DE69427904D1 - Integrierte Halbleiterdiode - Google Patents

Integrierte Halbleiterdiode

Info

Publication number
DE69427904D1
DE69427904D1 DE69427904T DE69427904T DE69427904D1 DE 69427904 D1 DE69427904 D1 DE 69427904D1 DE 69427904 T DE69427904 T DE 69427904T DE 69427904 T DE69427904 T DE 69427904T DE 69427904 D1 DE69427904 D1 DE 69427904D1
Authority
DE
Germany
Prior art keywords
integrated semiconductor
semiconductor diode
diode
integrated
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69427904T
Other languages
English (en)
Other versions
DE69427904T2 (de
Inventor
Paola Galbiati
Ubaldo Mastromatteo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
STMicroelectronics SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SRL filed Critical STMicroelectronics SRL
Application granted granted Critical
Publication of DE69427904D1 publication Critical patent/DE69427904D1/de
Publication of DE69427904T2 publication Critical patent/DE69427904T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
    • H01L29/6609—Diodes
    • H01L29/66128—Planar diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861—Diodes
    • H01L29/8611—Planar PN junction diodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Element Separation (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
DE69427904T 1994-05-31 1994-05-31 Integrierte Halbleiterdiode Expired - Fee Related DE69427904T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP94830266A EP0685891B1 (de) 1994-05-31 1994-05-31 Integrierte Halbleiterdiode

Publications (2)

Publication Number Publication Date
DE69427904D1 true DE69427904D1 (de) 2001-09-13
DE69427904T2 DE69427904T2 (de) 2002-04-04

Family

ID=8218457

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69427904T Expired - Fee Related DE69427904T2 (de) 1994-05-31 1994-05-31 Integrierte Halbleiterdiode

Country Status (4)

Country Link
US (2) US5629558A (de)
EP (1) EP0685891B1 (de)
JP (1) JPH07326773A (de)
DE (1) DE69427904T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09120995A (ja) * 1995-08-22 1997-05-06 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP4597284B2 (ja) * 1999-04-12 2010-12-15 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
EP1071133B1 (de) * 1999-07-21 2010-04-21 STMicroelectronics Srl Verfahren zum Herstellen von CMOS Transistoren nichtflüchtiger Speicher und von vertikalen Bipolartransistoren mit hohem Verstärkungsfaktor
JP2003509867A (ja) * 1999-09-16 2003-03-11 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 半導体装置
JP4526179B2 (ja) * 2000-11-21 2010-08-18 三菱電機株式会社 半導体装置
US6475870B1 (en) 2001-07-23 2002-11-05 Taiwan Semiconductor Manufacturing Company P-type LDMOS device with buried layer to solve punch-through problems and process for its manufacture
KR100800252B1 (ko) * 2002-03-05 2008-02-01 매그나칩 반도체 유한회사 씨모스 공정을 이용한 다이오드 소자의 제조 방법
US20040239873A1 (en) * 2003-05-28 2004-12-02 Dietz Dan L. Temple tip eyeglasses clasp
US7067879B1 (en) 2004-05-28 2006-06-27 National Semiconductor Corporation Integration of trench power transistors into a 1.5 μm BCD process
JP4791113B2 (ja) * 2005-09-12 2011-10-12 オンセミコンダクター・トレーディング・リミテッド 半導体装置
EP2058862B1 (de) * 2007-11-09 2018-09-19 ams AG Feldeffekttransistor und Verfahren zur Herstellung eines Feldeffekttransistors
US8476736B2 (en) * 2011-02-18 2013-07-02 Taiwan Semiconductor Manufacturing Company, Ltd. Low leakage diodes
CN102496624B (zh) * 2011-12-27 2014-02-12 上海先进半导体制造股份有限公司 高压bcd工艺中集成的浮动盆隔离结构
US8735937B2 (en) 2012-05-31 2014-05-27 Taiwan Semiconductor Manufacturing Company, Ltd. Fully isolated LIGBT and methods for forming the same
US9293460B2 (en) 2012-08-24 2016-03-22 Texas Instruments Incorporated ESD protection device with improved bipolar gain using cutout in the body well
US20170292047A1 (en) 2016-04-12 2017-10-12 Rextac Llc Hexene-1 Containing Amorphous Polyalphaolefins For Improved Hot Melt Adhesives
KR102456758B1 (ko) * 2021-04-05 2022-10-21 주식회사 키파운드리 고전압 반도체 소자 및 그의 제조 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE427598B (sv) * 1981-08-25 1983-04-18 Ericsson Telefon Ab L M Halvledardiod avsedd att inga i integrerade kretsar
IT1218128B (it) * 1987-03-05 1990-04-12 Sgs Microelettronica Spa Struttura integrata per rete di trasferimento di segnali,particolarmente per circuito di pilotaggio per transistori mos di potenza
DE69125390T2 (de) * 1991-07-03 1997-08-28 Cons Ric Microelettronica Laterale Bipolartransistorstruktur mit integriertem Kontrollschaltkreis und integriertem Leistungstransistor und deren Herstellungsprozess
US5242841A (en) * 1992-03-25 1993-09-07 Texas Instruments Incorporated Method of making LDMOS transistor with self-aligned source/backgate and photo-aligned gate
US5374569A (en) * 1992-09-21 1994-12-20 Siliconix Incorporated Method for forming a BiCDMOS
US5559044A (en) * 1992-09-21 1996-09-24 Siliconix Incorporated BiCDMOS process technology
US5648281A (en) * 1992-09-21 1997-07-15 Siliconix Incorporated Method for forming an isolation structure and a bipolar transistor on a semiconductor substrate
US5602046A (en) * 1996-04-12 1997-02-11 National Semiconductor Corporation Integrated zener diode protection structures and fabrication methods for DMOS power devices

Also Published As

Publication number Publication date
EP0685891B1 (de) 2001-08-08
DE69427904T2 (de) 2002-04-04
US5629558A (en) 1997-05-13
JPH07326773A (ja) 1995-12-12
US5940700A (en) 1999-08-17
EP0685891A1 (de) 1995-12-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee