JP7161132B2 - Light-emitting device manufacturing method and light-emitting device - Google Patents

Description

The present disclosure relates to a method for manufacturing a light emitting device and a light emitting device.

A light source device has been disclosed that includes an aggregate substrate having a plurality of partitions separated by partition walls, and a plurality of light emitting units that are provided in the plurality of partitions and emit light of different colors (see Patent Document 1).

JP 2013-183042 A

Provided are a method for manufacturing a light-emitting device and a light-emitting device that can efficiently manufacture a light-emitting device having a plurality of light-emitting portions.

A method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes an upper surface having a light-emitting portion, a lower surface opposite to the upper surface and having an external connection terminal, and a side surface between the upper surface and the lower surface. , a preparation step of preparing a plurality of light sources ranked by at least one of luminous flux and chromaticity; an extraction step of extracting a plurality of the light sources belonging to a desired rank from the plurality of the light sources; and a plurality of the extracted light sources. a joining step of joining the side surfaces to each other via the joining member such that the upper surface and the lower surface of the are exposed from the joining member and the external connection terminals are separated from the joining member.

A light emitting device according to an embodiment of the present disclosure includes a plurality of light sources and a joining member that joins the plurality of light sources, wherein the light sources include an upper surface having a light emitting portion and an external light source on the opposite side of the upper surface. and a side surface between the upper surface and the lower surface. The side surfaces are joined via the joining member so as to be separated from the member.

The present disclosure provides a method for manufacturing a light-emitting device and a light-emitting device including a plurality of light-emitting portions, which enables efficient manufacture of the light-emitting device.

1 is a perspective view schematically showing the configuration of a light emitting device according to a first embodiment; FIG. BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows typically the structure of the light-emitting device which concerns on 1st Embodiment. FIG. 1B is a cross-sectional view along the IC-IC line of FIG. 1B; FIG. 1B is a cross-sectional view along the ID-ID line of FIG. 1B; It is a bottom view showing typically the composition of the light-emitting device concerning a 1st embodiment. It is a mimetic diagram showing an example of a light-emitting device concerning a 1st embodiment. 4 is a flow chart of a method for manufacturing a light emitting device according to the first embodiment; 4A to 4C are cross-sectional views schematically showing the method for manufacturing the light emitting device according to the first embodiment; 4A to 4C are cross-sectional views schematically showing the method for manufacturing the light emitting device according to the first embodiment; 4A to 4C are cross-sectional views schematically showing the method for manufacturing the light emitting device according to the first embodiment; 4A to 4C are cross-sectional views schematically showing the method for manufacturing the light emitting device according to the first embodiment; 4A to 4C are cross-sectional views schematically showing the method for manufacturing the light emitting device according to the first embodiment; 4A to 4C are cross-sectional views schematically showing the method for manufacturing the light emitting device according to the first embodiment; 4A to 4C are cross-sectional views schematically showing the method for manufacturing the light emitting device according to the first embodiment; FIG. 4 is a plan view schematically showing a light emitting device according to a second embodiment; It is sectional drawing in IVB-IVB of FIG. 4A. It is a 1931 CIE chromaticity diagram showing the chromaticity of the light emitting device according to the second embodiment. FIG. 10 is a schematic diagram schematically showing a lighting state of a light emitting device according to a second embodiment; FIG. 10 is a schematic diagram schematically showing a lighting state of a light emitting device according to a second embodiment; FIG. 10 is a schematic diagram schematically showing a lighting state of a light emitting device according to a second embodiment;

Embodiments are described below with reference to the drawings. However, the embodiments described below are intended to exemplify the method of manufacturing a light-emitting device and the light-emitting device for embodying the technical idea of the present embodiment, and are not limited to the following. In addition, unless there is a specific description, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present invention, but are merely examples. It's nothing more than Note that the sizes and positional relationships of members shown in each drawing may be exaggerated for clarity of explanation. As a cross-sectional view, an end view showing only a cut surface may be used. Further, the number of light-emitting elements shown in each figure is set as an example to facilitate understanding of the configuration. In the embodiments, unless otherwise specified, the term "covering" includes not only direct contact but also indirect covering, for example, via another member.

<<1st Embodiment>>
1A is a perspective view schematically showing the configuration of a light emitting device according to a first embodiment; FIG. 1B is a plan view schematically showing the configuration of the light emitting device according to the first embodiment; FIG. FIG. 1C is a cross-sectional view taken along line IC--IC of FIG. 1B. FIG. 1D is a cross-sectional view along the ID-ID line in FIG. 1B. FIG. 1E is a bottom view schematically showing the configuration of the light emitting device. FIG. 1F is a schematic diagram showing combinations of ranked light sources.

[Light emitting device]
The light emitting device 200 includes a plurality of light sources 100 and a bonding member 60 that bonds the plurality of light sources 100 together. The light source 100 includes a top surface 101 having a light emitting part 110 , a bottom surface 102 opposite to the top surface 101 and having external connection terminals 3 , and a side surface 103 between the top surface 101 and the bottom surface 102 . The light source 100 has, for example, a substantially rectangular parallelepiped shape. The side surfaces 103 of the plurality of light sources 100 are joined via the joining member 60 so that the upper surface 101 and the lower surface 102 of the light sources 100 are exposed from the joining member 60 and the external connection terminals 3 are separated from the joining member. Thus, one light emitting device 200 is constructed. Here, as the light emitting device 200, three light sources 100 of the same emission color are joined side to side so that the light emitting sections 110 are arranged in one row and three columns.

In addition, the plurality of light sources 100 included in the light emitting device 200 may be light sources of the same emission color, or may be light sources of different emission colors. For example, in the case of combining light sources with the same emission color, by selecting and combining light sources with closer chromaticity ranks, it is possible to suppress color variations among the plurality of light emitting units provided in the light emitting device. By combining different emission colors, a light-emitting device capable of emitting multicolor light can be obtained.

(light source)
The light source 100 has a substantially rectangular parallelepiped shape, has a light emitting part on the upper surface, and has an external connection terminal 3 for external connection on the lower surface. The light source 100 includes a substrate 10, a light emitting element placed on the substrate 10, a translucent member 30 that covers the light emitting element, and a covering member 50 that exposes the upper surface of the translucent member and covers the side surfaces. , provided. The upper surface of the translucent member 30 exposed from the covering member 50 constitutes the light emitting portion of the light source 100 and emits light from the light emitting element to the outside. The covering member 50 forms part of the upper surface and at least part of the outer surface of the light source.

(substrate)
The substrate 10 is a member on which the light emitting element 20 is placed. The substrate 10 has, for example, a substantially rectangular shape in plan view. The substrate 10 may have a flat plate shape, or may have a concave portion for housing the light emitting element 20 on the top surface.
The substrate 10 includes a plurality of wirings functioning as electrodes of the light source and an insulating base material. The substrate 10 may be, for example, a ceramic substrate having a wiring layer, or a resin package in which lead electrodes and resin are integrally formed.

As the base material, PPA (polyphthalamide), PPS (polyphenylene sulfide), thermoplastic resin such as liquid crystal polymer, epoxy resin, silicone resin, modified epoxy resin, modified silicone resin, urethane resin, or phenol resin A thermosetting resin such as can be used. When ceramics are used for the base material, it is preferable to use aluminum oxide, aluminum nitride, mullite, silicon carbide, silicon nitride, or the like.
Examples of wiring include metals such as Fe, Cu, Ni, Al, Ag, Au, Pt, Ti, W, and Pd, and alloys containing at least one of these. Also, the wiring can have a plating layer on its surface. For the plating layer, for example, Au, Ag, Cu, Pt, or an alloy containing one of these can be used.

The wiring is arranged on the upper surface of the substrate and connected to the light emitting element 20, the upper surface wiring 2 is arranged on the lower surface opposite to the upper surface, the external connection terminal 3 is arranged to be electrically connected to the external power supply, and the upper surface wiring 2. and internal layer wirings for electrically connecting the external connection terminals 3 to each other. The inner layer wiring includes, for example, vias 4 penetrating through the base material.

(light-emitting element, protective element)
A light-emitting diode is preferably used as the light-emitting element 20 . The shape, size, etc. of the light emitting element 20 can be selected arbitrarily. A light-emitting element 20 having an arbitrary wavelength can be selected. For example, as the blue and green light emitting elements 20, nitride semiconductors (In _X Al _Y Ga _1-XY N, 0≦X, 0≦Y, X+Y≦1), ZnSe, GaP, etc. are used. can be used. As the red light emitting element 20, GaAlAs, AlInGaP, etc. can be used in addition to the nitride-based semiconductor element. When the light-emitting element is used in combination with the wavelength conversion member, it is preferable to use a light-emitting element made of a nitride semiconductor capable of emitting short wavelength light that can efficiently excite the wavelength conversion member.
The light-emitting device 20 includes a semiconductor layer on a translucent supporting substrate such as a sapphire substrate for growth, for example. Also, the light emitting element 20 may not have a support substrate.

The light emitting device 20 has positive and negative device electrodes. The positive and negative element electrodes may be arranged on the same surface side, or may be arranged on different surface sides. The light-emitting element 20 having a desired electrode arrangement can be appropriately selected depending on the form of the substrate used for the light source. The light emitting element 20 is electrically connected to wiring on the upper surface of the substrate by a conductive connecting member 8 . Examples of the conductive connection member 8 include eutectic solder, conductive paste, sintered metal, bumps, and wires.

Protective element 25 is, for example, a Zener diode. The protective element 25 has, for example, positive and negative electrodes on one surface, and is mounted on the wiring on the upper surface of the substrate 10 by a conductive connection member. Note that the light source 100 may not include the protective element 25 .

(translucent member)
The translucent member 30 is a member that covers the light emitting element 20 and transmits the light emitted from the light emitting element 20 to emit it to the outside. The upper surface of the translucent member 30 is exposed from the covering member 50 on the upper surface of the light source 100 and constitutes the light emitting portion of the light source. The translucent member 30 transmits 60% or more of the light from the light emitting element 20 and/or the light obtained by converting the wavelength of the light from the light emitting element 20 (for example, light in the wavelength range of 320 nm to 850 nm). and preferably transmit 70% or more of the light. Such members include, for example, glass, ceramics, inorganic materials such as sapphire, silicone resins, modified silicone resins, epoxy resins, modified epoxy resins, acrylic resins, phenolic resins, and resins or hybrid resins containing one or more of fluorine resins. Organic materials such as resins can be used.

The translucent member 30 may contain a phosphor capable of wavelength-converting at least part of the light incident on the translucent member 30 . The phosphor-containing translucent member 30 includes, for example, the material described above containing phosphor powder, a phosphor sintered body, and the like. The translucent member 30 may be formed by forming a phosphor layer such as a phosphor-containing resin layer or a phosphor-containing glass layer on the surface of a molding made of resin, glass, ceramic, or the like. Moreover, the translucent member 30 may contain a filler such as a diffusing material, depending on the purpose. When the light-transmitting member 30 contains a filler such as a diffusing material, the light-transmitting member 30 may be made of the above-described material containing the filler, or may be made of resin, glass, ceramic, or the like. A diffusion layer such as a resin layer containing a filler or a glass layer containing a filler may be provided.

As the phosphor, one known in the art can be used. For example, phosphors emitting green light include yttrium _- aluminum-garnet-based phosphors (e.g., Y3(Al, Ga) _5O12 :Ce), lutetium-aluminum-garnet-based phosphors (e.g., _{Lu3 (} Al, Ga ) ₅ O ₁₂ :Ce), terbium-aluminum-garnet-based phosphors (e.g. Tb ₃ (Al, Ga) ₅ O ₁₂ :Ce), silicate-based phosphors (e.g. (Ba, Sr) ₂ SiO ₄ :Eu), Chlorosilicate-based phosphors (eg, Ca ₈ Mg(SiO ₄ ) _{4 Cl2} :Eu), β-sialon-based phosphors (eg, Si _6-z Al _z O _z N _8-z : Eu (0<z<4.2 )), SGS-based phosphors (for example, SrGa ₂ S ₄ :Eu), and the like.

As a phosphor that emits yellow light, an α-sialon phosphor (for example, Mz(Si, Al) ₁₂
(O, N) ₁₆ (where 0<z≦2, and M is a lanthanide element other than Li, Mg, Ca, Y, and La and Ce). In addition, among the phosphors that emit green light, there is also a phosphor that emits yellow light. Further, for example, the yttrium-aluminum-garnet-based phosphor can shift the emission peak wavelength to the long wavelength side by substituting part of Y with Gd, and can emit yellow light. Among these, there are also fluorescent materials capable of emitting orange light.
Examples of phosphors that emit red light include nitrogen-containing calcium aluminosilicate (CASN or SCASN) phosphors (eg (Sr, Ca)AlSiN ₃ :Eu), BSESN phosphors (eg (Ba, Sr, Ca) ₂ Si ₅ N ₈ :Eu) and the like. In addition, a manganese-activated fluoride-based phosphor (a phosphor represented by the general formula (I) A ₂ [M _{1-a Mna} F ₆ ] (wherein in the above general formula (I), A is K, is at least one element selected from the group consisting of Li, Na, Rb, Cs and NH4, M is at least one element selected from the group consisting of Group ₄ elements and Group 14 elements, and a is 0< satisfies a<0.2)). Examples of this manganese-activated fluoride-based phosphor include a KSF-based phosphor (eg, K ₂ SiF ₆ :Mn), a KSAF-based phosphor (eg, K ₂ Si _0.99 Al _0.01 F _5.99 : Mn ) and MGF-based phosphors (eg, 3.5MgO·0.5MgF ₂ ·GeO ₂ :Mn).
The KSAF-based phosphor may have a composition represented by the following formula (I).
_{M2 [ SipAlqMnrFs ] (} I)
In formula (I), M represents an alkali metal and may contain at least K. Mn may be a tetravalent Mn ion. p, q, r and s may satisfy 0.9≤p+q+r≤1.1, 0<q≤0.1, 0<r≤0.2, 5.9≤s≤6.1. Preferably, 0.95≦p+q+r≦1.05 or 0.97≦p+q+r≦1.03, 0<q≦0.03, 0.002≦q≦0.02 or 0.003≦q≦0.015 , 0.005≦r≦0.15, 0.01≦r≦0.12 or 0.015≦r≦0.1, 5.92≦s≦6.05 or 5.95≦s≦6.025 can be For example, _{K2 [ Si0.946Al0.005Mn0.049F5.995 ]} , _{K2 [ Si0.942Al0.008Mn0.050F5.992 ]} , _{K2 [ Si0 . 939} Al _0.014 Mn _0.047 F _5.986 ]. With such a KSAF-based phosphor, it is possible to obtain red light emission with high brightness and a narrow half-value width of the emission peak wavelength.

As the diffusing material, those known in the art can be used. For example, barium titanate, titanium oxide, aluminum oxide, silicon oxide and the like can be used.
Further, when a resin is used as a binder for the phosphor and the diffusing material, examples of the resin include the resin used for the translucent member 30 described above.

(light guide member)
The light source may have a light guide member 40 between the translucent member 30 and the light emitting element 20 .
The light guide member 40 is, for example, a member that joins the light emitting element 20 and the plate-like or sheet-like translucent member 30 . Since the light guide member 40 is a member that guides the light from the light emitting element 20 to the translucent member 30, it is preferable to use a translucent material. The light guide member 40 may also be provided on the side surface of the light emitting element 20 .
As the light guide member 40, for example, translucent resin can be used. For example, the resin used for the translucent member 30 described above may be used. The light guide member 40 may contain the phosphor and/or diffusion material described above.

(coating member)
The covering member 50 exposes the upper surface of the translucent member 30 and covers the side surfaces thereof. Moreover, the covering member 50 is provided on the flat substrate 10 and covers the side surface of the light emitting element 20 and the side surface of the translucent member 30 . When the side surface of the light emitting element 20 is covered with the light guide member 40 or the translucent member 30, the covering member covers the side surface of the light emitting element 20 through these members.

Resin, for example, can be used as the covering member 50 . The resin used for the covering member 50 includes the resin used for the translucent member 30 described above.
The covering member 50 may contain a filler such as a light-reflecting substance in the resin described above. As a result, it is possible to function as a light reflecting member for reflecting the light from the light emitting element and efficiently emitting it upward.
Examples of light reflecting substances include titanium oxide, silicon oxide, aluminum oxide, zirconium oxide, magnesium oxide, potassium titanate, zinc oxide, silicon nitride, and boron nitride. Among them, it is preferable to use titanium oxide, which has a relatively high refractive index, from the viewpoint of light reflection. The light-reflecting substance can be used, for example, at a ratio of 20% by weight to 80% by weight or less with respect to the weight of the resin.
Also, the covering member may be formed integrally with the substrate. For example, when using a substrate having a recess for housing the light emitting element 20 on the top surface, the covering member may be a side wall of the recess integrally formed with the substrate.
The width of the covering member 50 covering the side surface of the light-transmitting member 30 (that is, the distance from the side surface of the light-transmitting member 30 to the outer surface of the light source in contact with the bonding member 60) in the light source arrangement direction is the width in the horizontal direction. From the viewpoint of suppressing light leakage and miniaturizing the light source, the thickness is preferably 30 μm or more and 300 μm or less, more preferably 50 μm or more and 200 μm or less.

(joining member)
The joining member 60 is a member that joins the plurality of light sources 100 together. The joining member 60 is arranged between opposing sides of adjacent light sources 100 . The joining member 60 joins the side surfaces 103 of the adjacent light sources 100 so that the upper surface 101 and the lower surface 102 of the light source 100 are exposed and separated from the external connection terminals 3 . That is, in the light emitting device 200, the plurality of light sources 100 have the upper surface having the light emitting portion of the light source and the lower surface having the external connection terminal exposed from the bonding member, and the side surfaces are bonded to each other via the bonding member.

The joining member 60 is arranged between adjacent light sources. The bonding member 60 preferably uses a member having a lower light transmittance than the covering member 50 in order to suppress light interference between adjacent light sources. At this time, it is more preferable that the joining member 60 covers substantially all of the opposing side surfaces between the light sources.
As the bonding member 60, for example, a resin containing a filler having a light shielding property can be used. Examples of the resin include those exemplified as the resin used for the translucent member 30 . Light-shielding fillers include fillers such as light-absorbing substances and light-reflecting substances. Examples of the light-reflecting substance include those exemplified as the light-reflecting substance used for the covering member 50 . Examples of light absorbing substances include black pigments such as carbon black and graphite. Also, a pigment other than black or a dye may be added. For example, a gray resin added with black and white pigments may be used. Among them, it is preferable to use a black resin or a gray resin. By providing the bonding member 60 made of black resin or gray resin between the light sources 100, interference of the light from the light source 100 to the adjacent light source 100 can be suppressed. Therefore, it is possible to provide a light-emitting device with a high contrast between light-emitting regions and non-light-emitting regions when individually lit, and with good "clearance".
The bonding member 60 arranged between the light sources is preferably arranged so that the top surface of the bonding member 60 is flush with the top surfaces of the light sources in consideration of preventing the bonding member 60 from creeping up onto the top surface of the light sources. In consideration of the thermal expansion of the joining member, the upper surface of the joining member 60 may be arranged so that the surface is slightly concave.
In addition, the joint member 60 arranged between the light sources is preferably arranged such that the lower surface of the joint member is flush with the lower surface of the light source, in consideration of preventing the joint member from creeping up to the external connection terminal. . In consideration of the thermal expansion of the resin, the lower surface of the joining member 60 may be arranged so that the surface is slightly concave.
The recessed surface can utilize the shrinkage (shrinkage of the resin) that accompanies curing of the resin.
The width of the joint member 60 arranged between the light sources (that is, the distance between the adjacent light sources) is determined from the viewpoint of suppressing light interference between the light sources and suppressing the generation of dark lines between the light sources when the adjacent light sources are simultaneously lit. From the standpoint of ease of color mixing when light sources emitting different colors are combined, the thickness is preferably 1 μm or more and 200 μm or less, and more preferably 5 μm or more and 50 μm or less.

The light source 100 can be made into a light source having a light emitting portion emitting a desired color by adjusting the emission wavelength of the light emitting element, the combination of the wavelength conversion members contained in the translucent member, the compounding ratio, and the like. For example, a red light source includes a blue light emitting element 20 and a translucent member 30 containing a red phosphor. As the white light emitting unit, for example, one having a blue light emitting element 20 and a translucent member 30 containing a yellow phosphor can be used. Examples of the green light emitting unit include a green light emitting element 20 and a translucent member 30 containing a diffusing material. Alternatively, the green light emitting unit may include, for example, a blue light emitting element 20 and a translucent member 30 containing a green phosphor. As the blue light emitting unit, for example, one having a blue light emitting element 20 and a translucent member 30 containing a diffusing material can be used.
As will be described later, the plurality of light sources 100 included in the light emitting device 200 are obtained by extracting and combining light sources belonging to a desired rank from light sources ranked by at least one of luminous flux and chromaticity.

For example, the plurality of light sources 100 included in the light emitting device 200 is a combination of a plurality of light sources 100 extracted from a group of light sources having the same emission color, for example, the same chromaticity rank. Thereby, color unevenness of the light emitting device 200 can be suppressed.
Furthermore, at this time, light sources having the same chromaticity rank and different luminous flux ranks may be combined. For example, as the light source 100 arranged in the center, a light source having a higher luminous flux than the light sources 100 arranged in the periphery can be arranged. For example, as shown in FIG. 1F, one centrally-located light source 100 is higher than the peripherally-located light sources 100, and the peripherally-located light sources have the same luminous flux rank. is preferred. For example, the centrally located light source has a luminous flux value of 400-425 lumens and the peripherally located light source has a luminous flux value of 375-400 lumens. Such light emission characteristics are preferable because they can illuminate the central region of the irradiation range more brightly when used in vehicle lamps such as headlights. Also, the luminous flux rank of the light source to be extracted may be selected in consideration of the optical characteristics of the lens combined with the light emitting device.

[Method for manufacturing light-emitting device]
A method for manufacturing a light-emitting device will be described.
FIG. 2 is a flow chart of the method for manufacturing the light emitting device according to the first embodiment. 3A to 3G are cross-sectional views schematically showing the method for manufacturing the light emitting device according to the first embodiment.

The method for manufacturing the light emitting device 200 includes a top surface 101 having a light emitting portion 110, a bottom surface 102 opposite to the top surface 101, and a side surface 103 between the top surface 101 and the bottom surface 102, and at least one of luminous flux and chromaticity. A preparation step S104 of preparing a plurality of ranked light sources 100; an extraction step S105 of extracting a plurality of light sources 100 belonging to a desired rank from the plurality of light sources 100; and a joining step S106 in which the side surfaces 103 are joined to each other via the joining member 60 so that the sides 103 are exposed from the joining member 60 .

The method for manufacturing the light emitting device 200 includes, before the preparation step S104, an assembly preparation step S101 of preparing an assembly 150 of light sources having a plurality of light emitting units 110 on the upper surface, and dividing the assembly 150 between the light emitting units 110. and measuring at least one of the luminous flux and chromaticity of the light source 100 after the singulating step S102, and based on the measured value of at least one of the luminous flux and chromaticity and a classification step S103 for ranking the light sources 100 .
Note that the material, arrangement, etc. of each member are the same as those described in the description of the light emitting device 200 described above, so description thereof will be omitted as appropriate.

(Aggregate preparation process)
The aggregate preparation step S101 is a step of preparing an aggregate 150 having a plurality of light emitting units 110 on its upper surface as an aggregate 150 of light sources. Here, the aggregate 150 includes an aggregate substrate 11 which is an aggregate of the substrates 10 of the light source 100, a plurality of light emitting elements 20 arranged on the aggregate substrate 11, and a translucent member covering each of the plurality of light emitting elements. and a covering member that exposes the upper surface of the translucent member and covers the side surface thereof.

In this step S101, a collective substrate 11 including a plurality of mounting regions 12 on the upper surface on which the light emitting elements 20 are mounted is prepared. At least one light emitting element 20 is mounted on each of the plurality of mounting regions 12 . In addition, the collective substrate 11 has wiring on the upper surface and the lower surface opposite to the upper surface. Moreover, the protective element 25 may be mounted on each of the plurality of mounting regions 12 . Although FIG. 3A shows the collective substrate 11 including eight mounting regions 12 in the horizontal direction for convenience, the number of mounting regions 12 may be adjusted as appropriate.

Next, the translucent member 30 covering the light emitting elements 20 mounted on the respective mounting regions 12 is arranged. The translucent member 30 can be formed by potting, printing, spraying, or the like, for example. Alternatively, the translucent member 30 may be prepared in advance in a plate-like or sheet-like shape and arranged on the light emitting element 20 . Here, a plate-like light-transmitting member 30 is placed on the light-emitting element 20 having a light-guiding member arranged on the upper surface thereof, and the light-emitting element 20 and the light-transmitting member 30 are joined via the light-guiding member 40. .

Next, a resin containing a light-reflecting member is placed on the aggregate substrate 11 as the covering member 50 that covers the side surface of the translucent member 30 . The resin is arranged on the collective substrate 11 so that the upper surface of the translucent member 30 is exposed from the resin. In other words, the upper surface of the translucent member 30 is exposed from the covering member 50 and constitutes the light emitting portion. As a result, a light source aggregate 150 having a plurality of light emitting portions 110 on the upper surface is formed. The covering member 50 covers the side surfaces of the light emitting elements 20 , the light guide member 40 and the translucent member 30 and the upper surface of the aggregate substrate 11 . The covering member 50 may be arranged as an underfill in the gap between the light emitting element 20 and the collective substrate 11 . The covering member 50 can be formed by, for example, transfer molding, injection molding, compression molding, potting, printing or spraying. As the aggregate substrate 11, an aggregate substrate having a plurality of recesses on its upper surface is prepared, one or more light emitting elements are placed on the bottom of each recess, and the translucent member 30 covering the light emitting elements is placed in the recess. can be placed in

(Singulation process)
The singulation step S<b>102 is a step of obtaining a plurality of light sources 100 by dividing the assembly 150 of light sources among the light emitting units 110 . In this step S102, the covering member 50 and the collective substrate 11 are divided in the thickness direction between adjacent light emitting portions. Division can be performed, for example, by cutting using a blade or the like. As a result, a plurality of light sources 100 each having an upper surface 101 having a light emitting portion 110 , a lower surface 102 opposite to the upper surface 101 , and a side surface 103 between the upper surface 101 and the lower surface 102 can be obtained.

(Classification process)
The classification step S103 is a step of measuring the luminous flux and/or chromaticity of the light source 100 after the singulation step S102, and ranking the light sources 100 based on the measured values. Alternatively, in the classification step S103, the light sources prepared by purchase or the like may be ranked.
Classification by luminous flux is based on the value of the measured luminous flux (unit: lumen), for example, a light source 100H belonging to a high luminous flux ranking, a light source 100M belonging to an intermediate luminous flux ranking, and a light source 100L belonging to a low luminous flux ranking. It can be classified into three ranks. Note that the classification by ranking may be classified into two ranks or four or more ranks according to the desired optical characteristics of the light emitting device 200 and the layout of the light sources 100 .

Classification by chromaticity value is based on the XY chromaticity coordinates of the CIE 1931 chromaticity diagram, and can be classified into any set chromaticity range (for example, the range surrounded by a rectangle connecting four chromaticity coordinates). can.

(Preparation process)
The preparation step S104 is a step of preparing a plurality of light sources each having a top surface having a light emitting part, a bottom surface opposite to the top surface, and side surfaces between the top surface and the bottom surface, and which are ranked according to at least one of luminous flux and chromaticity. is. As for the light source, a light source ranked by at least one of luminous flux and chromaticity may be prepared by purchase or the like, or the light source 100 ranked by the classification step S103 may be prepared. For example, in the preparation step S104, the light source 100H, which is a white light source having the same chromaticity classification (ranking) and is classified into a rank with a higher luminous flux, and the light source 100L, which has a lower luminous flux than the rank to which the light source 100H belongs. , a light source 100M belonging to an intermediate rank between the rank to which the light source 100H belongs and the rank to which the light source 100L belongs.

(Extraction process)
The extraction step S105 is a step of extracting a plurality of light sources 100 belonging to a desired rank from the plurality of light sources 100 prepared in step S104. As for the rank of the light source to be extracted, a light source with a suitable rank is extracted so that the light emitting device 200 can obtain desired optical characteristics. For example, when manufacturing a light emitting device 200 in which a plurality of white light sources 100 are arranged, two kinds of ranks are extracted: a light source 100H belonging to a high luminous flux rank and a light source 100M belonging to an intermediate luminous flux rank. The extracted light sources 100 of the two ranks are arranged horizontally with the light source 100M whose luminous flux belongs to the middle rank so as to sandwich the light source 100H whose luminous flux belongs to the high rank.

FIG. 1F shows an example in which a plurality of light sources 100 are arranged in 1 row and 3 columns, and a light source with a high luminous flux is arranged in the center. There may be.

(Joining process)
The bonding step S106 is a step of bonding the side surfaces 103 to each other via the bonding member 60 so that the top surface 101 and the bottom surface 102 of the extracted and arranged light sources 100 are exposed from the bonding member 60 .
In the bonding step S106, the light sources 100 extracted in the extraction step S105 are placed on the support member, and an uncured bonding member is placed between the light sources 100 by, for example, potting or spraying, and cured to form the bonding member 60. Form. The joining member 60 joins the side surfaces of the light source 100, for example, the cut surfaces cut in the singulation step S102. By joining the cut surfaces, which tend to be rough surfaces, it is possible to enhance the adhesion to the joining member. Also, the joint member 60 is arranged apart from the external connection terminals 3 so as not to cover the external connection terminals 3 on the lower surface of the light source 100 . In the bonding step S106, the external connection terminals 3 may be covered with the bonding member 60, and then the excess bonding member 60 covering the external connection terminals 3 may be removed.
As the supporting member, a sheet member made of a heat-resistant resin sheet, a UV-curable sheet, or the like can be used. When a resin sheet is used as the support member, the joining step S106 may include a step of removing the sheet member from the lower surface of the joined light sources 100 after joining the light sources 100 with the joining member 60 .
In the singulation process described above, when the aggregate substrate is cut using, for example, a blade, the width of the joining member arranged between the opposing side surfaces of the light sources 100 (that is, the distance between the opposing side surfaces of the adjacent light sources 100) is By making it smaller than the cutting width of the blade, the light source 100 can be arranged closer. As a result, miniaturization of the obtained light emitting device can be realized.
<Second embodiment>

Next, a light emitting device according to a second embodiment will be described with reference to FIGS. 4A and 4B, FIG. 5, and FIGS. 6A and 6B. 4A is a plan view schematically showing a light emitting device according to a second embodiment, and FIG. 4B is a cross-sectional view taken along IVB-IVB in FIG. 4A.
The light emitting device 200T includes a plurality of (here, two) light sources 100T1 and 100T2, and a joining member 60T that joins the plurality of light sources 100T1 and 100T2. Each of the light sources 100T1 and 100T2 includes a top surface 101 having a light emitting portion 110, a bottom surface 102 opposite to the top surface 101, and a side surface 103 between the top surface 101 and the bottom surface 102. The light sources 100T1 and 100T2 have, for example, a substantially rectangular parallelepiped shape, and are formed so that four corners are curved inward. The plurality of light sources 100T1 and 100T2 constitute one light emitting device 200T by bonding the side surfaces 103 to each other via the bonding member 60T so that the upper surface 101 and the lower surface 102 of the light sources are exposed from the bonding member 60T. there is Here, as the light emitting device 200T, two light sources 100T1 and 100T2 with different emission colors are joined together at the opposing side surfaces 103 of the adjacent light sources so that the light emitting portions 110 are aligned in one direction.

The light emitting device 200T can be made into a light emitting device 200T capable of emitting multicolor light by combining light sources of different emission colors. In the preparation process, the light emitting device 200T prepares a plurality of light sources classified into chromaticity ranks with different emission colors, and in the extraction process, extracts a plurality of light sources belonging to the chromaticity rank of the desired emission color, and extracts the extracted light sources. It can be manufactured by bonding the side surfaces of the light source together. At this time, it is preferable that the plurality of light sources emitting different colors have substantially the same outer shape.

The light sources 100T1 and 100T2 have the light emitting element 20 and the protection element 25 placed in recesses of a substrate 10T having a recess on the upper surface thereof. The substrate 10T is, for example, a ceramic substrate. A known substrate such as a ceramic substrate or a resin package can be used as the substrate 10T having the concave portion.
The light emitting element 20 and the protection element 25 are electrically connected to wiring provided on the substrate 10T by conductive members such as wires.

The translucent member 30T is a member that covers the light emitting element 20 and the protective element 25 and transmits the light emitted from the light emitting element 20 to emit the light to the outside. The translucent member 30T configures the light emitting portions of the light sources 100T1 and 100T2. A member similar to the translucent member 30 already described can be used for the translucent member 30T. Further, the translucent member 30T can contain a phosphor capable of wavelength-converting at least part of the light incident on the translucent member 30 .

The light emitting device 200T includes two light sources 100T1 and 100T2 with different chromaticities. One light source 100T1 of the light emitting device 200T1 emits red light. Specifically, the light source 100T1 has a first point whose chromaticity coordinates (x, y) are (0.669, 0.331) and (0.652 , 0.331), the third point is (0.688, 0.296), and the fourth point is (0.707, 0.294), the first and second points are Enclosed by the first straight line that connects, the second straight line that connects the second and third points, the third straight line that connects the third and fourth points, and the curve of the chromaticity diagram that connects the fourth and first points emits light in the chromaticity range Red. The light source 100T1 can emit red light by using a blue light emitting element as the light emitting element 20 and combining the blue light emitting element with a phosphor that emits red light when excited by the blue light of the light emitting element.

The other light source 100T2 of the light emitting device 200T emits blue-green (turquoise) light. Specifically, in the CIE 1931 chromaticity diagram, the first point whose chromaticity coordinates (x, y) are (0.012, 0.495) as shown in FIG. ), the third point (0.200, 0.320), and the fourth point (0.040, 0.320), the first straight line connecting the first and second points and , the second straight line connecting the second and third points, the third straight line connecting the third and fourth points, and the curve of the chromaticity diagram connecting the fourth and first points Emits the light contained in Turquoise. The light source 100T2 can emit blue-green light by using a blue-green light-emitting element as the light-emitting element 20, for example. Further, in order to adjust the chromaticity, phosphors that are excited by the light from the light emitting element 20 and have emission peak wavelengths in the wavelength ranges of green, yellowish green, yellow, orange and red may be used in combination.

The joining member 60T is arranged between the opposing side surfaces of the adjacent light sources 100T1 and 100T2, and joins the side surfaces 103 of the adjacent light sources 100T1 and 100T2 together so that the upper surface 101 and the lower surface 102 of each of the light sources 100T1 and 100T2 are exposed. are joined. As the joining member 60T used here, the same member as the joining member 60 already described can be used. Further, when the translucent member 30T contains a phosphor, it is preferable to use a light-blocking resin for the joining member 60T. A black or gray resin containing a black pigment can be used as the light-shielding resin. As a result, it is possible to suppress excitation of the fluorescent material of the adjacent light source by leakage light from one light source. In addition, the light emitting device can be made to have a high contrast between the light emitting region and the non-light emitting region when individually lit, and to have a good “parting property”.

The light emitting device 200T configured in this way will be described with reference to FIGS. 5 and 6A to 6C. Note that FIGS. 6A to 6C are described assuming that the light source on the side where the mesh-like diagonal lines are written is turned on.
As shown in FIGS. 6A to 6C, the light emitting unit 300 will be described as a configuration in which, for example, the light emitting device 200T shown in FIG. 4 is used in pairs as a first light emitting device 200T1 and a second light emitting device 200T2. The light-emitting unit 300 can be used as a vehicle lamp for automobiles, railroad vehicles, and the like, for example. In this case, the light-emitting unit 300 is preferably configured by arranging the light-emitting device 200T shown in FIG. 4 as the first light-emitting device 200T1 and the second light-emitting device 200T2 in left-right point symmetry.

The light emitting unit 300 emits red light when the first light sources 100T1 of the first light emitting device 200T1 and the second light emitting device 200T2 are turned on. In addition, the light emitting unit 300 emits blue-green light when the second light sources 100T2 of the first light emitting device 200T1 and the second light emitting device 200T2 are turned on. Further, the light-emitting unit 300 simultaneously turns on the first light source 100T1 and the second light source 100T2 of the first light-emitting device 200T1 and the second light-emitting device 200T2, thereby emitting white light by mixing red and blue-green light. can do.

For example, as shown in FIG. 5, a straight line passing through the chromaticity point R of the first light source emitting light included in the chromaticity range Red and the chromaticity point T of the second light source emitting light included in the chromaticity range Turquoise However, the chromaticity ranks of the light sources extracted as the first light source and the second light source are determined so as to pass through the chromaticity range White of white light in the XY chromaticity diagram. The chromaticity range White of white light is defined by, for example, a first point whose chromaticity coordinates (x, y) are (0.321, 0.306), a second point whose chromaticity coordinates (x, y) are (0.314, 0.338), For the third point (0.346, 0.367) and the fourth point (0.348, 0.341), the first straight line connecting the first point and the second point, the second point and the third point It is a range surrounded by a second straight line connecting the points, a third straight line connecting the third and fourth points, and a fourth straight line connecting the fourth and first points.

A vehicle lamp using the light-emitting unit 300 can be used, for example, as an automatic driving display lamp that notifies the surroundings that the vehicle is automatically driving by emitting blue-green light, as a tail lamp by emitting red light, and as a reverse light by emitting white light. (reverse lamp).

Also, the light-emitting unit may be a light-emitting device using light sources of other combinations of colors. For example, the first light source emits orange (amber) light. Specifically, in the CIE 1931 chromaticity diagram, the first point whose chromaticity coordinates (x, y) are (0.562, 0.438) as shown in FIG. ), the third point (0.576, 0.407), and the fourth point (0.589, 0.411), the first straight line connecting the first and second points and , the second straight line connecting the second and third points, the third straight line connecting the third and fourth points, and the curve of the chromaticity diagram connecting the fourth and first points Emit the light contained in Amber. The second light source emits light with an emission color of light blue.

Specifically, as shown in FIG. 5, the first point whose chromaticity coordinates (x, y) are (0.050, 0.275), the second point whose chromaticity coordinates are (0.100, 0.290), For the third point (0.120, 0.220) and the fourth point (0.069, 0.200), the first straight line connecting the first point and the second point, the second point and the third point Emit light included in the chromaticity range Lightblue surrounded by the second straight line connecting the points, the third straight line connecting the third and fourth points, and the curve of the chromaticity diagram connecting the fourth and first points . At this time, the light emitting unit emits orange light by turning on the first light sources of the first light emitting device and the second light emitting device. Also, the light-emitting unit emits light blue light by turning on the second light sources of the first light-emitting device and the second light-emitting device. Furthermore, the light-emitting unit can irradiate white light as a mixture of orange and light blue by turning on the first light source and the second light source of the first light-emitting device and the second light-emitting device at the same time. can.
For example, light blue light emission can function as a lamp for indicating the state of charge of the vehicle, orange light emission can function as a turn lamp, and white light emission can function as a day running lamp (DRL).

As described above, in the light emitting unit, light sources having chromaticity ranks such that a straight line passing through the chromaticity coordinates of the two light sources provided in the light emitting device passes through the chromaticity range of white in the chromaticity diagram are used in combination. can be done. This makes it possible to irradiate white light and two types of colored light from one lens of the light-emitting unit, thereby making it possible to reduce space and improve design.
In the light-emitting device, a plurality of light sources are arranged via a bonding member, thereby making it difficult to be affected by light caused by lighting and extinguishing of adjacent light sources, and making the brightness of each light source clear.
In the light emitting device, when a plurality of light sources are used, two, three, or four or more light sources are aligned in a straight line direction and adjacent light sources are joined via a joining member. For example, the light sources may be arranged in two rows and two columns. In particular, the variation of colors can be increased by configuring the light-emitting elements used in the light source with different luminous flux ranks so that they can be turned on and off independently.
The method for manufacturing the light-emitting unit is the same as the method for manufacturing the light-emitting device of the first embodiment, except that a plurality of light-emitting device aggregates and light-emitting devices with the same or different emission colors are used. omitted.

2 Top Wiring 3 External Connection Terminal 4 Via 8 Conductive Connection Member 10 Substrate 11 Collective Substrate 12 Placement Area 20 Light Emitting Element 25 Protective Element 30 Translucent Member 40 Light Guide Member 50 Covering Member 60 Joining Member 80 Module Substrate 100, 100H , 100M light source 100T1 first light source 100T2 second light source 100A blue light source 100B red light source 110, 110A, 110B, 100C light emitting units 200, 200T light emitting device 200T1 first light emitting device 200T2 second light emitting device 300 light emitting unit S1 assembly preparation step S2 Singulation step S3 Classification step S4 Preparation step S5 Extraction step S6 Joining step

Claims (10)

A light source comprising an upper surface having a light-emitting portion, a lower surface opposite to the upper surface and having an external connection terminal, and a side surface between the upper surface and the lower surface, wherein the light source is ranked according to at least one of luminous flux and chromaticity. a preparation step of preparing a plurality of
an extracting step of extracting a plurality of the light sources belonging to a desired rank from the plurality of light sources;
The extracted plurality of light sources are arranged on a support member, and the upper surface and the lower surface of the extracted plurality of light sources are exposed from the joint member, and the external connection terminals are separated from the joint member. A method of manufacturing a light-emitting device, comprising: joining the side surfaces to each other via the joining member; and removing the support member from the joined light sources. Before the preparation step,
an assembly preparation step of preparing an assembly of light sources having a plurality of light emitting parts on the upper surface;
a singulation step of obtaining a plurality of the light sources by dividing the assembly between the light emitting units;
and a classification step of measuring at least one of luminous flux and chromaticity of the light source after the singulation step, and ranking the light sources based on at least one of the measured luminous flux and chromaticity. 2. The method for manufacturing the light-emitting device according to 1. 3. The method of manufacturing a light-emitting device according to claim 2, wherein in the joining step, the cut surfaces cut in the singulation step are joined so as to face each other. In the bonding step,
4. The method of manufacturing a light emitting device according to claim 1, wherein the joining member covers all side surfaces of the plurality of light sources. 5. The method of manufacturing a light-emitting device according to claim 1, wherein in the joining step, the joining member joins light sources emitting light of different colors. 5. The method of manufacturing a light-emitting device according to claim 1, wherein in the joining step, the joining member joins light sources emitting light of the same color. 7. The method of manufacturing a light-emitting device according to claim 1, wherein in the joining step, the light-emitting portions of the plurality of light sources are arranged in a matrix. The light source includes a substrate, a light-emitting element placed on the substrate, a light-transmitting member covering the light-emitting element, a covering member exposing the top surface of the light-transmitting member and covering the side surface of the light-transmitting member, The method for manufacturing a light-emitting device according to any one of claims 1 to 7, comprising: 9. The method of manufacturing a light-emitting device according to claim 8, wherein the substrate is a ceramic substrate. 10. The method of manufacturing a light-emitting device according to claim 8, wherein the joining member uses a material having a lower light transmittance than the covering member.

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