FR2748856B1 - Dispositif diode a semiconducteur a montage en surface - Google Patents

Dispositif diode a semiconducteur a montage en surface

Info

Publication number
FR2748856B1
FR2748856B1 FR9606064A FR9606064A FR2748856B1 FR 2748856 B1 FR2748856 B1 FR 2748856B1 FR 9606064 A FR9606064 A FR 9606064A FR 9606064 A FR9606064 A FR 9606064A FR 2748856 B1 FR2748856 B1 FR 2748856B1
Authority
FR
France
Prior art keywords
surface mount
diode device
semiconductor diode
mount semiconductor
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9606064A
Other languages
English (en)
Other versions
FR2748856A1 (fr
Inventor
Jean Baptiste Martin
William Wasmer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Freescale Semiconducteurs France SAS
Original Assignee
Motorola Semiconducteurs SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Semiconducteurs SA filed Critical Motorola Semiconducteurs SA
Priority to FR9606064A priority Critical patent/FR2748856B1/fr
Priority to EP97103732A priority patent/EP0810660A1/fr
Priority to US08/820,428 priority patent/US6333550B1/en
Priority to JP9136152A priority patent/JPH1056117A/ja
Publication of FR2748856A1 publication Critical patent/FR2748856A1/fr
Application granted granted Critical
Publication of FR2748856B1 publication Critical patent/FR2748856B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR9606064A 1996-05-15 1996-05-15 Dispositif diode a semiconducteur a montage en surface Expired - Fee Related FR2748856B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR9606064A FR2748856B1 (fr) 1996-05-15 1996-05-15 Dispositif diode a semiconducteur a montage en surface
EP97103732A EP0810660A1 (fr) 1996-05-15 1997-03-06 Dispositif à diode semi-conducteur pour montage en surface
US08/820,428 US6333550B1 (en) 1996-05-15 1997-03-12 Surface mount semiconductor diode device
JP9136152A JPH1056117A (ja) 1996-05-15 1997-05-09 表面実装半導体ダイオード装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9606064A FR2748856B1 (fr) 1996-05-15 1996-05-15 Dispositif diode a semiconducteur a montage en surface

Publications (2)

Publication Number Publication Date
FR2748856A1 FR2748856A1 (fr) 1997-11-21
FR2748856B1 true FR2748856B1 (fr) 1998-08-21

Family

ID=9492166

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9606064A Expired - Fee Related FR2748856B1 (fr) 1996-05-15 1996-05-15 Dispositif diode a semiconducteur a montage en surface

Country Status (4)

Country Link
US (1) US6333550B1 (fr)
EP (1) EP0810660A1 (fr)
JP (1) JPH1056117A (fr)
FR (1) FR2748856B1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0966038A3 (fr) * 1998-06-15 2001-02-28 Ford Motor Company La liaison de dispositifs semiconducteurs de puissance
US6348700B1 (en) 1998-10-27 2002-02-19 The Mitre Corporation Monomolecular rectifying wire and logic based thereupon
DE19946194A1 (de) * 1999-09-27 2000-12-14 Infineon Technologies Ag Verfahren zur Herstellung eines integrierten Leistungsschaltkreises
US7595547B1 (en) 2005-06-13 2009-09-29 Vishay-Siliconix Semiconductor die package including cup-shaped leadframe
US6744124B1 (en) * 1999-12-10 2004-06-01 Siliconix Incorporated Semiconductor die package including cup-shaped leadframe
JP2003264265A (ja) 2002-03-08 2003-09-19 Mitsubishi Electric Corp 電力用半導体装置
US6942358B2 (en) * 2002-03-29 2005-09-13 Arista Enterprises, Inc. Light emitting diode (LED) flashlight
US7897453B2 (en) * 2008-12-16 2011-03-01 Sandisk 3D Llc Dual insulating layer diode with asymmetric interface state and method of fabrication

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3209209A (en) * 1963-02-21 1965-09-28 Burroughs Corp Means for connecting electrical component to circuit board
US4021839A (en) * 1975-10-16 1977-05-03 Rca Corporation Diode package
US4329707A (en) * 1978-09-15 1982-05-11 Westinghouse Electric Corp. Glass-sealed power thyristor
JPS57181146A (en) * 1981-04-30 1982-11-08 Hitachi Ltd Resin-sealed semiconductor device
FR2660797A1 (fr) * 1990-04-06 1991-10-11 Motorola Semiconducteurs Boitier d'encapsulage perfectionne pour dispositif a semiconducteur.
US5225897A (en) * 1991-10-02 1993-07-06 Unitrode Corporation Molded package for semiconductor devices with leadframe locking structure

Also Published As

Publication number Publication date
FR2748856A1 (fr) 1997-11-21
US6333550B1 (en) 2001-12-25
EP0810660A1 (fr) 1997-12-03
JPH1056117A (ja) 1998-02-24

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse