GB2462815A - Light emitting diode lamp - Google Patents

Light emitting diode lamp Download PDF

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Publication number
GB2462815A
GB2462815A GB0815052A GB0815052A GB2462815A GB 2462815 A GB2462815 A GB 2462815A GB 0815052 A GB0815052 A GB 0815052A GB 0815052 A GB0815052 A GB 0815052A GB 2462815 A GB2462815 A GB 2462815A
Authority
GB
United Kingdom
Prior art keywords
light emitting
emitting diode
heat dissipation
electric conducting
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0815052A
Other versions
GB0815052D0 (en
Inventor
Kuang-Chao Yeh
Lee-Hao Shen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SENSITIVE ELECTRONIC CO Ltd
Original Assignee
SENSITIVE ELECTRONIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SENSITIVE ELECTRONIC CO Ltd filed Critical SENSITIVE ELECTRONIC CO Ltd
Priority to GB0815052A priority Critical patent/GB2462815A/en
Publication of GB0815052D0 publication Critical patent/GB0815052D0/en
Publication of GB2462815A publication Critical patent/GB2462815A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F21V29/004—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

A light emitting diode lamp includes a shade 22 and a base 21 having an electric conducting member 20 at one end, the other end being formed with a heat dissipation member 23 to which is adhered a light emitting diode (LED) module 32. The heat dissipation member can be either a cylinder (fig 6, 23a) or a polygonal pyramid 23, to each surface being attached an electric conducting lamina 31, a pin base, and a soft heat conducting circuit substrate 30 supporting LED chip 32. The base 21 can be heat conductive metal such as copper or aluminium and have a through hole to connect to the electrical connector 20. The shade 22 may be a sphere of silicon. The shape allows a wide range of illumination from LEDs 32 and fast heat dissipation through the heat-sink base 21.

Description

LIGHT EMITTING DIODE LAMP
BACKGROUND OF THE INVENTION
(a) Field of the Invention
The present invention relates to a light emitting diode lamp, and more particularly to a light emitting diode lamp which can illuminate wider and can achieve a fast heat dissipation effect.
(b) Description of the Prior Art
A light emitting diode is a solid-state semiconductor that uses an interaction of electrons and holes to release energy in terms of light; therefore, the light emitted from the light emitting diode belongs to a photoluminescence, and the light emitting diode is provided with advantages of a small volume, a fast reaction speed, a longer lifetime of usage, low electricity consumption, a good vibration-proof feature and no pollution. The light emitting diode is a light emitting element of all kinds of electrical appliances, information bulletin boards, and communication products, and has been broadly utilized in all fields, especially existing illumination equipment. Although an efficiency of an early light emitting diode is not as expected when compared to conventional illumination equipment, under a subsequent improvement in technology and material science, brightness that is produced from the light emitting diode has been intensified significantly; therefore, the light emitting diode will gradually replace the conventional light emitting element.
Moreover, under the influence of subsequent technology and material science, an electric current required by the light emitting diode is increasing. Hence, heat energy that is produced from the light emitting diode is increasing gradually, as well. In order to not allow the excessive heat energy to affect the lifetime of the light emitting diode, providing a proper heat dissipation structure to the illumination equipment that uses the light emitting diode as its light emitting element has been a required approach to an existing illumination device.
A common heat dissipation method includes using a fan or a water-cooled device, etc. However, as the ordinary illumination device is limited to its structure, and these heat dissipation methods are not designed for the illumination device, these common heat dissipation methods cannot be added into the original illumination device to facilitate carrying out the heat dissipation function for the illumination device that uses the light emitting diode.
Referring to FIG. 1, it shows a heat dissipation structure of a conventional LED (Light Emitting Diode) lamp-set, wherein the heat
-
dissipation structure 1 includes a lamp holder 10, a lamp shade 11 and an LED lamp module 12. The LED lamp module 12 is assembled by a heat dissipation assembly 121, a circuit board 122 and a light emitting diode 123. The heat dissipation assembly 121 is formed with a plurality of grooves 1211, and the light emitting diode 123 is welded on the circuit board 122 before latching the circuit board 122 into the heat dissipation assembly 121 through the groove 1211. Accordingly, in addition to that better brightness can be available by light sources of various angles, a heat dissipation efficiency of the heat dissipation assembly 121 can be increased, and a lifetime of the LED lamp module 12 can be increased, as well.
However, upon using the aforementioned heat dissipation structure of the LED lamp-set, following problems and shortcomings actually exist to be improved: 1. As the light emitting element is welded on the circuit board 122, when the heat dissipation assembly 121 is processed, each installation surface should be punched additionally into the groove 1211, thereby increasing a work procedure and also raising manufacturing cost.
2. Upon assembling, the circuit board 122 should be inserted into the groove 211 that effects of fixation and energizing can be achieved; therefore, more time will be spent in assembling, and an efficiency of production will be reduced greatly.
SUMMARY OF THE INVENTION
The primary object of the present invention is to provide a light emitting diode lamp which includes a base, an electric conducting member and a shade, wherein an end of the base is installed with the electric conducting member, an end of the base far away from the electric conducting member is formed with a heat dissipation member on which at least one LED lamp module can be adhered, and the LED lamp module is constituted by an electric conducting lamina or a pin base, and at least one chip. As the heat dissipation member is a polygonal pyramid, each surface of the polygonal pyramid is provided with one electric conducting lamina, and the electric conducting lamina is then adhered with a piece of soft heat conducting circuit substrate. The soft heat conducting circuit substrate is an electric loop of the LED lamp module on the polygonal pyramid, and the soft heat conducting circuit substrate on each pyramid surface of the polygonal pyramid can be adhered with at least one chip. In addition, the base is a high heat conducting metal (e.g., copper or aluminum). As each pyramid surface of the polygonal pyramid is attached with the electric conducting lamina or the pin base, the soft heat conducting circuit substrate and the chips, when the chips on the polygonal pyramid illuminate, a range of illumination will be wider.
Furthermore, through the base that is made by the high heat conducting metal, a fast heat dissipation effect can be achieved.
Another object of the present invention is provide a light emitting diode lamp which can achieve the practicability and progressiveness of an increased range of illumination by installing a plurality of light emitting diodes on various surfaces, because that the light emitting diode emits straight light, an area covered by light when illuminating is very limited.
Still another object of the present invention is to provide a light emitting diode lamp, wherein as the heat dissipation member can be adhered with the electric conducting lamina, the electric conducting lamina is adhered with the soft heat conducting circuit substrate or an LED part, and the heat dissipation member is the polygonal pyramid or a cylinder, the electric conducting lamina and the soft heat conducting circuit substrate can be adhered onto any heat dissipation member of a various shape. Therefore, when processing the heat dissipation member, its work procedure will be extremely easy, thereby largely reducing cost of manufacturing.
To enable a further understanding of the said objectives and the technological methods of the invention herein, the brief description of the drawings below is followed by the detailed description of the preferred embodiments.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. I shows a heat dissipation structure of a conventional LED lamp-set.
FIG. 2 shows a three-dimensional view of a preferred embodiment of the present invention.
FIG. 3 shows an exploded view of a preferred embodiment of the present invention.
FIG. 4 shows a first schematic view of an operation of a preferred embodiment of the present invention.
FIG. 5 shows a second schematic view of an operation of a preferred embodiment of the present invention.
FIG. 6 shows a three-dimensional view of another configuration of the present invention.
FIG. 7 shows a first schematic view of an operation of another preferred embodiment of the present invention.
FIG. 8 shows a second schematic view of an operation of another preferred embodiment of the present invention.
FIG. 9 shows a schematic view of an operation of still another preferred embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring to FIG. 2 and FIG. 3, it shows a three-dimensional view and an exploded view, of a preferred embodiment of the present invention. An LED lamp 2 comprises a base 21, an electric conducting member 20 and a shade 22, wherein an end of the base 21 is installed with the electric conducting member 20, and an end of the base 21 far away from the electric conducting member 20 is formed with a heat dissipation member 23 on which at least one LED lamp module 3 can be adhered. The LED lamp module 3 is constituted by an electric conducting lamina 30 or a pin base (not shown in the drawings), and at least one chip 32, wherein the electric conducting lamina 30 can be bended into a required shape according to a shape of the heat dissipation member 23, and the heat dissipation member 23 is a polygonal pyramid 231 with each surface of the polygonal pyramid 231 being provided with one electric conducting lamina 30 which is then adhered with a piece of soft heat conducting circuit substrate 31. The soft heat conducting circuit substrate 31 is an electric loop of the LED lamp module 3 on the polygonal pyramid 231, and the soft heat conducting circuit substrate 31 on each pyramid surface of the polygonal pyramid 231 can be adhered with at least one chip 32. Furthermore, the base 21 is a high heat conducting metal (e.g., copper or aluminum), as each pyramid surface of the polygonal pyramid 231 is attached with the electric conducting lamina 30 or the pin base, the soft heat conducting circuit substrate 31 and the chips 32.
Referring to F1G. 4 and FIG. 5, it shows a first schematic view of an operation and a second schematic view of an operation, of a preferred embodiment of the present invention. As the base 21 is formed with a holding space 211 (as shown in FIG. 3), the heat dissipation member 23 is a polygonal pyramid 231, and the polygonal pyramid 231 is formed with at least one through-hole 232 allowing a wire 201 that connects the electric conducting member 20 to transfix, when the base 21 and the electric conducting member 20 are assembled, due to that the electric conducting member 20 is connected with the wire 201, the wire 201 is first transfixed into the base 21, and is then transfixed out of the plural through-holes 231, before locking the electric conducting member 20 at a bottom of the base 21. However, the electric conducting lamina 30 is attached on each surface of the polygonal pyramid 231 (e.g., a triangular prism, a quadrilateral or polygonal prism), and then the soft heat conducting circuit substrate 31 is attached on the polygonal pyramid 231, with a surface of the soft heat conducting circuit substrate 31 being formed with a circuit, such that the chip 32 can be directly adhered for use, before connecting the wire 201 to the electric conducting lamina 30.
Accordingly, the LED lamp 2 can be provided with a wide-angle illumination effect, and can also achieve an extremely good heat dissipation effect. On the other hand, as electricity is conducted through the electric conducting lamina 30, there is no need to add an additional heat dissipation device or to punch out grooves; because only by using the electric conducting lamina 30, a high heat dissipation effect can be achieved as well.
Referring to FIG. 6, it shows a three-dimensional view of another configuration of the present invention. If a heat dissipation member 23a is in a configuration of a cylinder 233, then an electric conducting lamina 30a and a soft heat conducting circuit substrate 31a can be attached on the heat dissipation member 23a along a circumference of the cylinder 233, and then chips 32a can be adhered respectively on each soft heat conducting circuit substrate 31a. Thus, an LED lamp 2a can illuminate wider, and when attaching the soft heat conducting circuit substrate 31a, -10-it does not require an excessive cutting operation, which can save a lot of manufacturing time and thereby improving an efficiency of production.
Referring to FIG. 7 and FIG. 8, it shows a first schematic view of an operation and a second schematic view of an operation, of another preferred embodiment of the present invention. An LED lamp 4 is constituted by a base 41, a heat dissipation unit 43 and a shade 42, wherein the base 41 and the heat dissipation unit 43 are formed integrally. Moreover, the heat dissipation unit 43 is a polygonal pyramid 431, each surface of the polygonal pyramid 431 is adhered with one chip 5 by using silicon 6, interior of which is mixed with fluorescence powder, as an adhesive medium; whereas, the shade 42 that is added on the base 41 can be formed as a sphere of silicon. Accordingly, the entire LED lamp 4 is provided with a wide-angle illumination effect, and its lifetime of usage can be extended by using a high heat dissipation function of the heat dissipation unit 43 and the base 41 to carry out the heat dissipation.
Referring to FIG. 9, it shows a schematic view of an operation of still another preferred embodiment of the present invention. An LED lamp 4a is assembled by a base 41a, a heat dissipation unit 43a and a shade 42a, wherein the base 41a and the heat dissipation unit 43a are formed
-H
integrally. In addition, the heat dissipation unit 43a is a cylinder 432, a top surface of the cylinder 432 can be adhered with a chip 5a by using silicon 6a, interior of which is mixed with fluorescence powder, as an adhesive medium; whereas, the shade 42a that is added on the base 41 a can be formed as a sphere of silicon, thereby forming a sealed state.
Accordingly, referring to all the drawings, the present invention is actually provided with following advantages in comparison with the prior art: 1. As the heat dissipation unit is a polygonal pyramid 231, each surface of the polygonal pyramid 231 can be adhered with one electric conducting lamina 30, and then the electric conducting lamina 30 is added with at least one chip 32. Therefore, when the chips 32 illuminate, the range of illumination can be wider.
In addition, through the base 21, 41 that is made by the high heat conducting metal, the fast heat dissipation effect can be achieved.
2. As the heat dissipation member 23 is attached to the electric conducting lamina 30, the heat dissipation member 23 is a polygonal pyramid 231 or a cylinder 233, allowing the electric conducting lamina 30 to be adhered to any heat dissipation -12 -member 23 of a various shape. Hence, when processing the heat dissipation member 23, its work procedure will be very easy, thereby largely reducing cost of manufacturing.
It is of course to be understood that the embodiments described herein is merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by persons skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims. -13-

Claims (11)

  1. What is claimed is: 1. A light emitting diode lamp, comprising a base, an electric conducting member and a shade, wherein an end of the base is installed with the electric conducting member, and an end of the base far away from the electric conducting member is formed with a heat dissipation member on which is adhered with at least one LED (Light Emitting Diode) lamp module.
  2. 2. The light emitting diode lamp according to claim 1, wherein the LED lamp module includes an electric conducting lamina which is bended into a required shape according to a shape of the heat dissipation member, and at least one chip which is adhered on the electric conducting lamina.
  3. 3. The light emitting diode lamp according to claim 2, wherein the electric conducting lamina is a pin base.
  4. 4. The light emitting diode lamp according to claim 1, wherein the heat dissipation member is adhered with at least one polygonal pyramid of electric conducting lamina.
  5. 5. The light emitting diode lamp according to claim 4, wherein the polygonal pyramid is adhered with a piece of soft heat conducting circuit substrate which is an electric loop of the LED lamp module -14 -on the polygonal pyramid.
  6. 6. The light emitting diode lamp according to claim 1, wherein the heat dissipation member is adhered with at least one cylinder of electric conducting lamina.
  7. 7. The light emitting diode lamp according to claim 1, wherein interior of the heat dissipation member is formed with at least one through-hole allowing a wire that connects the electric conducting member to transfix.
  8. 8. The light emitting diode lamp according to claim 1, wherein the base is a high heat conducting metal.
  9. 9. The light emitting diode lamp according to claim 7, wherein the high heat conducting metal is copper or aluminum.
  10. 10. The light emitting diode lamp according to claim 1, wherein the shade is a sphere of silicon.
  11. 11. Light emitting diode lamp substantially as herein described above and illustrated in the accompanying drawings of FIG. 2 to FIG. 9.
GB0815052A 2008-08-18 2008-08-18 Light emitting diode lamp Withdrawn GB2462815A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0815052A GB2462815A (en) 2008-08-18 2008-08-18 Light emitting diode lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0815052A GB2462815A (en) 2008-08-18 2008-08-18 Light emitting diode lamp

Publications (2)

Publication Number Publication Date
GB0815052D0 GB0815052D0 (en) 2008-09-24
GB2462815A true GB2462815A (en) 2010-02-24

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Family Applications (1)

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GB0815052A Withdrawn GB2462815A (en) 2008-08-18 2008-08-18 Light emitting diode lamp

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2322843A1 (en) * 2010-06-17 2011-05-18 Chun-Hsien Lee LED bulb
EP2363636A1 (en) * 2010-02-26 2011-09-07 Toshiba Lighting & Technology Corporation Lighting fixture

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4267559A (en) * 1979-09-24 1981-05-12 Bell Telephone Laboratories, Incorporated Low thermal impedance light-emitting diode package
US20020113244A1 (en) * 2001-02-22 2002-08-22 Barnett Thomas J. High power LED
US20030040200A1 (en) * 2001-08-24 2003-02-27 Densen Cao Method for making a semiconductor light source
US20060214179A1 (en) * 2001-08-24 2006-09-28 Cao Group, Inc. Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame
WO2007037940A1 (en) * 2005-09-21 2007-04-05 General Electric Company Method for electrical insulation via applying a poly (arylene ether) composition and insulated electrical conductor
US20070165408A1 (en) * 2006-01-13 2007-07-19 Chia-Mao Li High-power LED package structure
US20070200127A1 (en) * 2003-05-27 2007-08-30 Andrews Peter S Power surface mount light emitting die package
WO2008037940A1 (en) * 2006-09-26 2008-04-03 Ghollam Tahmosybayat Lamp assembly

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4267559A (en) * 1979-09-24 1981-05-12 Bell Telephone Laboratories, Incorporated Low thermal impedance light-emitting diode package
US20020113244A1 (en) * 2001-02-22 2002-08-22 Barnett Thomas J. High power LED
US20030040200A1 (en) * 2001-08-24 2003-02-27 Densen Cao Method for making a semiconductor light source
US20060214179A1 (en) * 2001-08-24 2006-09-28 Cao Group, Inc. Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame
US20070200127A1 (en) * 2003-05-27 2007-08-30 Andrews Peter S Power surface mount light emitting die package
WO2007037940A1 (en) * 2005-09-21 2007-04-05 General Electric Company Method for electrical insulation via applying a poly (arylene ether) composition and insulated electrical conductor
US20070165408A1 (en) * 2006-01-13 2007-07-19 Chia-Mao Li High-power LED package structure
WO2008037940A1 (en) * 2006-09-26 2008-04-03 Ghollam Tahmosybayat Lamp assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2363636A1 (en) * 2010-02-26 2011-09-07 Toshiba Lighting & Technology Corporation Lighting fixture
US8500298B2 (en) 2010-02-26 2013-08-06 Toshiba Lighting & Technology Corporation Lighting fixture
EP2322843A1 (en) * 2010-06-17 2011-05-18 Chun-Hsien Lee LED bulb

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