JP2003255166A5 - - Google Patents
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- Publication number
- JP2003255166A5 JP2003255166A5 JP2002054375A JP2002054375A JP2003255166A5 JP 2003255166 A5 JP2003255166 A5 JP 2003255166A5 JP 2002054375 A JP2002054375 A JP 2002054375A JP 2002054375 A JP2002054375 A JP 2002054375A JP 2003255166 A5 JP2003255166 A5 JP 2003255166A5
- Authority
- JP
- Japan
- Prior art keywords
- optical
- flat
- optical waveguide
- dimensional
- waveguide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 claims 50
- 239000000758 substrate Substances 0.000 claims 13
- 230000005540 biological transmission Effects 0.000 claims 8
- 239000003550 marker Substances 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 4
- 239000013307 optical fiber Substances 0.000 claims 3
- 238000010030 laminating Methods 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002054375A JP3768901B2 (ja) | 2002-02-28 | 2002-02-28 | 立体光導波路の製造方法 |
| US10/370,605 US20030161573A1 (en) | 2002-02-28 | 2003-02-24 | Three-dimensional optical waveguide, method of manufacturing same, optical module, and optical transmission system |
| EP03004550.4A EP1341019B1 (en) | 2002-02-28 | 2003-02-28 | Three-dimensional optical waveguide |
| CNB03107040XA CN1328604C (zh) | 2002-02-28 | 2003-02-28 | 三维光学波导及其制造方法、光学模块和光学传输系统 |
| US11/600,730 US7580605B2 (en) | 2002-02-28 | 2006-11-17 | Three-dimensional optical waveguide, method of manufacturing same, optical module, and optical transmission system |
| US12/503,521 US7869671B2 (en) | 2002-02-28 | 2009-07-15 | Three-dimensional optical waveguide, method of manufacturing same, optical module, and optical transmission system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002054375A JP3768901B2 (ja) | 2002-02-28 | 2002-02-28 | 立体光導波路の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003255166A JP2003255166A (ja) | 2003-09-10 |
| JP2003255166A5 true JP2003255166A5 (enExample) | 2005-06-16 |
| JP3768901B2 JP3768901B2 (ja) | 2006-04-19 |
Family
ID=27678567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002054375A Expired - Fee Related JP3768901B2 (ja) | 2002-02-28 | 2002-02-28 | 立体光導波路の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US20030161573A1 (enExample) |
| EP (1) | EP1341019B1 (enExample) |
| JP (1) | JP3768901B2 (enExample) |
| CN (1) | CN1328604C (enExample) |
Families Citing this family (73)
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| US7251393B2 (en) * | 2004-03-30 | 2007-07-31 | Lockheed Martin Corporation | Optical router |
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| US7391937B2 (en) * | 2004-10-22 | 2008-06-24 | Lockheed Martin Corporation | Compact transition in layered optical fiber |
| JP4587772B2 (ja) * | 2004-10-22 | 2010-11-24 | イビデン株式会社 | 多層プリント配線板 |
| JP5005168B2 (ja) * | 2004-12-06 | 2012-08-22 | ソニー株式会社 | 光導波装置及びその製造方法、並びに光情報処理装置及び電子機器 |
| KR20070110882A (ko) * | 2005-02-16 | 2007-11-20 | 어플라이드 머티어리얼스, 인코포레이티드 | Ic 칩에 대한 광 결합 |
| US7189584B2 (en) * | 2005-04-27 | 2007-03-13 | Hewlett-Packard Development Company, L.P. | Fabrication alignment technique for light guide screen |
| JP2008040003A (ja) | 2006-08-03 | 2008-02-21 | Fuji Xerox Co Ltd | フレキシブル光導波路フィルム、光送受信モジュール、マルチチャンネル光送受信モジュール及びフレキシブル光導波路フィルムの製造方法 |
| US8867868B2 (en) * | 2006-10-03 | 2014-10-21 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit |
| JP5182097B2 (ja) * | 2006-11-22 | 2013-04-10 | 株式会社ニコン | 光導波路モジュールの製造方法 |
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| WO2010123595A2 (en) * | 2009-01-15 | 2010-10-28 | Mayo Foundation For Medical Education And Research | Optical edge connector |
| CN101872043B (zh) * | 2010-06-12 | 2013-09-04 | 中央大学 | 光学传输模块 |
| JP2012063969A (ja) * | 2010-09-16 | 2012-03-29 | Nitto Denko Corp | 光導波路デバイスおよび光学式タッチパネル |
| KR20120048258A (ko) * | 2010-11-05 | 2012-05-15 | 한국전자통신연구원 | 경사진 거울 및 렌즈를 구비한 광 도파로 구조체 |
| US9164247B2 (en) * | 2011-07-28 | 2015-10-20 | Source Photonics, Inc. | Apparatuses for reducing the sensitivity of an optical signal to polarization and methods of making and using the same |
| CN103827712B (zh) * | 2011-09-26 | 2017-09-12 | 3M创新有限公司 | 在其主表面上具有多个交错式光重新导向结构的光学基底 |
| TWI511477B (zh) * | 2011-12-07 | 2015-12-01 | Hon Hai Prec Ind Co Ltd | 光收發裝置 |
| US20130188970A1 (en) * | 2012-01-19 | 2013-07-25 | Kalpendu Shastri | Packaging Platform For Opto-Electronic Assemblies Using Silicon-Based Turning Mirrors |
| JP5877749B2 (ja) * | 2012-03-29 | 2016-03-08 | 日東電工株式会社 | 光電気混載基板の製法 |
| US9134494B2 (en) * | 2012-05-29 | 2015-09-15 | 3M Innovative Properties Company | Optical interconnect |
| KR102009979B1 (ko) * | 2012-06-07 | 2019-08-12 | 삼성전자주식회사 | 반도체 패키지 및 이를 포함하는 반도체 장치 |
| JP6081086B2 (ja) * | 2012-06-14 | 2017-02-15 | Tdk株式会社 | 光電素子用実装装置及び実装方法 |
| ITTO20120583A1 (it) * | 2012-07-02 | 2014-01-03 | St Microelectronics Srl | Dispositivo optoelettronico integrato con guida d'onda e relativo procedimento di fabbricazione |
| KR20140064530A (ko) * | 2012-11-20 | 2014-05-28 | 삼성전자주식회사 | 광 연결을 포함하는 다중 칩 패키지 |
| US9052464B1 (en) * | 2013-01-18 | 2015-06-09 | Kotura, Inc. | Transfer of light signals between optical devices |
| US9442254B2 (en) | 2013-06-10 | 2016-09-13 | Freescale Semiconductor, Inc. | Method and apparatus for beam control with optical MEMS beam waveguide |
| US9766409B2 (en) | 2013-06-10 | 2017-09-19 | Nxp Usa, Inc. | Optical redundancy |
| US9810843B2 (en) * | 2013-06-10 | 2017-11-07 | Nxp Usa, Inc. | Optical backplane mirror |
| US9435952B2 (en) | 2013-06-10 | 2016-09-06 | Freescale Semiconductor, Inc. | Integration of a MEMS beam with optical waveguide and deflection in two dimensions |
| US10230458B2 (en) | 2013-06-10 | 2019-03-12 | Nxp Usa, Inc. | Optical die test interface with separate voltages for adjacent electrodes |
| US9094135B2 (en) * | 2013-06-10 | 2015-07-28 | Freescale Semiconductor, Inc. | Die stack with optical TSVs |
| US9086551B2 (en) * | 2013-10-30 | 2015-07-21 | International Business Machines Corporation | Double mirror structure for wavelength division multiplexing with polymer waveguides |
| EP3201686B9 (en) * | 2014-09-29 | 2022-01-12 | Magic Leap, Inc. | Architectures and methods for outputting different wavelength light out of waveguides |
| NZ773836A (en) | 2015-03-16 | 2022-07-01 | Magic Leap Inc | Methods and systems for diagnosing and treating health ailments |
| CN107924103B (zh) | 2015-06-15 | 2021-06-22 | 奇跃公司 | 具有用于内耦合复用光流的光学元件的显示系统 |
| US10243322B2 (en) | 2015-12-17 | 2019-03-26 | Finisar Corporation | Surface coupled systems |
| US10992104B2 (en) | 2015-12-17 | 2021-04-27 | Ii-Vi Delaware, Inc. | Dual layer grating coupler |
| US10739518B2 (en) * | 2015-12-21 | 2020-08-11 | International Business Machines Corporation | Optical components for wavelength division multiplexing with high-density optical interconnect modules |
| US9791640B2 (en) * | 2016-03-14 | 2017-10-17 | Te Connectivity Corporation | Interposer with separable interface |
| KR102798670B1 (ko) | 2016-04-08 | 2025-04-21 | 매직 립, 인코포레이티드 | 가변 포커스 렌즈 엘리먼트들을 가진 증강 현실 시스템들 및 방법들 |
| WO2017197020A1 (en) | 2016-05-12 | 2017-11-16 | Magic Leap, Inc. | Distributed light manipulation over imaging waveguide |
| CN106159565A (zh) * | 2016-08-22 | 2016-11-23 | 安费诺电子装配(厦门)有限公司 | 一种带拉带脱锁结构的高速连接器模组及组装方法 |
| KR102506485B1 (ko) | 2016-11-18 | 2023-03-03 | 매직 립, 인코포레이티드 | 넓은 입사 각도 범위들의 광을 방향전환시키기 위한 다중층 액정 회절 격자들 |
| JP7116058B2 (ja) | 2016-11-18 | 2022-08-09 | マジック リープ, インコーポレイテッド | 空間可変液晶回折格子 |
| EP3542213B1 (en) | 2016-11-18 | 2025-10-08 | Magic Leap, Inc. | Waveguide light multiplexer using crossed gratings |
| US11067860B2 (en) | 2016-11-18 | 2021-07-20 | Magic Leap, Inc. | Liquid crystal diffractive devices with nano-scale pattern and methods of manufacturing the same |
| CA3045663A1 (en) | 2016-12-08 | 2018-06-14 | Magic Leap, Inc. | Diffractive devices based on cholesteric liquid crystal |
| US10895784B2 (en) | 2016-12-14 | 2021-01-19 | Magic Leap, Inc. | Patterning of liquid crystals using soft-imprint replication of surface alignment patterns |
| US10371896B2 (en) | 2016-12-22 | 2019-08-06 | Magic Leap, Inc. | Color separation in planar waveguides using dichroic filters |
| US10451799B2 (en) | 2017-01-23 | 2019-10-22 | Magic Leap, Inc. | Eyepiece for virtual, augmented, or mixed reality systems |
| US10359565B2 (en) * | 2017-02-07 | 2019-07-23 | Nokia Of America Corporation | Optoelectronic circuit having one or more double-sided substrates |
| IL301881B2 (en) | 2017-02-23 | 2024-08-01 | Magic Leap Inc | Display system with variable power reflector |
| CN115097625A (zh) | 2017-03-21 | 2022-09-23 | 奇跃公司 | 光学设备、头戴式显示器、成像系统和对对象成像的方法 |
| JP6842377B2 (ja) * | 2017-06-20 | 2021-03-17 | 日本電信電話株式会社 | 平面光回路積層デバイス |
| KR20190009515A (ko) * | 2017-07-19 | 2019-01-29 | 삼성전자주식회사 | 반도체 장치 |
| CN120161619A (zh) | 2017-09-21 | 2025-06-17 | 奇跃公司 | 具有被配置为捕获眼睛和/或环境的图像的波导的增强现实显示器 |
| AU2018386296B2 (en) | 2017-12-15 | 2023-11-23 | Magic Leap, Inc. | Eyepieces for augmented reality display system |
| US10705302B2 (en) * | 2018-02-27 | 2020-07-07 | Samsung Electronics Co., Ltd. | Photonic integrated circuit packages |
| US11435522B2 (en) | 2018-09-12 | 2022-09-06 | Ii-Vi Delaware, Inc. | Grating coupled laser for Si photonics |
| US11237393B2 (en) | 2018-11-20 | 2022-02-01 | Magic Leap, Inc. | Eyepieces for augmented reality display system |
| EP3899620A1 (en) * | 2018-12-18 | 2021-10-27 | Telefonaktiebolaget LM Ericsson (publ) | Optical interconnect and method of manufacture thereof |
| US11404850B2 (en) | 2019-04-22 | 2022-08-02 | Ii-Vi Delaware, Inc. | Dual grating-coupled lasers |
| EP3987343A4 (en) | 2019-06-20 | 2023-07-19 | Magic Leap, Inc. | EYEWEARS FOR AUGMENTED REALITY DISPLAY SYSTEM |
| CN111146682B (zh) * | 2019-12-04 | 2021-02-26 | 上海传输线研究所(中国电子科技集团公司第二十三研究所) | 一种光纤耦合半导体激光器模块及半导体激光器 |
| TWI873228B (zh) * | 2020-11-18 | 2025-02-21 | 芯巧科技股份有限公司 | 具光耦特性之電子元件的改良結構 |
| WO2023026572A1 (ja) * | 2021-08-26 | 2023-03-02 | 株式会社村田製作所 | 光学部品 |
| US12130470B2 (en) | 2021-10-25 | 2024-10-29 | Globalfoundries U.S. Inc. | PIC die and package with multiple level and multiple depth connections of fibers to on-chip optical components |
| WO2023105591A1 (ja) * | 2021-12-06 | 2023-06-15 | 日本電信電話株式会社 | 光回路 |
| US11650381B1 (en) | 2022-02-12 | 2023-05-16 | Globalfoundries U.S. Inc. | PIC die and package with cover for multiple level and multiple depth connections of fibers to on-chip optical components |
| CN115877521A (zh) * | 2022-11-28 | 2023-03-31 | 之江实验室 | 光电子芯片、堆叠封装结构和光电子芯片的制作方法 |
Family Cites Families (37)
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| DE3834335A1 (de) * | 1988-10-08 | 1990-04-12 | Telefunken Systemtechnik | Halbleiterschaltung |
| US5198008A (en) * | 1990-11-09 | 1993-03-30 | National Semiconductor Corporation | Method of fabricating an optical interconnect structure |
| US5416861A (en) * | 1994-04-29 | 1995-05-16 | University Of Cincinnati | Optical synchronous clock distribution network and high-speed signal distribution network |
| US5911022A (en) * | 1994-09-29 | 1999-06-08 | Siemens Aktiengesellschaft | Optical coupling arrangement |
| DE19519548A1 (de) * | 1995-05-27 | 1996-11-28 | Bosch Gmbh Robert | Anordnung zur Verbindung von integriert-optischen Komponenten und Verwendung der Anordnung |
| GB2302681A (en) | 1995-06-27 | 1997-01-29 | Yuen Ping Fan | Dispensing roll adapter |
| EP0933656A3 (en) * | 1998-02-02 | 2000-02-09 | Matsushita Electric Industrial Co., Ltd. | Optical waveguide component and a method of producing the same |
| JPH11311721A (ja) * | 1998-02-27 | 1999-11-09 | Oki Electric Ind Co Ltd | 光結合モジュールおよびその製造方法 |
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| US6324313B1 (en) * | 1998-12-21 | 2001-11-27 | Lsi Logic Corporation | On-chip multiple layer vertically transitioning optical waveguide and damascene method of fabricating the same |
| JP3635523B2 (ja) * | 1999-02-03 | 2005-04-06 | パイオニア株式会社 | 光導波路素子及び光ピックアップ |
| JP3100584B2 (ja) * | 1999-02-15 | 2000-10-16 | 日本電信電話株式会社 | 光電子集積回路およびその作製方法 |
| DE10080449D2 (de) * | 1999-02-23 | 2001-11-22 | Ppc Electronic Ag Cham | Leiterplatte für electrische und optische Signale sowie Verfahren zu deren Herstellung |
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| JP2001110188A (ja) * | 1999-10-13 | 2001-04-20 | Mitsubishi Chemicals Corp | 光メモリ素子の製造方法及び光メモリ素子用樹脂製コア/クラッド部材 |
| US20010053260A1 (en) * | 2000-03-13 | 2001-12-20 | Toshiyuki Takizawa | Optical module and method for producing the same, and optical circuit device |
| WO2002010814A1 (en) * | 2000-08-01 | 2002-02-07 | University Of Maryland, College Park | Method for fabrication of vertically coupled integrated optical structures |
| US6519393B2 (en) * | 2000-08-10 | 2003-02-11 | Bruce Lee Booth | Coupling of optical waveguide to optical waveguide devices |
| JP2002092939A (ja) * | 2000-09-12 | 2002-03-29 | Pioneer Electronic Corp | 多層光学式記録媒体及びその製造方法 |
| DE10054370A1 (de) * | 2000-10-30 | 2002-05-16 | Infineon Technologies Ag | Optisches Verteilerelement |
| JP2002286959A (ja) * | 2000-12-28 | 2002-10-03 | Canon Inc | 半導体装置、光電融合基板、及びそれらの製造方法 |
| US20020110328A1 (en) * | 2001-02-14 | 2002-08-15 | Bischel William K. | Multi-channel laser pump source for optical amplifiers |
| JP2002258081A (ja) * | 2001-02-28 | 2002-09-11 | Fujitsu Ltd | 光配線基板、光配線基板の製造方法及び多層光配線 |
| JP2003022961A (ja) * | 2001-07-10 | 2003-01-24 | Nikon Corp | アライメントマーク、荷電粒子線露光装置用レチクル及び荷電粒子線露光方法 |
| JP2003167175A (ja) * | 2001-12-04 | 2003-06-13 | Matsushita Electric Ind Co Ltd | 光実装基板及び光デバイス |
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| KR101228225B1 (ko) * | 2003-05-23 | 2013-01-31 | 파나소닉 주식회사 | 광디바이스, 광디바이스의 제조방법 및 광집적 디바이스 |
| JP2006023385A (ja) * | 2004-07-06 | 2006-01-26 | Fuji Xerox Co Ltd | 積層型光導波路フィルム及びその製造方法、並びに導波路型光モジュール |
| TWI294258B (en) * | 2004-08-03 | 2008-03-01 | Rohm & Haas Elect Mat | Methods of forming devices having optical functionality |
| JP2006106263A (ja) * | 2004-10-04 | 2006-04-20 | Fujinon Sano Kk | 光学素子の製造方法 |
| JP4559327B2 (ja) * | 2005-09-14 | 2010-10-06 | 株式会社日立製作所 | レンズを用いた光モジュールのアラインメント方法およびその方法で作成した光モジュール |
-
2002
- 2002-02-28 JP JP2002054375A patent/JP3768901B2/ja not_active Expired - Fee Related
-
2003
- 2003-02-24 US US10/370,605 patent/US20030161573A1/en not_active Abandoned
- 2003-02-28 EP EP03004550.4A patent/EP1341019B1/en not_active Expired - Lifetime
- 2003-02-28 CN CNB03107040XA patent/CN1328604C/zh not_active Expired - Lifetime
-
2006
- 2006-11-17 US US11/600,730 patent/US7580605B2/en not_active Expired - Fee Related
-
2009
- 2009-07-15 US US12/503,521 patent/US7869671B2/en not_active Expired - Fee Related
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