JP7134131B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP7134131B2 JP7134131B2 JP2019084802A JP2019084802A JP7134131B2 JP 7134131 B2 JP7134131 B2 JP 7134131B2 JP 2019084802 A JP2019084802 A JP 2019084802A JP 2019084802 A JP2019084802 A JP 2019084802A JP 7134131 B2 JP7134131 B2 JP 7134131B2
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- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L23/49575—Assemblies of semiconductor devices on lead frames
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- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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- H01L23/495—Lead-frames or other flat leads
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
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- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
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- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
図1は、実施の形態1の半導体装置を模式的に図示する断面図である。
図2は、実施の形態2の半導体装置を模式的に図示する断面図である。
図3は、実施の形態3の半導体装置を模式的に図示する平面図である。ここでは、内部の構成を示すためにモールド樹脂を外形以外は透明として図示している。
図4は、実施の形態4の半導体装置を模式的に図示する平面図である。
実施の形態5の半導体装置5においては、第1のゲート樹脂残り161を構成するゲート樹脂残りの数、位置及びサイズは、限定されない。図5に図示される実施の形態5の半導体装置5においては、第1のゲート樹脂残り161は、互いに分離された複数のゲート樹脂残り161a、161b及び161cからなる。
Claims (4)
- 第1の半導体素子と、
第2の半導体素子と、
前記第1の半導体素子が搭載される第1の搭載領域と前記第2の半導体素子が搭載される第2の搭載領域とを有する搭載面と、前記第1の搭載領域の裏側にある第1の裏領域と前記第2の搭載領域の裏側にある第2の裏領域とを有する裏面と、を有するダイパッドを備えるリードフレームと、
前記第1の半導体素子、前記第2の半導体素子及び前記ダイパッドを封止し、前記第2の裏領域に直接的に接触するモールド樹脂と、
前記第1の裏領域上に配置され、前記モールド樹脂の外部に露出し、前記モールド樹脂の熱伝導率より高い熱伝導率を有する絶縁シートと、
を備え、
前記モールド樹脂は、前記モールド樹脂の前記リードフレームが突出する面とは異なる面に設けられた第1のゲート樹脂残り及び第2のゲート樹脂残りを備える
半導体装置。 - 前記第2の半導体素子は、前記第1の半導体素子の発熱量より小さい発熱量を有する
請求項1の半導体装置。 - 前記絶縁シートは、互いに分離された複数の絶縁シートを備える
請求項1又は2の半導体装置。 - 前記第2のゲート樹脂残りは、互いに分離された複数のゲート樹脂残りを備える
請求項1から3までのいずれかの半導体装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019084802A JP7134131B2 (ja) | 2019-04-26 | 2019-04-26 | 半導体装置 |
US16/736,501 US11164812B2 (en) | 2019-04-26 | 2020-01-07 | Semiconductor device |
DE102020110616.5A DE102020110616A1 (de) | 2019-04-26 | 2020-04-20 | Halbleitervorrichtung |
CN202010316092.XA CN111863742A (zh) | 2019-04-26 | 2020-04-21 | 半导体装置 |
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Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019084802A JP7134131B2 (ja) | 2019-04-26 | 2019-04-26 | 半導体装置 |
Publications (3)
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JP2020181917A JP2020181917A (ja) | 2020-11-05 |
JP2020181917A5 JP2020181917A5 (ja) | 2021-07-26 |
JP7134131B2 true JP7134131B2 (ja) | 2022-09-09 |
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JP2019084802A Active JP7134131B2 (ja) | 2019-04-26 | 2019-04-26 | 半導体装置 |
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US (1) | US11164812B2 (ja) |
JP (1) | JP7134131B2 (ja) |
CN (1) | CN111863742A (ja) |
DE (1) | DE102020110616A1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005232313A (ja) | 2004-02-19 | 2005-09-02 | Mitsubishi Electric Corp | 熱伝導性樹脂シートおよびこれを用いたパワーモジュール |
US20140055173A1 (en) | 2012-08-21 | 2014-02-27 | Mitsubishi Electric Corporation | Power module |
WO2015104834A1 (ja) | 2014-01-10 | 2015-07-16 | 三菱電機株式会社 | 電力半導体装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0536745A (ja) | 1991-08-01 | 1993-02-12 | Shinko Electric Ind Co Ltd | 封止金型及び封止方法 |
JPH0595014A (ja) | 1991-10-02 | 1993-04-16 | Hitachi Ltd | 封止体形成方法 |
JP3345241B2 (ja) * | 1995-11-30 | 2002-11-18 | 三菱電機株式会社 | 半導体装置 |
JP3572833B2 (ja) * | 1996-12-19 | 2004-10-06 | 株式会社デンソー | 樹脂封止型半導体装置の製造方法 |
JP3390661B2 (ja) * | 1997-11-13 | 2003-03-24 | 三菱電機株式会社 | パワーモジュール |
KR100723454B1 (ko) * | 2004-08-21 | 2007-05-30 | 페어차일드코리아반도체 주식회사 | 높은 열 방출 능력을 구비한 전력용 모듈 패키지 및 그제조방법 |
JP2004063688A (ja) * | 2002-07-26 | 2004-02-26 | Mitsubishi Electric Corp | 半導体装置及び半導体アセンブリモジュール |
JP5272191B2 (ja) * | 2007-08-31 | 2013-08-28 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
KR101204564B1 (ko) * | 2011-09-30 | 2012-11-23 | 삼성전기주식회사 | 전력 모듈 패키지 및 그 제조 방법 |
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2019
- 2019-04-26 JP JP2019084802A patent/JP7134131B2/ja active Active
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2020
- 2020-01-07 US US16/736,501 patent/US11164812B2/en active Active
- 2020-04-20 DE DE102020110616.5A patent/DE102020110616A1/de active Pending
- 2020-04-21 CN CN202010316092.XA patent/CN111863742A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005232313A (ja) | 2004-02-19 | 2005-09-02 | Mitsubishi Electric Corp | 熱伝導性樹脂シートおよびこれを用いたパワーモジュール |
US20060188727A1 (en) | 2004-02-19 | 2006-08-24 | Mitsubishi Denki Kabushiki Kaisha | Thermally conductive resin sheet and power module using the same |
US20140055173A1 (en) | 2012-08-21 | 2014-02-27 | Mitsubishi Electric Corporation | Power module |
JP2014041852A (ja) | 2012-08-21 | 2014-03-06 | Mitsubishi Electric Corp | パワーモジュール |
CN103633077A (zh) | 2012-08-21 | 2014-03-12 | 三菱电机株式会社 | 功率模块 |
WO2015104834A1 (ja) | 2014-01-10 | 2015-07-16 | 三菱電機株式会社 | 電力半導体装置 |
US20160233151A1 (en) | 2014-01-10 | 2016-08-11 | Mitsubishi Electric Corporation | Power semiconductor device |
Also Published As
Publication number | Publication date |
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CN111863742A (zh) | 2020-10-30 |
DE102020110616A1 (de) | 2020-10-29 |
US20200343173A1 (en) | 2020-10-29 |
US11164812B2 (en) | 2021-11-02 |
JP2020181917A (ja) | 2020-11-05 |
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