SE0102784L - Mönsterkort för elektriska och optiska signaler och metod för att tillverka detsamma - Google Patents

Mönsterkort för elektriska och optiska signaler och metod för att tillverka detsamma

Info

Publication number
SE0102784L
SE0102784L SE0102784A SE0102784A SE0102784L SE 0102784 L SE0102784 L SE 0102784L SE 0102784 A SE0102784 A SE 0102784A SE 0102784 A SE0102784 A SE 0102784A SE 0102784 L SE0102784 L SE 0102784L
Authority
SE
Sweden
Prior art keywords
electrical
optical signals
manufacturing
same
circuit boards
Prior art date
Application number
SE0102784A
Other languages
English (en)
Other versions
SE521674C2 (sv
SE0102784D0 (sv
Inventor
Peter Leo Straub
Original Assignee
Ppc Electronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppc Electronic Ag filed Critical Ppc Electronic Ag
Publication of SE0102784L publication Critical patent/SE0102784L/sv
Publication of SE0102784D0 publication Critical patent/SE0102784D0/sv
Publication of SE521674C2 publication Critical patent/SE521674C2/sv

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
SE0102784A 1999-02-23 2001-08-22 Mönsterkort för elektriska och optiska signaler och metod för att tillverka detsamma SE521674C2 (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH33599 1999-02-23
PCT/CH2000/000056 WO2000050946A1 (de) 1999-02-23 2000-02-02 Leiterplatte für electrische und optische signale sowie verfahren zu deren herstellung

Publications (3)

Publication Number Publication Date
SE0102784L true SE0102784L (sv) 2001-08-22
SE0102784D0 SE0102784D0 (sv) 2001-08-22
SE521674C2 SE521674C2 (sv) 2003-11-25

Family

ID=4184679

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0102784A SE521674C2 (sv) 1999-02-23 2001-08-22 Mönsterkort för elektriska och optiska signaler och metod för att tillverka detsamma

Country Status (13)

Country Link
US (1) US6760497B1 (sv)
EP (1) EP1155348B1 (sv)
JP (1) JP2002538490A (sv)
KR (1) KR100467951B1 (sv)
AT (1) ATE242494T1 (sv)
AU (1) AU2090400A (sv)
DE (2) DE10080449D2 (sv)
DK (1) DK1155348T3 (sv)
ES (1) ES2195856T3 (sv)
FI (1) FI20011614A (sv)
GB (1) GB2363522B (sv)
SE (1) SE521674C2 (sv)
WO (1) WO2000050946A1 (sv)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW460717B (en) * 1999-03-30 2001-10-21 Toppan Printing Co Ltd Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same
TWI239798B (en) 1999-05-28 2005-09-11 Toppan Printing Co Ltd Photo electric wiring substrate, mounted substrate, and the manufacture method of the photo electric wiring substrate
WO2002031566A1 (de) * 2000-10-10 2002-04-18 Siemens Aktiengesellschaft Leiterplatte mit optischen lagen aus glas
WO2002032199A1 (de) 2000-10-13 2002-04-18 Ppc Electronic Ag Leiterplatte sowie verfahren zum herstellen einer solchen leiterplatte und eines schichtverbundmaterials für eine solche leiterplatte
WO2003005616A2 (en) * 2001-07-06 2003-01-16 Viasystems Group, Inc. System and method for integrating optical layers in a pcb for inter-board communications
DE10151859A1 (de) * 2001-10-24 2003-05-08 Buerkle Gmbh Robert Verfahren und Vorrichtung zum Herstellen mehrlagiger Leiterplatten
JP3768901B2 (ja) * 2002-02-28 2006-04-19 松下電器産業株式会社 立体光導波路の製造方法
US7367718B2 (en) * 2002-09-06 2008-05-06 Sumitomo Electric Industries, Ltd. Optical module
DE10261609B4 (de) * 2002-12-20 2007-05-03 Novaled Ag Lichtemittierende Anordnung
US20040218848A1 (en) * 2003-04-30 2004-11-04 Industrial Technology Research Institute Flexible electronic/optical interconnection film assembly and method for manufacturing
US7286770B2 (en) 2003-07-18 2007-10-23 International Business Machines Corporation Fiber optic transmission lines on an SOC
KR20050040589A (ko) * 2003-10-29 2005-05-03 삼성전기주식회사 광도파로가 형성된 인쇄회로 기판 및 그 제조 방법
KR20050046356A (ko) * 2003-11-14 2005-05-18 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
TWI282633B (en) * 2005-08-29 2007-06-11 Phoenix Prec Technology Corp Optical electronics integrated semiconductor device and method for fabricating the same
TWI264762B (en) * 2005-09-05 2006-10-21 Phoenix Prec Technology Corp Optical electronics integrated semiconductor package
JP4934070B2 (ja) * 2008-01-24 2012-05-16 日東電工株式会社 光電気混載基板の製造方法
US9081137B2 (en) 2013-01-21 2015-07-14 International Business Machines Corporation Implementing embedded hybrid electrical-optical PCB construct
DE102014015393A1 (de) 2014-10-17 2016-04-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Bereitstellung eines Mehrlagenverbundes mit optischer Glaslage
US10459160B2 (en) 2017-01-31 2019-10-29 Corning Optical Communications LLC Glass waveguide assemblies for OE-PCBs and methods of forming OE-PCBs

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990001176A1 (en) 1988-07-18 1990-02-08 Konechny Edward Thomas Jr Optical device and circuit board set
US5271083A (en) 1992-07-27 1993-12-14 Motorola, Inc. Molded optical waveguide with contacts utilizing leadframes and method of making same
US5249245A (en) 1992-08-31 1993-09-28 Motorola, Inc. Optoelectroinc mount including flexible substrate and method for making same
JPH06167622A (ja) * 1992-11-30 1994-06-14 Kyocera Corp 光素子用回路基板及びその製造方法
DE19826658A1 (de) * 1998-06-16 1999-12-30 Siemens Ag Schaltungsträger mit integrierten, aktiven, optischen Funktionen
US6785447B2 (en) * 1998-10-09 2004-08-31 Fujitsu Limited Single and multilayer waveguides and fabrication process
TW460717B (en) * 1999-03-30 2001-10-21 Toppan Printing Co Ltd Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same

Also Published As

Publication number Publication date
WO2000050946A1 (de) 2000-08-31
AU2090400A (en) 2000-09-14
GB2363522B (en) 2003-06-25
FI20011614A (sv) 2001-08-08
DE50002445D1 (de) 2003-07-10
GB2363522A (en) 2001-12-19
SE521674C2 (sv) 2003-11-25
GB0119556D0 (en) 2001-10-03
KR20020003190A (ko) 2002-01-10
JP2002538490A (ja) 2002-11-12
KR100467951B1 (ko) 2005-01-24
EP1155348B1 (de) 2003-06-04
ATE242494T1 (de) 2003-06-15
EP1155348A1 (de) 2001-11-21
US6760497B1 (en) 2004-07-06
DE10080449D2 (de) 2001-11-22
ES2195856T3 (es) 2003-12-16
DK1155348T3 (da) 2003-09-15
SE0102784D0 (sv) 2001-08-22

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Legal Events

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NUG Patent has lapsed