GB2432967A - White light LED with fluorescent powder containing wavelength converting plate - Google Patents

White light LED with fluorescent powder containing wavelength converting plate Download PDF

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Publication number
GB2432967A
GB2432967A GB0524356A GB0524356A GB2432967A GB 2432967 A GB2432967 A GB 2432967A GB 0524356 A GB0524356 A GB 0524356A GB 0524356 A GB0524356 A GB 0524356A GB 2432967 A GB2432967 A GB 2432967A
Authority
GB
United Kingdom
Prior art keywords
thin plate
color
chip
bracing frame
mixing led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0524356A
Other versions
GB0524356D0 (en
Inventor
Ching-Huei Wu
Tun-Ching Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unity Opto Technology Co Ltd
Original Assignee
Unity Opto Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unity Opto Technology Co Ltd filed Critical Unity Opto Technology Co Ltd
Priority to GB0524356A priority Critical patent/GB2432967A/en
Publication of GB0524356D0 publication Critical patent/GB0524356D0/en
Publication of GB2432967A publication Critical patent/GB2432967A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K2/00—Non-electric light sources using luminescence; Light sources using electrochemiluminescence
    • F21K2/06—Non-electric light sources using luminescence; Light sources using electrochemiluminescence using chemiluminescence
    • F21K2/08—Non-electric light sources using luminescence; Light sources using electrochemiluminescence using chemiluminescence activated by an electric field, i.e. electrochemiluminescence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

In a LED package with a fluorescent powder containing converter plate, the plate act as wavelength converting plate because part of the colored light from the light emitting chip excites the fluorescent powder in the plate and emits light with another wavelength. Fluorescent powders are mixed with an adhesive to form a thin plate 20. A segmentation process is then performed on the thin plate. A light emitting chip 13 is coupled to a concave bracing frame 10, and then the segmented thin plate 20 is mounted in the concave bracing frame 10 against its inner walls. A transparent adhesive for fixing is injected into the concave bracing frame 10, whereby the color-mixing LED has simplified manufacturing procedure, reduced manufacturing cost, and easy assembling design. The LED package can also be constructed by bonding the light emitting chip to two electrodes on the surface of a printed circuit board or a ceramic board, and fixing the thin fluorescent powder containing wavelength converter plate over the chip with a transparent adhesive.

Description

<p>COLOR-MIXING LED</p>
<p>FIELD OF THE INVENTION</p>
<p>The present invention relates a light emitting diode (LED) or the like, and more particularly to a color-mixing LED that has simplified manufacturing procedure, effective reduced manufacturing cost, and easy assembling design.</p>
<p>BACKGROUND OF THE INVENTION</p>
<p>The LED, which is previously applied to indicators of electronic products in early years, provides the advantages of lower power consumption, long lifetime, and producing no heat, so it is currently further applied to lighting and large-sized display screen. However, the generation of white light from the LED is an important key technology when the LED is applied to the lighting.</p>
<p>In order to obtain the white light by mixing primary colors with one another, different chips for respectively emitting red, green, and blue lights must be applied simultaneously since most common LEDs generate colored lights, for example, red light, green light, blue light, etc. As a result, the white light can be obtained by exciting these chips with different current values.</p>
<p>Referring to FIG. 4, a conventional white light LED is shown, wherein red, blue, and green-light chips Al, A2, and A3 are packaged in a package C. Besides, a control chip E is also packaged in this package C. The chips Al, A2, and A3 are connected to the control chip E by bonding wires B, wherein they are connected to the outside environment by pins D. However, in this conventional structure, these chips are mounted separately. In other words, the white light is only generated on optical overlaps of these three chips. The light, which is generated on the edge of every chip, has the same color as the light emitted from this chip, and the light, which is generated on the optical overlaps of every two chips, is a mixing light of these two chips. As a result, its manufacturing cost is increased and its manufacturing procedure is more complicated since there is a need to mount another control chip.</p>
<p>In view of the aforementioned conventional deficiencies, the present inventor makes diligent studies in providing consumers with a color-mixing LED that has simplified manufacturing procedure, effective reduced manufacturing cost, and easy assembling design according to the motive of the present invention.</p>
<p>SUMMARY OF THE INVENTION</p>
<p>It is a main objective of the present invention to provide a color-mixing LED with simplified manufacturing procedure, effective reduced manufacturing cost, and easy assembling design.</p>
<p>In order to achieve this objective, fluorescent powders are mixed with an adhesive to form a thin plate. A segmentation process is then performed on the thin plate. A chip is coupled to a concave bracing frame, and then the segmented thin plate is mounted in the concave bracing frame against its inner walls. A transparent adhesive for fixing is injected into the concave bracing frame. Accordingly, the color-mixing LED has simplified manufacturing procedure, reduced manufacturing cost, and easy assembling design.</p>
<p>The aforementioned objectives and advantages of the present invention will be readily clarified in the description of the preferred embodiments and the enclosed drawings of the present invention.</p>
<p>BRIEF DESCRIPTION OF THE DRAWINGS</p>
<p>FIG. 1 is a schematic, assembled view showing a first preferred embodiment of the present invention.</p>
<p>FIG. 2 is a schematic, assembled view showing a second preferred embodiment of the present invention.</p>
<p>FIG. 3 is a schematic, assembled view showing a third preferred embodiment of the present invention.</p>
<p>FIG. 4 is a top view showing a conventional white-light LED.</p>
<p>DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT</p>
<p>As shown FIG. 1, according to a preferred embodiment of the present invention, two opposite-polarity pins 11, 12 are mounted on bottom edges of a concave bracing frame 10, wherein a chip 13 is coupled to the inside of the concave bracing frame 10, and the chip 13 is connected to the opposite-polarity pins 11, 12 via two bonding wires 14, 15. At least a thin plate 20 is mounted above these two bonding wires 14, 15. The thin plate 20 is made of a mixture of fluorescent powders and an adhesive, and it is manufactured by injection molding or casting method, wherein the adhesive is, for example, epoxy resin, polyphthalamide (abbreviated as PPA), or silicon gel. Thereafter, a segmentation process is performed to segment the manufactured thin plate 20 into proper-sized pieces, and the segmented thin plate 20 is then mounted inside the concave bracing frame 10 against its inner walls so as to separate the chip 13 and the bonding wires 14, 15 from the outside environment. Thereafter, the bracing frame 10 is covered with a transparent adhesive 25 for the purpose of fixing, wherein the transparent adhesive 25 is, for example, epoxy resin, polyphthalamide (abbreviated as PPA), or silicon gel such that the thin plate 20 is steadily mounted inside the concave bracing frame for separating the transparent adhesive 25 from the chip 13 and that the amount of the transparent adhesive 25, which is used in the manufacture of the light emitting diode, can be reduced effectively.</p>
<p>After the manufactured light emitting diode is supplied with electric power, the colored light emitted from the chip 13 will pass through the thin plate 20 that contains uniform fluorescent powders. A uniform mixing light with no chromatic aberration is formed when the thin plate 20 is excited by the colored light since the thin plate 20 has a uniform thickness and the fluorescent powders dissolved in the thin plate 20 has a uniform density.</p>
<p>Referring further to FIG. 2, the chip 13 can be flip-chip bonded to the opposite-polarity pins 11, 12 by tin solders or gold solders. The tin solders 16, 17 are exemplified in this second preferred embodiment. The chip 13 is flip-chip bonded to the opposite-polarity pins 11, 12 by the tin solders 16, 17, and the thin plate 20 is stacked over the chip 13. There is no need to utilize the bonding wires since the chip 13 is flip-chip bonded to the opposite-polarity pins 11, 12 directly. As a result, the thin plate 20 can be stacked on the chip 13 directly or mounted above the chip 13.</p>
<p>Referring further to FIG. 3, the bracing frame can be replaced by a printed circuit board (PCB) 30 or a ceramic board, wherein two electrodes 31, 32 are mounted on the PCB 30, and the chip 13 is flip-chip bonded to the electrodes 31, 32 by tin solders 16, 17. The segmented thin plate 20 is mounted on the chip 13, and the thin plate 20 and the chip 13 are thereafter packaged by the transparent adhesive 25 for fixing so as to complete the manufacture of the light emitting diode.</p>
<p>According to the foregoing description, it is apparent that the structure of the present invention provides the following advantages, wherein: 1. By use of the thin plate that has the fluorescent powders, the manufacturing procedure of the color-mixing LED can be simplified effectively such that its assembly is easy so as to reduce the manufacturing cost effectively.</p>
<p>2. The thin plate that mounts above the chip has a uniform thickness and uniform fluorescent powders so as to produce uniform mixing light.</p>
<p>3. The concave bracing frame is partitioned into two parts by the thin plate such that the transparent adhesive only covers the space over the thin plate and not covers the space under the thin plate so as to reduce the required amount of the transparent adhesive.</p>
<p>In summary, the color-mixing LED disclosed in the present invention satisfies patentability. Accordingly, it is submitted for a patent.</p>
<p>While the preferred embodiments of the invention are set forth for the purpose of disclosure, modifications of the disclosed embodiments of the invention as well as other embodiments thereof may occur to those skilled in the art, without departing from the scope of the invention as defined by the appended claims.</p>

Claims (1)

  1. <p>What the invention claimed is: 1. A color-mixing LED comprising: a thin
    plate, the thin plate being a mixture of fluorescent powders and an adhesive; a concave bracing frame, the thin plate being segmented and mounted in the concave bracing frame against inner walls of the concave bracing frame; a chip coupled to the inside of the concave bracing frame; and a transparent adhesive injected into the concave bracing frame for fixing, whereby the color-mixing LED has simplified manufacturing procedure, reduced manufacturing cost, and easy assembling design.</p>
    <p>2. The color-mixing LED of claim 1, wherein the adhesive of the thin plate is epoxy resin, polyphthalamide (PPA), or silicon gel.</p>
    <p>3. The color-mixing LED of claim 1, wherein the chip is wire-bonded and connected to the concave bracing frame by bonding wires and the thin plate that locates against the concave bracing frame is higher than the bonding wires.</p>
    <p>4. The color-mixing LED of claim 1, wherein the chip is flip-chip bonded to the concave bracing frame and the thin plate is mounted over the chip.</p>
    <p>5. The color-mixing LED of claim 1, wherein the transparent adhesive is epoxy resin, polyphthalamide (PPA), or silicon gel.</p>
    <p>6. A color-mixing LED comprising: a printed circuit board on which at least two electrodes are mounted; a chip coupled to the electrodes; a thin plate mounted on the chip, the thin plate being made of a mixture of fluorescent powders and an adhesive; and a transparent adhesive for fixing the thin plate over the chip mounted on the printed circuit board, whereby the color-mixing LED has simplified manufacturing procedure, reduced manufacturing cost, and easy assembling design.</p>
    <p>7. The color-mixing LED of claim 6, wherein the adhesive of the thin plate is epoxy resin, polyphthalamide (PPA), or silicon gel.</p>
    <p>8. The color-mixing LED of claim 6, wherein the transparent adhesive is epoxy resin, polyphthalamide (PPA), or silicon gel.</p>
    <p>9. A color-mixing LED comprising: a ceramic board on which at least two electrodes are mounted; a chip coupled to the electrodes; a thin plate mounted on the chip, the thin plate being made of a mixture of fluorescent powders and an adhesive; and a transparent adhesive for fixing the thin plate over the chip mounted on the ceramic board, whereby the color-mixing LED has simplified manufacturing procedure, reduced manufacturing cost, and easy assembling design.</p>
    <p>10. The color-mixing LED of claim 9, wherein the adhesive of the thin plate is epoxy resin, polyphthalaniide (PPA), or silicon gel.</p>
    <p>11. The color-mixing LED of claim 9, wherein the transparent adhesive is epoxy resin, polyphthalamide (PPA), or silicon gel.</p>
    <p>12. A color-mixing LED substantially as herembefore described with reference to Figure 1, Figure 2, or Figure 3 of the accompanying drawings.</p>
GB0524356A 2005-11-30 2005-11-30 White light LED with fluorescent powder containing wavelength converting plate Withdrawn GB2432967A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0524356A GB2432967A (en) 2005-11-30 2005-11-30 White light LED with fluorescent powder containing wavelength converting plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0524356A GB2432967A (en) 2005-11-30 2005-11-30 White light LED with fluorescent powder containing wavelength converting plate

Publications (2)

Publication Number Publication Date
GB0524356D0 GB0524356D0 (en) 2006-01-04
GB2432967A true GB2432967A (en) 2007-06-06

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2332187A2 (en) * 2008-09-02 2011-06-15 Bridgelux, Inc. Phosphor-converted led
CN102384405A (en) * 2010-08-27 2012-03-21 罗姆股份有限公司 LED light source unit for backlight of liquid crystal display, and liquid crystal display

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020063301A1 (en) * 2000-09-21 2002-05-30 Tetsuya Hanamoto Semiconductor light-emitting device and light-emitting display device therewith
US20020063250A1 (en) * 2000-10-24 2002-05-30 Yuichiro Ikenaga Semiconductor device and method of inspecting the same
US20020070449A1 (en) * 2000-12-12 2002-06-13 Lumileds Lighting, U.S., Lls Light-emitting device and production thereof
US20020079837A1 (en) * 2000-12-19 2002-06-27 Jun Okazaki Chip-type LED and process of manufacturing the same
US20030067264A1 (en) * 2001-10-09 2003-04-10 Agilent Technologies, Inc. Light-emitting diode and method for its production
EP1363335A2 (en) * 2002-05-15 2003-11-19 Sumitomo Electric Industries, Ltd. White color light emitting device
EP1408559A2 (en) * 2002-10-07 2004-04-14 Citizen Electronics Co., Ltd. White light emitting device
JP2004253592A (en) * 2003-02-20 2004-09-09 Sumitomo Electric Ind Ltd White light emitting device
US20050077531A1 (en) * 2003-10-10 2005-04-14 Kim Hyun Kyung Wavelength converted light emitting apparatus using phosphor and manufacturing method thereof
EP1574558A1 (en) * 2002-12-20 2005-09-14 Toyoda Gosei Co., Ltd. Phosphor and optical device using same

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020063301A1 (en) * 2000-09-21 2002-05-30 Tetsuya Hanamoto Semiconductor light-emitting device and light-emitting display device therewith
US20020063250A1 (en) * 2000-10-24 2002-05-30 Yuichiro Ikenaga Semiconductor device and method of inspecting the same
US20020070449A1 (en) * 2000-12-12 2002-06-13 Lumileds Lighting, U.S., Lls Light-emitting device and production thereof
US20020079837A1 (en) * 2000-12-19 2002-06-27 Jun Okazaki Chip-type LED and process of manufacturing the same
US20030067264A1 (en) * 2001-10-09 2003-04-10 Agilent Technologies, Inc. Light-emitting diode and method for its production
EP1363335A2 (en) * 2002-05-15 2003-11-19 Sumitomo Electric Industries, Ltd. White color light emitting device
EP1408559A2 (en) * 2002-10-07 2004-04-14 Citizen Electronics Co., Ltd. White light emitting device
EP1574558A1 (en) * 2002-12-20 2005-09-14 Toyoda Gosei Co., Ltd. Phosphor and optical device using same
JP2004253592A (en) * 2003-02-20 2004-09-09 Sumitomo Electric Ind Ltd White light emitting device
US20050077531A1 (en) * 2003-10-10 2005-04-14 Kim Hyun Kyung Wavelength converted light emitting apparatus using phosphor and manufacturing method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2332187A2 (en) * 2008-09-02 2011-06-15 Bridgelux, Inc. Phosphor-converted led
EP2332187A4 (en) * 2008-09-02 2013-05-29 Bridgelux Inc Phosphor-converted led
JP2014212329A (en) * 2008-09-02 2014-11-13 ブリッジラックス インコーポレイテッド Phosphor-converted led
JP2016167626A (en) * 2008-09-02 2016-09-15 ブリッジラックス インコーポレイテッド Phosphor conversion led
CN102384405A (en) * 2010-08-27 2012-03-21 罗姆股份有限公司 LED light source unit for backlight of liquid crystal display, and liquid crystal display
CN102384405B (en) * 2010-08-27 2015-01-14 罗姆股份有限公司 LED light source unit for backlight of liquid crystal display, and liquid crystal display

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