KR960025513U - 반도체 칩 - Google Patents

반도체 칩

Info

Publication number
KR960025513U
KR960025513U KR2019940038539U KR19940038539U KR960025513U KR 960025513 U KR960025513 U KR 960025513U KR 2019940038539 U KR2019940038539 U KR 2019940038539U KR 19940038539 U KR19940038539 U KR 19940038539U KR 960025513 U KR960025513 U KR 960025513U
Authority
KR
South Korea
Prior art keywords
semiconductor chip
chip
semiconductor
Prior art date
Application number
KR2019940038539U
Other languages
English (en)
Other versions
KR200161172Y1 (ko
Inventor
홍준기
Original Assignee
현대반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대반도체주식회사 filed Critical 현대반도체주식회사
Priority to KR2019940038539U priority Critical patent/KR200161172Y1/ko
Publication of KR960025513U publication Critical patent/KR960025513U/ko
Application granted granted Critical
Publication of KR200161172Y1 publication Critical patent/KR200161172Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019940038539U 1994-12-30 1994-12-30 반도체 칩 KR200161172Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940038539U KR200161172Y1 (ko) 1994-12-30 1994-12-30 반도체 칩

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940038539U KR200161172Y1 (ko) 1994-12-30 1994-12-30 반도체 칩

Publications (2)

Publication Number Publication Date
KR960025513U true KR960025513U (ko) 1996-07-22
KR200161172Y1 KR200161172Y1 (ko) 1999-11-15

Family

ID=19404763

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940038539U KR200161172Y1 (ko) 1994-12-30 1994-12-30 반도체 칩

Country Status (1)

Country Link
KR (1) KR200161172Y1 (ko)

Also Published As

Publication number Publication date
KR200161172Y1 (ko) 1999-11-15

Similar Documents

Publication Publication Date Title
DE69509878T2 (de) Halbleiterchipträger
DE69508046T2 (de) Integrierte halbleiteranordnung
DE69518935D1 (de) Halbleiterpackung
KR960015828A (ko) 반도체 집적 회로
DE69517759T2 (de) Integrierte Halbleiterschaltung
KR960015898A (ko) 반도체 집적회로
KR960012443A (ko) 반도체 패키지
KR960025455U (ko) 반도체 패키지
KR960038722U (ko) 반도체 칩
KR960038724U (ko) 반도체 칩
KR950025923U (ko) 반도체 칩
KR960025513U (ko) 반도체 칩
KR960015635U (ko) 반도체패키지
KR960012677U (ko) 반도체 패키지
KR960006383U (ko) 반도체 패키지
KR950028703U (ko) 반도체 장치
KR970046697U (ko) 반도체 칩
KR970046782U (ko) 반도체 칩
KR970025815U (ko) 반도체 칩
KR960038725U (ko) 반도체칩
KR960025520U (ko) 반도체 리드 프레임
KR950023965U (ko) 반도체 리드프레임
KR960025521U (ko) 반도체 패키지
KR960025466U (ko) 반도체 패키지
KR960025523U (ko) 반도체 패키지

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090727

Year of fee payment: 11

EXPY Expiration of term