CN102081205B - 光电复合配线模块及其制造方法 - Google Patents
光电复合配线模块及其制造方法 Download PDFInfo
- Publication number
- CN102081205B CN102081205B CN201010268438.XA CN201010268438A CN102081205B CN 102081205 B CN102081205 B CN 102081205B CN 201010268438 A CN201010268438 A CN 201010268438A CN 102081205 B CN102081205 B CN 102081205B
- Authority
- CN
- China
- Prior art keywords
- optical
- flat cable
- transmission path
- optical transmission
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 225
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 230000005540 biological transmission Effects 0.000 claims description 108
- 238000009429 electrical wiring Methods 0.000 claims description 48
- 239000002131 composite material Substances 0.000 claims description 33
- 230000001681 protective effect Effects 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 239000013307 optical fiber Substances 0.000 description 44
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 239000002861 polymer material Substances 0.000 description 8
- 238000003491 array Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000010365 information processing Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000000835 fiber Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
- H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009199589A JP5102815B2 (ja) | 2009-08-31 | 2009-08-31 | 光電気複合配線モジュールおよびその製造方法 |
JP2009-199589 | 2009-08-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102081205A CN102081205A (zh) | 2011-06-01 |
CN102081205B true CN102081205B (zh) | 2014-12-03 |
Family
ID=43625098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010268438.XA Expired - Fee Related CN102081205B (zh) | 2009-08-31 | 2010-08-30 | 光电复合配线模块及其制造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8363993B2 (zh) |
JP (1) | JP5102815B2 (zh) |
CN (1) | CN102081205B (zh) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5102815B2 (ja) * | 2009-08-31 | 2012-12-19 | 日立電線株式会社 | 光電気複合配線モジュールおよびその製造方法 |
WO2013009193A1 (en) | 2011-07-13 | 2013-01-17 | Fisher & Paykel Healthcare Limited | Impeller and motor assembly |
CA2746773A1 (en) * | 2011-07-18 | 2013-01-18 | Fiber Connections Inc. | Field terminated fiber optic and electrical connection device |
JP5938922B2 (ja) * | 2012-01-27 | 2016-06-22 | 日立金属株式会社 | 光モジュール、光伝送装置、及び光伝送装置の製造方法 |
US20150021228A1 (en) | 2012-02-02 | 2015-01-22 | Visunex Medical Systems Co., Ltd. | Eye imaging apparatus and systems |
US9655517B2 (en) | 2012-02-02 | 2017-05-23 | Visunex Medical Systems Co. Ltd. | Portable eye imaging apparatus |
JP2013167750A (ja) | 2012-02-15 | 2013-08-29 | Hitachi Cable Ltd | 光電気複合配線モジュール |
US20130230272A1 (en) * | 2012-03-01 | 2013-09-05 | Oracle International Corporation | Chip assembly configuration with densely packed optical interconnects |
US9351639B2 (en) | 2012-03-17 | 2016-05-31 | Visunex Medical Systems Co. Ltd. | Eye imaging apparatus with a wide field of view and related methods |
US8938136B2 (en) | 2012-08-08 | 2015-01-20 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Opto-electronic system having flip-chip substrate mounting |
JP6079122B2 (ja) * | 2012-10-12 | 2017-02-15 | 日立金属株式会社 | 光基板、光基板の製造方法、及び光モジュール構造 |
AU2013101734A4 (en) | 2012-12-18 | 2015-09-24 | Fisher & Paykel Healthcare Limited | Impeller and motor assembly |
WO2014102341A1 (en) * | 2012-12-31 | 2014-07-03 | Iee International Electronics & Engineering S.A. | Optical system generating a structured light field from an array of light sources by meand of a refracting or reflecting light structuring element |
CN104966773B (zh) * | 2013-01-22 | 2018-03-09 | 浙江中宙照明科技有限公司 | 一种led发光装置 |
US9986908B2 (en) | 2014-06-23 | 2018-06-05 | Visunex Medical Systems Co. Ltd. | Mechanical features of an eye imaging apparatus |
WO2016028701A1 (en) * | 2014-08-18 | 2016-02-25 | Adc Telecommunications, Inc. | Hybrid dongle cable assembly |
WO2016123138A1 (en) | 2015-01-26 | 2016-08-04 | Visunex Medical Systems Co. Ltd. | A disposable cap for an eye imaging apparatus and related methods |
EP3277156A4 (en) * | 2015-03-31 | 2018-12-26 | Visunex Medical Systems Co. Ltd. | A wireless imaging apparatus and related methods |
EP3081152B1 (en) | 2015-04-17 | 2022-12-07 | Nokia Technologies Oy | Electrode for a user wearable apparatus |
WO2017158721A1 (ja) * | 2016-03-15 | 2017-09-21 | オリンパス株式会社 | 光伝送モジュール及び内視鏡 |
JP6903400B2 (ja) * | 2016-04-04 | 2021-07-14 | 東芝ライフスタイル株式会社 | ランドリー機器 |
JP6959731B2 (ja) * | 2016-11-30 | 2021-11-05 | 日東電工株式会社 | 光電気混載基板 |
EP3615820A4 (en) | 2017-04-23 | 2021-01-06 | Fisher & Paykel Healthcare Limited | BREATHING ASSISTANCE DEVICE |
US10613273B2 (en) * | 2017-05-19 | 2020-04-07 | Mellanox Technologies, Ltd. | Optical component assembly and waveguide loopback |
JP6423930B1 (ja) * | 2017-07-28 | 2018-11-14 | Smk株式会社 | 光電気複合ケーブル |
KR101896864B1 (ko) * | 2018-02-12 | 2018-09-07 | 주식회사 씨앤씨컴 | 케이블 하네스 |
US20220182740A1 (en) * | 2019-03-20 | 2022-06-09 | Sony Group Corporation | Information processing apparatus, information processing method, and communication system |
JP2021044437A (ja) * | 2019-09-12 | 2021-03-18 | 住友電気工業株式会社 | 受光装置 |
TWI817057B (zh) * | 2019-11-15 | 2023-10-01 | 合聖科技股份有限公司 | 影像傳輸系統及影像傳輸方法 |
CN111367020B (zh) * | 2020-03-20 | 2022-05-20 | 中航光电科技股份有限公司 | 一种板上光纤垂直互连光连接器 |
TW202217377A (zh) | 2020-07-06 | 2022-05-01 | 新加坡商光子智能私人有限公司 | 積體電路中介層、系統、裝置、製造積體電路中介層的方法、以及用於從多個節點向目的地傳輸資訊的方法與系統 |
Citations (5)
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JP2004170684A (ja) * | 2002-11-20 | 2004-06-17 | Seiko Epson Corp | チップ間光インターコネクション回路、電気光学装置および電子機器 |
CN1761107A (zh) * | 2004-09-22 | 2006-04-19 | 日立电线株式会社 | 光电复合配线部件和使用该部件的电子设备 |
CN1910486A (zh) * | 2004-02-17 | 2007-02-07 | 浜松光子学株式会社 | 光配线基板及其制造方法 |
US20080003840A1 (en) * | 2004-09-17 | 2008-01-03 | Thales | Plug Connector Having Electric and Optical Contacts |
CN101206288A (zh) * | 2006-12-22 | 2008-06-25 | 富士施乐株式会社 | 光电复合布线模块及信息处理装置 |
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JPS5323088A (en) * | 1976-08-16 | 1978-03-03 | Junkosha Co Ltd | Cable in which active circuit is provided |
US4597631A (en) * | 1982-12-02 | 1986-07-01 | The United States Of America As Represented By The Secretary Of The Navy | Printed circuit card hybrid |
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US5367593A (en) * | 1993-09-03 | 1994-11-22 | Motorola, Inc. | Optical/electrical connector and method of fabrication |
JPH1153959A (ja) * | 1997-07-29 | 1999-02-26 | Oki Densen Kk | 光・メタル複合フラットケーブル |
KR100322579B1 (ko) | 1998-10-08 | 2002-03-08 | 윤종용 | 광 커넥터 모듈 |
DE19861162A1 (de) | 1998-11-06 | 2000-06-29 | Harting Elektrooptische Bauteile Gmbh & Co Kg | Verfahren zur Herstellung einer Leiterplatte sowie Leiterplatte |
KR100402409B1 (ko) | 2001-05-26 | 2003-10-30 | (주)오피트정보통신 | 원거리 전송이 가능한 디지털 비디오 신호 인터페이스 모듈 |
JP2003014546A (ja) * | 2001-06-28 | 2003-01-15 | Minolta Co Ltd | 走査型測色装置 |
JP2003057468A (ja) | 2001-08-21 | 2003-02-26 | Canon Inc | 光素子、光導波装置、それらの製造方法、およびそれらを用いた光電気混載基板 |
EP1286194A3 (en) | 2001-08-21 | 2004-05-19 | Canon Kabushiki Kaisha | Optical waveguide apparatus |
JP2003222746A (ja) * | 2002-01-29 | 2003-08-08 | Mitsubishi Electric Corp | 光電気結合装置 |
KR100528972B1 (ko) * | 2003-10-27 | 2005-11-16 | 한국전자통신연구원 | 테이퍼진 광도파로가 내장된 광 인쇄회로기판 시스템 |
JP4069856B2 (ja) * | 2003-12-02 | 2008-04-02 | 株式会社日立製作所 | 光半導体素子実装用基板及びその製造方法 |
JP4383244B2 (ja) * | 2004-05-13 | 2009-12-16 | 古河電気工業株式会社 | 回転コネクタ |
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WO2007091733A2 (en) | 2006-02-09 | 2007-08-16 | Matsushita Electric Works, Ltd. | Photoelectric converting device, manufacturing method of the same, and external waveguide |
US7454096B2 (en) * | 2006-05-18 | 2008-11-18 | International Business Machines Corporation | Flexible printed circuits capable of transmitting electrical and optical signals |
JP2008244774A (ja) * | 2007-03-27 | 2008-10-09 | Seiko Epson Corp | 光通信送信回路、光通信受信回路および光通信回路 |
JP4764373B2 (ja) * | 2007-04-13 | 2011-08-31 | 日本電信電話株式会社 | 光導波回路およびその作製方法 |
JP4962152B2 (ja) * | 2007-06-15 | 2012-06-27 | 日立電線株式会社 | 光電気複合伝送アセンブリ |
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JP5102815B2 (ja) * | 2009-08-31 | 2012-12-19 | 日立電線株式会社 | 光電気複合配線モジュールおよびその製造方法 |
-
2009
- 2009-08-31 JP JP2009199589A patent/JP5102815B2/ja not_active Expired - Fee Related
-
2010
- 2010-08-04 US US12/805,536 patent/US8363993B2/en not_active Expired - Fee Related
- 2010-08-30 CN CN201010268438.XA patent/CN102081205B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004170684A (ja) * | 2002-11-20 | 2004-06-17 | Seiko Epson Corp | チップ間光インターコネクション回路、電気光学装置および電子機器 |
CN1910486A (zh) * | 2004-02-17 | 2007-02-07 | 浜松光子学株式会社 | 光配线基板及其制造方法 |
US20080003840A1 (en) * | 2004-09-17 | 2008-01-03 | Thales | Plug Connector Having Electric and Optical Contacts |
CN1761107A (zh) * | 2004-09-22 | 2006-04-19 | 日立电线株式会社 | 光电复合配线部件和使用该部件的电子设备 |
CN101206288A (zh) * | 2006-12-22 | 2008-06-25 | 富士施乐株式会社 | 光电复合布线模块及信息处理装置 |
Also Published As
Publication number | Publication date |
---|---|
JP5102815B2 (ja) | 2012-12-19 |
US8363993B2 (en) | 2013-01-29 |
CN102081205A (zh) | 2011-06-01 |
JP2011053269A (ja) | 2011-03-17 |
US20110052205A1 (en) | 2011-03-03 |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: HITACHI METALS, LTD. Free format text: FORMER OWNER: HITACHI CABLE CO., LTD. Effective date: 20140429 Free format text: FORMER OWNER: HITACHI CABLE FINE TECH LTD. Effective date: 20140429 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20140429 Address after: Tokyo, Japan Applicant after: HITACHI METALS, Ltd. Address before: Tokyo, Japan Applicant before: Hitachi Cable Co.,Ltd. Effective date of registration: 20140429 Address after: Tokyo, Japan Applicant after: Hitachi Cable Co.,Ltd. Address before: Tokyo, Japan Applicant before: Hitachi Cable Co.,Ltd. Applicant before: Hitachi Metals, Ltd. |
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C14 | Grant of patent or utility model | ||
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CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20141203 Termination date: 20200830 |