端任意一个地方,都能取得与上述效果同等的效果。
最后,接合臂126、毛细管127及喷嘴128与第一实施例一样,参考第一实施例的说明,在此省略说明。
另外,在本实施例中,虽然详述了导线接合,但具有光学识别装置的装后等也能取得同样的效果。另外,载置于载置台的不限于导线架,只要是需要防止后述的导电箔的氧化的就可取得同样的效果。在对金属基板、印刷电路板、陶瓷基板等进行装片、导线接合时,即使在局部涂敷焊料部分的装置中只要具有光学识别装置,就可以应用。
本发明的识别装置包括:具有加热功能的基板载置台;在所述基板载置台上,覆盖操作区域的罩;所述罩上面设置的操作孔;所述操作孔上方设置的照明;在配置于所述照明上方的镜筒内设置的图形识别用照相机;而且吹入所述罩内的非活性气体利用所述基板载置台加热,利用从所述操作孔向外部喷出时与室温的温差形成波动,所述波动笼罩在所述照明内及周边。但是在本发明的识别装置中,所述照明上下端及镜筒下端具有遮蔽盖,防止所述波动侵入所述照明内。因此,在所述照明内,不会因所述波动而使照明产生波动,所以可以提高所述图形识别用照相机的识别精度。
另外,本发明的接合装置包括:具有加热功能的基板载置台;在所述基板载置台上,覆盖操作区域的罩;所述罩上面设置的操作孔;所述操作孔上方设置的照明;配置于所述照明的毛细管;在配置于所述照明上方的镜筒内设置的图形识别用照相机;而且吹入所述罩内的非活性气体利用所述基板载置台加热,因从所述操作孔向外部喷出时与室温的温度差形成波动。特别是利用照明下端设置的遮蔽盖,防止所述波动侵入所述照明内,由所述图形识别用照相机进行识别。之后使所述毛细管移动到所述操作孔,通过所述操作孔接合。这时通过用所述遮蔽盖防止所述波动侵入所述照明内,用识别照相机以高精度进行图形识别,因此可以实现能以μm级标准高精度接合的接合装置。
另外,在本发明的电路装置的制造方法中,通过采用上述识别装置及接合装置,在导线接合工序中,设有在小面积上集成多个搭载部的集成块的导电材料构成的基板,即使长时间置于高温度下也不会被氧化,所以可以实现能提高基板与绝缘树脂的结合面的耐湿性、耐剥离性的电路装置的制造方法。
Claims (34)
1.一种识别装置,其特征在于,包括:
具有加热功能的基板载置台;
在所述基板载置台上,覆盖操作区域的罩;
所述罩上方设置的操作孔;
所述操作孔上方设置的照明;
在配置于所述照明上方的镜筒内设置的图形识别用照相机;
至少在所述照明下端设置透明的遮蔽盖,防止吹入所述罩内的非活性气体因所述基板载置台的加热而产生的上升气流的波动侵入所述照明内。
2.如权利要求1所述的识别装置,其特征在于,所述遮蔽盖设置在所述镜筒下端。
3.如权利要求1或2所述的识别装置,其特征在于,所述遮蔽盖由透明的薄膜或透明的基板构成。
4.如权利要求1所述的识别装置,其特征在于,在所述罩和所述基板载置台形成的空间,有所述非活性气体流动。
5.如权利要求1或4所述的识别装置,其特征在于,所述罩的一部分以箝位器形成。
6.如权利要求5所述的识别装置,其特征在于,所述箝位器具有所述非活性气体进气孔。
7.如权利要求1所述的识别装置,其特征在于,所述非活性气体由氮气形成。
8.如权利要求1所述的识别装置,其特征在于,所述照明是设置在所述镜筒部下方的环状照明。
9.一种识别装置,其特征在于,包括:
具有加热功能的基板载置台;
在所述基板载置台上,覆盖操作区域的罩;
所述罩上方设置的操作孔;
所述操作孔上方设置的照明;
在配置于所述照明上方的镜筒内设置的图形识别用照相机;
至少在所述照明上端或从照明上端到下端中的任一位置,设置透明的遮蔽盖,防止吹入所述罩内的非活性气体因所述基板载置台的加热而产生的上升气流的波动侵入所述照明内。
10.如权利要求9所述的识别装置,其特征在于,所述遮蔽盖设置在所述镜筒下端。
11.如权利要求9或10所述的识别装置,其特征在于,所述遮蔽盖由透明的薄膜或透明的基板构成。
12.如权利要求9所述的识别装置,其特征在于,在以所述罩和所述基板载置台形成的空间,有所述非活性气体流动。
13.如权利要求9或12所述的识别装置,其特征在于,所述罩的一部分以箝位器形成。
14.如权利要求13所述的识别装置,其特征在于,所述箝位器具有所述非活性气体的进气孔。
15.如权利要求9所述的识别装置,其特征在于,所述非活性气体由氮气形成。
16.如权利要求9所述的识别装置,其特征在于,所述照明是设置在所述镜筒部下方的环状照明。
17.一种接合装置,其特征在于,包括:
具有加热功能的基板载置台;
在所述基板载置台上覆盖操作区域的罩;
所述罩上方设置的操作孔;
设置在所述操作孔上方的照明;
设于所述照明侧面的毛细管
至少在所述照明下端设置透明的遮蔽盖,防止吹入所述罩内的非活性气体因所述基板载置台的加热而产生的上升气流的波动侵入所述照明内,由所述图形识别用照相机识别后,将所述毛细管移动到所述操作孔上,通过所述操作孔接合。
18.如权利要求17所述的接合装置,其特征在于,所述遮蔽盖由透明的薄膜或透明的基板构成。
19.如权利要求17所述的接合装置,其特征在于,在以所述罩和所述基板载置台形成的空间,充满所述非活性气体。
20.如权利要求17或19所述的接合装置,其特征在于,所述非活性气体由氮气形成。
21.如权利要求17所述的接合装置,其特征在于,所述照明是设置在所述镜筒部下方的环状照明。
22.一种接合装置,其特征在于,包括:
具有加热功能的基板载置台;
在所述基板载置台上,覆盖操作区域的罩;
所述罩上方设置的操作孔;
所述操作孔上方设置的照明;
配置于所述照明侧面的毛细管;
在配置于所述照明上方的镜筒内设置的图形识别用照相机;
至少在所述照明上端或从照明上端到下端中的任一位置,设置透明的遮蔽盖,防止吹入所述罩内的非活性气体因所述基板载置台的加热而产生的上升气流的波动侵入所述照明内,由所述图形识别用照相机识别后,将所述毛细管移动到所述操作孔上,通过所述操作孔接合。
23.如权利要求22所述的接合装置,其特征在于,所述遮蔽盖由透明薄膜或透明的基板构成。
24.如权利要求22所述的接合装置,其特征在于,在以所述罩和所述基板载置台形成的空间,充满所述非活性气体。
25.如权利要求22或24所述的接合装置,其特征在于,所述非活性气体由氮气形成。
26.如权利要求22所述的接合装置,其特征在于,所述照明是设置在所述镜筒部下方的环状照明。
27.一种电路装置的制造方法,其特征在于,包括以下工序:
准备基板块的工序,该基板块具有在小面积上集成多个搭载部及导线的导电图形,并在所述搭载部固定电路元件;在将所述基板向基板载置台的全部所述搭载部组装期间,载置所述基板块的工序;
利用加热功能加热所述基板载置台,罩内充满所述非活性气体的工序;
至少在所述照明下端设置透明的遮蔽盖,防止吹入所述罩内的非活性气体因所述基板载置台的加热而产生的上升气流的波动侵入所述照明内,由镜内设置的识别用照相机,识别所述搭载部的所述电路元件,将所述各搭载部的所述电路元件和所述导电图形连接的工序。
28.如权利要求27所述的电路装置的制造方法,其特征在于,所述遮蔽盖由透明的薄膜或透明的基板构成。
29.如权利要求27所述的电路装置的制造方法,其特征在于,所述非活性气体由氮气形成。
30.如权利要求27所述的电路装置的制造方法,其特征在于,所述电路元件是固定半导体裸片、芯片电路部件的一者或两者。
31.一种电路装置的制造方法,其特征在于,具有以下工序:
准备基板块的工序,该基板块具有在小面积上集成多个搭载部及导线的导电图形,在所述搭载部固定电路元件;在将基板向基板载置台的全部所述搭载部的组装期间,载置所述基板块的工序;
由加热功能加热所述基板载置台,并在罩内充满所述非活性气体的工序;
至少在所述照明上端或从照明上端到下端中的任一位置,设置透明的遮蔽盖,防止吹入所述罩内的非活性气体因所述基板载置台的加热而产生的上升气流的波动侵入所述照明内,利用设置在镜筒内的识别用照相机识别所述各搭载部的所述电路元件,将所述各搭载部的所述电路元件和所述导电图形导线接合的工序。
32.如权利要求31所述的电路装置的制造方法,其特征在于,所述遮蔽盖由透明的薄膜或透明的基板构成。
33.如权利要求31所述的电路装置的制造方法,其特征在于,所述非活性气体由氮气形成。
34.如权利要求31所述的电路装置的制造方法,其特征在于,所述电路元件是固定半导体裸片、芯片电路部件中的一个或两个。
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JP2001195397A JP4711549B2 (ja) | 2001-06-27 | 2001-06-27 | 半導体装置の製造方法 |
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CN1393920A true CN1393920A (zh) | 2003-01-29 |
CN1211850C CN1211850C (zh) | 2005-07-20 |
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CNB021231761A Expired - Fee Related CN1211850C (zh) | 2001-06-27 | 2002-06-26 | 识别装置、接合装置及电路装置的制造方法 |
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US (2) | US6729528B2 (zh) |
JP (1) | JP4711549B2 (zh) |
KR (1) | KR100702560B1 (zh) |
CN (1) | CN1211850C (zh) |
TW (1) | TW538656B (zh) |
Cited By (2)
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CN106463414A (zh) * | 2014-03-14 | 2017-02-22 | 株式会社新川 | 接合装置及接合方法 |
CN114430655A (zh) * | 2020-10-29 | 2022-05-03 | 爱立发株式会社 | 电子部件接合装置 |
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WO2002028590A1 (de) * | 2000-10-06 | 2002-04-11 | Pac Tech - Packaging Technologies Gmbh | Vorrichtung zur positionierung eines werkzeuges gegenüber einem werkstück |
JP2003007759A (ja) * | 2001-06-27 | 2003-01-10 | Sanyo Electric Co Ltd | 認識装置、ボンディング装置および回路装置の製造方法 |
JP4711549B2 (ja) * | 2001-06-27 | 2011-06-29 | 三洋電機株式会社 | 半導体装置の製造方法 |
JP4166065B2 (ja) * | 2002-09-27 | 2008-10-15 | 三洋電機株式会社 | 回路装置の製造方法 |
JP4057457B2 (ja) * | 2003-04-15 | 2008-03-05 | 株式会社ディスコ | フリップチップボンダー |
US6892927B2 (en) * | 2003-04-24 | 2005-05-17 | Intel Corporation | Method and apparatus for bonding a wire to a bond pad on a device |
KR100555507B1 (ko) * | 2003-07-16 | 2006-03-03 | 삼성전자주식회사 | 칩스케일패키지 제조를 위한 박형 인쇄회로기판 |
JP4043495B2 (ja) * | 2006-04-20 | 2008-02-06 | 株式会社カイジョー | ワーククランプ及びワイヤボンディング装置 |
US8357998B2 (en) * | 2009-02-09 | 2013-01-22 | Advanced Semiconductor Engineering, Inc. | Wirebonded semiconductor package |
JP4717129B2 (ja) * | 2009-05-13 | 2011-07-06 | 三洋電機株式会社 | 半導体装置の製造方法 |
US8096461B2 (en) * | 2009-09-03 | 2012-01-17 | Advanced Semiconductor Engineering, Inc. | Wire-bonding machine with cover-gas supply device |
US8091762B1 (en) * | 2010-12-08 | 2012-01-10 | Asm Assembly Automation Ltd | Wedge bonding method incorporating remote pattern recognition system |
KR101900210B1 (ko) | 2011-02-17 | 2018-09-18 | 나이키 이노베이트 씨.브이. | 센서 시스템을 구비한 풋웨어 |
CN102259246A (zh) * | 2011-07-19 | 2011-11-30 | 东莞佰鸿电子有限公司 | Led连接线焊接防氧化装置 |
DE102013201143A1 (de) * | 2013-01-24 | 2014-08-07 | Tetiana Nowack | Faltbarer Einsatz für Blumenvasen |
TWI528481B (zh) * | 2014-02-13 | 2016-04-01 | 新川股份有限公司 | 球形成裝置、打線裝置以及球形成方法 |
US10475763B2 (en) * | 2015-05-26 | 2019-11-12 | Asm Technology Singapore Pte Ltd | Die bonding apparatus comprising an inert gas environment |
EP3373325A4 (en) * | 2015-11-05 | 2019-05-01 | Furukawa Electric Co. Ltd. | CHIP FIXING DEVICE AND CHIP FIXING METHOD |
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JPS62276840A (ja) * | 1986-05-26 | 1987-12-01 | Hitachi Ltd | ボンデイング装置 |
JPS6329535A (ja) * | 1986-07-22 | 1988-02-08 | Mitsubishi Electric Corp | ワイヤボンダ− |
JPH0195527A (ja) * | 1987-10-07 | 1989-04-13 | Mitsubishi Electric Corp | ワイヤボンデイング装置 |
JPH02112246A (ja) * | 1988-10-21 | 1990-04-24 | Hitachi Ltd | ボンディング装置 |
JP2981973B2 (ja) * | 1995-05-30 | 1999-11-22 | 株式会社新川 | ワイヤボンディング装置 |
JPH09139399A (ja) * | 1995-11-16 | 1997-05-27 | Toshiba Electron Eng Corp | 画像認識方法、その装置、ワイヤボンダ画像認識方法およびその装置 |
JP3920413B2 (ja) * | 1997-07-18 | 2007-05-30 | 株式会社東芝 | 実装装置及び実装方法 |
US6234376B1 (en) * | 1999-07-13 | 2001-05-22 | Kulicke & Soffa Investments, Inc. | Supplying a cover gas for wire ball bonding |
JP2003007759A (ja) * | 2001-06-27 | 2003-01-10 | Sanyo Electric Co Ltd | 認識装置、ボンディング装置および回路装置の製造方法 |
JP4711549B2 (ja) * | 2001-06-27 | 2011-06-29 | 三洋電機株式会社 | 半導体装置の製造方法 |
JP2003037131A (ja) * | 2001-07-25 | 2003-02-07 | Sanyo Electric Co Ltd | ボンディング装置 |
-
2001
- 2001-06-27 JP JP2001195397A patent/JP4711549B2/ja not_active Expired - Fee Related
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2002
- 2002-05-23 TW TW91110847A patent/TW538656B/zh not_active IP Right Cessation
- 2002-06-24 US US10/178,214 patent/US6729528B2/en not_active Expired - Fee Related
- 2002-06-26 CN CNB021231761A patent/CN1211850C/zh not_active Expired - Fee Related
- 2002-06-26 KR KR20020036058A patent/KR100702560B1/ko not_active IP Right Cessation
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106463414A (zh) * | 2014-03-14 | 2017-02-22 | 株式会社新川 | 接合装置及接合方法 |
CN106463414B (zh) * | 2014-03-14 | 2019-01-15 | 株式会社新川 | 接合装置及接合方法 |
CN114430655A (zh) * | 2020-10-29 | 2022-05-03 | 爱立发株式会社 | 电子部件接合装置 |
CN114430655B (zh) * | 2020-10-29 | 2023-08-01 | 爱立发株式会社 | 电子部件接合装置 |
Also Published As
Publication number | Publication date |
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KR100702560B1 (ko) | 2007-04-04 |
US6729528B2 (en) | 2004-05-04 |
KR20030004072A (ko) | 2003-01-14 |
CN1211850C (zh) | 2005-07-20 |
JP2003007760A (ja) | 2003-01-10 |
JP4711549B2 (ja) | 2011-06-29 |
TW538656B (en) | 2003-06-21 |
US7093744B2 (en) | 2006-08-22 |
US20030000993A1 (en) | 2003-01-02 |
US20040155089A1 (en) | 2004-08-12 |
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