JP3768901B2 - 立体光導波路の製造方法 - Google Patents

立体光導波路の製造方法 Download PDF

Info

Publication number
JP3768901B2
JP3768901B2 JP2002054375A JP2002054375A JP3768901B2 JP 3768901 B2 JP3768901 B2 JP 3768901B2 JP 2002054375 A JP2002054375 A JP 2002054375A JP 2002054375 A JP2002054375 A JP 2002054375A JP 3768901 B2 JP3768901 B2 JP 3768901B2
Authority
JP
Japan
Prior art keywords
substrate
waveguide
lens
light
marker
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002054375A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003255166A (ja
JP2003255166A5 (enExample
Inventor
薫 石田
継博 是永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2002054375A priority Critical patent/JP3768901B2/ja
Priority to US10/370,605 priority patent/US20030161573A1/en
Priority to CNB03107040XA priority patent/CN1328604C/zh
Priority to EP03004550.4A priority patent/EP1341019B1/en
Publication of JP2003255166A publication Critical patent/JP2003255166A/ja
Publication of JP2003255166A5 publication Critical patent/JP2003255166A5/ja
Application granted granted Critical
Publication of JP3768901B2 publication Critical patent/JP3768901B2/ja
Priority to US11/600,730 priority patent/US7580605B2/en
Priority to US12/503,521 priority patent/US7869671B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12002Three-dimensional structures
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/43Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S385/00Optical waveguides
    • Y10S385/901Illuminating or display apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
JP2002054375A 2002-02-28 2002-02-28 立体光導波路の製造方法 Expired - Fee Related JP3768901B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2002054375A JP3768901B2 (ja) 2002-02-28 2002-02-28 立体光導波路の製造方法
US10/370,605 US20030161573A1 (en) 2002-02-28 2003-02-24 Three-dimensional optical waveguide, method of manufacturing same, optical module, and optical transmission system
CNB03107040XA CN1328604C (zh) 2002-02-28 2003-02-28 三维光学波导及其制造方法、光学模块和光学传输系统
EP03004550.4A EP1341019B1 (en) 2002-02-28 2003-02-28 Three-dimensional optical waveguide
US11/600,730 US7580605B2 (en) 2002-02-28 2006-11-17 Three-dimensional optical waveguide, method of manufacturing same, optical module, and optical transmission system
US12/503,521 US7869671B2 (en) 2002-02-28 2009-07-15 Three-dimensional optical waveguide, method of manufacturing same, optical module, and optical transmission system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002054375A JP3768901B2 (ja) 2002-02-28 2002-02-28 立体光導波路の製造方法

Publications (3)

Publication Number Publication Date
JP2003255166A JP2003255166A (ja) 2003-09-10
JP2003255166A5 JP2003255166A5 (enExample) 2005-06-16
JP3768901B2 true JP3768901B2 (ja) 2006-04-19

Family

ID=27678567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002054375A Expired - Fee Related JP3768901B2 (ja) 2002-02-28 2002-02-28 立体光導波路の製造方法

Country Status (4)

Country Link
US (3) US20030161573A1 (enExample)
EP (1) EP1341019B1 (enExample)
JP (1) JP3768901B2 (enExample)
CN (1) CN1328604C (enExample)

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7343058B2 (en) * 2003-04-22 2008-03-11 Intel Corporation Efficient light coupler from off-chip to on-chip waveguides
US7929814B2 (en) * 2003-04-23 2011-04-19 Lightwire, Inc. Sub-micron planar lightwave devices formed on an SOI optical platform
US7251393B2 (en) * 2004-03-30 2007-07-31 Lockheed Martin Corporation Optical router
US7389013B2 (en) * 2004-09-30 2008-06-17 Stmicroelectronics, Inc. Method and system for vertical optical coupling on semiconductor substrate
US7391937B2 (en) * 2004-10-22 2008-06-24 Lockheed Martin Corporation Compact transition in layered optical fiber
JP4587772B2 (ja) * 2004-10-22 2010-11-24 イビデン株式会社 多層プリント配線板
JP5005168B2 (ja) * 2004-12-06 2012-08-22 ソニー株式会社 光導波装置及びその製造方法、並びに光情報処理装置及び電子機器
CN101147088B (zh) * 2005-02-16 2011-08-17 应用材料股份有限公司 光学耦合至ic芯片
US7189584B2 (en) * 2005-04-27 2007-03-13 Hewlett-Packard Development Company, L.P. Fabrication alignment technique for light guide screen
JP2008040003A (ja) 2006-08-03 2008-02-21 Fuji Xerox Co Ltd フレキシブル光導波路フィルム、光送受信モジュール、マルチチャンネル光送受信モジュール及びフレキシブル光導波路フィルムの製造方法
US8867868B2 (en) * 2006-10-03 2014-10-21 Kabushiki Kaisha Toshiba Semiconductor integrated circuit
JP5182097B2 (ja) * 2006-11-22 2013-04-10 株式会社ニコン 光導波路モジュールの製造方法
US7646949B2 (en) * 2007-07-27 2010-01-12 Kotura, Inc. Efficient transfer of light signals between optical devices
US8540434B2 (en) 2009-01-15 2013-09-24 Mayo Foundation For Medical Education And Research Optical edge connector
CN101872043B (zh) * 2010-06-12 2013-09-04 中央大学 光学传输模块
JP2012063969A (ja) * 2010-09-16 2012-03-29 Nitto Denko Corp 光導波路デバイスおよび光学式タッチパネル
KR20120048258A (ko) * 2010-11-05 2012-05-15 한국전자통신연구원 경사진 거울 및 렌즈를 구비한 광 도파로 구조체
US9164247B2 (en) * 2011-07-28 2015-10-20 Source Photonics, Inc. Apparatuses for reducing the sensitivity of an optical signal to polarization and methods of making and using the same
US9207413B2 (en) * 2011-09-26 2015-12-08 3M Innovative Properties Company Optical substrate having a plurality of staggered light redirecting features on a major surface thereof
TWI511477B (zh) * 2011-12-07 2015-12-01 Hon Hai Prec Ind Co Ltd 光收發裝置
US20130188970A1 (en) * 2012-01-19 2013-07-25 Kalpendu Shastri Packaging Platform For Opto-Electronic Assemblies Using Silicon-Based Turning Mirrors
JP5877749B2 (ja) * 2012-03-29 2016-03-08 日東電工株式会社 光電気混載基板の製法
WO2013180943A1 (en) * 2012-05-29 2013-12-05 3M Innovative Properties Company Optical interconnect
KR102009979B1 (ko) * 2012-06-07 2019-08-12 삼성전자주식회사 반도체 패키지 및 이를 포함하는 반도체 장치
JP6081086B2 (ja) 2012-06-14 2017-02-15 Tdk株式会社 光電素子用実装装置及び実装方法
ITTO20120583A1 (it) * 2012-07-02 2014-01-03 St Microelectronics Srl Dispositivo optoelettronico integrato con guida d'onda e relativo procedimento di fabbricazione
KR20140064530A (ko) * 2012-11-20 2014-05-28 삼성전자주식회사 광 연결을 포함하는 다중 칩 패키지
US9052464B1 (en) * 2013-01-18 2015-06-09 Kotura, Inc. Transfer of light signals between optical devices
US9810843B2 (en) 2013-06-10 2017-11-07 Nxp Usa, Inc. Optical backplane mirror
US9094135B2 (en) * 2013-06-10 2015-07-28 Freescale Semiconductor, Inc. Die stack with optical TSVs
US9435952B2 (en) 2013-06-10 2016-09-06 Freescale Semiconductor, Inc. Integration of a MEMS beam with optical waveguide and deflection in two dimensions
US9766409B2 (en) 2013-06-10 2017-09-19 Nxp Usa, Inc. Optical redundancy
US9442254B2 (en) 2013-06-10 2016-09-13 Freescale Semiconductor, Inc. Method and apparatus for beam control with optical MEMS beam waveguide
US10230458B2 (en) 2013-06-10 2019-03-12 Nxp Usa, Inc. Optical die test interface with separate voltages for adjacent electrodes
US9086551B2 (en) * 2013-10-30 2015-07-21 International Business Machines Corporation Double mirror structure for wavelength division multiplexing with polymer waveguides
AU2015323940B2 (en) * 2014-09-29 2021-05-20 Magic Leap, Inc. Architectures and methods for outputting different wavelength light out of waveguides
NZ773822A (en) 2015-03-16 2022-07-29 Magic Leap Inc Methods and systems for diagnosing and treating health ailments
IL256276B (en) 2015-06-15 2022-09-01 Magic Leap Inc Display system with optical components for coupling multiple light streams
US10992104B2 (en) 2015-12-17 2021-04-27 Ii-Vi Delaware, Inc. Dual layer grating coupler
US10243322B2 (en) * 2015-12-17 2019-03-26 Finisar Corporation Surface coupled systems
US10739518B2 (en) * 2015-12-21 2020-08-11 International Business Machines Corporation Optical components for wavelength division multiplexing with high-density optical interconnect modules
US9791640B2 (en) * 2016-03-14 2017-10-17 Te Connectivity Corporation Interposer with separable interface
EP3440497B1 (en) 2016-04-08 2023-08-16 Magic Leap, Inc. Augmented reality systems and methods with variable focus lens elements
US9904058B2 (en) 2016-05-12 2018-02-27 Magic Leap, Inc. Distributed light manipulation over imaging waveguide
CN106159565A (zh) * 2016-08-22 2016-11-23 安费诺电子装配(厦门)有限公司 一种带拉带脱锁结构的高速连接器模组及组装方法
US11067860B2 (en) 2016-11-18 2021-07-20 Magic Leap, Inc. Liquid crystal diffractive devices with nano-scale pattern and methods of manufacturing the same
KR102506485B1 (ko) 2016-11-18 2023-03-03 매직 립, 인코포레이티드 넓은 입사 각도 범위들의 광을 방향전환시키기 위한 다중층 액정 회절 격자들
KR102533671B1 (ko) 2016-11-18 2023-05-16 매직 립, 인코포레이티드 공간 가변적 액정 회절 격자들
IL312713A (en) 2016-11-18 2024-07-01 Magic Leap Inc Waveguide light multiplexer using crossed gratings
IL304304B2 (en) 2016-12-08 2024-08-01 Magic Leap Inc Diffractive devices based on cholesteric liquid crystal
KR102550742B1 (ko) 2016-12-14 2023-06-30 매직 립, 인코포레이티드 표면 정렬 패턴들의 소프트-임프린트 복제를 이용한 액정들의 패터닝
US10371896B2 (en) 2016-12-22 2019-08-06 Magic Leap, Inc. Color separation in planar waveguides using dichroic filters
AU2018210527B2 (en) 2017-01-23 2022-12-01 Magic Leap, Inc. Eyepiece for virtual, augmented, or mixed reality systems
US10359565B2 (en) * 2017-02-07 2019-07-23 Nokia Of America Corporation Optoelectronic circuit having one or more double-sided substrates
IL307602A (en) 2017-02-23 2023-12-01 Magic Leap Inc Variable focus virtual imagers based on polarization conversion
IL269317B2 (en) 2017-03-21 2023-11-01 Magic Leap Inc An eye imaging device that uses optical refractive elements
JP6842377B2 (ja) * 2017-06-20 2021-03-17 日本電信電話株式会社 平面光回路積層デバイス
KR20190009515A (ko) * 2017-07-19 2019-01-29 삼성전자주식회사 반도체 장치
EP3685215B1 (en) 2017-09-21 2024-01-03 Magic Leap, Inc. Augmented reality display with waveguide configured to capture images of eye and/or environment
CA3084011C (en) 2017-12-15 2024-06-11 Magic Leap, Inc. Eyepieces for augmented reality display system
US10705302B2 (en) * 2018-02-27 2020-07-07 Samsung Electronics Co., Ltd. Photonic integrated circuit packages
US11435522B2 (en) 2018-09-12 2022-09-06 Ii-Vi Delaware, Inc. Grating coupled laser for Si photonics
WO2020106824A1 (en) 2018-11-20 2020-05-28 Magic Leap, Inc. Eyepieces for augmented reality display system
WO2020125946A1 (en) * 2018-12-18 2020-06-25 Telefonaktiebolaget Lm Ericsson (Publ) Optical interconnect and method of manufacture thereof
US11404850B2 (en) 2019-04-22 2022-08-02 Ii-Vi Delaware, Inc. Dual grating-coupled lasers
CN114286962A (zh) 2019-06-20 2022-04-05 奇跃公司 用于增强现实显示系统的目镜
CN111146682B (zh) * 2019-12-04 2021-02-26 上海传输线研究所(中国电子科技集团公司第二十三研究所) 一种光纤耦合半导体激光器模块及半导体激光器
TWI873228B (zh) * 2020-11-18 2025-02-21 芯巧科技股份有限公司 具光耦特性之電子元件的改良結構
CN117581132A (zh) * 2021-08-26 2024-02-20 株式会社村田制作所 光学部件
US12130470B2 (en) 2021-10-25 2024-10-29 Globalfoundries U.S. Inc. PIC die and package with multiple level and multiple depth connections of fibers to on-chip optical components
WO2023105591A1 (ja) * 2021-12-06 2023-06-15 日本電信電話株式会社 光回路
US11650381B1 (en) 2022-02-12 2023-05-16 Globalfoundries U.S. Inc. PIC die and package with cover for multiple level and multiple depth connections of fibers to on-chip optical components
CN115877521B (zh) * 2022-11-28 2026-03-13 之江实验室 堆叠封装结构和堆叠封装结构的制作方法
US20240377580A1 (en) * 2023-05-11 2024-11-14 Taiwan Semiconductor Manufacturing Co., Ltd. Optical device and methods of manufacture

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3834335A1 (de) * 1988-10-08 1990-04-12 Telefunken Systemtechnik Halbleiterschaltung
US5198008A (en) * 1990-11-09 1993-03-30 National Semiconductor Corporation Method of fabricating an optical interconnect structure
US5416861A (en) * 1994-04-29 1995-05-16 University Of Cincinnati Optical synchronous clock distribution network and high-speed signal distribution network
US5911022A (en) * 1994-09-29 1999-06-08 Siemens Aktiengesellschaft Optical coupling arrangement
DE19519548A1 (de) * 1995-05-27 1996-11-28 Bosch Gmbh Robert Anordnung zur Verbindung von integriert-optischen Komponenten und Verwendung der Anordnung
GB2302681A (en) 1995-06-27 1997-01-29 Yuen Ping Fan Dispensing roll adapter
US6314228B1 (en) * 1998-02-02 2001-11-06 Matsushita Electric Industrial Co., Ltd. Optical waveguide component and a method of producing the same
JPH11311721A (ja) * 1998-02-27 1999-11-09 Oki Electric Ind Co Ltd 光結合モジュールおよびその製造方法
US6115521A (en) * 1998-05-07 2000-09-05 Trw Inc. Fiber/waveguide-mirror-lens alignment device
US6324313B1 (en) * 1998-12-21 2001-11-27 Lsi Logic Corporation On-chip multiple layer vertically transitioning optical waveguide and damascene method of fabricating the same
JP3635523B2 (ja) * 1999-02-03 2005-04-06 パイオニア株式会社 光導波路素子及び光ピックアップ
JP3100584B2 (ja) * 1999-02-15 2000-10-16 日本電信電話株式会社 光電子集積回路およびその作製方法
ES2195856T3 (es) * 1999-02-23 2003-12-16 Ppc Electronic Ag Placa de circuitos impresos para señales electricas y opticas asi como procedimiento para su fabricacion.
US6314224B1 (en) * 1999-06-18 2001-11-06 Alcatel Thick-walled cable jacket with non-circular cavity cross section
TW451084B (en) * 1999-06-25 2001-08-21 Toppan Printing Co Ltd Optical-electro wiring board, mounted board, and manufacturing method of optical-electro wiring board
WO2001016630A1 (en) * 1999-08-27 2001-03-08 Board Of Regents The University Of Texas System Packaging enhanced board level opto-electronic interconnects
JP2001110188A (ja) * 1999-10-13 2001-04-20 Mitsubishi Chemicals Corp 光メモリ素子の製造方法及び光メモリ素子用樹脂製コア/クラッド部材
US20010053260A1 (en) * 2000-03-13 2001-12-20 Toshiyuki Takizawa Optical module and method for producing the same, and optical circuit device
WO2002010814A1 (en) * 2000-08-01 2002-02-07 University Of Maryland, College Park Method for fabrication of vertically coupled integrated optical structures
US6519393B2 (en) * 2000-08-10 2003-02-11 Bruce Lee Booth Coupling of optical waveguide to optical waveguide devices
JP2002092939A (ja) * 2000-09-12 2002-03-29 Pioneer Electronic Corp 多層光学式記録媒体及びその製造方法
DE10054370A1 (de) * 2000-10-30 2002-05-16 Infineon Technologies Ag Optisches Verteilerelement
JP2002286959A (ja) * 2000-12-28 2002-10-03 Canon Inc 半導体装置、光電融合基板、及びそれらの製造方法
US20020110328A1 (en) * 2001-02-14 2002-08-15 Bischel William K. Multi-channel laser pump source for optical amplifiers
JP2002258081A (ja) * 2001-02-28 2002-09-11 Fujitsu Ltd 光配線基板、光配線基板の製造方法及び多層光配線
JP2003022961A (ja) * 2001-07-10 2003-01-24 Nikon Corp アライメントマーク、荷電粒子線露光装置用レチクル及び荷電粒子線露光方法
JP2003167175A (ja) * 2001-12-04 2003-06-13 Matsushita Electric Ind Co Ltd 光実装基板及び光デバイス
US20030128933A1 (en) * 2002-01-10 2003-07-10 International Business Machines Corporation Light-coupling device
JP3855773B2 (ja) 2002-01-11 2006-12-13 オムロン株式会社 光合分波器
JP3833180B2 (ja) * 2002-02-08 2006-10-11 キヤノン株式会社 二次元光導波路の製造方法
JP3833132B2 (ja) * 2002-03-25 2006-10-11 キヤノン株式会社 光導波装置の製造方法
DE10238741A1 (de) * 2002-08-19 2004-03-04 Infineon Technologies Ag Planare optische Komponente und Kopplungsvorrichtung zur Kopplung von Licht zwischen einer planaren optischen Komponente und einem optischen Bauteil
CN1723401B (zh) * 2003-05-23 2010-12-01 松下电器产业株式会社 光器件和光器件制造方法以及光集成器件
JP2006023385A (ja) * 2004-07-06 2006-01-26 Fuji Xerox Co Ltd 積層型光導波路フィルム及びその製造方法、並びに導波路型光モジュール
TWI294258B (en) * 2004-08-03 2008-03-01 Rohm & Haas Elect Mat Methods of forming devices having optical functionality
JP2006106263A (ja) * 2004-10-04 2006-04-20 Fujinon Sano Kk 光学素子の製造方法
JP4559327B2 (ja) * 2005-09-14 2010-10-06 株式会社日立製作所 レンズを用いた光モジュールのアラインメント方法およびその方法で作成した光モジュール

Also Published As

Publication number Publication date
CN1441266A (zh) 2003-09-10
CN1328604C (zh) 2007-07-25
US7869671B2 (en) 2011-01-11
EP1341019A3 (en) 2004-09-29
EP1341019B1 (en) 2017-12-13
JP2003255166A (ja) 2003-09-10
EP1341019A2 (en) 2003-09-03
US7580605B2 (en) 2009-08-25
US20030161573A1 (en) 2003-08-28
US20090277228A1 (en) 2009-11-12
US20070062221A1 (en) 2007-03-22

Similar Documents

Publication Publication Date Title
JP3768901B2 (ja) 立体光導波路の製造方法
JP4759423B2 (ja) 光伝送システム
JP6127053B2 (ja) マルチチャンネルトランシーバ
CN1983880B (zh) 光通信用光学棱镜和光收发模块
US12379555B2 (en) Detachable connector for co-packaged optics
US8100589B2 (en) Optical module and optical waveguide
KR102011337B1 (ko) 다채널 광수신 모듈
KR20260044253A (ko) 광 섬유 대 칩 광 커플러
CN108474911A (zh) 具有组合式发射器及接收器组合件的光学收发器
CN104364689A (zh) 用于耦合光纤输入/输出的具有结构化反射表面的耦合装置
KR20090010100A (ko) 광전자 구성요소 및 광학 도파관을 포함하는 인쇄회로기판 엘리먼트
TW200540481A (en) Light transmitting and receiving module
NL2003498C2 (nl) Opto-elektronische inrichting voor het bidirectioneel via glasvezels transporteren van informatie en werkwijze voor het vervaardigen van een dergelijke inrichting.
TW201838366A (zh) 光通信模組及雙向光通信模組
CN105403967B (zh) 光传输次组件及其制造方法
US6625369B1 (en) Optical transmitter-receiver module
JP7068005B2 (ja) 光受信モジュール、光モジュール、及び光伝送装置
WO2010095499A1 (ja) 光送受信モジュールと分光素子の製造方法及び光送受信モジュールの製造方法
JP7548413B2 (ja) 光接続構造、パッケージ構造、光モジュールおよびパッケージ構造の製造方法
EP4564068A1 (en) Apparatus and method for manufacturing optical wire
JP2008020720A (ja) 光導波路及び並列光送受信装置
KR102702422B1 (ko) 광 신호 검출 장치 및 광 신호 검출 방법
Schneider et al. Optical interconnects on printed circuit boards using embedded optical fibers
JP2015068997A (ja) 光電気変換装置およびそれを用いた光モジュール
Châteauneuf Design and alignment methodologies for two-dimensional free-space optical interconnects

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040922

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040922

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20050902

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20051101

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20051227

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20060124

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20060202

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100210

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100210

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110210

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120210

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130210

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130210

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140210

Year of fee payment: 8

LAPS Cancellation because of no payment of annual fees