CN1310345C - 白光发光装置 - Google Patents
白光发光装置 Download PDFInfo
- Publication number
- CN1310345C CN1310345C CNB2003101015379A CN200310101537A CN1310345C CN 1310345 C CN1310345 C CN 1310345C CN B2003101015379 A CNB2003101015379 A CN B2003101015379A CN 200310101537 A CN200310101537 A CN 200310101537A CN 1310345 C CN1310345 C CN 1310345C
- Authority
- CN
- China
- Prior art keywords
- light emitting
- emitting device
- white light
- emitting element
- protective member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
- Luminescent Compositions (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002294326A JP4280050B2 (ja) | 2002-10-07 | 2002-10-07 | 白色発光装置 |
| JP2002294326 | 2002-10-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1497747A CN1497747A (zh) | 2004-05-19 |
| CN1310345C true CN1310345C (zh) | 2007-04-11 |
Family
ID=32025495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101015379A Expired - Fee Related CN1310345C (zh) | 2002-10-07 | 2003-10-08 | 白光发光装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7180240B2 (enExample) |
| EP (1) | EP1408559A3 (enExample) |
| JP (1) | JP4280050B2 (enExample) |
| KR (1) | KR100655252B1 (enExample) |
| CN (1) | CN1310345C (enExample) |
| TW (1) | TWI236159B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102403422A (zh) * | 2011-11-17 | 2012-04-04 | 深圳市天电光电科技有限公司 | 一种led封装结构的加工方法及led封装结构 |
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| US20060006791A1 (en) * | 2004-07-06 | 2006-01-12 | Chia Chee W | Light emitting diode display that does not require epoxy encapsulation of the light emitting diode |
| JP2006049442A (ja) | 2004-08-02 | 2006-02-16 | Sharp Corp | 半導体発光装置およびその製造方法 |
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| TWD110646S1 (zh) * | 2004-10-19 | 2006-05-01 | 羅姆電子股份有限公司 | 發光二極體 |
| TWD110647S1 (zh) * | 2004-10-19 | 2006-05-01 | 羅姆電子股份有限公司 | 發光二極體 |
| USD521946S1 (en) * | 2004-10-19 | 2006-05-30 | Rohm Co., Ltd. | Light emitting diode |
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| USD521950S1 (en) * | 2004-10-19 | 2006-05-30 | Rohm Co., Ltd. | Light emitting diode |
| TWD110644S1 (zh) * | 2004-10-19 | 2006-05-01 | 羅姆電子股份有限公司 | 發光二極體 |
| USD544847S1 (en) * | 2004-10-19 | 2007-06-19 | Rohm Co., Ltd. | Light emitting diode |
| USD521463S1 (en) * | 2004-10-19 | 2006-05-23 | Rohm Co., Ltd. | Light emitting diode |
| USD536308S1 (en) * | 2004-10-19 | 2007-02-06 | Rohm Co., Ltd. | Light emitting diode |
| TWD110645S1 (zh) * | 2004-10-19 | 2006-05-01 | 羅姆電子股份有限公司 | 發光二極體 |
| TWI245437B (en) * | 2004-11-16 | 2005-12-11 | Lighthouse Technology Co Ltd | Package structure of a surface mount device light emitting diode |
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| JP4591071B2 (ja) * | 2004-12-20 | 2010-12-01 | 日亜化学工業株式会社 | 半導体装置 |
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| TWD120106S1 (zh) * | 2005-06-08 | 2007-11-21 | 松下電器產業股份有限公司 | 照明用發光元件模組 |
| TWD120846S1 (zh) * | 2005-06-08 | 2008-01-01 | 松下電器產業股份有限公司 | 照明用發光元件模組 |
| US20070001182A1 (en) * | 2005-06-30 | 2007-01-04 | 3M Innovative Properties Company | Structured phosphor tape article |
| TWI422044B (zh) | 2005-06-30 | 2014-01-01 | 克立公司 | 封裝發光裝置之晶片尺度方法及經晶片尺度封裝之發光裝置 |
| US7294861B2 (en) * | 2005-06-30 | 2007-11-13 | 3M Innovative Properties Company | Phosphor tape article |
| KR101161383B1 (ko) | 2005-07-04 | 2012-07-02 | 서울반도체 주식회사 | 발광 다이오드 및 이를 제조하기 위한 방법 |
| US20070007542A1 (en) * | 2005-07-07 | 2007-01-11 | Sumitomo Electric Industries,Ltd. | White-Light Emitting Device |
| JP2007027278A (ja) * | 2005-07-13 | 2007-02-01 | Shinko Electric Ind Co Ltd | 半導体装置および半導体装置の製造方法 |
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| KR100807015B1 (ko) * | 2005-08-16 | 2008-02-25 | 가부시끼가이샤 도시바 | 발광 장치 |
| JP2007073575A (ja) * | 2005-09-05 | 2007-03-22 | Matsushita Electric Ind Co Ltd | 半導体発光装置 |
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| JP5153950B1 (ja) * | 2012-04-18 | 2013-02-27 | E&E Japan株式会社 | 発光ダイオード |
| JP7068771B2 (ja) | 2013-07-08 | 2022-05-17 | ルミレッズ ホールディング ベーフェー | 波長変換式半導体発光デバイス |
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| JP6632834B2 (ja) | 2015-08-24 | 2020-01-22 | スタンレー電気株式会社 | 発光装置 |
| JP6928424B2 (ja) * | 2016-02-24 | 2021-09-01 | 日亜化学工業株式会社 | 蛍光体及び発光装置 |
| KR101902371B1 (ko) | 2017-03-02 | 2018-09-28 | 주식회사 이츠웰 | 파장 선택형 엘이디 패키지 및 이를 이용한 엘이디 패키지 어레이 |
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| JP2019046989A (ja) | 2017-09-04 | 2019-03-22 | スタンレー電気株式会社 | 半導体発光装置及び半導体発光装置の製造方法 |
| JP6675032B1 (ja) * | 2019-07-08 | 2020-04-01 | 御田 護 | 半導体発光装置 |
| CN115279861A (zh) * | 2020-08-03 | 2022-11-01 | 三垦电气株式会社 | 减光剂以及包含减光剂的发光装置 |
| JP7701614B2 (ja) * | 2021-09-30 | 2025-07-02 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
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| JP3768864B2 (ja) * | 2001-11-26 | 2006-04-19 | シチズン電子株式会社 | 表面実装型発光ダイオード及びその製造方法 |
| JP2003163378A (ja) * | 2001-11-26 | 2003-06-06 | Citizen Electronics Co Ltd | 表面実装型発光ダイオード及びその製造方法 |
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- 2003-10-03 EP EP03256244A patent/EP1408559A3/en not_active Withdrawn
- 2003-10-06 TW TW092127665A patent/TWI236159B/zh not_active IP Right Cessation
- 2003-10-07 KR KR1020030069507A patent/KR100655252B1/ko not_active Expired - Fee Related
- 2003-10-07 US US10/679,490 patent/US7180240B2/en not_active Expired - Lifetime
- 2003-10-08 CN CNB2003101015379A patent/CN1310345C/zh not_active Expired - Fee Related
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| JPH11163417A (ja) * | 1997-09-26 | 1999-06-18 | Matsushita Electric Ind Co Ltd | 発光ダイオード |
| JP2002043625A (ja) * | 2000-07-19 | 2002-02-08 | Koha Co Ltd | Led装置 |
| JP2002289925A (ja) * | 2001-03-23 | 2002-10-04 | Citizen Electronics Co Ltd | 発光ダイオード |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102403422A (zh) * | 2011-11-17 | 2012-04-04 | 深圳市天电光电科技有限公司 | 一种led封装结构的加工方法及led封装结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1408559A2 (en) | 2004-04-14 |
| CN1497747A (zh) | 2004-05-19 |
| JP2004128424A (ja) | 2004-04-22 |
| KR100655252B1 (ko) | 2006-12-08 |
| JP4280050B2 (ja) | 2009-06-17 |
| TWI236159B (en) | 2005-07-11 |
| TW200414568A (en) | 2004-08-01 |
| EP1408559A3 (en) | 2006-07-05 |
| US20040070338A1 (en) | 2004-04-15 |
| US7180240B2 (en) | 2007-02-20 |
| KR20040031661A (ko) | 2004-04-13 |
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