DE69637939D1 - Halbleiteranordnung - Google Patents
HalbleiteranordnungInfo
- Publication number
- DE69637939D1 DE69637939D1 DE69637939T DE69637939T DE69637939D1 DE 69637939 D1 DE69637939 D1 DE 69637939D1 DE 69637939 T DE69637939 T DE 69637939T DE 69637939 T DE69637939 T DE 69637939T DE 69637939 D1 DE69637939 D1 DE 69637939D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31255695A JP3345241B2 (ja) | 1995-11-30 | 1995-11-30 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69637939D1 true DE69637939D1 (de) | 2009-07-09 |
Family
ID=18030640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69637939T Expired - Lifetime DE69637939D1 (de) | 1995-11-30 | 1996-09-05 | Halbleiteranordnung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5814878A (de) |
EP (1) | EP0777272B1 (de) |
JP (1) | JP3345241B2 (de) |
DE (1) | DE69637939D1 (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3062691B1 (ja) * | 1999-02-26 | 2000-07-12 | 株式会社三井ハイテック | 半導体装置 |
JP3581268B2 (ja) * | 1999-03-05 | 2004-10-27 | 株式会社東芝 | ヒートシンク付半導体装置およびその製造方法 |
US6188130B1 (en) | 1999-06-14 | 2001-02-13 | Advanced Technology Interconnect Incorporated | Exposed heat spreader with seal ring |
WO2002056378A1 (en) * | 2001-01-11 | 2002-07-18 | Matsushita Electric Industrial Co., Ltd. | Circuit board and production method therefor |
JP4286465B2 (ja) * | 2001-02-09 | 2009-07-01 | 三菱電機株式会社 | 半導体装置とその製造方法 |
KR100723454B1 (ko) * | 2004-08-21 | 2007-05-30 | 페어차일드코리아반도체 주식회사 | 높은 열 방출 능력을 구비한 전력용 모듈 패키지 및 그제조방법 |
US7061080B2 (en) * | 2001-06-11 | 2006-06-13 | Fairchild Korea Semiconductor Ltd. | Power module package having improved heat dissipating capability |
JP2003100986A (ja) * | 2001-09-26 | 2003-04-04 | Toshiba Corp | 半導体装置 |
JP2004357384A (ja) * | 2003-05-28 | 2004-12-16 | Toyoda Mach Works Ltd | ヒートシンクへのスイッチング素子取付構造 |
US8269338B2 (en) * | 2006-08-10 | 2012-09-18 | Vishay General Semiconductor Llc | Semiconductor device having improved heat dissipation capabilities |
JP5252819B2 (ja) * | 2007-03-26 | 2013-07-31 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
JP5124329B2 (ja) * | 2008-03-26 | 2013-01-23 | 新電元工業株式会社 | 半導体装置 |
DE102009046172A1 (de) * | 2009-10-29 | 2011-05-05 | Robert Bosch Gmbh | Kühlkörper mit verbesserter Kühleffizienz, mit Kühlkörper ausgestattete Schaltung und Herstellungsverfahren hierfür |
WO2012137439A1 (ja) | 2011-04-05 | 2012-10-11 | パナソニック株式会社 | 封止型半導体装置及びその製造方法 |
JP5857468B2 (ja) * | 2011-06-22 | 2016-02-10 | 株式会社デンソー | 半導体装置 |
JP2017055146A (ja) * | 2011-09-08 | 2017-03-16 | ローム株式会社 | 半導体装置、半導体装置の製造方法、半導体装置の実装構造、およびパワー用半導体装置 |
JP2013070026A (ja) | 2011-09-08 | 2013-04-18 | Rohm Co Ltd | 半導体装置、半導体装置の製造方法、半導体装置の実装構造、およびパワー用半導体装置 |
JP5797126B2 (ja) * | 2012-02-06 | 2015-10-21 | 三菱電機株式会社 | 半導体装置 |
JP6364543B2 (ja) | 2015-03-30 | 2018-07-25 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
CN108604578B (zh) * | 2016-02-09 | 2021-07-16 | 三菱电机株式会社 | 电力用半导体装置及其制造方法 |
JP7134131B2 (ja) * | 2019-04-26 | 2022-09-09 | 三菱電機株式会社 | 半導体装置 |
WO2023203754A1 (ja) * | 2022-04-22 | 2023-10-26 | 三菱電機株式会社 | コンデンサユニットおよび電子機器 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56147453A (en) * | 1980-04-17 | 1981-11-16 | Nec Corp | Semiconductor device |
US4451973A (en) * | 1981-04-28 | 1984-06-05 | Matsushita Electronics Corporation | Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor |
DE3232632A1 (de) * | 1981-09-03 | 1983-03-10 | General Electric Co., Schenectady, N.Y. | Hochdruck-alkalimetalldampflampe mit verbesserter wirksamkeit |
JPS60170248A (ja) * | 1984-02-15 | 1985-09-03 | Toshiba Corp | 半導体装置 |
DE3684184D1 (de) * | 1985-06-20 | 1992-04-16 | Toshiba Kawasaki Kk | Verkapselte halbleiteranordnung. |
JPH01282846A (ja) * | 1988-05-09 | 1989-11-14 | Nec Corp | 混成集積回路 |
US4965710A (en) * | 1989-11-16 | 1990-10-23 | International Rectifier Corporation | Insulated gate bipolar transistor power module |
US5202288A (en) * | 1990-06-01 | 1993-04-13 | Robert Bosch Gmbh | Method of manufacturing an electronic circuit component incorporating a heat sink |
DE4021871C2 (de) * | 1990-07-09 | 1994-07-28 | Lsi Logic Products Gmbh | Hochintegriertes elektronisches Bauteil |
JPH04277660A (ja) * | 1991-03-06 | 1992-10-02 | Nec Corp | 集積回路パッケージ |
US5652461A (en) * | 1992-06-03 | 1997-07-29 | Seiko Epson Corporation | Semiconductor device with a convex heat sink |
JPH06107911A (ja) * | 1992-09-24 | 1994-04-19 | Sumitomo Bakelite Co Ltd | 半導体封止用樹脂組成物 |
JPH06209054A (ja) * | 1993-01-08 | 1994-07-26 | Mitsubishi Electric Corp | 半導体装置 |
US5430331A (en) * | 1993-06-23 | 1995-07-04 | Vlsi Technology, Inc. | Plastic encapsulated integrated circuit package having an embedded thermal dissipator |
US5397746A (en) * | 1993-11-03 | 1995-03-14 | Intel Corporation | Quad flat package heat slug composition |
US5444909A (en) * | 1993-12-29 | 1995-08-29 | Intel Corporation | Method of making a drop-in heat sink |
JP3325697B2 (ja) * | 1994-01-20 | 2002-09-17 | 三菱電機株式会社 | パワーデバイスの制御装置およびモータの駆動制御装置 |
JP2988243B2 (ja) * | 1994-03-16 | 1999-12-13 | 株式会社日立製作所 | パワー混成集積回路装置 |
KR0128164B1 (ko) * | 1994-06-21 | 1998-04-02 | 황인길 | 반도체 패키지용 범용 히트스프레더 |
US5666003A (en) * | 1994-10-24 | 1997-09-09 | Rohm Co. Ltd. | Packaged semiconductor device incorporating heat sink plate |
US5652463A (en) * | 1995-05-26 | 1997-07-29 | Hestia Technologies, Inc. | Transfer modlded electronic package having a passage means |
US5646831A (en) * | 1995-12-28 | 1997-07-08 | Vlsi Technology, Inc. | Electrically enhanced power quad flat pack arrangement |
-
1995
- 1995-11-30 JP JP31255695A patent/JP3345241B2/ja not_active Expired - Fee Related
-
1996
- 1996-06-17 US US08/664,498 patent/US5814878A/en not_active Expired - Lifetime
- 1996-09-05 DE DE69637939T patent/DE69637939D1/de not_active Expired - Lifetime
- 1996-09-05 EP EP96114255A patent/EP0777272B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0777272B1 (de) | 2009-05-27 |
EP0777272A2 (de) | 1997-06-04 |
JPH09153571A (ja) | 1997-06-10 |
US5814878A (en) | 1998-09-29 |
EP0777272A3 (de) | 2000-03-01 |
JP3345241B2 (ja) | 2002-11-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |