CN1328604C - 三维光学波导及其制造方法、光学模块和光学传输系统 - Google Patents

三维光学波导及其制造方法、光学模块和光学传输系统 Download PDF

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Publication number
CN1328604C
CN1328604C CNB03107040XA CN03107040A CN1328604C CN 1328604 C CN1328604 C CN 1328604C CN B03107040X A CNB03107040X A CN B03107040XA CN 03107040 A CN03107040 A CN 03107040A CN 1328604 C CN1328604 C CN 1328604C
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China
Prior art keywords
substrate
waveguide
optical
lens
light
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Expired - Lifetime
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CNB03107040XA
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Chinese (zh)
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CN1441266A (zh
Inventor
石田薰
是永继博
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Publication of CN1441266A publication Critical patent/CN1441266A/zh
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12002—Three-dimensional structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S385/00—Optical waveguides
    • Y10S385/901—Illuminating or display apparatus

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Semiconductor Lasers (AREA)
CNB03107040XA 2002-02-28 2003-02-28 三维光学波导及其制造方法、光学模块和光学传输系统 Expired - Lifetime CN1328604C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002054375 2002-02-28
JP2002054375A JP3768901B2 (ja) 2002-02-28 2002-02-28 立体光導波路の製造方法

Publications (2)

Publication Number Publication Date
CN1441266A CN1441266A (zh) 2003-09-10
CN1328604C true CN1328604C (zh) 2007-07-25

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CNB03107040XA Expired - Lifetime CN1328604C (zh) 2002-02-28 2003-02-28 三维光学波导及其制造方法、光学模块和光学传输系统

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US (3) US20030161573A1 (enExample)
EP (1) EP1341019B1 (enExample)
JP (1) JP3768901B2 (enExample)
CN (1) CN1328604C (enExample)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7343058B2 (en) * 2003-04-22 2008-03-11 Intel Corporation Efficient light coupler from off-chip to on-chip waveguides
EP1625424A4 (en) * 2003-04-23 2009-04-15 Siophcal Inc PLANAR SUBMICROMETER LIGHT WAVE DEVICES MADE ON AN OPTICAL SOI PLATFORM
US7251393B2 (en) * 2004-03-30 2007-07-31 Lockheed Martin Corporation Optical router
US7389013B2 (en) * 2004-09-30 2008-06-17 Stmicroelectronics, Inc. Method and system for vertical optical coupling on semiconductor substrate
US7391937B2 (en) * 2004-10-22 2008-06-24 Lockheed Martin Corporation Compact transition in layered optical fiber
JP4587772B2 (ja) * 2004-10-22 2010-11-24 イビデン株式会社 多層プリント配線板
JP5005168B2 (ja) * 2004-12-06 2012-08-22 ソニー株式会社 光導波装置及びその製造方法、並びに光情報処理装置及び電子機器
KR20070110882A (ko) * 2005-02-16 2007-11-20 어플라이드 머티어리얼스, 인코포레이티드 Ｉｃ 칩에 대한 광 결합
US7189584B2 (en) * 2005-04-27 2007-03-13 Hewlett-Packard Development Company, L.P. Fabrication alignment technique for light guide screen
JP2008040003A (ja) 2006-08-03 2008-02-21 Fuji Xerox Co Ltd フレキシブル光導波路フィルム、光送受信モジュール、マルチチャンネル光送受信モジュール及びフレキシブル光導波路フィルムの製造方法
US8867868B2 (en) * 2006-10-03 2014-10-21 Kabushiki Kaisha Toshiba Semiconductor integrated circuit
JP5182097B2 (ja) * 2006-11-22 2013-04-10 株式会社ニコン 光導波路モジュールの製造方法
US7646949B2 (en) * 2007-07-27 2010-01-12 Kotura, Inc. Efficient transfer of light signals between optical devices
WO2010123595A2 (en) * 2009-01-15 2010-10-28 Mayo Foundation For Medical Education And Research Optical edge connector
CN101872043B (zh) * 2010-06-12 2013-09-04 中央大学 光学传输模块
JP2012063969A (ja) * 2010-09-16 2012-03-29 Nitto Denko Corp 光導波路デバイスおよび光学式タッチパネル
KR20120048258A (ko) * 2010-11-05 2012-05-15 한국전자통신연구원 경사진 거울 및 렌즈를 구비한 광 도파로 구조체
US9164247B2 (en) * 2011-07-28 2015-10-20 Source Photonics, Inc. Apparatuses for reducing the sensitivity of an optical signal to polarization and methods of making and using the same
CN103827712B (zh) * 2011-09-26 2017-09-12 3M创新有限公司 在其主表面上具有多个交错式光重新导向结构的光学基底
TWI511477B (zh) * 2011-12-07 2015-12-01 Hon Hai Prec Ind Co Ltd 光收發裝置
US20130188970A1 (en) * 2012-01-19 2013-07-25 Kalpendu Shastri Packaging Platform For Opto-Electronic Assemblies Using Silicon-Based Turning Mirrors
JP5877749B2 (ja) * 2012-03-29 2016-03-08 日東電工株式会社 光電気混載基板の製法
US9134494B2 (en) * 2012-05-29 2015-09-15 3M Innovative Properties Company Optical interconnect
KR102009979B1 (ko) * 2012-06-07 2019-08-12 삼성전자주식회사 반도체 패키지 및 이를 포함하는 반도체 장치
JP6081086B2 (ja) * 2012-06-14 2017-02-15 Tdk株式会社 光電素子用実装装置及び実装方法
ITTO20120583A1 (it) * 2012-07-02 2014-01-03 St Microelectronics Srl Dispositivo optoelettronico integrato con guida d'onda e relativo procedimento di fabbricazione
KR20140064530A (ko) * 2012-11-20 2014-05-28 삼성전자주식회사 광 연결을 포함하는 다중 칩 패키지
US9052464B1 (en) * 2013-01-18 2015-06-09 Kotura, Inc. Transfer of light signals between optical devices
US9442254B2 (en) 2013-06-10 2016-09-13 Freescale Semiconductor, Inc. Method and apparatus for beam control with optical MEMS beam waveguide
US9766409B2 (en) 2013-06-10 2017-09-19 Nxp Usa, Inc. Optical redundancy
US9810843B2 (en) * 2013-06-10 2017-11-07 Nxp Usa, Inc. Optical backplane mirror
US9435952B2 (en) 2013-06-10 2016-09-06 Freescale Semiconductor, Inc. Integration of a MEMS beam with optical waveguide and deflection in two dimensions
US10230458B2 (en) 2013-06-10 2019-03-12 Nxp Usa, Inc. Optical die test interface with separate voltages for adjacent electrodes
US9094135B2 (en) * 2013-06-10 2015-07-28 Freescale Semiconductor, Inc. Die stack with optical TSVs
US9086551B2 (en) * 2013-10-30 2015-07-21 International Business Machines Corporation Double mirror structure for wavelength division multiplexing with polymer waveguides
EP3201686B9 (en) * 2014-09-29 2022-01-12 Magic Leap, Inc. Architectures and methods for outputting different wavelength light out of waveguides
NZ773836A (en) 2015-03-16 2022-07-01 Magic Leap Inc Methods and systems for diagnosing and treating health ailments
CN107924103B (zh) 2015-06-15 2021-06-22 奇跃公司 具有用于内耦合复用光流的光学元件的显示系统
US10243322B2 (en) 2015-12-17 2019-03-26 Finisar Corporation Surface coupled systems
US10992104B2 (en) 2015-12-17 2021-04-27 Ii-Vi Delaware, Inc. Dual layer grating coupler
US10739518B2 (en) * 2015-12-21 2020-08-11 International Business Machines Corporation Optical components for wavelength division multiplexing with high-density optical interconnect modules
US9791640B2 (en) * 2016-03-14 2017-10-17 Te Connectivity Corporation Interposer with separable interface
KR102798670B1 (ko) 2016-04-08 2025-04-21 매직 립, 인코포레이티드 가변 포커스 렌즈 엘리먼트들을 가진 증강 현실 시스템들 및 방법들
WO2017197020A1 (en) 2016-05-12 2017-11-16 Magic Leap, Inc. Distributed light manipulation over imaging waveguide
CN106159565A (zh) * 2016-08-22 2016-11-23 安费诺电子装配（厦门）有限公司 一种带拉带脱锁结构的高速连接器模组及组装方法
KR102506485B1 (ko) 2016-11-18 2023-03-03 매직 립, 인코포레이티드 넓은 입사 각도 범위들의 광을 방향전환시키기 위한 다중층 액정 회절 격자들
JP7116058B2 (ja) 2016-11-18 2022-08-09 マジック リープ， インコーポレイテッド 空間可変液晶回折格子
EP3542213B1 (en) 2016-11-18 2025-10-08 Magic Leap, Inc. Waveguide light multiplexer using crossed gratings
US11067860B2 (en) 2016-11-18 2021-07-20 Magic Leap, Inc. Liquid crystal diffractive devices with nano-scale pattern and methods of manufacturing the same
CA3045663A1 (en) 2016-12-08 2018-06-14 Magic Leap, Inc. Diffractive devices based on cholesteric liquid crystal
US10895784B2 (en) 2016-12-14 2021-01-19 Magic Leap, Inc. Patterning of liquid crystals using soft-imprint replication of surface alignment patterns
US10371896B2 (en) 2016-12-22 2019-08-06 Magic Leap, Inc. Color separation in planar waveguides using dichroic filters
US10451799B2 (en) 2017-01-23 2019-10-22 Magic Leap, Inc. Eyepiece for virtual, augmented, or mixed reality systems
US10359565B2 (en) * 2017-02-07 2019-07-23 Nokia Of America Corporation Optoelectronic circuit having one or more double-sided substrates
IL301881B2 (en) 2017-02-23 2024-08-01 Magic Leap Inc Display system with variable power reflector
CN115097625A (zh) 2017-03-21 2022-09-23 奇跃公司 光学设备、头戴式显示器、成像系统和对对象成像的方法
JP6842377B2 (ja) * 2017-06-20 2021-03-17 日本電信電話株式会社 平面光回路積層デバイス
KR20190009515A (ko) * 2017-07-19 2019-01-29 삼성전자주식회사 반도체 장치
CN120161619A (zh) 2017-09-21 2025-06-17 奇跃公司 具有被配置为捕获眼睛和/或环境的图像的波导的增强现实显示器
AU2018386296B2 (en) 2017-12-15 2023-11-23 Magic Leap, Inc. Eyepieces for augmented reality display system
US10705302B2 (en) * 2018-02-27 2020-07-07 Samsung Electronics Co., Ltd. Photonic integrated circuit packages
US11435522B2 (en) 2018-09-12 2022-09-06 Ii-Vi Delaware, Inc. Grating coupled laser for Si photonics
US11237393B2 (en) 2018-11-20 2022-02-01 Magic Leap, Inc. Eyepieces for augmented reality display system
EP3899620A1 (en) * 2018-12-18 2021-10-27 Telefonaktiebolaget LM Ericsson (publ) Optical interconnect and method of manufacture thereof
US11404850B2 (en) 2019-04-22 2022-08-02 Ii-Vi Delaware, Inc. Dual grating-coupled lasers
EP3987343A4 (en) 2019-06-20 2023-07-19 Magic Leap, Inc. EYEWEARS FOR AUGMENTED REALITY DISPLAY SYSTEM
CN111146682B (zh) * 2019-12-04 2021-02-26 上海传输线研究所（中国电子科技集团公司第二十三研究所） 一种光纤耦合半导体激光器模块及半导体激光器
TWI873228B (zh) * 2020-11-18 2025-02-21 芯巧科技股份有限公司 具光耦特性之電子元件的改良結構
WO2023026572A1 (ja) * 2021-08-26 2023-03-02 株式会社村田製作所 光学部品
US12130470B2 (en) 2021-10-25 2024-10-29 Globalfoundries U.S. Inc. PIC die and package with multiple level and multiple depth connections of fibers to on-chip optical components
WO2023105591A1 (ja) * 2021-12-06 2023-06-15 日本電信電話株式会社 光回路
US11650381B1 (en) 2022-02-12 2023-05-16 Globalfoundries U.S. Inc. PIC die and package with cover for multiple level and multiple depth connections of fibers to on-chip optical components
CN115877521A (zh) * 2022-11-28 2023-03-31 之江实验室 光电子芯片、堆叠封装结构和光电子芯片的制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000222769A (ja) * 1999-02-03 2000-08-11 Pioneer Electronic Corp 光導波路素子及び光ピックアップ
JP2001110188A (ja) * 1999-10-13 2001-04-20 Mitsubishi Chemicals Corp 光メモリ素子の製造方法及び光メモリ素子用樹脂製コア／クラッド部材
US20010053260A1 (en) * 2000-03-13 2001-12-20 Toshiyuki Takizawa Optical module and method for producing the same, and optical circuit device
WO2002010814A1 (en) * 2000-08-01 2002-02-07 University Of Maryland, College Park Method for fabrication of vertically coupled integrated optical structures

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3834335A1 (de) * 1988-10-08 1990-04-12 Telefunken Systemtechnik Halbleiterschaltung
US5198008A (en) * 1990-11-09 1993-03-30 National Semiconductor Corporation Method of fabricating an optical interconnect structure
US5416861A (en) * 1994-04-29 1995-05-16 University Of Cincinnati Optical synchronous clock distribution network and high-speed signal distribution network
US5911022A (en) * 1994-09-29 1999-06-08 Siemens Aktiengesellschaft Optical coupling arrangement
DE19519548A1 (de) * 1995-05-27 1996-11-28 Bosch Gmbh Robert Anordnung zur Verbindung von integriert-optischen Komponenten und Verwendung der Anordnung
GB2302681A (en) 1995-06-27 1997-01-29 Yuen Ping Fan Dispensing roll adapter
EP0933656A3 (en) * 1998-02-02 2000-02-09 Matsushita Electric Industrial Co., Ltd. Optical waveguide component and a method of producing the same
JPH11311721A (ja) * 1998-02-27 1999-11-09 Oki Electric Ind Co Ltd 光結合モジュールおよびその製造方法
US6115521A (en) * 1998-05-07 2000-09-05 Trw Inc. Fiber/waveguide-mirror-lens alignment device
US6324313B1 (en) * 1998-12-21 2001-11-27 Lsi Logic Corporation On-chip multiple layer vertically transitioning optical waveguide and damascene method of fabricating the same
JP3100584B2 (ja) * 1999-02-15 2000-10-16 日本電信電話株式会社 光電子集積回路およびその作製方法
DE10080449D2 (de) * 1999-02-23 2001-11-22 Ppc Electronic Ag Cham Leiterplatte für electrische und optische Signale sowie Verfahren zu deren Herstellung
US6314224B1 (en) * 1999-06-18 2001-11-06 Alcatel Thick-walled cable jacket with non-circular cavity cross section
TW451084B (en) * 1999-06-25 2001-08-21 Toppan Printing Co Ltd Optical-electro wiring board, mounted board, and manufacturing method of optical-electro wiring board
AU7885900A (en) * 1999-08-27 2001-03-26 Board Of Regents, The University Of Texas System Packaging enhanced board level opto-electronic interconnects
US6519393B2 (en) * 2000-08-10 2003-02-11 Bruce Lee Booth Coupling of optical waveguide to optical waveguide devices
JP2002092939A (ja) * 2000-09-12 2002-03-29 Pioneer Electronic Corp 多層光学式記録媒体及びその製造方法
DE10054370A1 (de) * 2000-10-30 2002-05-16 Infineon Technologies Ag Optisches Verteilerelement
JP2002286959A (ja) * 2000-12-28 2002-10-03 Canon Inc 半導体装置、光電融合基板、及びそれらの製造方法
US20020110328A1 (en) * 2001-02-14 2002-08-15 Bischel William K. Multi-channel laser pump source for optical amplifiers
JP2002258081A (ja) * 2001-02-28 2002-09-11 Fujitsu Ltd 光配線基板、光配線基板の製造方法及び多層光配線
JP2003022961A (ja) * 2001-07-10 2003-01-24 Nikon Corp アライメントマーク、荷電粒子線露光装置用レチクル及び荷電粒子線露光方法
JP2003167175A (ja) * 2001-12-04 2003-06-13 Matsushita Electric Ind Co Ltd 光実装基板及び光デバイス
US20030128933A1 (en) * 2002-01-10 2003-07-10 International Business Machines Corporation Light-coupling device
JP3855773B2 (ja) 2002-01-11 2006-12-13 オムロン株式会社 光合分波器
JP3833180B2 (ja) * 2002-02-08 2006-10-11 キヤノン株式会社 二次元光導波路の製造方法
JP3833132B2 (ja) * 2002-03-25 2006-10-11 キヤノン株式会社 光導波装置の製造方法
DE10238741A1 (de) * 2002-08-19 2004-03-04 Infineon Technologies Ag Planare optische Komponente und Kopplungsvorrichtung zur Kopplung von Licht zwischen einer planaren optischen Komponente und einem optischen Bauteil
KR101228225B1 (ko) * 2003-05-23 2013-01-31 파나소닉 주식회사 광디바이스, 광디바이스의 제조방법 및 광집적 디바이스
JP2006023385A (ja) * 2004-07-06 2006-01-26 Fuji Xerox Co Ltd 積層型光導波路フィルム及びその製造方法、並びに導波路型光モジュール
TWI294258B (en) * 2004-08-03 2008-03-01 Rohm & Haas Elect Mat Methods of forming devices having optical functionality
JP2006106263A (ja) * 2004-10-04 2006-04-20 Fujinon Sano Kk 光学素子の製造方法
JP4559327B2 (ja) * 2005-09-14 2010-10-06 株式会社日立製作所 レンズを用いた光モジュールのアラインメント方法およびその方法で作成した光モジュール

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000222769A (ja) * 1999-02-03 2000-08-11 Pioneer Electronic Corp 光導波路素子及び光ピックアップ
JP2001110188A (ja) * 1999-10-13 2001-04-20 Mitsubishi Chemicals Corp 光メモリ素子の製造方法及び光メモリ素子用樹脂製コア／クラッド部材
US20010053260A1 (en) * 2000-03-13 2001-12-20 Toshiyuki Takizawa Optical module and method for producing the same, and optical circuit device
WO2002010814A1 (en) * 2000-08-01 2002-02-07 University Of Maryland, College Park Method for fabrication of vertically coupled integrated optical structures

Also Published As

Publication number Publication date
JP3768901B2 (ja) 2006-04-19
US20070062221A1 (en) 2007-03-22
EP1341019A2 (en) 2003-09-03
US7580605B2 (en) 2009-08-25
US7869671B2 (en) 2011-01-11
US20090277228A1 (en) 2009-11-12
JP2003255166A (ja) 2003-09-10
EP1341019B1 (en) 2017-12-13
US20030161573A1 (en) 2003-08-28
CN1441266A (zh) 2003-09-10
EP1341019A3 (en) 2004-09-29

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