FR2882494B1 - Circuit metallique apte a etre utilise dans un procede d'assemblage de composants a broches sur ledit circuit et procede d'assemblage associe - Google Patents
Circuit metallique apte a etre utilise dans un procede d'assemblage de composants a broches sur ledit circuit et procede d'assemblage associeInfo
- Publication number
- FR2882494B1 FR2882494B1 FR0501911A FR0501911A FR2882494B1 FR 2882494 B1 FR2882494 B1 FR 2882494B1 FR 0501911 A FR0501911 A FR 0501911A FR 0501911 A FR0501911 A FR 0501911A FR 2882494 B1 FR2882494 B1 FR 2882494B1
- Authority
- FR
- France
- Prior art keywords
- circuit
- associated assembly
- spindle components
- assembly method
- assembling spindle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/029—Welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0221—Laser welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0501911A FR2882494B1 (fr) | 2005-02-24 | 2005-02-24 | Circuit metallique apte a etre utilise dans un procede d'assemblage de composants a broches sur ledit circuit et procede d'assemblage associe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0501911A FR2882494B1 (fr) | 2005-02-24 | 2005-02-24 | Circuit metallique apte a etre utilise dans un procede d'assemblage de composants a broches sur ledit circuit et procede d'assemblage associe |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2882494A1 FR2882494A1 (fr) | 2006-08-25 |
FR2882494B1 true FR2882494B1 (fr) | 2010-12-31 |
Family
ID=35045403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0501911A Expired - Fee Related FR2882494B1 (fr) | 2005-02-24 | 2005-02-24 | Circuit metallique apte a etre utilise dans un procede d'assemblage de composants a broches sur ledit circuit et procede d'assemblage associe |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2882494B1 (fr) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3438809B2 (ja) * | 1998-01-28 | 2003-08-18 | ミヤチテクノス株式会社 | 端子部材に電線を溶接するためのレーザ溶接方法 |
US6392778B1 (en) * | 1999-03-17 | 2002-05-21 | Koninklijke Philips Electronics N.V. | Opto-electronic element |
DE10002703B4 (de) * | 2000-01-22 | 2006-12-07 | Robert Bosch Gmbh | Verfahren zum Herstellen einer elektrisch leitenden Verbindung mittels Laserstrahlung |
US6541800B2 (en) * | 2001-02-22 | 2003-04-01 | Weldon Technologies, Inc. | High power LED |
US6626680B2 (en) * | 2001-08-24 | 2003-09-30 | Wilson Greatbatch Ltd. | Wire bonding surface |
-
2005
- 2005-02-24 FR FR0501911A patent/FR2882494B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2882494A1 (fr) | 2006-08-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 12 |
|
PLFP | Fee payment |
Year of fee payment: 13 |
|
ST | Notification of lapse |
Effective date: 20181031 |