JP5857468B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5857468B2 JP5857468B2 JP2011138804A JP2011138804A JP5857468B2 JP 5857468 B2 JP5857468 B2 JP 5857468B2 JP 2011138804 A JP2011138804 A JP 2011138804A JP 2011138804 A JP2011138804 A JP 2011138804A JP 5857468 B2 JP5857468 B2 JP 5857468B2
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- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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Description
一面(20a,27a)に、第1接続部(23)及び該第1接続部(23)と電気的に分離された第2接続部(24)を有する電子部品搭載部材(20,27)と、
第1主面と、該第1主面と反対の第2主面との両方に電極を有し、第1主面が一面(20a)と対向するように配置されるとともに、はんだ(60)により第1主面の電極が第1接続部(23)と接続された電子部品(30)と、
電子部品(30)の第2主面に対向配置された対向部(41)と、該対向部(41)から延び、対向部(41)に対して屈曲された脚部(42)とを有し、はんだ(61)により対向部(41)が第2主面の電極と接続され、はんだ(62)により脚部(42)が第2接続部(24)と接続された金属板(40)と、
電子部品搭載部材(20,27)の少なくとも一部、電子部品(30)、及び金属板(40)を一体的に封止するモールド樹脂(50)と、を備え、
金属板(40)の対向部(41)の厚さが、脚部(42)の厚さよりも厚くされており、
電子部品よりも背が高くされ、電子部品搭載部材(20)の一面(20)上における金属板(40)の配置領域と異なる領域に配置された高背部品(33)をさらに備え、
該高背部品(33)もモールド樹脂(50)によって封止され、
一面(20a,27a)に垂直な垂直方向において、金属板(40)の対向部(41)における電子部品搭載部材(20)と反対の上面(41b)と、高背部品(33)における電子部品搭載部材(20)と反対の上面(33b)が同じ位置とされるとともに、垂直方向において、モールド樹脂(50)のうち、対向部(41)の上面(41b)を覆う部分の厚さと高背部品(33)の上面(33b)を覆う部分の厚さが同じとなっていることを特徴とする。
複数の電子部品(31,32)を備え、
各電子部品(31,32)の第2主面の電極が、同一の対向部(41)に接続された構成とすると良い。
複数の電子部品(31,32)の厚さが異なる場合、
垂直方向において、金属板(40)の対向部(41)は、該対向部(41)と電子部品(31,32)との厚さの和が等しくなるように、電子部品(30)の第2主面に対向する対向面(41a)に段差を有して部分的に厚さが異なることが好ましい。
金属板(40)の対向部(41)は、電子部品(30)の第2主面に対向する対向面(41a)と反対の裏面(41b)に溝部(44)を有し、
該溝部(44)は、対向面(41a)と裏面(41b)とを連結する側面(41c)に端部が開口していると良い。
金属板(40)の対向部(41)は、電子部品(30)の第2主面に対向する対向面(41a)と、該対向面(41a)と反対の裏面(41b)とを連結する側面(41c)に、凹凸部(45)を有しても良い。
電子部品搭載部材(20)は、絶縁基材(21)に配線が形成された基板であり、
第1接続部(23)は、基板(20)の一面(20a)に形成されたランドであり、
第2接続部(24)は、基板(20)の一面(20a)において第1接続部(23)と離れて形成されたランドである構成を採用することができる。
電子部品搭載部材(27)は、リードフレームであり、
第1接続部(23)は、リードフレーム(27)のダイパッド(28)における電子部品(30)との接続部分であり、
第2接続部(24)は、電子部品(30)が配置されたダイパッド(28)と電気的に分離された部分(29)であって、金属板(40)の脚部(42)との接続部分である構成を採用することもできる。
図1及び図2に示す半導体装置10は、基板20と、基板20の一面20a上に配置された縦型素子30と、縦型素子30上、すなわち縦型素子30に対して基板20と反対側に配置され、縦型素子30の他方の電極が電気的に接続された金属板40と、モールド樹脂50を備える。
本実施形態において、上記実施形態に示した半導体装置10と共通する部分についての説明は割愛する。第1実施形態では、同一の金属板40(40a又は40b)に接続される複数の縦型素子31,32の厚さがほぼ同じである例を示した。
本実施形態において、上記実施形態に示した半導体装置10と共通する部分についての説明は割愛する。上記実施形態では、金属板40の対向部41における上面41aが平坦である例を示した。これに対し、本実施形態では、図7に示すように、金属板40の対向部41が、上面41bに溝部44を有している。この溝部44は、対向部41の下面41aと上面41bとを連結する側面41cに端部が開口している。具体的には、垂直方向に沿う平面が矩形状の対向部41において、相対する側面41cを跨ぐように、溝部44が形成されている。
本実施形態において、上記実施形態に示した半導体装置10と共通する部分についての説明は割愛する。第3実施形態では、金属板40の対向部41が、上面41aに溝部44を有する例を示した。これに対し、本実施形態では、図8に示すように、金属板40の対向部41が、その側面41cに凹凸部45を有している。
20・・・基板(電子部品搭載部材)
20a・・・一面
23,23a〜23c・・・ランド、第1接続部
24・・・ランド、第2接続部
27・・・リードフレーム(電子部品搭載部材)
28・・・ダイパッド
29・・・リード
30・・・縦型素子(両面に電極を有する電子部品)
31・・・IGBT
32・・・FWD
40,40a,40b・・・金属板
41・・・対向部
41b・・・上面
42・・・脚部
50・・・モールド樹脂
51・・・被覆部
60〜63・・・はんだ
Claims (7)
- 一面(20a,27a)に、第1接続部(23)及び該第1接続部(23)と電気的に分離された第2接続部(24)を有する電子部品搭載部材(20,27)と、
第1主面と該第1主面と反対の第2主面との両方に電極を有し、前記第1主面が対向するように前記電子部品搭載部材(20)の一面(20a)上に配置されるとともに、はんだ(60)により前記第1主面の電極が前記第1接続部(23)と接続された電子部品(30)と、
前記電子部品(30)の第2主面に対向配置された対向部(41)と、該対向部(41)から延び、前記対向部(41)に対して屈曲された脚部(42)とを有し、はんだ(61)により前記対向部(41)が前記電子部品(30)における第2主面の電極と接続され、はんだ(62)により前記脚部(42)が前記第2接続部(24)と接続された金属板(40)と、
前記電子部品搭載部材(20,27)の少なくとも一部、前記電子部品(30)、及び前記金属板(40)を一体的に封止するモールド樹脂(50)と、を備えた半導体装置であって、
前記金属板(40)の対向部(41)の厚さが、前記脚部(42)の厚さよりも厚くされており、
前記電子部品よりも背が高くされ、前記電子部品搭載部材(20)の一面(20)上における前記金属板(40)の配置領域と異なる領域に配置された高背部品(33)をさらに備え、
該高背部品(33)も前記モールド樹脂(50)によって封止され、
前記一面(20a,27a)に垂直な垂直方向において、前記金属板(40)の対向部(41)における電子部品搭載部材(20)と反対の上面(41b)と、前記高背部品(33)における電子部品搭載部材(20)と反対の上面(33b)が同じ位置とされるとともに、前記垂直方向において、前記モールド樹脂(50)のうち、前記対向部(41)の上面(41b)を覆う部分の厚さと前記高背部品(33)の上面(33b)を覆う部分の厚さが同じとなっていることを特徴とする半導体装置。 - 複数の前記電子部品(31,32)を備え、
各電子部品(31,32)における第2主面の電極が、同一の前記対向部(41)に接続されていることを特徴とする請求項1に記載の半導体装置。 - 複数の前記電子部品(31,32)は、互いに厚さが異なり、
前記垂直方向において、前記金属板(40)の対向部(41)は、該対向部(41)と前記電子部品(31,32)との厚さの和が等しくなるように、前記電子部品(30)の第2主面に対向する対向面(41a)に段差を有して部分的に厚さが異なることを特徴とする請求項2に記載の半導体装置。 - 前記金属板(40)の対向部(41)は、前記電子部品(30)の第2主面に対向する対向面(41a)と反対の裏面(41b)に溝部(44)を有し、
該溝部(44)は、前記対向面(41a)と前記裏面(41b)とを連結する側面(41c)に端部が開口していることを特徴とする請求項1〜3いずれか1項に記載の半導体装置。 - 前記金属板(40)の対向部(41)は、前記電子部品(30)の第2主面に対向する対向面(41a)と、該対向面(41a)と反対の裏面(41b)とを連結する側面(41c)に、凹凸部(45)を有することを特徴とする請求項1〜4いずれか1項に記載の半導体装置。
- 前記電子部品搭載部材(20)は、絶縁基材(21)に配線が形成された基板であり、
前記第1接続部(23)は、前記基板(20)の一面(20a)に形成されたランドであり、
前記第2接続部(24)は、前記基板(20)の一面(20a)において前記第1接続部(23)と離れて形成されたランドであることを特徴とする請求項1〜5いずれか1項に記載の半導体装置。 - 前記電子部品搭載部材(27)は、リードフレームであり、
前記第1接続部(23)は、前記リードフレーム(27)のダイパッド(28)における電子部品(30)との接続部分であり、
前記第2接続部(24)は、前記リードフレーム(27)において前記電子部品(30)が配置されたダイパッド(28)と電気的に分離された部分(29)であって、前記金属板(40)の脚部(42)との接続部分であることを特徴とする請求項1〜5いずれか1項に記載の半導体装置。
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