ES2195856T3 - Placa de circuitos impresos para señales electricas y opticas asi como procedimiento para su fabricacion. - Google Patents

Placa de circuitos impresos para señales electricas y opticas asi como procedimiento para su fabricacion.

Info

Publication number
ES2195856T3
ES2195856T3 ES00901028T ES00901028T ES2195856T3 ES 2195856 T3 ES2195856 T3 ES 2195856T3 ES 00901028 T ES00901028 T ES 00901028T ES 00901028 T ES00901028 T ES 00901028T ES 2195856 T3 ES2195856 T3 ES 2195856T3
Authority
ES
Spain
Prior art keywords
printed circuit
electrical
procedure
manufacturing
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES00901028T
Other languages
English (en)
Inventor
Peter Leo Straub
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PPC Electronic AG
Original Assignee
PPC Electronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PPC Electronic AG filed Critical PPC Electronic AG
Application granted granted Critical
Publication of ES2195856T3 publication Critical patent/ES2195856T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Communication System (AREA)
  • Electroluminescent Light Sources (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Placa de circuitos impresos para señales eléctricas y ópticas, así como procedimiento para su fabricación, cuya placa (30) comprende al menos un nivel de conducción eléctrica (EL) para la retransmisión de señales eléctricas y/o corrientes eléctricas, así como al menos un nivel de conducción óptica (OL) para la retransmisión de señales ópticas, estando los niveles de conducción (EL,OL) situados dentro de la placa de circuitos impresos (30) superpuestos entre sí en forma de paquete apilado y unidos entre sí. Si se consigue una construcción especialmente flexible y sencilla, con al mismo tiempo una forma de fabricación simplificada, haciendo que el nivel de conducción óptica (OL) comprenda como elemento conductor por lo menos una capa delgada de vidrio (11).
ES00901028T 1999-02-23 2000-02-02 Placa de circuitos impresos para señales electricas y opticas asi como procedimiento para su fabricacion. Expired - Lifetime ES2195856T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH33599 1999-02-23

Publications (1)

Publication Number Publication Date
ES2195856T3 true ES2195856T3 (es) 2003-12-16

Family

ID=4184679

Family Applications (1)

Application Number Title Priority Date Filing Date
ES00901028T Expired - Lifetime ES2195856T3 (es) 1999-02-23 2000-02-02 Placa de circuitos impresos para señales electricas y opticas asi como procedimiento para su fabricacion.

Country Status (13)

Country Link
US (1) US6760497B1 (es)
EP (1) EP1155348B1 (es)
JP (1) JP2002538490A (es)
KR (1) KR100467951B1 (es)
AT (1) ATE242494T1 (es)
AU (1) AU2090400A (es)
DE (2) DE50002445D1 (es)
DK (1) DK1155348T3 (es)
ES (1) ES2195856T3 (es)
FI (1) FI20011614A (es)
GB (1) GB2363522B (es)
SE (1) SE521674C2 (es)
WO (1) WO2000050946A1 (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW460717B (en) * 1999-03-30 2001-10-21 Toppan Printing Co Ltd Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same
TWI239798B (en) 1999-05-28 2005-09-11 Toppan Printing Co Ltd Photo electric wiring substrate, mounted substrate, and the manufacture method of the photo electric wiring substrate
EP1325372A1 (de) * 2000-10-10 2003-07-09 Siemens Aktiengesellschaft Leiterplatte mit optischen lagen aus glas
WO2002032199A1 (de) 2000-10-13 2002-04-18 Ppc Electronic Ag Leiterplatte sowie verfahren zum herstellen einer solchen leiterplatte und eines schichtverbundmaterials für eine solche leiterplatte
JP3666752B2 (ja) * 2001-07-06 2005-06-29 ヴァイアシステムズ グループ インコーポレイテッド インターボード通信用ｐｃｂに光学層を一体化するためのシステムおよび方法
DE10151859A1 (de) * 2001-10-24 2003-05-08 Buerkle Gmbh Robert Verfahren und Vorrichtung zum Herstellen mehrlagiger Leiterplatten
JP3768901B2 (ja) * 2002-02-28 2006-04-19 松下電器産業株式会社 立体光導波路の製造方法
US7367718B2 (en) * 2002-09-06 2008-05-06 Sumitomo Electric Industries, Ltd. Optical module
DE10262143B4 (de) * 2002-12-20 2011-01-20 Ksg Leiterplatten Gmbh Lichtemittierende Anordnung
US20040218848A1 (en) * 2003-04-30 2004-11-04 Industrial Technology Research Institute Flexible electronic/optical interconnection film assembly and method for manufacturing
US7286770B2 (en) 2003-07-18 2007-10-23 International Business Machines Corporation Fiber optic transmission lines on an SOC
KR20050040589A (ko) * 2003-10-29 2005-05-03 삼성전기주식회사 광도파로가 형성된 인쇄회로 기판 및 그 제조 방법
KR20050046356A (ko) * 2003-11-14 2005-05-18 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
TWI282633B (en) * 2005-08-29 2007-06-11 Phoenix Prec Technology Corp Optical electronics integrated semiconductor device and method for fabricating the same
TWI264762B (en) * 2005-09-05 2006-10-21 Phoenix Prec Technology Corp Optical electronics integrated semiconductor package
JP4934070B2 (ja) 2008-01-24 2012-05-16 日東電工株式会社 光電気混載基板の製造方法
US9081137B2 (en) 2013-01-21 2015-07-14 International Business Machines Corporation Implementing embedded hybrid electrical-optical PCB construct
DE102014015393A1 (de) 2014-10-17 2016-04-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Bereitstellung eines Mehrlagenverbundes mit optischer Glaslage
US10459160B2 (en) 2017-01-31 2019-10-29 Corning Optical Communications LLC Glass waveguide assemblies for OE-PCBs and methods of forming OE-PCBs

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990001176A1 (en) * 1988-07-18 1990-02-08 Konechny Edward Thomas Jr Optical device and circuit board set
US5271083A (en) 1992-07-27 1993-12-14 Motorola, Inc. Molded optical waveguide with contacts utilizing leadframes and method of making same
US5249245A (en) * 1992-08-31 1993-09-28 Motorola, Inc. Optoelectroinc mount including flexible substrate and method for making same
JPH06167622A (ja) * 1992-11-30 1994-06-14 Kyocera Corp 光素子用回路基板及びその製造方法
DE19826658A1 (de) * 1998-06-16 1999-12-30 Siemens Ag Schaltungsträger mit integrierten, aktiven, optischen Funktionen
US6785447B2 (en) * 1998-10-09 2004-08-31 Fujitsu Limited Single and multilayer waveguides and fabrication process
TW460717B (en) * 1999-03-30 2001-10-21 Toppan Printing Co Ltd Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same

Also Published As

Publication number Publication date
WO2000050946A1 (de) 2000-08-31
SE0102784D0 (sv) 2001-08-22
US6760497B1 (en) 2004-07-06
DE10080449D2 (de) 2001-11-22
SE521674C2 (sv) 2003-11-25
ATE242494T1 (de) 2003-06-15
AU2090400A (en) 2000-09-14
SE0102784L (sv) 2001-08-22
GB0119556D0 (en) 2001-10-03
EP1155348A1 (de) 2001-11-21
JP2002538490A (ja) 2002-11-12
FI20011614A (fi) 2001-08-08
KR100467951B1 (ko) 2005-01-24
GB2363522B (en) 2003-06-25
DK1155348T3 (da) 2003-09-15
KR20020003190A (ko) 2002-01-10
GB2363522A (en) 2001-12-19
EP1155348B1 (de) 2003-06-04
DE50002445D1 (de) 2003-07-10

Similar Documents

Publication Publication Date Title
ES2195856T3 (es) Placa de circuitos impresos para señales electricas y opticas asi como procedimiento para su fabricacion.
TW200637453A (en) Duble-sided flexible printed circuit board
DE59811322D1 (de) Elektrisches oder elektronisches gerät
WO2007047930A3 (en) Electroluminescent panel
WO2005107411A3 (en) Tiled flat panel lighting system
TW342579B (en) Manufacturing method of printed circuit board and printed circuit board
TW200644202A (en) Method of manufacturing flexible circuit substrate
TW200742518A (en) Flexible printed circuit board and method for manufacturing the same
WO2005060401A3 (en) Direct contact power transfer pad and method of making same
TW200730061A (en) Multilayer circuit board and electronic apparatus
ATE431001T1 (de) Elektrisches / elektronisches installationsgerät
TW200629998A (en) Printed circuit board and forming method thereof
ATE348404T1 (de) Bauelementanordnung und verfahren zur herstellung einer bauelementanordnung
SE9802157L (sv) Elektrisk komponent
BR0212612A (pt) Etiqueta eletrônica fina e método para fazer a mesma
DE59407670D1 (de) Kern für elektrische Verbindungssubstrate und elektrische Verbindungssubstrate mit Kern, sowie Verfahren zu deren Herstellung
WO2010040161A3 (de) Schaltvorrichtung zur elektrischen kontaktprüfung
DE60044644D1 (de) LEITERPLATTE MIT EINER ISOLIERBARRIERE, Herstellungsverfahren einer solchen Barriere und einer solchen Platte
EP1784065A4 (en) ELECTRODE SUBSTRATE
HK1052254A1 (en) Manufacture of printed circuit board with test points.
ATE488814T1 (de) Elektronisches etikett
KR200386700Y1 (ko) 이엘램프시트 돔스위치
BR0006223A (pt) Tomada de ficha
DE502004004952D1 (de) Sensorsystem und verfahren zu dessen herstellung
WO2006113721A3 (en) Auto-calibration label and methods of forming the same