JP4934070B2 - 光電気混載基板の製造方法 - Google Patents
光電気混載基板の製造方法 Download PDFInfo
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- JP4934070B2 JP4934070B2 JP2008013875A JP2008013875A JP4934070B2 JP 4934070 B2 JP4934070 B2 JP 4934070B2 JP 2008013875 A JP2008013875 A JP 2008013875A JP 2008013875 A JP2008013875 A JP 2008013875A JP 4934070 B2 JP4934070 B2 JP 4934070B2
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- Prior art keywords
- core
- layer
- opto
- thin film
- hybrid board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/132—Integrated optical circuits characterised by the manufacturing method by deposition of thin films
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Optical Integrated Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
下記の一般式(1)で示されるビスフェノキシエタノールフルオレンジグリシジルエーテル(成分A)35重量部、脂環式エポキシである3,4−エポキシシクロヘキセニルメチル−3’,4’−エポキシヘキセンカルボキシレート(ダイセル化学社製、セロキサイド2021P)(成分B)40重量部、シクロヘキセンオキシド骨格を有する脂環式エポキシ樹脂(ダイセル化学社製、セロキサイド2081)(成分C)25重量部、4,4’−ビス〔ジ(βヒドロキシエトキシ)フェニルスルフィニオ〕フェニルスルフィド−ビス−ヘキサフルオロアンチモネートの50%プロピオンカーボネート溶液(成分D)1重量部とを混合することにより、アンダークラッド層およびオーバークラッド層の形成材料を調製した。
上記成分A:70重量部、1,3,3−トリス{4−〔2−(3−オキセタニル)〕ブトキシフェニル}ブタン:30重量部、上記成分D:1重量部を乳酸エチル28重量部に溶解することにより、コアの形成材料を調製した。
ステンレス製基台(厚み20μm)の表面に、上記アンダークラッド層の形成材料をスピンコート法により塗布した後、100℃×15分間の加熱処理により乾燥させた。ついで、所望の開口パターンが形成されたフォトマスク(露光マスク)を介して、2000mJ/cm2 の紫外線照射による露光を行った。つぎに、100℃×15分間の加熱処理を行うことにより、アンダークラッド層を形成した。このアンダークラッド層の厚みを接触式膜厚計で測定すると25μmであった。また、このアンダークラッド層の、波長830nmにおける屈折率は、1.542であった。
4 金属薄膜
6 電気配線
6a めっき層
Claims (3)
- アンダークラッド層上に複数のコアを所定パターンに突出形成するコア形成工程と、その突出形成されたコアの側面および頂面と,そのコア形成部分を除くアンダークラッド層の表面部分と,に沿って金属薄膜を形成する金属薄膜形成工程と、この金属薄膜に対して電解めっきを施すことにより、上記金属薄膜で被覆されたコアとそれに隣接するコアとの間の溝部をめっき層で埋めるとともに上記金属薄膜で被覆されたコアの頂面をめっき層で被覆する電解めっき工程と、上記コアの頂面に形成された上記金属薄膜およびその上のめっき層を研磨により除去して上記溝部内に残存するめっき層を電気配線とする電気配線形成工程と、上記コアおよび上記電気配線を被覆した状態でオーバークラッド層を形成するオーバークラッド層形成工程とを備えていることを特徴とする光電気混載基板の製造方法。
- アンダークラッド層が、金属製基台の上に形成される請求項1記載の光電気混載基板の製造方法。
- 金属製基台が、ステンレス製基台である請求項2記載の光電気混載基板の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008013875A JP4934070B2 (ja) | 2008-01-24 | 2008-01-24 | 光電気混載基板の製造方法 |
KR1020090005475A KR20090082133A (ko) | 2008-01-24 | 2009-01-22 | 광전기 혼재 기판의 제조 방법과 이에 의해 얻어진 광전기 혼재 기판 |
EP09000889A EP2083294B1 (en) | 2008-01-24 | 2009-01-22 | Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby |
US12/359,129 US7957622B2 (en) | 2008-01-24 | 2009-01-23 | Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby |
CN2009100011880A CN101493546B (zh) | 2008-01-24 | 2009-01-23 | 光电混载基板的制造方法及由该方法得到的光电混载基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008013875A JP4934070B2 (ja) | 2008-01-24 | 2008-01-24 | 光電気混載基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009175431A JP2009175431A (ja) | 2009-08-06 |
JP4934070B2 true JP4934070B2 (ja) | 2012-05-16 |
Family
ID=40514088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008013875A Expired - Fee Related JP4934070B2 (ja) | 2008-01-24 | 2008-01-24 | 光電気混載基板の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7957622B2 (ja) |
EP (1) | EP2083294B1 (ja) |
JP (1) | JP4934070B2 (ja) |
KR (1) | KR20090082133A (ja) |
CN (1) | CN101493546B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8503848B2 (en) * | 2011-01-27 | 2013-08-06 | Hewlett-Packard Development Company, L.P. | Waveguide arrays |
US20130048342A1 (en) * | 2011-08-23 | 2013-02-28 | Tyco Electronics Corporation | Circuit board |
JP6080155B2 (ja) * | 2012-11-08 | 2017-02-15 | 日東電工株式会社 | 光電気混載基板 |
US9081137B2 (en) * | 2013-01-21 | 2015-07-14 | International Business Machines Corporation | Implementing embedded hybrid electrical-optical PCB construct |
JP6379378B2 (ja) | 2013-09-06 | 2018-08-29 | 住友電工プリントサーキット株式会社 | 光電気混載基板 |
JP6168602B2 (ja) * | 2013-10-31 | 2017-07-26 | 日東電工株式会社 | 光電気混載モジュール |
JP6319762B2 (ja) * | 2013-10-31 | 2018-05-09 | 日東電工株式会社 | 光電気混載基板およびその製法 |
US10345571B2 (en) | 2014-01-30 | 2019-07-09 | Karl Storz Endovision, Inc. | Intelligent light source |
US10928589B2 (en) * | 2018-02-20 | 2021-02-23 | Honeywell International Inc. | Metallic blinder between optical waveguides to reduce cross talk |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2931048B2 (ja) * | 1990-07-04 | 1999-08-09 | 三井化学株式会社 | 高純度テレフタル酸の製造方法 |
JPH05281429A (ja) * | 1992-03-30 | 1993-10-29 | Sony Corp | 光導体路を内装したプリント基板の製造方法 |
JP3674061B2 (ja) * | 1994-10-31 | 2005-07-20 | 株式会社日立製作所 | 薄膜多層回路基板および光導波路の製造方法 |
JP2002538490A (ja) | 1999-02-23 | 2002-11-12 | ペーペーツェー エレクトロニカ アーゲー | 電気信号及び光信号のための印刷回路基板、並びにその製造方法 |
JP3491677B2 (ja) | 1999-06-24 | 2004-01-26 | 日本電気株式会社 | 光電気混載基板およびその製造方法 |
US6477284B1 (en) | 1999-06-14 | 2002-11-05 | Nec Corporation | Photo-electric combined substrate, optical waveguide and manufacturing process therefor |
JP2001154052A (ja) * | 1999-11-29 | 2001-06-08 | Oki Printed Circuit Kk | 光導波路の製造方法 |
JP3514443B2 (ja) * | 2000-10-10 | 2004-03-31 | 日本電信電話株式会社 | 光ファイバ布線板の製造方法 |
JP2002246744A (ja) * | 2001-02-20 | 2002-08-30 | Nec Corp | 導体形成方法およびこれを用いた多層配線基板製造方法 |
JP2003287636A (ja) * | 2002-03-28 | 2003-10-10 | Nec Corp | 光機能デバイスおよびその製造方法 |
JP2004012635A (ja) * | 2002-06-04 | 2004-01-15 | Nippon Paint Co Ltd | 光電気配線複合実装基板及びその製造方法 |
JP4023285B2 (ja) * | 2002-10-24 | 2007-12-19 | ソニー株式会社 | 光・電気配線混載ハイブリッド回路基板及びその製造方法並びに光・電気配線混載ハイブリッド回路モジュール及びその製造方法 |
JP2005181662A (ja) * | 2003-12-19 | 2005-07-07 | Fuji Xerox Co Ltd | 高分子光導波路の製造方法 |
JP2005221556A (ja) * | 2004-02-03 | 2005-08-18 | Nitto Denko Corp | 光導波路の製法 |
JP2006156439A (ja) | 2004-11-25 | 2006-06-15 | Nitto Denko Corp | 光電気混載基板の製造方法 |
US7523852B2 (en) * | 2004-12-05 | 2009-04-28 | International Business Machines Corporation | Solder interconnect structure and method using injection molded solder |
JP4508140B2 (ja) * | 2006-03-28 | 2010-07-21 | パナソニック電工株式会社 | 部品内蔵モジュール |
JP4934069B2 (ja) * | 2008-01-24 | 2012-05-16 | 日東電工株式会社 | 光電気混載基板の製造方法 |
JP4934068B2 (ja) * | 2008-01-24 | 2012-05-16 | 日東電工株式会社 | 光電気混載基板の製造方法およびそれによって得られた光電気混載基板 |
JP4796615B2 (ja) * | 2008-11-26 | 2011-10-19 | 日東電工株式会社 | 光電気混載基板およびその製造方法 |
-
2008
- 2008-01-24 JP JP2008013875A patent/JP4934070B2/ja not_active Expired - Fee Related
-
2009
- 2009-01-22 EP EP09000889A patent/EP2083294B1/en not_active Expired - Fee Related
- 2009-01-22 KR KR1020090005475A patent/KR20090082133A/ko not_active Application Discontinuation
- 2009-01-23 CN CN2009100011880A patent/CN101493546B/zh not_active Expired - Fee Related
- 2009-01-23 US US12/359,129 patent/US7957622B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP2083294A2 (en) | 2009-07-29 |
US20100008621A1 (en) | 2010-01-14 |
CN101493546B (zh) | 2012-09-05 |
CN101493546A (zh) | 2009-07-29 |
JP2009175431A (ja) | 2009-08-06 |
EP2083294A3 (en) | 2009-08-12 |
US7957622B2 (en) | 2011-06-07 |
EP2083294B1 (en) | 2011-12-28 |
KR20090082133A (ko) | 2009-07-29 |
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