FR2835651B1 - Dispositif de montage d'un boitier semi-conducteur sur une plaque-support par l'intermediaire d'une embase - Google Patents

Dispositif de montage d'un boitier semi-conducteur sur une plaque-support par l'intermediaire d'une embase

Info

Publication number
FR2835651B1
FR2835651B1 FR0201427A FR0201427A FR2835651B1 FR 2835651 B1 FR2835651 B1 FR 2835651B1 FR 0201427 A FR0201427 A FR 0201427A FR 0201427 A FR0201427 A FR 0201427A FR 2835651 B1 FR2835651 B1 FR 2835651B1
Authority
FR
France
Prior art keywords
mounting
base
support plate
plate via
semiconductor housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0201427A
Other languages
English (en)
Other versions
FR2835651A1 (fr
Inventor
Remi Brechignac
Kevin Channon
Juan Exposito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR0201427A priority Critical patent/FR2835651B1/fr
Priority to US10/358,994 priority patent/US7012331B2/en
Publication of FR2835651A1 publication Critical patent/FR2835651A1/fr
Application granted granted Critical
Publication of FR2835651B1 publication Critical patent/FR2835651B1/fr
Priority to US11/223,233 priority patent/US20060012002A1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
FR0201427A 2002-02-06 2002-02-06 Dispositif de montage d'un boitier semi-conducteur sur une plaque-support par l'intermediaire d'une embase Expired - Fee Related FR2835651B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0201427A FR2835651B1 (fr) 2002-02-06 2002-02-06 Dispositif de montage d'un boitier semi-conducteur sur une plaque-support par l'intermediaire d'une embase
US10/358,994 US7012331B2 (en) 2002-02-06 2003-02-05 Device for mounting a semiconductor package on a support plate via a base
US11/223,233 US20060012002A1 (en) 2002-02-06 2005-09-09 Device for mounting a semiconductor package on a support plate via a base

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0201427A FR2835651B1 (fr) 2002-02-06 2002-02-06 Dispositif de montage d'un boitier semi-conducteur sur une plaque-support par l'intermediaire d'une embase

Publications (2)

Publication Number Publication Date
FR2835651A1 FR2835651A1 (fr) 2003-08-08
FR2835651B1 true FR2835651B1 (fr) 2005-04-15

Family

ID=27619949

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0201427A Expired - Fee Related FR2835651B1 (fr) 2002-02-06 2002-02-06 Dispositif de montage d'un boitier semi-conducteur sur une plaque-support par l'intermediaire d'une embase

Country Status (2)

Country Link
US (2) US7012331B2 (fr)
FR (1) FR2835651B1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2824953B1 (fr) * 2001-05-18 2004-07-16 St Microelectronics Sa Boitier semi-conducteur optique a lentille incorporee et blindage
DE10329102A1 (de) * 2003-06-27 2005-01-27 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Halbleitermodul
TWI244173B (en) * 2003-11-12 2005-11-21 Optimum Care Int Tech Inc Semiconductor chip package structure
FR2869158A1 (fr) * 2004-04-20 2005-10-21 St Microelectronics Sa Boitier semi-conducteur optique a moyen compressible de reglage
JP4464260B2 (ja) * 2004-11-24 2010-05-19 キヤノン株式会社 半導体装置、放射線撮像装置、及びその製造方法
JP4651008B2 (ja) * 2005-02-01 2011-03-16 シチズン電子株式会社 発光ダイオード
JP4478049B2 (ja) * 2005-03-15 2010-06-09 三菱電機株式会社 半導体装置
KR100654975B1 (ko) * 2005-07-27 2006-12-08 현대모비스 주식회사 차량용 일사량감지센서
KR100736891B1 (ko) * 2006-01-13 2007-07-10 서울반도체 주식회사 Ｌｅｄ 램프
US7966041B2 (en) 2008-01-30 2011-06-21 Sony Ericsson Mobile Communications Ab Pin mounting of camera module in a radio communication terminal
DE102008013028A1 (de) * 2008-03-07 2009-09-10 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil, Gerät zur Aufzeichnung von Bildinformation und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
CN101648175B (zh) * 2008-08-11 2012-06-13 鸿富锦精密工业（深圳）有限公司 涂敷装置
WO2010050972A1 (fr) * 2008-10-31 2010-05-06 Hewlett-Packard Development Company, L.P. Ressort de support d’ensemble entre des raccords rigides
US10083922B2 (en) * 2016-11-23 2018-09-25 Intel Corporation Inductor interconnect

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04111686A (ja) * 1990-08-31 1992-04-13 Canon Inc 画像入力装置
US5359190A (en) * 1992-12-31 1994-10-25 Apple Computer, Inc. Method and apparatus for coupling an optical lens to an imaging electronics array
JP3057130B2 (ja) * 1993-02-18 2000-06-26 三菱電機株式会社 樹脂封止型半導体パッケージおよびその製造方法
JP3309100B2 (ja) * 1994-09-26 2002-07-29 信越ポリマー株式会社 Ｌｓｉパッケージの実装方法
JP3681457B2 (ja) * 1996-01-11 2005-08-10 日本テキサス・インスツルメンツ株式会社 ソケット
US6000125A (en) * 1996-01-30 1999-12-14 Samsung Electronics America, Inc. Method of heat dissipation from two surfaces of a microprocessor
JPH10284205A (ja) * 1997-03-31 1998-10-23 Nec Corp Ｉｃソケット
US6071139A (en) * 1998-03-31 2000-06-06 Micron Technology, Inc. Locking assembly for securing semiconductor device to carrier substrate
US6020635A (en) * 1998-07-07 2000-02-01 Advanced Interconnections Corporation Converter socket terminal
JP2000040572A (ja) * 1998-07-23 2000-02-08 Nec Eng Ltd Ｌｓｉパッケージ用ソケット
JP3410670B2 (ja) 1998-12-24 2003-05-26 オムロン株式会社 圧接結線用コネクタ
JP2000284205A (ja) 1999-01-29 2000-10-13 Fuji Photo Film Co Ltd 露光記録装置
JP2001188155A (ja) * 1999-12-28 2001-07-10 Kuurii Components Kk 撮像素子の固定手段
JP2001203913A (ja) * 2000-01-21 2001-07-27 Sony Corp 撮像装置、カメラモジュール及びカメラシステム
US6518659B1 (en) * 2000-05-08 2003-02-11 Amkor Technology, Inc. Stackable package having a cavity and a lid for an electronic device
US6541800B2 (en) * 2001-02-22 2003-04-01 Weldon Technologies, Inc. High power LED
US6545345B1 (en) * 2001-03-20 2003-04-08 Amkor Technology, Inc. Mounting for a package containing a chip

Also Published As

Publication number Publication date
US20030214028A1 (en) 2003-11-20
FR2835651A1 (fr) 2003-08-08
US7012331B2 (en) 2006-03-14
US20060012002A1 (en) 2006-01-19

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20071030