CN201655810U - 微型贴片二极管 - Google Patents

微型贴片二极管 Download PDF

Info

Publication number
CN201655810U
CN201655810U CN2010201425716U CN201020142571U CN201655810U CN 201655810 U CN201655810 U CN 201655810U CN 2010201425716 U CN2010201425716 U CN 2010201425716U CN 201020142571 U CN201020142571 U CN 201020142571U CN 201655810 U CN201655810 U CN 201655810U
Authority
CN
China
Prior art keywords
sheet
tube core
pin piece
pin
pin sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010201425716U
Other languages
English (en)
Inventor
张心波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN2010201425716U priority Critical patent/CN201655810U/zh
Application granted granted Critical
Publication of CN201655810U publication Critical patent/CN201655810U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Electrotherapy Devices (AREA)

Abstract

本实用新型涉及一种微型贴片二极管，包括片状管芯、位于片状管芯两侧的第一引脚片和第二引脚片及密封绝缘外层，所述的第一引脚片呈Z字形，片状管芯的阳极面焊接在第一引脚片的底面上，第二引脚片焊接在片状管芯的阴极面上，密封绝缘层包覆在片状管芯和第一引脚片及第二引脚片上，且第一引脚片和第二引脚片的两侧伸出密封绝缘外层。本实用新型增加了片状管芯的阴极面与第二引脚片的接触面积，使得贴片二极管通过的工作电流大、承受的功率大，能提高产品合格率和良品率。

Description

微型贴片二极管
技术领域
本实用新型涉及一种微型贴片二极管，属于半导体二极管的技术领域。
背景技术
由于贴片二极管的管芯面积大于柱式二极管的面积，具有导通面积大，耐压性好等特点，而越来越多的用于各类印制线路板中。但常规微型贴片二极管见图1所示，片状管芯2的阳极面焊接在一侧的第一引脚片1上，而贴片管芯2的阴极面是通过铝丝3或金丝球经焊接或超声键合在另一侧的第二引脚片5上，最后将片状管芯2和第一引脚片和第二引脚片放入注塑模内注塑封装形成密封绝缘外壳，再经切脚，引脚打弯、测试分选等工艺制成微型贴片二极管。但该种结构的贴片二极管其片状管芯的阴极面是通过铝丝或金丝球与另一第二引脚片连接，贴片二极管通过的工作电流和功率均较小。另一方面，片状管芯采用铝丝或金丝球与第二引脚片连接，由于接触面积小，不仅增加了加工工序，而且也增加了加工的难度，该种结构的贴片二极管生产效率不高，且产品合格率不高。再则，由于微型贴片二极管在工作中，会受到机械应力以及热应力等因素的影响，也由于芯片与第二引脚片接触面积小，易造成贴片二极管的损坏，而不能有效提高贴片二极管的品质。
发明内容
本实用新型的目的是提供一种能增加工作电流大，能提高生产效率和产品的合格率的微型贴片二极管。
本实用新型为达到上述目的的技术方案是：一种微型贴片二极管，包括片状管芯、位于片状管芯两侧的第一引脚片和第二引脚片及密封绝缘外层，其特征在于：所述的第一引脚片呈Z字形，片状管芯的阳极面焊接在第一引脚片的下底面上，第二引脚片焊接在片状管芯的阴极面上，密封绝缘层包覆在片状管芯和第一引脚片及第二引脚片上，且第一引脚片和第二引脚片的两侧伸出密封绝缘外层。
本实用新型的第一引脚片采用Z形结构，片状管芯的阳极面焊接在第一引脚片的下底面上，而第二引脚片也焊接在片状管芯的阴极面上，而增加片状管芯与第二引脚片的接触面积，使得贴片二极管通过的工作电流大、承受的功率大。本实用新型片状管芯的阳极面和阴极面直接与第一引脚片和第二引脚片焊接，减少制造工艺，也由于第二引脚片直接焊接在片状管芯的阴极面上而增大接触面积，能大幅度提高生产效率，而提高产品的合格率，同时，也降低贴片二极管的工作过程中，受机械应力以及热应力等因素的影响，而提高微型贴片二极管的产品品质。
附图说明
下面结合附图对本实用新型的实施例作进一步的描述描述。
图1是已有微型贴片二极管的结构示意图。
图2是本实用新型的微型贴片二极管的结构示意图。
其中：1-第一引脚片，1-1-底面，1-2-竖边，2-片状管芯，3-铝丝，4-密封绝缘外层，5-第二引脚片。
具体实施方式
见图2所示，本实用新型的微型贴片二极管，包括片状管芯2、位于片状管芯2两侧的第一引脚片1和第二引脚片5及密封绝缘外层4，本实用新型的第一引脚片1呈Z字形，片状管芯2的阳极面焊接在第一引脚片1的底面1-1上，第二引脚片5焊接在片状管芯2的阴极面上，而增加片状管芯与第二引脚片5的接触面积，提高微型贴片二极管的工作电流大。本实用新型为使片状管芯2可靠的连接在第一引脚片1上，片状管芯2的侧边贴合第一引脚片1的竖边1-2上，密封绝缘外层4包覆在片状管芯2和第一引脚片1及第二引脚片5上，且第一引脚片1和第二引脚片5的两侧伸出密封绝缘外层4。

Claims (2)

1.一种微型贴片二极管，包括片状管芯、位于片状管芯两侧的第一引脚片和第二引脚片及密封绝缘外层，其特征在于：所述第一引脚片呈Z字形，片状管芯的阳极面焊接在第一引脚片的下底面上，第二引脚片焊接在片状管芯的阴极面上，密封绝缘层包覆在片状管芯和第一引脚片及第二引脚片上，且第一引脚片和第二引脚片的两侧伸出密封绝缘外层。
2.根据权利要求1所述的微型贴片二极管，其特征在于：所述的片状管芯的侧面与第一引脚片的竖边相接。
CN2010201425716U 2010-03-26 2010-03-26 微型贴片二极管 Expired - Fee Related CN201655810U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010201425716U CN201655810U (zh) 2010-03-26 2010-03-26 微型贴片二极管

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010201425716U CN201655810U (zh) 2010-03-26 2010-03-26 微型贴片二极管

Publications (1)

Publication Number Publication Date
CN201655810U true CN201655810U (zh) 2010-11-24

Family

ID=43121054

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010201425716U Expired - Fee Related CN201655810U (zh) 2010-03-26 2010-03-26 微型贴片二极管

Country Status (1)

Country Link
CN (1) CN201655810U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102299131A (zh) * 2011-09-09 2011-12-28 南通康比电子有限公司 一种sod-123封装结构的二极管

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102299131A (zh) * 2011-09-09 2011-12-28 南通康比电子有限公司 一种sod-123封装结构的二极管

Similar Documents

Publication Publication Date Title
CN107564987B (zh) 一种应用于叠片组件的焊带结构
CN106449538A (zh) 贴片式整流器件结构
CN201655810U (zh) 微型贴片二极管
CN109037569A (zh) 一种新能源电池模组电连接结构
CN103633174A (zh) 一种带保护功能的高效率聚光光伏光电转换接收器
CN203608446U (zh) 一种带保护功能的大电流聚光光伏光电转换接收器
CN206672823U (zh) 一种双面切环三复合电触头支承模
CN203260570U (zh) 一种基于框架腐蚀凸点的无载体式新型封装件
CN204792446U (zh) 一种片式固体电解质钽电容器的多钽芯引线框架结构
US9065030B2 (en) Diode package having improved lead wire and manufacturing method thereof
CN105185857B (zh) 光伏太阳能电池组件焊带
CN206301840U (zh) 一种直插超小型侧发光led红外发射管模组
CN209626196U (zh) 一种igbt陶瓷管壳应力自适应调节结构
CN108010975B (zh) 一种太阳能发电组件用旁路二极管
CN101853915B (zh) Led支架制作方法
CN102983197A (zh) 一种反光焊带
CN203607426U (zh) 一种大电流聚光光伏光电转换接收器
CN205194735U (zh) 双头直插式led支架
CN203617280U (zh) 便于打丝的引线框架
CN203553143U (zh) 一种引线框架
CN213988910U (zh) 一种新型电池片串焊连接结构
CN202796929U (zh) 一种贴片式引线框架
CN203038916U (zh) To220封装引线框架
CN202758879U (zh) 一种改进型引线框架
CN206312931U (zh) 一种稳固型led支架

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101124

Termination date: 20130326