JP2015142077A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2015142077A JP2015142077A JP2014015294A JP2014015294A JP2015142077A JP 2015142077 A JP2015142077 A JP 2015142077A JP 2014015294 A JP2014015294 A JP 2014015294A JP 2014015294 A JP2014015294 A JP 2014015294A JP 2015142077 A JP2015142077 A JP 2015142077A
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Abstract
Description
図2(a)は、実施形態の半導体装置1の模式上面図であり、図2(b)は、樹脂80を取り除いた模式上面図である。図2(b)において樹脂80は側面の外形線のみを図示している。
Claims (5)
- 第1リードフレームと、
前記第1リードフレームに対して離間して設けられた第2リードフレームと、
前記第1リードフレーム上に設けられた半導体チップであって、第1面と前記第1面に対向する第2面とを持つ半導体層と、前記第1面に設けられ前記第1リードフレームに接合された第1電極と、前記第2面に設けられた第2電極と、を有する半導体チップと、
前記半導体チップを封止する樹脂と、
前記半導体チップの前記第2面上に設けられ前記第2電極に接合された第1部分であって、前記半導体チップの前記第2電極に接合された接合面と、前記接合面に対向し、前記樹脂から露出した放熱面と、前記接合面及び前記放熱面に対して傾斜し、前記樹脂に覆われた側面と、を有する第1部分と、
前記第1部分から前記第2リードフレーム側に突出し、前記第1部分よりも薄く、前記第2リードフレームに接合された第2部分と、
を有するコネクタと、
を備えた半導体装置。 - 前記放熱面と前記側面とは鈍角を形成している請求項1記載の半導体装置。
- 前記コネクタの前記第2部分が前記第2リードフレーム側に突出する方向の反対側の側面が傾斜している請求項1または2に記載の半導体装置。
- 第1リードフレームと、
前記第1リードフレームに対して離間して設けられた第2リードフレームと、
前記第1リードフレーム上に設けられた半導体チップであって、第1面と前記第1面に対向する第2面とを持つ半導体層と、前記第1面に設けられ前記第1リードフレームに接合された第1電極と、前記第2面に設けられた第2電極と、を有する半導体チップと、
前記半導体チップを封止する樹脂と、
前記半導体チップの前記第2面上に設けられ前記第2電極に接合された第1部分であって、前記半導体チップの前記第2電極に接合された接合面と、前記接合面に対向し、前記樹脂から露出した放熱面と、前記樹脂に覆われた側面と、前記側面に設けられて前記樹脂に覆われ、前記第2部分の突出方向とは異なる方向に突出した突出部と、を有する第1部分と、
前記第1部分から前記第2リードフレーム側に突出し、前記第1部分よりも薄く、前記第2リードフレームに接合された第2部分と、
を有するコネクタと、
を備えた半導体装置。 - 前記突出部の上面は前記放熱面よりも前記半導体チップ側に位置し、前記放熱面と、前記突出部の前記上面との間に段差が形成されている請求項4記載の半導体装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014015294A JP2015142077A (ja) | 2014-01-30 | 2014-01-30 | 半導体装置 |
US14/300,638 US9362192B2 (en) | 2014-01-30 | 2014-06-10 | Semiconductor device comprising heat dissipating connector |
CN201410299509.0A CN104821302B (zh) | 2014-01-30 | 2014-06-27 | 半导体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014015294A JP2015142077A (ja) | 2014-01-30 | 2014-01-30 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
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JP2015142077A true JP2015142077A (ja) | 2015-08-03 |
Family
ID=53679726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014015294A Pending JP2015142077A (ja) | 2014-01-30 | 2014-01-30 | 半導体装置 |
Country Status (3)
Country | Link |
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US (1) | US9362192B2 (ja) |
JP (1) | JP2015142077A (ja) |
CN (1) | CN104821302B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017050489A (ja) * | 2015-09-04 | 2017-03-09 | 株式会社東芝 | 半導体パッケージおよび半導体パッケージの製造方法 |
WO2019049214A1 (ja) * | 2017-09-05 | 2019-03-14 | 新電元工業株式会社 | 半導体装置 |
US11776884B2 (en) | 2020-09-08 | 2023-10-03 | Kabushiki Kaisha Toshiba | Porous body on the side surface of a connector mounted to semiconductor device |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004153234A (ja) * | 2002-09-05 | 2004-05-27 | Toshiba Corp | 半導体装置 |
US20100176508A1 (en) * | 2009-01-12 | 2010-07-15 | Ciclon Semiconductor Device Corp. | Semiconductor device package and method of assembly thereof |
JP2013008748A (ja) * | 2011-06-22 | 2013-01-10 | Denso Corp | 半導体装置 |
JP2015142052A (ja) * | 2014-01-29 | 2015-08-03 | 株式会社デンソー | 接合方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5854511A (en) * | 1995-11-17 | 1998-12-29 | Anam Semiconductor, Inc. | Semiconductor package including heat sink with layered conductive plate and non-conductive tape bonding to leads |
CN1226785A (zh) * | 1998-02-16 | 1999-08-25 | 姜牧 | 能用于电视墙无缝拼接的显示幕板及用其所拼接的电视墙 |
JP3627738B2 (ja) * | 2001-12-27 | 2005-03-09 | 株式会社デンソー | 半導体装置 |
US20040080028A1 (en) * | 2002-09-05 | 2004-04-29 | Kabushiki Kaisha Toshiba | Semiconductor device with semiconductor chip mounted in package |
JP3879688B2 (ja) * | 2003-03-26 | 2007-02-14 | 株式会社デンソー | 半導体装置 |
US7683464B2 (en) * | 2005-09-13 | 2010-03-23 | Alpha And Omega Semiconductor Incorporated | Semiconductor package having dimpled plate interconnections |
JP2008124390A (ja) | 2006-11-15 | 2008-05-29 | Toshiba Corp | 半導体装置 |
DE102007012154B4 (de) * | 2007-03-12 | 2014-05-08 | Infineon Technologies Ag | Halbleitermodul mit Halbleiterchips und Verfahren zur Herstellung desselben |
JP5452210B2 (ja) | 2009-12-21 | 2014-03-26 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
US8497572B2 (en) * | 2010-07-05 | 2013-07-30 | Denso Corporation | Semiconductor module and method of manufacturing the same |
-
2014
- 2014-01-30 JP JP2014015294A patent/JP2015142077A/ja active Pending
- 2014-06-10 US US14/300,638 patent/US9362192B2/en active Active
- 2014-06-27 CN CN201410299509.0A patent/CN104821302B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004153234A (ja) * | 2002-09-05 | 2004-05-27 | Toshiba Corp | 半導体装置 |
US20100176508A1 (en) * | 2009-01-12 | 2010-07-15 | Ciclon Semiconductor Device Corp. | Semiconductor device package and method of assembly thereof |
JP2013008748A (ja) * | 2011-06-22 | 2013-01-10 | Denso Corp | 半導体装置 |
JP2015142052A (ja) * | 2014-01-29 | 2015-08-03 | 株式会社デンソー | 接合方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017050489A (ja) * | 2015-09-04 | 2017-03-09 | 株式会社東芝 | 半導体パッケージおよび半導体パッケージの製造方法 |
WO2019049214A1 (ja) * | 2017-09-05 | 2019-03-14 | 新電元工業株式会社 | 半導体装置 |
JP6517439B1 (ja) * | 2017-09-05 | 2019-05-22 | 新電元工業株式会社 | 半導体装置 |
CN111095543A (zh) * | 2017-09-05 | 2020-05-01 | 新电元工业株式会社 | 半导体装置 |
US11688714B2 (en) | 2017-09-05 | 2023-06-27 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor package with three leads |
CN111095543B (zh) * | 2017-09-05 | 2023-11-17 | 新电元工业株式会社 | 半导体装置 |
US11776884B2 (en) | 2020-09-08 | 2023-10-03 | Kabushiki Kaisha Toshiba | Porous body on the side surface of a connector mounted to semiconductor device |
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US20150214138A1 (en) | 2015-07-30 |
CN104821302B (zh) | 2018-06-01 |
US9362192B2 (en) | 2016-06-07 |
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