CN102259246A - Led连接线焊接防氧化装置 - Google Patents

Led连接线焊接防氧化装置 Download PDF

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Publication number
CN102259246A
CN102259246A CN2011102011717A CN201110201171A CN102259246A CN 102259246 A CN102259246 A CN 102259246A CN 2011102011717 A CN2011102011717 A CN 2011102011717A CN 201110201171 A CN201110201171 A CN 201110201171A CN 102259246 A CN102259246 A CN 102259246A
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China
Prior art keywords
connecting line
inlet channel
nitrogen inlet
hole
led
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Pending
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CN2011102011717A
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English (en)
Inventor
李伟健
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Dongguan Baihong Electronic Co Ltd
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Dongguan Baihong Electronic Co Ltd
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Priority to CN2011102011717A priority Critical patent/CN102259246A/zh
Publication of CN102259246A publication Critical patent/CN102259246A/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009Pre-treatment of the connector or the bonding area
    • H01L2224/8503Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]

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  • Arc Welding In General (AREA)

Abstract

本发明公开了一种LED连接线焊接防氧化装置,包括本体、打火杆﹑储气空间和氮气进气通道,所述的本体中部纵向设有一通孔,一打火杆横向穿置于本体的一端,该打火杆的末端靠近通孔;所述的本体的另一端连接有氮气进气通道,该氮气进气通道至通孔处形成一储气空间,所述的氮气进气通道的两侧分别设有第一排气孔和第二排气孔。本发明设计合理,构思新颖,较传统的防氧化装置具有显著的改进和明显的技术效果,可有效保证LED连接线焊接时的氮气含量,具有巨大的市场价值。

Description

LED连接线焊接防氧化装置
技术领域
本发明涉及LED技术领域,具体地说,它是一种LED连接线焊接防氧化装置。
背景技术
连接线在LED封装中起到一个导线连接的作用,将芯片表面电极和支架连接起来,当导通电流时,电流通过连接线进入芯片,使芯片发光。
由于金丝具有电导率大、耐腐蚀、韧性好等优点,相比较其他材质而言,其最大的优点就是抗氧化性,这是金线以前应用于LED封装的主要原因。但由于金线价格昂贵,导致LED的成本较高,因此,金线逐步减少使用将是未来LED封装之发展趋势
也有生产厂家采用合金线或铜线代替金线,而由于合金线或铜线在焊接过程中容易被氧化,需要采用一种装置防止连接线被氧化,现有的防氧化装置不仅体积较大、占用空间较大,而且在工作时,不能保证连接线焊接时周围的氮气含量,容易导致连接线被氧化,废品率较高,成本较高。
因此,急需一种体积小、有效保证连接线焊接时周围的氮气含量的装置来弥补现有技术的不足。
发明内容
本发明的目的是通过一种LED连接线焊接防氧化装置的设计,使得LED连接线在焊接时不易被氧化,提高产品的合格率和生产效率。
为实现上述目的,本发明所采用的技术方案是:一种LED连接线焊接防氧化装置,包括本体、打火杆﹑储气空间和氮气进气通道,所述的本体中部纵向设有一通孔,一打火杆横向穿置于本体的一端,该打火杆的末端靠近通孔;所述的本体的另一端连接有氮气进气通道,该氮气进气通道至通孔处形成一储气空间,所述的氮气进气通道的两侧分别设有第一排气孔和第二排气孔。
本发明工作时,将连接线、芯片和支架置于通孔处,氮气由氮气进入通道进入通孔处的储气空间,并将该储气空间中的空气从通孔的上下方以及第一排气孔和第二排气孔排除,通过通孔、第一排气孔和第二排气孔也可在后续的工作工程中快速地排除使用过的氮气,而储气空间可在劈刀极速上升或下降时﹐储存的氮气被瞬间压缩或瞬间汇至中心处﹐从而使得该空间持续保持纯氮气的含量,当劈刀从通孔的正上方从下往上,极速行至打火杆末端靠近所在的通孔处时,由打火杆放电,从而实现连接线的焊接。由于上述的通孔处即为LED连接线的焊接处,从而可有效持续保证LED连接线在焊接时周围的氮气含量,防止连接线被氧化,避免造成不必要的浪费。
本发明设计合理,构思新颖,较传统的防氧化装置具有显著的改进和明显的技术效果,可有效保证LED连接线焊接时的氮气含量,具有巨大的市场价值。
附图说明
附图1为本发明LED连接线焊接防氧化装置的结构示意图;
附图2为本发明LED连接线焊接防氧化装置的剖面示意图。
图中各符号分别是:(1)本体,(2)通孔,(3)打火杆,(4)氮气进气通道,(5)第一排气孔,(6)第二排气孔。
具体实施方式
下面结合附图对本发明作进一步的详细说明:
参看图1和图2,本发明一种LED连接线焊接防氧化装置,包括本体1、打火杆3和氮气进气通道4,所述的本体1中部纵向设有一通孔2,一打火杆3横向穿置于本体的一端,该打火杆的末端靠近通孔;所述的本体1的另一端连接有氮气进气通道4,该氮气进气通道4至通孔处形成一储气空间,所述的氮气进气通道4的两侧分别设有第一排气孔5和第二排气孔6。
本发明所例举的实施例并非对自己的限定,凡是未脱离本发明技术方案的内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明的技术方案范围内。

Claims (1)

1.一种LED连接线焊接防氧化装置,包括本体、打火杆﹑储气空间和氮气进气通道,其特征在于:所述的本体中部纵向设有一通孔,一打火杆横向穿置于本体的一端,该打火杆的末端靠近通孔;所述的本体的另一端连接有氮气进气通道,该氮气进气通道至通孔处形成一储气空间,所述的氮气进气通道的两侧分别设有第一排气孔和第二排气孔。
CN2011102011717A 2011-07-19 2011-07-19 Led连接线焊接防氧化装置 Pending CN102259246A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102513687A (zh) * 2011-12-16 2012-06-27 先进光电器材(深圳)有限公司 焊线机及其防氧化结构
CN103199059A (zh) * 2013-04-23 2013-07-10 山东泰吉星电子科技有限公司 纯氮气环境下的铜线键合方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2116101A (en) * 1982-02-10 1983-09-21 Hitachi Ltd Wire bonding apparatus
US4925085A (en) * 1989-05-25 1990-05-15 Motorola Inc. Bonding means and method
US20010042777A1 (en) * 1999-07-02 2001-11-22 Kabushiki Kaisha Shinkawa Wire bonding method
US20040155089A1 (en) * 2001-06-27 2004-08-12 Sanyo Electric Co., Ltd., A Japan Corporation Recognition device, bonding device, and method of manufacturing a circuit device
CN201609811U (zh) * 2009-12-30 2010-10-20 深圳市晶导电子有限公司 铜丝球焊键合保护装置
CN201856051U (zh) * 2010-10-20 2011-06-08 圣崴科技股份有限公司 用于焊线设备的供气装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2116101A (en) * 1982-02-10 1983-09-21 Hitachi Ltd Wire bonding apparatus
US4925085A (en) * 1989-05-25 1990-05-15 Motorola Inc. Bonding means and method
US20010042777A1 (en) * 1999-07-02 2001-11-22 Kabushiki Kaisha Shinkawa Wire bonding method
US20040155089A1 (en) * 2001-06-27 2004-08-12 Sanyo Electric Co., Ltd., A Japan Corporation Recognition device, bonding device, and method of manufacturing a circuit device
CN201609811U (zh) * 2009-12-30 2010-10-20 深圳市晶导电子有限公司 铜丝球焊键合保护装置
CN201856051U (zh) * 2010-10-20 2011-06-08 圣崴科技股份有限公司 用于焊线设备的供气装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102513687A (zh) * 2011-12-16 2012-06-27 先进光电器材(深圳)有限公司 焊线机及其防氧化结构
CN102513687B (zh) * 2011-12-16 2014-03-05 先进光电器材(深圳)有限公司 焊线机及其防氧化结构
CN103199059A (zh) * 2013-04-23 2013-07-10 山东泰吉星电子科技有限公司 纯氮气环境下的铜线键合方法

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Application publication date: 20111130