CN1330007C - 高功率led - Google Patents

高功率led Download PDF

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CN1330007C
CN1330007C CNB028068084A CN02806808A CN1330007C CN 1330007 C CN1330007 C CN 1330007C CN B028068084 A CNB028068084 A CN B028068084A CN 02806808 A CN02806808 A CN 02806808A CN 1330007 C CN1330007 C CN 1330007C
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anode
lens
led
negative electrode
tube core
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CN1503992A (zh
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汤玛斯·J·巴奈特
肖恩·P·蒂林噶斯特
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Weldon Technologies Inc
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Abstract

所述的方法和系统是用于包括LED组件的一种系统。LED组件可包括一阳极，连接到阳极的阴极，连接到阴极和阳极的LED管芯，及位于由透镜、阴极和阳极限定的一腔体中粘性的或硅树脂材料。粘性的或硅树脂材料可以是凝胶，润滑脂，非弹性材料，或非液体材料。该方法和系统可进一步包括一安装装置，其中透镜机械连接到插口，卡销，或螺栓连接等方式的安装装置。该方法和系统可进而包括一阳极条带，该条带包括用来形成LED组件阵列的阳极阵列，并包括一载体条带，该条带包括容纳装置，容纳LED组件阵列。透镜的部分可或者以覆盖或者包含光可激发材料，或者粘性材料可包括光可激发材料，使得系统发射白光。

Description

高功率LED
技术领域
各实施例一般涉及用于在制造发光二极管(LED)等的组装，这可提供更大的光输出和增加的可靠性。实施例的一种方式可产生光学上有效的LED，这种LED可产生每单位面积比当前业内可得的更高的照明。实施例的另一方式可提供一种装置，把器件机械附加到灯具或印刷电路板。实施例的另一方式可提供一种对于LED改进的组件，以及用于在条带上组装多个LED的方法，这更好地便于用于使用LED的组件的自动制造方法。实施例的另一方式可提供产生白色光的装置。实施例的另一方式可提供安装多个LED管芯的一种装置。
背景技术
制造LED发光元件的技术在业内被广泛述及，并为专业人员所熟知。此外，产生白色LED的技术在业内周知且有述。相关的专利包括：U.S.Patent No.5,813,752颁发给Singer et al.On September29，1998，标题为“UV/Blue LED-Phosphorus Devise With Short WavePass，Long Wave Pass Band Pass and Peroit Filters，”该文献描述了分层蓝色/UV LED半导体的使用，具有荧光体的顶层与用于产生白光的滤光器；U.S.Patent Nos.5,998,928与6,060,440颁发给Shimizuet al.分别在December 7，1999 and May 20，2000，且每一个标题为“Light Emitting Device Having A Nitride Compound SemiconductorAnd A Phosphor Containing A Gamet Fluorescent Material，”该文献描述了白色光LED的设计，采用蓝色LED以激发荧光体材料层，包括以铈激励的暗红色荧光材料和/或包括使用围绕荧光体的分散材料，该荧光体包含元件以扩散所得的照明。
各种LED组件结构的形成还在若干LED制造商的市售数据记录单(data sheet)中公开；例如参见技术数据记录单，用于Super FluxLED，by LumiLeds(Philips Lighting and Agilent Technology之间的合资公司)；SnapLED 150 LEDS，by LumiLeds；Six LED Hgh MountStop Light Array，by LumiLeds；Luxeon Star，by LumiLeds；SharkSeries，High Flux LED Illuminators，by Opto Technology，Inc。
背景
发光二极管(LED)是当电流通过时产生各色光的一种小型半导体器件。颜色基本上取决于LED管芯发光元件或芯片的化学成分。LED表现出对基于灯丝的发光器件的各种优势，诸如较长的寿命，较低的功率需求，良好的初始驱动特性，高抗震性及对重复电源切换的高耐受性。因为这些出色的特性，LED广泛用于诸如指示器和低功率发光应用。
近来，已经开发出具有高照明和效率的红色、绿色与蓝色(RGB)LED，并在大屏幕LED显示器中采用。这类LED显示器能够以较低的功率工作，并具有重量轻且表现出长寿命的出色特性。使用LED作为可替代的光源的应用正在成长。
即使其有这些正面的特性，由于该装置在从供给的电流产生光时并不是100％有效，LED芯片能够产生大量的热。因而，要采用散热器以驱散由LED产生的热，这通常通过LED本身的金属引线框提供。如果热不能被适当驱散，则由于不同的热膨胀系数所至应力要加在LED的各种内部元件上。某些制造商已经，但是以一种折衷的方式，生产出具有大散热器的更强大的LED。首先，如果带有大散热器的LED使用传统的方法进行焊接(即波动焊，回流焊)，来自焊接过程的热量传导到LED芯片，这可能引起LED失效。其次，如果使用非传统的技术(即巴(bar)焊或激光焊接)焊接LED，由于过程的热敏感性一般这必须由LED制造商进行。因而，LED制造商作为“板级(bord level)”元件提供高通量LED。但是这种结构并适合意向的最终产品设计物理空间要求。
此外，LED与一相关透镜的光耦合是效率低的。一般来说，LED由使用透光环氧树脂封装到基片上的半导体芯片组成。芯片(折射率n≈3.4)对环氧树脂(n≈1.56)的这一直接界面生成两种材料之间剧烈的折射率梯度。在光从高折射率介质向低折射率介质行进时，由于光不能逃逸由内部反射引起的封装而受到菲涅耳损失。因而，使折射率过渡最小化的材料或材料层，将降低否则将出现的菲涅耳损失。通过以具有LED芯片材料与环氧树脂之间中间值折射率的一层或多层光凝胶或液体(以下统称为“凝胶”)，代替透明的环氧树脂，将强化光子抽取因而光的输出。
进而，因为用来密封传统的LED芯片的环氧树脂在完全凝固时一般是刚性的，热膨胀能够在导线和LED芯片之间的粘合上引起一定程度的剪切和拉伸应力。通过把芯片和导线的粘合密封在凝胶而不是环氧树脂中，能够使导线粘合在正常工作条件下在凝胶内作某种运动，因而降低了芯片和导线粘合之间的剪切和拉伸应力。
最后，当接合到各种产品的应用时，LED(在其各种封装设计中)一般设计为组装到印刷电路板并使用焊接过程固定。然而，由于本发明的LED组件能够使用另外的机械过程(即抽头&插口，激光焊接等)组装，LED的使用对于自动制造过程更为灵活，使用比先前所需较少的板上空间，并能够适合种类更广泛的产品应用。本实施例LED组件的机械安装一般将较少或完全消除LED组装过程期间LED受到的热，因而消除了元件失效的主要根源。此外，LED装有整体的金属引线框架，提供了实际上比接合到环氧树脂印刷电路板上的传统LED所提供的更大的散热。
发明内容
一个实施例提供了包括一LED组件(package)的一种系统。该LED组件包括一环形阳极与连接到环形阳极的阴极。该LED组件还包括连接到阴极和环形阳极的LED管芯(die)，及连接到环形阳极的透镜。LED组件还包括位于由透镜、阴极和环形阳极限定的腔体中的粘性材料。
另一实施例提供了一种系统，包括一安装装置和一LED组件。LED组件包括一带有中心开口的环形引线框架，连接到与中心开口相邻引线框架的散热器，连接到散热器并通过导线粘合到颜色框架的LED管芯，以及连接到引线框架的透镜。透镜包括一突起，该凸起用来把LED组件机械固定到安装装置。LED组件还包括位于由透镜、散热器和引线框架限定的腔体中的硅树脂材料。
另一实施例提供了制造带有LED组件的系统的一种方法。LED组件的制造包括以下步骤a)提供带有管芯杯的散热器，b)提供带有容纳散热器的同心开口的环形引线框架，c)把LED管芯连接到散热器管芯杯，d)把LED管芯通过导线粘合经过同心开口连接到引线框架，e)向由透镜、引线和散热器限定的腔体分配粘性(viscous)材料，以及f)把透镜连接到引线框架(lead frame)。
另一实施例提供了包括一LED组件的一种系统。该LED组件包括一环形阳极及连接到环形阳极的阴极。该LED组件还包括连接到阴极及环形阳极的一LED管芯，以及连接到环形阳极的一透镜。该LED组件还包括由透镜、阴极与环形阳极限定的一腔体。
另一实施例提供了包括一LED组件的一系统。该LED组件包括一阳极和连接到阳极的阴极。该LED组件还包括连接阴极与阳极的LED管芯及连接到阳极的一透镜。LED组件还包括位于由透镜、阴极和阳极限定的一腔体。
另一方式可以是，粘性或硅树脂材料为凝胶，润滑脂，非弹性材料，或非液体材料。
另一方式可以是，该系统包括一安装装置，其中LED组件通过透镜机械连接到安装装置。
另一方式可以是，该系统还包括一阳极条带，该条带包括用来形成LED组件阵列的阳极阵列，以及载体条带，该条带包括容纳LED组件阵列的容纳装置。
另一方式可以是，透镜的一部分或者涂敷或包括光可激发材料，使得系统发射白光。另一方式可以是，硅树脂或粘性材料包含光可激发材料，使得系统方式白光。
另一方式可以是，使用多个LED管芯。
根据本发明，提供了一种包括LED组件的系统，该LED组件包括：具有对称形状的阳极；连接到所述阳极的阴极；连接到所述阴极和阳极的LED管芯；连接到所述阳极的透镜；及由所述透镜、阴极和阳极限定的腔体。
附图说明
通过参照附图阅读以下说明书和权利要求，对这些实施例所涉及的业内专业人员本发明进一步的特性将变得显而易见，其中：
图1A是LED组件一实施例的的剖视图；
图1B是一系统的实施例的剖视图；
图2是LED组件一实施例的的分解图；
图3是LED组件一实施例截面的局部剖视图；
图4根据几个实施例的阳极的透视图；
图5是包括一印刷电路板和LED组件的系统的另一实施例的示意图；
图6是包括一载体条带和LED组件的系统的另一实施例的示意图；
图7是带有多个LED管芯LED组件的另一实施例的分解图；
图8A是LED组件另一实施例的侧视图；
图8B是图8A的LED组件的底视图；
图9A是LED组件另一实施例的侧视图；
图9B是图9A的LED组件的底视图；
图10是包括壳体和LED组件的系统的另一实施例的示意图；以及
图11是包括载体阵列和LED组件的系统另一实施例的示意图。
具体实施方式
参见图1-4，示出系统100的LED组件10。系统100的LED组件10包括一环形阳极12，阴极14，LED管芯16和透镜18。这一粘性材料20可以是透明的硅树脂凝胶或润滑脂，非弹性材料，非液体材料等。在其它实施例中，腔体22可包含液体，弹性或固体材料，或可不包含任何材料。
LED管芯16连接到阴极14的管芯帽24，并通过导线接合26连接到阳极12。LED管芯16可通过热和电传导环氧树脂等连接到管芯杯24。管芯杯24可具有反射面。阴极14通过使用连接材料28连接到阳极12，这可以是液晶聚合物等，只要材料是热传导的和电绝缘的。在向腔体22分配粘性材料20之后，透镜18通过互补连接装置30(参见图3)连接到阳极12，这可以是倒刺或阳极保持接头，及连接装置31(参见图3)，这可以是容纳开口。透镜18还包括突起32，其可以是透镜脚，允许LED组件10可拆卸固定在插口方式的安装装置54的连接装置36中，其中对脚32通过从阳极12的周边部分延伸长的柔性延伸34向连接装置36加偏压。另外，如在图9-10可见，插口装置可直接接合到电灯器具，以消除对二次连接装置及印刷电路板的需要。在可拆卸固定到安装装置54之后，从安装装置54延长的延伸部分55被容纳在印刷电路板(PCB)40中的开口56中，且从安装装置54延长的延伸部分57被容纳在印刷电路板40中的开口58中，以便把安装装置54连接到PCB40。在安装装置54内，开口59容纳阴极柱60。
环形阳极12位于系统100的中心。环形阳极12是用于LED系统100的引线框架。如图4中最好可见，在所示的圆形实施例中，环形引线框架12有些象倒置的平底锅，具有一集中的，最好是同心的在“底部”52形成的窗口50，提供到LED管芯16和导线接合26的通路，并且从LED管芯16发射的光通过其分布到透镜18。然而，其它实施例可以有其它一般为对称的形状，其与环形实施例那样同样适于作为引线框架。如以上所讨论，在一实施例中，模压的倒刺30在引线框架12体的周边附近四周形成，用于在LED组件组装期间在引线框架12与透镜18的容纳开口31之间俘获啮合。
LED组件10还允许产品组装过程中有明显的改进。由于圆形LED组件10不是特定指向的，这可以安装在PCB40上的安装装置54中，或如图10所见，LED组件10可安装在电灯器具组件100中光照装置354中的安装装置254中，其中在任何这些实施例中LED组件10安装在关于其中心辐射反向的任何指向。这消除了在组装之前对特定元件指向的需要。图1-5中所示的实施例可能类似于RCA-型插座，这允许LED组件10易于安装到类似样子的插口中安装装置54中的连接装置36中，而无需加热或任何特定的工具。
引线框架12的环形设计还使其可提供大的面积，用于散发在使用中产生的热。由于环形几何形状所固有的圆周应力，该形状还进一步有益于降低热膨胀。
LED组件10的其它的实施例使用多个LED管芯16，诸如图7所示的实施例，其可包括红色、绿色和蓝色LED管芯16。这些实施例的某些中，每一LED管芯16必须通过导线接合26连接到引线框架12不同的段，以便对每一LED管芯16提供分开的阳极段12A-C。使用实施例的环形结构，可易于容纳从引线框架12到多个LED管芯16的多个导线接合26。
最后，引线框架12可用激光焊接而不是焊锡焊接，或其它方式到PCB 40的机械连接，以提供LED组件10与PCB 40之间的电接触，从而尽量减少在LED组件10组装为产品或部件期间LED管芯16过热的危险。
LED组件10采用透镜18，该透镜可以是各种透镜图案或几何形状，该透镜被预模制并可由已知的若干材料之一构成，这些材料是环氧树脂、尿素树脂、硅树脂、丙烯酸树脂、玻璃等。虽然以圆形实施例示出，但透镜18的形状可以是任何一般每一限制的对称形状，诸如方形，六边形，三角形等。透镜18对LED组件10提供光学图案，并可配置为凹陷，凸起，或准直透镜，并可以是光学透明，或包含分散剂以便散射输出光。在几个实施例中，透镜18的内表面可涂敷适当的光可激发材料，或透镜18可包含适当的光可激发材料，该材料可以是荧光体材料，用于当LED管芯以蓝色、紫外线或其它颜色激发时产生白光。在其它实施例中，硅树脂或粘性材料20可包含光可激发材料。此外，透镜18既是对粘性材料20部分地限定腔体，又作为LED管芯16及伴随的导线接合26的防护屏。通过预模制透镜18，LED组件10的光输出易于通过产生透镜18不同的配置、图案或几何形状被修改。
粘性材料20可以是光学质量的凝胶或润滑脂或其它粘性材料，它们的折射率可以是n≈1.7或更大。粘性材料20包含在透镜18中，以便能够提供折射率大约为n≈3.40的LED管芯16，与折射率大约为n≈1.5的透镜之间的折射率逐步过渡。如果粘性材料20是光学凝胶，这可以是由Nye Optical制造的类型的凝胶。此外，粘性材料20降低了导线接合26与LED管芯16上由热膨胀引起的应力。在一个实施例中，粘性材料20通过将其在透镜18内分布在各层而形成，使得它有变化的折射率，其中折射率最高的层最靠近LED管芯16。除了便于LED组件10的组装之外，LED管芯16与透镜18之间之间的粘性材料的变化层次还减少了LED组件10内的菲涅耳损失。
如上所讨论，在某些实施例中使用蓝色、紫外线或其它颜色LED管芯16，通过光可激发材料产生发射的或输出的白光，这些材料可以是位于透镜18内或上的荧光材料，或类似于Shimizu et al.InU.S.Pat.Nos.5,998,925 and 6,069,440中所公开的情形，粘性材料20可包含适当的荧光材料。然而，与Shimizu et al.专利不同，在某些实施例中一个或多个粘性材料20层代替先有技术固化的环氧树脂涂敷树脂。此外，在另一些实施例中，荧光体承载粘性材料20不是限定在保持LED管芯16的腔体22，而是填充整个透镜18的腔体。在图中所示的圆形实施例中，荧光体承载粘性材料20半球结构，比Shimizu et al.一般描绘的LED提供了更多的全方向输出。
用来连接引线框架12到LED管芯16的导线接合26可以是金，但也可由铜，铂，铝或它们的合金制成。导线接合26的直径一般在范围10-45μm。如业内所知，因为根据先有技术方法制成的LED中的材料之间的热膨胀系数，不推荐使用直径小于25μm的导线接合，因为在接合点可能断裂。于是，与先有技术不同，导线接合26封入粘性材料而不是硬质树脂，这样允许有某种膨胀而不会有电接合的损失。导线接合26通过通常的导线接合技术连接到LED管芯16的电极与引线框架12。
可作为铜套(slug)或散热器阴极14装设在LED组件的中心，并用作为LED组件10的阴极。如以上所讨论，阴极14配置为在其上表面具有管芯杯24，其内装有LED管芯16。又如上所讨论，液晶聚合物28可用来连接阴极14到阳极12的位置。液晶聚合物28还提供一种屏障以便密封粘性材料20在适当的位置。此外，因为液晶聚合物28热连接到阳极12，这提供对LED管芯16附加的散热。管芯杯24的内表面可以通过电镀或其它方式抛光为一反射面，以便把从LED管芯16发射的光按预定的方式指向。阴极14的质量对LED管芯16提供了优秀的散热，以便允许较高的功率施加到LED管芯16，结果得到较高的流明输出。
在某些实施例中，阴极14可装有整体的中心柱60。当这样配置时，通过通常的焊接技术，或不使用热，通过向安装装置32和36互补插口排布压接配合LED组件10，能够组装到PCB40部件。在其它实施例中，阴极14的基部62，当没有整体的中心柱时，能够被激光焊接或其它方式机械连接到阳极12，以提供电接触。参见图6在其它实施例中，每一LED组件10的阴极14可连接到载体条带42上的容纳装置72，其中阳极12的每一个可使用载体条带70连接。在如图8A-B中所示的其它实施例中，LED组件410包括一带有柱体460的阴极414，该柱体包括可连接到系统中互补的连接装置的一突起470，这可以是一卡口型的连接系统。在图9A-B中可见的其它实施例中，LED组件510包括带有螺纹位表面570的柱体560的一阴极，它可以连接到系统中的互补连接装置。
其折射率可以是n≈3.40的LED管芯16提供了流明输出。LED管芯16可以是多层外延半导体结构，其阳极和阴极分别电安装到内引线12和安装引线14。当加电时，LED管芯16是发射由其化学构成预定的波长的光的元件。如上所讨论，为了产生所需的白色LED输出，如图7中所见，LED管芯16的多种颜色，诸如红色、蓝色和绿色，可组合到单个的LED组件中。然而，在其它实施例中，绿色，紫外线或其它颜色的LED管芯16用来激发体积18中荧光体包含成分或硅树脂或粘性材料22，以便产生白光。具有类似功能的某些先有技术装置是Singer et al.，主张在蓝色LED芯片顶部使用荧光体层以产生白光，Shimizu et al.，主张使用嵌入到LED芯片上树脂涂敷材料位置的荧光体材料，以及Shimizu et al.，主张在围绕LED芯片的模制透镜中使用荧光体。
如图6中所见，一个实施例提供了连续形成为载体条带70的阳极12的一阵列，其可以是阳极载体条带，这可通过模压或其它传统的手段形成。装置结构便于LED组件10的制造。阳极条带70还提供了把LED组件10组装为部件的另一装置。例如，可以是包含具有共用阴极容纳装置72的阴极载体条带的载体条带42，可用作为一个部件。在这种应用中，只需要到阴极的一个电连接。类似地，阳极载体条带70能够配置为具有共用阳极，这种情形下，只通过形成两个电连接，LED组件10的整个条带能够易于组装到产品中。阴极载体条带42和阳极载体条带70可沿它们的长度被周期地刻痕(如虚线所示)，以使阴极载体条带42和阳极载体条带70能够被分割为预定的长度。
已经就其特定实施例对各种实施例进行了详细说明，但显然，在不背离由以下权利要求所定义的实施例精神和范围之下，可以有各种变型和修改。

Claims (49)

1.一种包括LED组件的系统，该LED组件包括：
具有对称形状的阳极；
连接到所述阳极的阴极；
连接到所述阴极和阳极的LED管芯；
连接到所述阳极的透镜；及
由所述透镜、阴极和阳极限定的腔体。
2.权利要求1的系统，其中所述阳极是环形阳极。
3.权利要求1的系统，还包括安装装置，其中LED组件通过透镜机械连接到安装装置。
4.权利要求1的系统，其中该系统是电灯器具。
5.权利要求1的系统，还包括：
阳极条带，该条带包括用来形成LED组件阵列的阳极阵列，以及
载体条带，该条带包括容纳LED组件阵列的容纳装置。
6.权利要求1的系统，其中阳极和透镜包括互补连接装置，用于将所述阳极和透镜互相配合地接合在一起。
7.权利要求6的系统，其中互补连接装置是阳极倒刺和透镜开口。
8.权利要求1的系统，其中所述LED管芯为多个LED管芯。
9.权利要求1的系统，其中所述LED管芯通过热和电传导环氧树脂连接到阴极，且LED管芯通过导线粘合连接到阳极。
10.权利要求1的系统，其中阴极是散热器。
11.权利要求1的系统，其中阴极包括LED管芯与其连接的管芯杯。
12.权利要求1的系统，其中阳极是引线框架。
13.权利要求1的系统，其中透镜的一部分包括光可激发材料，使得该系统发射白光。
14.权利要求1的系统，其中透镜的一部分包括分散剂以漫射输出光。
15.权利要求1的系统，还包括在腔体中的液体材料、弹性材料和固态材料中的至少之一。
16.权利要求1的系统，还包括至少部分填充在腔体中的粘性材料。
17.权利要求16的系统，其中所述腔体填充有粘性材料。
18.权利要求16的系统，其中粘性材料是非弹性材料。
19.权利要求16的系统，其中粘性材料是润滑脂。
20.权利要求16的系统，其中粘性材料是非液体材料。
21.权利要求16的系统，其中粘性材料是硅树脂材料。
22.权利要求1的系统，其中透镜的一部分涂敷光可激发材料，使该系统发射白光。
23.权利要求1的系统，其中该系统是前灯装置。
24.权利要求1的系统，其中该系统是闪光灯装置。
25.权利要求1的系统，还包括安装在板上的插口装置，其中透镜通过透镜突起机械地连接到插口装置，并且通过从阳极延伸出的柔性延伸物紧固地偏压在插口装置中。
26.权利要求1的系统，其中阴极包括带螺纹部分，其中螺纹被用来把LED组件连接到系统。
27.权利要求16的系统，其中粘性材料包括光可激发材料。
28.权利要求27的系统，其中白光通过光可激发材料产生。
29.权利要求1的系统，还包括：
安装装置；以及
与阴极安装端相邻的突起，
其中LED组件通过突起机械安装到安装装置。
30.权利要求1的系统，其中透镜具有对称形状，以便从LED管芯漫射照明。
31.权利要求1的系统，其中所述透镜为凹透镜、凸透镜和准直透镜之一，以便从LED管芯漫射照明。
32.权利要求1的系统，其中透镜具有光学几何形状，以便产生所需的光图案。
33.权利要求1的系统，其中透镜具有光学图案，以便产生所需的光图案。
34.权利要求1的系统，还包括：
安装装置；及
在腔体中的粘性材料、液体材料、弹性材料、固态材料中的至少之一。
35.权利要求34的系统，其中所述材料是凝胶。
36.权利要求34的系统，其中所述材料是黏性的。
37.权利要求34的系统，其中所述材料是润滑脂。
38.一种制造带有LED组件的系统的方法，包括以下步骤：
a)提供带有管芯杯的阴极；
b)提供带有容纳阴极的同心开口的环形阳极；
c)把LED管芯连接到阴极的管芯杯；
d)把LED管芯通过导线粘合经过同心开口连接到阳极；
e)将透镜连接到所述阳极；以及
f)向由透镜、阳极和阴极限定的腔体分配粘性材料。
39.权利要求38的方法，还包括以液晶聚合物把阴极连接到阳极的步骤。
40.权利要求38的方法，还包括以管芯附着粘合剂把LED管芯连接到阴极的步骤。
41.权利要求38的方法，还包括对多个LED管芯重复步骤c)和d)。
42.权利要求38的方法，还包括以下步骤：
在安装装置中提供插口装置；以及
通过透镜把LED组件机械连接到插口装置。
43.权利要求38的方法，还包括提供阴极的有螺纹部分，以便把LED组件机械连接到系统。
44.权利要求38的方法，还包括以下步骤：
提供安装装置，以及
在阴极附着端上提供突起，
其中突起由安装装置容纳，以便把LED组件机械连接到系统。
45.权利要求38的方法，还包括以下步骤：
在阳极上提供倒刺；以及
在透镜上提供容纳孔；
其中倒刺容纳在容纳孔中，以便进行把阳极连接到透镜的步骤。
46.权利要求38的方法，还包括下述步骤：
形成阳极条带，该条带包括用来形成LED组件阵列的阳极阵列；以及
形成载体条带，该条带包括容纳装置以容纳LED组件阵列。
47.权利要求38的方法，还包括为透镜的一部分提供光可激发材料的步骤，使得该系统发射白光。
48.权利要求38的方法，还包括以光可激发材料涂敷透镜一部分的步骤，使该系统发射白光。
49.权利要求38的方法，还包括在粘性材料中提供光可激发材料的步骤，使该系统发射白光。
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Families Citing this family (282)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8093823B1 (en) * 2000-02-11 2012-01-10 Altair Engineering, Inc. Light sources incorporating light emitting diodes
US7049761B2 (en) 2000-02-11 2006-05-23 Altair Engineering, Inc. Light tube and power supply circuit
US7320632B2 (en) * 2000-06-15 2008-01-22 Lednium Pty Limited Method of producing a lamp
AUPQ818100A0 (en) * 2000-06-15 2000-07-06 Arlec Australia Limited Led lamp
KR20010000545A (ko) * 2000-10-05 2001-01-05 유태경 펌핑 층이 집적된 다 파장 ＡｌＧａＩｎＮ계 반도체ＬＥＤ 소자 및 그 제조 방법
US8569785B2 (en) * 2001-08-24 2013-10-29 Cao Group, Inc. Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame
US8201985B2 (en) * 2001-08-24 2012-06-19 Cao Group, Inc. Light bulb utilizing a replaceable LED light source
US7728345B2 (en) * 2001-08-24 2010-06-01 Cao Group, Inc. Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame
US7976211B2 (en) * 2001-08-24 2011-07-12 Densen Cao Light bulb utilizing a replaceable LED light source
US6827468B2 (en) * 2001-12-10 2004-12-07 Robert D. Galli LED lighting assembly
US7118255B2 (en) * 2001-12-10 2006-10-10 Galli Robert D LED lighting assembly with improved heat exchange
US7055989B2 (en) * 2001-12-10 2006-06-06 Robert Galli LED lighting assembly
US7083305B2 (en) * 2001-12-10 2006-08-01 Galli Robert D LED lighting assembly with improved heat management
US7121680B2 (en) * 2001-12-10 2006-10-17 Galli Robert D LED lighting assembly with improved heat management
US6942365B2 (en) * 2002-12-10 2005-09-13 Robert Galli LED lighting assembly
US7652303B2 (en) * 2001-12-10 2010-01-26 Galli Robert D LED lighting assembly
US6974234B2 (en) * 2001-12-10 2005-12-13 Galli Robert D LED lighting assembly
FR2835651B1 (fr) * 2002-02-06 2005-04-15 St Microelectronics Sa Dispositif de montage d'un boitier semi-conducteur sur une plaque-support par l'intermediaire d'une embase
US6700138B2 (en) * 2002-02-25 2004-03-02 Silicon Bandwidth, Inc. Modular semiconductor die package and method of manufacturing thereof
US6762432B2 (en) * 2002-04-01 2004-07-13 Micrel, Inc. Electrical field alignment vernier
CN1653297B (zh) 2002-05-08 2010-09-29 佛森技术公司 高效固态光源及其使用和制造方法
AU2003233248B2 (en) * 2002-06-14 2006-11-09 Lednium Technology Pty Limited A lamp and method of producing a lamp
US20040032728A1 (en) * 2002-08-19 2004-02-19 Robert Galli Optical assembly for LED chip package
US7224000B2 (en) * 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
US7800121B2 (en) * 2002-08-30 2010-09-21 Lumination Llc Light emitting diode component
US7244965B2 (en) * 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
US7775685B2 (en) 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US7264378B2 (en) 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
AU2003270918A1 (en) * 2002-09-30 2004-04-23 Teledyne Lighting And Display Products, Inc. Illuminator assembly
US7091582B2 (en) * 2002-11-27 2006-08-15 Mario Merlin Electronic package with snap-on perimeter wall
DE10255932A1 (de) * 2002-11-29 2004-06-17 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
CN100383573C (zh) 2002-12-02 2008-04-23 3M创新有限公司 多光源照明系统
US6897486B2 (en) * 2002-12-06 2005-05-24 Ban P. Loh LED package die having a small footprint
US7692206B2 (en) * 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
US7153004B2 (en) * 2002-12-10 2006-12-26 Galli Robert D Flashlight housing
US8093620B2 (en) * 2002-12-10 2012-01-10 Galli Robert D LED lighting assembly with improved heat management
AU2004219544B2 (en) * 2003-03-12 2009-05-28 Lednium Technology Pty Limited A lamp assembly and a process for producing a lamp assembly
CA2518625A1 (en) * 2003-03-12 2004-09-23 Lednium Pty. Ltd. A lamp and a process for producing a lamp
US7038370B2 (en) * 2003-03-17 2006-05-02 Lumileds Lighting, U.S., Llc Phosphor converted light emitting device
US20040183081A1 (en) * 2003-03-20 2004-09-23 Alexander Shishov Light emitting diode package with self dosing feature and methods of forming same
FR2853200B1 (fr) * 2003-03-27 2005-10-07 Valeo Vision Procede de fixation d'une diode electroluminescente de puissance sur un radiateur, et dispositif de signalisation comportant une telle diode.
US7204615B2 (en) * 2003-03-31 2007-04-17 Lumination Llc LED light with active cooling
US7543961B2 (en) * 2003-03-31 2009-06-09 Lumination Llc LED light with active cooling
US7556406B2 (en) * 2003-03-31 2009-07-07 Lumination Llc Led light with active cooling
US6903380B2 (en) * 2003-04-11 2005-06-07 Weldon Technologies, Inc. High power light emitting diode
US6787782B1 (en) 2003-04-23 2004-09-07 B/E Aerospace, Inc. Ultraviolet-light vehicle air cleaning system
JP2004342870A (ja) * 2003-05-16 2004-12-02 Stanley Electric Co Ltd 大電流駆動用発光ダイオード
US7510038B2 (en) * 2003-06-11 2009-03-31 Delphi Technologies, Inc. Steering system with lane keeping integration
US7000999B2 (en) 2003-06-12 2006-02-21 Ryan Jr Patrick Henry Light emitting module
US20060221609A1 (en) * 2003-06-12 2006-10-05 Ryan Patrick H Jr Lighting strip
US6803607B1 (en) * 2003-06-13 2004-10-12 Cotco Holdings Limited Surface mountable light emitting device
US7128450B2 (en) * 2003-06-27 2006-10-31 Lear Corporation Modular light assembly and method for installing a modular light assembly in a vehicle
JP2005044699A (ja) * 2003-07-24 2005-02-17 Koito Mfg Co Ltd 車両用灯具及び光源モジュール
US7679096B1 (en) * 2003-08-21 2010-03-16 Opto Technology, Inc. Integrated LED heat sink
US20050201100A1 (en) * 2003-09-08 2005-09-15 Cassarly William J. Led lighting assembly
US7198386B2 (en) * 2003-09-17 2007-04-03 Integrated Illumination Systems, Inc. Versatile thermally advanced LED fixture
DE10347541B4 (de) * 2003-10-09 2012-02-16 Odelo Led Gmbh Verfahren zum Herstellen eines lichtleitenden LED-Körpers in mindestens zwei Fertigungsstufen
US7819550B2 (en) * 2003-10-31 2010-10-26 Phoseon Technology, Inc. Collection optics for led array with offset hemispherical or faceted surfaces
FR2862424B1 (fr) * 2003-11-18 2006-10-20 Valeo Electronique Sys Liaison Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif
US7403680B2 (en) * 2003-12-02 2008-07-22 3M Innovative Properties Company Reflective light coupler
US7250611B2 (en) * 2003-12-02 2007-07-31 3M Innovative Properties Company LED curing apparatus and method
US7329887B2 (en) 2003-12-02 2008-02-12 3M Innovative Properties Company Solid state light device
US20050116635A1 (en) * 2003-12-02 2005-06-02 Walson James E. Multiple LED source and method for assembling same
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
US20050122713A1 (en) * 2003-12-03 2005-06-09 Hutchins Donald C. Lighting
US7456805B2 (en) * 2003-12-18 2008-11-25 3M Innovative Properties Company Display including a solid state light device and method using same
US7321161B2 (en) * 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
DE102004004779B4 (de) * 2004-01-30 2015-09-03 Osram Opto Semiconductors Gmbh Leuchtdioden-Beleuchtungsmodul mit optischer Einrichtung zur Strahlformung
US7081644B2 (en) * 2004-02-06 2006-07-25 Barnes Group Inc. Overmolded lens on leadframe and method for overmolding lens on lead frame
US10575376B2 (en) 2004-02-25 2020-02-25 Lynk Labs, Inc. AC light emitting diode and AC LED drive methods and apparatus
WO2011143510A1 (en) 2010-05-12 2011-11-17 Lynk Labs, Inc. Led lighting system
US10499465B2 (en) 2004-02-25 2019-12-03 Lynk Labs, Inc. High frequency multi-voltage and multi-brightness LED lighting devices and systems and methods of using same
WO2005090686A2 (en) * 2004-03-15 2005-09-29 Onscreen Technologies, Inc. Rapid dispatch emergency signs
WO2005091392A1 (en) * 2004-03-18 2005-09-29 Phoseon Technology, Inc. Micro-reflectors on a substrate for high-density led array
EP1754259B1 (en) 2004-03-18 2019-07-17 Phoseon Technology, Inc. Direct and indirect cooling of leds
US20050212439A1 (en) * 2004-03-25 2005-09-29 Integrated Illumination Systems, Inc. Integrating flex circuitry and rigid flexible circuitry, with high power/high brightness LEDs
US7355284B2 (en) * 2004-03-29 2008-04-08 Cree, Inc. Semiconductor light emitting devices including flexible film having therein an optical element
WO2005098971A1 (fr) * 2004-04-08 2005-10-20 Yu-Chao Wu Dispositif a diode electroluminescente, dispositif de dispersion de chaleur a diode electroluminescente et appareil d'eclairage comprenant le dispositif precite
US7138659B2 (en) * 2004-05-18 2006-11-21 Onscreen Technologies, Inc. LED assembly with vented circuit board
US7280288B2 (en) 2004-06-04 2007-10-09 Cree, Inc. Composite optical lens with an integrated reflector
US7456499B2 (en) 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
DE102004028143B4 (de) * 2004-06-10 2006-12-14 Deutsches Zentrum für Luft- und Raumfahrt e.V. Vorrichtung zur Digitalisierung von Filmmaterial
KR100576866B1 (ko) * 2004-06-16 2006-05-10 삼성전기주식회사 발광다이오드 및 그 제조방법
KR20060000977A (ko) * 2004-06-30 2006-01-06 엘지.필립스 엘시디 주식회사 액정표시장치의 백라이트 유닛
US20060006791A1 (en) * 2004-07-06 2006-01-12 Chia Chee W Light emitting diode display that does not require epoxy encapsulation of the light emitting diode
US20060196638A1 (en) * 2004-07-07 2006-09-07 Georgia Tech Research Corporation System and method for thermal management using distributed synthetic jet actuators
US7236366B2 (en) * 2004-07-23 2007-06-26 Excel Cell Electronic Co., Ltd. High brightness LED apparatus with an integrated heat sink
US7201495B2 (en) * 2004-08-03 2007-04-10 Philips Lumileds Lighting Company, Llc Semiconductor light emitting device package with cover with flexible portion
WO2006016398A1 (ja) * 2004-08-10 2006-02-16 Renesas Technology Corp. 発光装置および発光装置の製造方法
DE102004044166B4 (de) * 2004-09-13 2009-02-12 BöSha GmbH + Co KG Explosionsgeschützte Leuchte mit Leuchtdioden als Lichtquelle
US7677763B2 (en) * 2004-10-20 2010-03-16 Timothy Chan Method and system for attachment of light emitting diodes to circuitry for use in lighting
US20060082315A1 (en) * 2004-10-20 2006-04-20 Timothy Chan Method and system for attachment of light emmiting diodes to circuitry for use in lighting
DE102004056252A1 (de) * 2004-10-29 2006-05-04 Osram Opto Semiconductors Gmbh Beleuchtungseinrichtung, Kfz-Scheinwerfer und Verfahren zur Herstellung einer Beleuchtungseinrichtung
US9281001B2 (en) * 2004-11-08 2016-03-08 Phoseon Technology, Inc. Methods and systems relating to light sources for use in industrial processes
US7982229B2 (en) * 2004-11-18 2011-07-19 Koninklijke Philips Electronics N.V. Light emitting device with conversion structure
US7296916B2 (en) * 2004-12-21 2007-11-20 3M Innovative Properties Company Illumination assembly and method of making same
US7285802B2 (en) * 2004-12-21 2007-10-23 3M Innovative Properties Company Illumination assembly and method of making same
US20060131601A1 (en) * 2004-12-21 2006-06-22 Ouderkirk Andrew J Illumination assembly and method of making same
US7906788B2 (en) * 2004-12-22 2011-03-15 Panasonic Corporation Semiconductor light emitting device, illumination module, illumination apparatus, method for manufacturing semiconductor light emitting device, and method for manufacturing semiconductor light emitting element
US7777247B2 (en) * 2005-01-14 2010-08-17 Cree, Inc. Semiconductor light emitting device mounting substrates including a conductive lead extending therein
KR100631901B1 (ko) * 2005-01-31 2006-10-11 삼성전기주식회사 Ｌｅｄ 패키지 프레임 및 이를 채용하는 ｌｅｄ 패키지
US7235815B2 (en) * 2005-02-14 2007-06-26 Hsien-Ta Shen LED light set
KR100631903B1 (ko) * 2005-02-17 2006-10-11 삼성전기주식회사 고출력 ｌｅｄ 하우징 및 그 제조 방법
FR2882494B1 (fr) * 2005-02-24 2010-12-31 Valeo Vision Circuit metallique apte a etre utilise dans un procede d'assemblage de composants a broches sur ledit circuit et procede d'assemblage associe
US7977698B2 (en) * 2005-03-18 2011-07-12 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. System and method for surface mountable display
KR100616684B1 (ko) * 2005-06-03 2006-08-28 삼성전기주식회사 고출력 ｌｅｄ 패키지 및 그 제조방법
US7980743B2 (en) 2005-06-14 2011-07-19 Cree, Inc. LED backlighting for displays
WO2006134635A1 (ja) * 2005-06-14 2006-12-21 Rohm Co., Ltd. 発光装置
TWM284076U (en) * 2005-06-17 2005-12-21 Arima Optoelectronics Corp The structure of the base of the package of a semiconductor device
US20070023169A1 (en) * 2005-07-29 2007-02-01 Innovative Fluidics, Inc. Synthetic jet ejector for augmentation of pumped liquid loop cooling and enhancement of pool and flow boiling
US20070041195A1 (en) * 2005-08-16 2007-02-22 Excel Cell Electronic Co., Ltd. Light emitting assembly
WO2007034803A1 (ja) * 2005-09-20 2007-03-29 Matsushita Electric Works, Ltd. Ｌｅｄ照明器具
KR20070033801A (ko) * 2005-09-22 2007-03-27 삼성전기주식회사 발광 다이오드 패키지 및 그 제조 방법
US7932535B2 (en) * 2005-11-02 2011-04-26 Nuventix, Inc. Synthetic jet cooling system for LED module
US20070102718A1 (en) * 2005-11-07 2007-05-10 Akira Takekuma Lens in light emitting device
JP4013077B2 (ja) * 2005-11-21 2007-11-28 松下電工株式会社 発光装置およびその製造方法
CN100454595C (zh) * 2005-12-09 2009-01-21 富准精密工业(深圳)有限公司 发光二极管模组
SG151282A1 (en) * 2005-12-29 2009-04-30 Lam Chiang Lim High power led housing removably fixed to a heat sink
EP1974389A4 (en) 2006-01-05 2010-12-29 Illumitex Inc SEPARATE OPTICAL DEVICE FOR DIRECTING LIGHT FROM A LED
EP1996860A2 (en) * 2006-01-31 2008-12-03 3M Innovative Properties Company Led illumination assembly with compliant foil construction
US7422344B2 (en) * 2006-02-01 2008-09-09 Anteya Technology Corporation Full color flashlight with high power LED
KR100741821B1 (ko) * 2006-02-23 2007-07-23 삼성전기주식회사 발광 다이오드 모듈
US7710045B2 (en) * 2006-03-17 2010-05-04 3M Innovative Properties Company Illumination assembly with enhanced thermal conductivity
US7808004B2 (en) * 2006-03-17 2010-10-05 Edison Opto Corporation Light emitting diode package structure and method of manufacturing the same
US20070230182A1 (en) * 2006-03-28 2007-10-04 Yun Tai Led module
EP2013919A2 (en) 2006-05-02 2009-01-14 Superbulbs, Inc. Method of light dispersion and preferential scattering of certain wavelengths of light for light-emitting diodes and bulbs constructed therefrom
CN101506934A (zh) 2006-05-02 2009-08-12 舒伯布尔斯公司 塑料led灯泡
JP2009535784A (ja) * 2006-05-02 2009-10-01 スーパーバルブス・インコーポレイテッド Ｌｅｄ電球用熱除去設計
KR100726972B1 (ko) 2006-06-30 2007-06-14 한국광기술원 조립이 용이한 플런저 발광 다이오드 패키지
US7842960B2 (en) * 2006-09-06 2010-11-30 Lumination Llc Light emitting packages and methods of making same
US8567992B2 (en) * 2006-09-12 2013-10-29 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof
WO2008031580A1 (en) 2006-09-12 2008-03-20 Paul Lo Integrally formed single piece light emitting diode light wire
US8052303B2 (en) 2006-09-12 2011-11-08 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
US8322889B2 (en) 2006-09-12 2012-12-04 GE Lighting Solutions, LLC Piezofan and heat sink system for enhanced heat transfer
US8807796B2 (en) 2006-09-12 2014-08-19 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof
WO2008038924A1 (en) 2006-09-28 2008-04-03 Seoul Opto Device Co., Ltd. Ultraviolet light emitting diode package
US20090275157A1 (en) * 2006-10-02 2009-11-05 Illumitex, Inc. Optical device shaping
KR20090064474A (ko) 2006-10-02 2009-06-18 일루미텍스, 인크. Ｌｅｄ 시스템 및 방법
US7816698B2 (en) * 2007-04-13 2010-10-19 Industrial Technology Research Institute Heat dissipation package for heat generation element
WO2008052318A1 (en) * 2006-10-31 2008-05-08 Tir Technology Lp Light source comprising a light-excitable medium
US7806560B2 (en) * 2007-01-31 2010-10-05 3M Innovative Properties Company LED illumination assembly with compliant foil construction
US20080203412A1 (en) * 2007-02-28 2008-08-28 E-Pin Optical Industry Co., Ltd. LED assembly with molded glass lens
US20080218998A1 (en) * 2007-03-08 2008-09-11 Quest William J Device having multiple light sources and methods of use
US7618163B2 (en) * 2007-04-02 2009-11-17 Ruud Lighting, Inc. Light-directing LED apparatus
US7976194B2 (en) * 2007-05-04 2011-07-12 Ruud Lighting, Inc. Sealing and thermal accommodation arrangement in LED package/secondary lens structure
US7938558B2 (en) * 2007-05-04 2011-05-10 Ruud Lighting, Inc. Safety accommodation arrangement in LED package/lens structure
US7566147B2 (en) 2007-05-04 2009-07-28 Ruud Lighting, Inc. Multi-LED light fixture with secure arrangement for LED-array wiring
US7622795B2 (en) * 2007-05-15 2009-11-24 Nichepac Technology Inc. Light emitting diode package
US20100027277A1 (en) * 2007-05-15 2010-02-04 Nichepac Technology Inc. Light emitting diode package
TW200847467A (en) * 2007-05-23 2008-12-01 Tysun Inc Light emitting diode lamp
US8439528B2 (en) 2007-10-03 2013-05-14 Switch Bulb Company, Inc. Glass LED light bulbs
US11297705B2 (en) 2007-10-06 2022-04-05 Lynk Labs, Inc. Multi-voltage and multi-brightness LED lighting devices and methods of using same
US11317495B2 (en) 2007-10-06 2022-04-26 Lynk Labs, Inc. LED circuits and assemblies
CN103925559A (zh) 2007-10-24 2014-07-16 开关电灯公司 用于发光二极管光源的散射器
US7810954B2 (en) * 2007-12-03 2010-10-12 Lumination Llc LED-based changeable color light lamp
US7943211B2 (en) * 2007-12-06 2011-05-17 Willis Electric Co., Ltd. Three dimensional displays having deformable constructions
US8118447B2 (en) 2007-12-20 2012-02-21 Altair Engineering, Inc. LED lighting apparatus with swivel connection
WO2009100358A1 (en) 2008-02-08 2009-08-13 Illumitex, Inc. System and method for emitter layer shaping
US7942563B2 (en) * 2008-02-29 2011-05-17 Tyco Electronics Corporation LED with light pipe assembly
ATE532400T1 (de) * 2008-04-17 2011-11-15 Koninkl Philips Electronics Nv Wärmeleitendes montageelement zur anbringung einer bestückten leiterplatte an einem kühlkörper
US20090273940A1 (en) 2008-05-01 2009-11-05 Cao Group, Inc. LED lighting device
US9423096B2 (en) 2008-05-23 2016-08-23 Cree, Inc. LED lighting apparatus
US8360599B2 (en) 2008-05-23 2013-01-29 Ilumisys, Inc. Electric shock resistant L.E.D. based light
US8388193B2 (en) * 2008-05-23 2013-03-05 Ruud Lighting, Inc. Lens with TIR for off-axial light distribution
US8348475B2 (en) 2008-05-23 2013-01-08 Ruud Lighting, Inc. Lens with controlled backlight management
JP2011523511A (ja) * 2008-05-29 2011-08-11 クリー インコーポレイテッド 近距離場で光を混合する光源
US7841750B2 (en) 2008-08-01 2010-11-30 Ruud Lighting, Inc. Light-directing lensing member with improved angled light distribution
GB2462815A (en) * 2008-08-18 2010-02-24 Sensitive Electronic Co Ltd Light emitting diode lamp
US20100058837A1 (en) * 2008-09-05 2010-03-11 Quest William J Device having multiple light sources and methods of use
US8653984B2 (en) 2008-10-24 2014-02-18 Ilumisys, Inc. Integration of LED lighting control with emergency notification systems
US7938562B2 (en) 2008-10-24 2011-05-10 Altair Engineering, Inc. Lighting including integral communication apparatus
US8901823B2 (en) 2008-10-24 2014-12-02 Ilumisys, Inc. Light and light sensor
US8324817B2 (en) 2008-10-24 2012-12-04 Ilumisys, Inc. Light and light sensor
US8214084B2 (en) 2008-10-24 2012-07-03 Ilumisys, Inc. Integration of LED lighting with building controls
TW201022327A (en) * 2008-10-30 2010-06-16 Solvay Advanced Polymers Llc Hydroquinone-containing polyesters having improved whiteness
EP2182275A1 (en) * 2008-10-31 2010-05-05 Osram Gesellschaft mit Beschränkter Haftung A lighting module and corresponding method
WO2010056324A1 (en) * 2008-11-12 2010-05-20 Neos International, Llc Device and method for cooling chips and leds
TWI383129B (zh) * 2008-11-19 2013-01-21 Everlight Electronics Co Ltd 對立式光編碼器
TW201034256A (en) 2008-12-11 2010-09-16 Illumitex Inc Systems and methods for packaging light-emitting diode devices
JP2012517106A (ja) * 2009-02-04 2012-07-26 リンデール インコーポレイテッド 蛍光体複合物を被覆した拡散デバイスおよび方法
US7898077B2 (en) * 2009-02-12 2011-03-01 Honeywell International Inc. Adjustable threaded cores for LED thermal management
EP3273161A1 (en) * 2009-02-17 2018-01-24 Epistar Corporation Led light bulbs for space lighting
US20100225215A1 (en) * 2009-03-03 2010-09-09 Han-Ming Lee Multi-chip cup semi-conductor lamp
US20100289415A1 (en) * 2009-05-18 2010-11-18 Johnny Chen Energy efficient decorative lighting
US9255686B2 (en) 2009-05-29 2016-02-09 Cree, Inc. Multi-lens LED-array optic system
EP2462375B1 (en) 2009-08-04 2015-09-30 Bruce Aerospace, Inc. High brightness light emitting diode luminaire
US8585253B2 (en) 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array
US8449128B2 (en) 2009-08-20 2013-05-28 Illumitex, Inc. System and method for a lens and phosphor layer
KR101014063B1 (ko) 2009-08-26 2011-02-10 엘지이노텍 주식회사 발광 소자 및 이를 이용한 라이트 유닛
US9385285B2 (en) 2009-09-17 2016-07-05 Koninklijke Philips N.V. LED module with high index lens
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
TWI403003B (zh) * 2009-10-02 2013-07-21 Chi Mei Lighting Tech Corp 發光二極體及其製造方法
US8101962B2 (en) * 2009-10-06 2012-01-24 Kuang Hong Precision Co., Ltd. Carrying structure of semiconductor
US20110085327A1 (en) * 2009-10-14 2011-04-14 Johnny Chen Decorative light display with LEDs
CN102062346A (zh) * 2009-11-12 2011-05-18 富准精密工业(深圳)有限公司 发光组件
TWM376913U (en) * 2009-11-26 2010-03-21 Forward Electronics Co Ltd LED packaging structure
US8241044B2 (en) * 2009-12-09 2012-08-14 Tyco Electronics Corporation LED socket assembly
US8878454B2 (en) 2009-12-09 2014-11-04 Tyco Electronics Corporation Solid state lighting system
US8210715B2 (en) * 2009-12-09 2012-07-03 Tyco Electronics Corporation Socket assembly with a thermal management structure
US8235549B2 (en) * 2009-12-09 2012-08-07 Tyco Electronics Corporation Solid state lighting assembly
US8845130B2 (en) * 2009-12-09 2014-09-30 Tyco Electronics Corporation LED socket assembly
EP3214662B1 (en) 2010-01-29 2018-09-26 Japan Aviation Electronics Industry, Ltd. Light-emitting apparatus
EP2553332B1 (en) 2010-03-26 2016-03-23 iLumisys, Inc. Inside-out led bulb
US8541958B2 (en) 2010-03-26 2013-09-24 Ilumisys, Inc. LED light with thermoelectric generator
US8896005B2 (en) * 2010-07-29 2014-11-25 Cree, Inc. Lighting devices that comprise one or more solid state light emitters
US8585248B1 (en) * 2010-08-16 2013-11-19 NuLEDs, Inc. LED luminaire having heat sinking panels
US8568015B2 (en) 2010-09-23 2013-10-29 Willis Electric Co., Ltd. Decorative light string for artificial lighted tree
US9024341B2 (en) 2010-10-27 2015-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Refractive index tuning of wafer level package LEDs
US8523394B2 (en) 2010-10-29 2013-09-03 Ilumisys, Inc. Mechanisms for reducing risk of shock during installation of light tube
CN103649617B (zh) * 2010-12-15 2017-02-08 伊利诺斯工具制品有限公司 用于发光二极管的散热器/连接器系统
DE102011013277A1 (de) * 2011-03-07 2012-09-13 Schott Ag Gehäuse für Hochleistungsleuchtdioden - "2-Lagen-System"
US8632213B2 (en) 2011-05-05 2014-01-21 Cree, Inc. Lighting fixture with flow-through cooling
US8298633B1 (en) 2011-05-20 2012-10-30 Willis Electric Co., Ltd. Multi-positional, locking artificial tree trunk
CN102162593B (zh) * 2011-06-03 2015-07-15 上海三思电子工程有限公司 一种照明装置
US20140239809A1 (en) 2011-08-18 2014-08-28 Lynk Labs, Inc. Devices and systems having ac led circuits and methods of driving the same
US9072171B2 (en) 2011-08-24 2015-06-30 Ilumisys, Inc. Circuit board mount for LED light
US8952402B2 (en) * 2011-08-26 2015-02-10 Micron Technology, Inc. Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods
US8591069B2 (en) 2011-09-21 2013-11-26 Switch Bulb Company, Inc. LED light bulb with controlled color distribution using quantum dots
US9429309B2 (en) 2011-09-26 2016-08-30 Ideal Industries, Inc. Device for securing a source of LED light to a heat sink surface
US9249955B2 (en) 2011-09-26 2016-02-02 Ideal Industries, Inc. Device for securing a source of LED light to a heat sink surface
US9423119B2 (en) 2011-09-26 2016-08-23 Ideal Industries, Inc. Device for securing a source of LED light to a heat sink surface
US8569960B2 (en) 2011-11-14 2013-10-29 Willis Electric Co., Ltd Conformal power adapter for lighted artificial tree
US9157587B2 (en) 2011-11-14 2015-10-13 Willis Electric Co., Ltd. Conformal power adapter for lighted artificial tree
JP5427325B2 (ja) * 2011-11-30 2014-02-26 パナソニック株式会社 窒化物半導体発光装置
WO2013082609A1 (en) 2011-12-02 2013-06-06 Lynk Labs, Inc. Color temperature controlled and low thd led lighting devices and systems and methods of driving the same
US8876321B2 (en) 2011-12-09 2014-11-04 Willis Electric Co., Ltd. Modular lighted artificial tree
US8568001B2 (en) 2012-02-03 2013-10-29 Tyco Electronics Corporation LED socket assembly
US9541258B2 (en) 2012-02-29 2017-01-10 Cree, Inc. Lens for wide lateral-angle distribution
US10408429B2 (en) 2012-02-29 2019-09-10 Ideal Industries Lighting Llc Lens for preferential-side distribution
US9541257B2 (en) 2012-02-29 2017-01-10 Cree, Inc. Lens for primarily-elongate light distribution
US9184518B2 (en) 2012-03-02 2015-11-10 Ilumisys, Inc. Electrical connector header for an LED-based light
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
USD697664S1 (en) 2012-05-07 2014-01-14 Cree, Inc. LED lens
US9044056B2 (en) 2012-05-08 2015-06-02 Willis Electric Co., Ltd. Modular tree with electrical connector
US10206530B2 (en) 2012-05-08 2019-02-19 Willis Electric Co., Ltd. Modular tree with locking trunk
US9572446B2 (en) 2012-05-08 2017-02-21 Willis Electric Co., Ltd. Modular tree with locking trunk and locking electrical connectors
US9179793B2 (en) 2012-05-08 2015-11-10 Willis Electric Co., Ltd. Modular tree with rotation-lock electrical connectors
CN102691917B (zh) * 2012-06-12 2014-03-26 陈广友 一种led灯珠
WO2014008463A1 (en) 2012-07-06 2014-01-09 Ilumisys, Inc. Power supply assembly for led-based light tube
US9271367B2 (en) 2012-07-09 2016-02-23 Ilumisys, Inc. System and method for controlling operation of an LED-based light
JP6055642B2 (ja) * 2012-10-10 2016-12-27 株式会社小糸製作所 灯具
DE102013201219A1 (de) * 2013-01-25 2014-07-31 Osram Opto Semiconductors Gmbh Leuchtmittel
US9671074B2 (en) 2013-03-13 2017-06-06 Willis Electric Co., Ltd. Modular tree with trunk connectors
US9439528B2 (en) 2013-03-13 2016-09-13 Willis Electric Co., Ltd. Modular tree with locking trunk and locking electrical connectors
US9285084B2 (en) 2013-03-14 2016-03-15 Ilumisys, Inc. Diffusers for LED-based lights
USD718490S1 (en) 2013-03-15 2014-11-25 Cree, Inc. LED lens
US10267464B2 (en) 2015-10-26 2019-04-23 Willis Electric Co., Ltd. Tangle-resistant decorative lighting assembly
US9140438B2 (en) 2013-09-13 2015-09-22 Willis Electric Co., Ltd. Decorative lighting with reinforced wiring
US9157588B2 (en) 2013-09-13 2015-10-13 Willis Electric Co., Ltd Decorative lighting with reinforced wiring
US11306881B2 (en) 2013-09-13 2022-04-19 Willis Electric Co., Ltd. Tangle-resistant decorative lighting assembly
US9267650B2 (en) 2013-10-09 2016-02-23 Ilumisys, Inc. Lens for an LED-based light
USD751240S1 (en) 2013-11-01 2016-03-08 Cree, Inc. Light fixture
US9273833B2 (en) 2013-11-01 2016-03-01 Cree, Inc. LED light fixtures with arrangement for electrical connection
CN203697831U (zh) * 2013-11-04 2014-07-09 宁波米德兰电子制造有限公司 一种新型圣诞老人像
US9894949B1 (en) 2013-11-27 2018-02-20 Willis Electric Co., Ltd. Lighted artificial tree with improved electrical connections
US8870404B1 (en) 2013-12-03 2014-10-28 Willis Electric Co., Ltd. Dual-voltage lighted artificial tree
DE102013114209A1 (de) * 2013-12-17 2015-06-18 Osram Opto Semiconductors Gmbh Verfahren zur Montage einer Chipträger-LED auf einen Trägerkörper und optoelektronisches Bauelement mit einer Chipträger-LED und einem Trägerkörper
US9523479B2 (en) 2014-01-03 2016-12-20 Cree, Inc. LED lens
CA2937642A1 (en) 2014-01-22 2015-07-30 Ilumisys, Inc. Led-based light with addressed leds
US9883566B1 (en) 2014-05-01 2018-01-30 Willis Electric Co., Ltd. Control of modular lighted artificial trees
US9510400B2 (en) 2014-05-13 2016-11-29 Ilumisys, Inc. User input systems for an LED-based light
US10741735B2 (en) 2014-06-02 2020-08-11 3M Innovative Properties Company LED with remote phosphor and shell reflector
ES2718541T3 (es) * 2015-01-23 2019-07-02 Viabizzuno Srl Estructura de lámpara LED modular
US9989223B1 (en) * 2015-03-09 2018-06-05 Automated Assembly Corporation LED lighting apparatus with LEDs and wires attached to metal sheet member by adhesive
EP3091275B1 (en) * 2015-05-08 2018-02-14 OSRAM GmbH A method of assembling lighting devices and corresponding device
US10161568B2 (en) 2015-06-01 2018-12-25 Ilumisys, Inc. LED-based light with canted outer walls
JP6582754B2 (ja) * 2015-08-31 2019-10-02 日亜化学工業株式会社 複合基板、発光装置、及び発光装置の製造方法
ITUA20164136A1 (it) * 2016-05-18 2016-08-18 Claudio Sensidoni Procedimento industriale per il collaggio cob led
US10480708B1 (en) * 2016-09-30 2019-11-19 Viza Electronics Pte. Ltd. Systems and methods for mounting electrical device to junction box
EP3376099B1 (en) 2017-03-17 2019-09-18 Lumileds Holding B.V. Led lighting arrangement
US10468566B2 (en) 2017-04-10 2019-11-05 Ideal Industries Lighting Llc Hybrid lens for controlled light distribution
DE102017108688B4 (de) * 2017-04-24 2022-08-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines optoelektronischen Bauteils und optoelektronisches Bauteil
CN107256922B (zh) * 2017-07-14 2023-05-26 湖南粤港模科实业有限公司 一种铝箔式散热器与芯片封装一体化光源结构
US10088122B1 (en) * 2017-08-04 2018-10-02 Jute Industrial Co., Ltd. Integrated lamp
US11079077B2 (en) 2017-08-31 2021-08-03 Lynk Labs, Inc. LED lighting system and installation methods
CN107676647A (zh) * 2017-10-31 2018-02-09 商洛市虎之翼科技有限公司 一种调焦激光照明装置
CN107676648A (zh) * 2017-10-31 2018-02-09 商洛市虎之翼科技有限公司 一种激光照明装置
US10683974B1 (en) 2017-12-11 2020-06-16 Willis Electric Co., Ltd. Decorative lighting control
WO2019151826A1 (ko) * 2018-02-05 2019-08-08 엘지이노텍 주식회사 반도체 소자 패키지 및 이를 포함하는 발광장치
US11205620B2 (en) * 2018-09-18 2021-12-21 International Business Machines Corporation Method and apparatus for supplying power to VLSI silicon chips
KR20210040209A (ko) * 2019-10-02 2021-04-13 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
WO2022011085A1 (en) * 2020-07-08 2022-01-13 Lumenxt Llc Compact lighting system including leds electrically connected to heat sinks

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1059667A2 (en) * 1999-06-09 2000-12-13 Sanyo Electric Co., Ltd. Hybrid integrated circuit device

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3899826A (en) * 1971-12-20 1975-08-19 Motorola Inc Scannable light emitting diode array and method
US4478588A (en) 1978-03-06 1984-10-23 Amp Incorporated Light emitting diode assembly
NL178376C (nl) * 1978-06-19 1986-03-03 Philips Nv Koppelelement met een lichtbron en een lens.
JPS58222578A (ja) * 1982-06-18 1983-12-24 Toshiba Corp 照明装置
NL8502025A (nl) 1985-07-15 1987-02-02 Philips Nv Lagedrukkwikdampontladingslamp.
CA1274613A (en) 1986-12-24 1990-09-25 Leendert Vriens Projection device and associated display device
JPH0511714A (ja) * 1991-06-28 1993-01-22 Takiron Co Ltd ドツトマトリクス発光表示体及びその製造方法
US5578839A (en) 1992-11-20 1996-11-26 Nichia Chemical Industries, Ltd. Light-emitting gallium nitride-based compound semiconductor device
DE69433926T2 (de) 1993-04-28 2005-07-21 Nichia Corp., Anan Halbleitervorrichtung aus einer galliumnitridartigen III-V-Halbleiterverbindung
JP2894921B2 (ja) 1993-04-30 1999-05-24 シャープ株式会社 半導体装置およびその製造方法
US5440658A (en) * 1993-06-29 1995-08-08 Savage, Jr.; John M. Modular fiber optic cable assembly
US5514627A (en) 1994-01-24 1996-05-07 Hewlett-Packard Company Method and apparatus for improving the performance of light emitting diodes
JPH07297479A (ja) 1994-04-27 1995-11-10 Mitsubishi Electric Corp 光半導体装置およびその製造方法
US5557115A (en) 1994-08-11 1996-09-17 Rohm Co. Ltd. Light emitting semiconductor device with sub-mount
JP3271645B2 (ja) 1995-06-08 2002-04-02 日亜化学工業株式会社 窒化物半導体発光ダイオード
US5798537A (en) 1995-08-31 1998-08-25 Kabushiki Kaisha Toshiba Blue light-emitting device
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
TW383508B (en) 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
US6274890B1 (en) * 1997-01-15 2001-08-14 Kabushiki Kaisha Toshiba Semiconductor light emitting device and its manufacturing method
JPH11103097A (ja) 1997-07-30 1999-04-13 Rohm Co Ltd 半導体発光素子
US5910661A (en) 1997-05-13 1999-06-08 Colvin, Jr.; Arthur E. Flourescence sensing device
US5813752A (en) 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue LED-phosphor device with short wave pass, long wave pass band pass and peroit filters
US5813753A (en) 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
US5847507A (en) 1997-07-14 1998-12-08 Hewlett-Packard Company Fluorescent dye added to epoxy of light emitting diode lens
JPH11135838A (ja) 1997-10-20 1999-05-21 Ind Technol Res Inst 白色発光ダイオード及びその製造方法
US6252254B1 (en) * 1998-02-06 2001-06-26 General Electric Company Light emitting device with phosphor composition
US6051849A (en) 1998-02-27 2000-04-18 North Carolina State University Gallium nitride semiconductor structures including a lateral gallium nitride layer that extends from an underlying gallium nitride layer
US6158882A (en) 1998-06-30 2000-12-12 Emteq, Inc. LED semiconductor lighting system
US6274924B1 (en) 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
US6204523B1 (en) * 1998-11-06 2001-03-20 Lumileds Lighting, U.S., Llc High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range
JP2001036143A (ja) 1999-07-19 2001-02-09 Stanley Electric Co Ltd マイクロレンズ付発光素子アレイチップ及びその製造方法
US6302595B1 (en) * 2000-03-14 2001-10-16 Bivar, Inc. Optical transmission system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1059667A2 (en) * 1999-06-09 2000-12-13 Sanyo Electric Co., Ltd. Hybrid integrated circuit device

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