CN113508463A

CN113508463A - Method for manufacturing light-emitting device, method for manufacturing light-emitting module, light-emitting device, and light-emitting module

Info

Publication number: CN113508463A
Application number: CN202080016646.2A
Authority: CN
Inventors: 石井贵士; 若松大; 荫山弘明
Original assignee: Nichia Corp
Current assignee: Nichia Corp
Priority date: 2019-07-04
Filing date: 2020-06-09
Publication date: 2021-10-15
Also published as: JP2021013003A; JP7037078B2

Abstract

Provided are a method for manufacturing a light-emitting device and a light-emitting module having narrow light-emitting surfaces, and a light-emitting device and a light-emitting module. A method for manufacturing a light-emitting device (100) comprises the steps of: a step of preparing a plurality of first element structures (15), wherein the first element structures (15) are provided with a sub-mounting substrate (10), a light-emitting element (20) and a light-transmitting member (30) in this order; a step of placing the plurality of first element structures (15) so that the sub-mount board (10) faces the sheet member; and forming a first covering member (40) on the sheet member, the first covering member covering the side surfaces of the first element structures (15).

Description

Method for manufacturing light-emitting device, method for manufacturing light-emitting module, light-emitting device, and light-emitting module

Technical Field

The present disclosure relates to a method for manufacturing a light-emitting device and a method for manufacturing a light-emitting module, and a light-emitting device and a light-emitting module.

Background

Conventionally, a light emitting device having a plurality of light emitting surfaces is known. For example, patent document 1 discloses a light-emitting device including: a plurality of light emitting elements; a light transmissive member covering an upper surface of the light emitting element; and a light reflective member integrally covering side surfaces of the plurality of light emitting elements.

Patent document 1: japanese patent laid-open publication No. 2016-

There is room for further improvement in the structure of the light-emitting device in which a plurality of light-emitting surfaces are arranged at high density.

An object of an embodiment of the present disclosure is to provide a method for manufacturing a light-emitting device and a method for manufacturing a light-emitting module having narrow light-emitting surfaces, and a light-emitting device and a light-emitting module.

Disclosure of Invention

The method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes: preparing a plurality of first element structures, each of which includes a submount substrate, a light-emitting element, and a light-transmissive member in this order; a step of mounting the plurality of first element structures so that the sub-mount substrate faces the sheet member; and forming a first covering member on the sheet member, the first covering member covering a side surface of each of the first element structures.

The method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes: preparing a plurality of first element structures, each of which includes a submount substrate, a light-emitting element, and a light-transmissive member in this order; a step of mounting the plurality of first element structures so that the sub-mount substrate faces the sheet member; forming a second covering member on the sheet member, the second covering member covering a side surface of each of the sub-mount boards; and forming a first covering member on the second covering member, the first covering member covering a side surface of each of the light emitting elements and a side surface of each of the light transmissive members, and the first covering member having a higher light reflectance with respect to light from the light emitting elements than the second covering member.

The method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes: preparing a plurality of second element structures, each of which includes a submount substrate and a light-emitting element in this order; a step of mounting the plurality of second element structures so that the sub-mount board and the sheet member face each other; a step of disposing a light-transmissive member on each of the light-emitting elements after the plurality of second element structures are mounted on the sheet member; and forming a first covering member on the sheet member, the first covering member covering a side surface of each of the second element structures and a side surface of each of the light transmissive members.

The method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes: preparing a plurality of second element structures, each of which includes a submount substrate and a light-emitting element in this order; a step of mounting the plurality of second element structures so that the sub-mount board and the sheet member face each other; a step of disposing a light-transmissive member on each of the light-emitting elements after the plurality of second element structures are mounted on the sheet member; forming a second covering member on the sheet member, the second covering member covering a side surface of each of the sub-mount boards; and forming a first covering member on the second covering member, the first covering member covering a side surface of each of the light emitting elements and a side surface of each of the light transmissive members, and the first covering member having a higher light reflectance with respect to light from the light emitting elements than the second covering member.

The method for manufacturing a light emitting module according to an embodiment of the present disclosure includes the steps of: preparing a light-emitting device by using the method for manufacturing a light-emitting device described above; and a step of mounting the light-emitting device so that the submount substrate and the module substrate face each other.

The method for manufacturing a light emitting module according to an embodiment of the present disclosure includes the steps of: preparing a plurality of first element structures, each of which includes a submount substrate, a light-emitting element, and a light-transmissive member in this order; a step of mounting the plurality of first element structures so that the sub-mount substrate and the module substrate face each other; forming a frame body surrounding the plurality of first element structures on the module substrate; and forming a first covering member in the housing, the first covering member covering a side surface of each of the first element structures.

A light-emitting device according to an embodiment of the present disclosure includes: a plurality of first element structures which are provided with a sub-mount substrate, a light-emitting element, and a light-transmissive member in this order; and a first covering member that covers a side surface of each of the first element structures to hold the plurality of first element structures.

A light-emitting device according to an embodiment of the present disclosure includes: a plurality of first element structures which are provided with a sub-mount substrate, a light-emitting element, and a light-transmissive member in this order; a second covering member that covers a side surface of each of the sub-mount boards to hold the plurality of first element structures; and a first covering member that covers a side surface of each of the light emitting elements and a side surface of each of the light transmissive members, holds the plurality of first element structures, and has a higher light reflectance with respect to light from the light emitting elements than the second covering member.

The light-emitting module according to an embodiment of the present disclosure includes: the light-emitting device described above; and a module substrate on which the light emitting device is mounted so as to face the submount substrate.

The method for manufacturing a light-emitting device according to the embodiment of the present disclosure can manufacture a light-emitting device having a narrow light-emitting surface.

The method for manufacturing a light-emitting module according to the embodiment of the present disclosure can manufacture a light-emitting module having a narrow light-emitting surface.

The light-emitting device according to the embodiment of the present disclosure can narrow the interval between the light-emitting surfaces.

The light emitting module of the embodiment of the present disclosure can make the light emitting surfaces narrower.

Drawings

Fig. 1A is a perspective view schematically showing the structure of a light-emitting module including the light-emitting device according to the first embodiment.

Fig. 1B is a plan view schematically showing the structure of a light-emitting module including the light-emitting device according to the first embodiment.

FIG. 1C is a cross-sectional view of the IC-IC line of FIG. 1B.

FIG. 1D is a cross-sectional view of the ID-ID line of FIG. 1B.

Fig. 1E is a cross-sectional view schematically showing the structure of the light-emitting device of the first embodiment.

Fig. 1F is a bottom view schematically showing the structure of the light-emitting device of the first embodiment.

Fig. 2 is a flowchart of a method for manufacturing the light-emitting device of the first embodiment.

Fig. 3 is a flowchart of a method of manufacturing the light emitting module of the first embodiment.

Fig. 4A is a cross-sectional view showing a step of mounting a light-emitting element in the first element structure preparing step of the method of manufacturing a light-emitting device according to the first embodiment.

Fig. 4B is a cross-sectional view showing a step of providing a light transmissive member in the first element structure preparing step of the method for manufacturing a light emitting device according to the first embodiment.

Fig. 4C is a cross-sectional view showing a step of fabricating a first element structure in the first element structure preparing step in the method of manufacturing a light-emitting device according to the first embodiment.

Fig. 4D is a cross-sectional view showing a step of forming a housing in the method of manufacturing the light-emitting device according to the first embodiment.

Fig. 4E is a cross-sectional view showing a step of mounting the first element structure in the method of manufacturing the light-emitting device according to the first embodiment.

Fig. 4F is a cross-sectional view showing a step of forming the first cover member in the method of manufacturing the light-emitting device according to the first embodiment.

Fig. 4G is a cross-sectional view showing a step of removing the sheet member in the method of manufacturing the light-emitting device according to the first embodiment.

Fig. 4H is a cross-sectional view showing a step of mounting a light-emitting device in the method of manufacturing a light-emitting module according to the first embodiment.

Fig. 4I is a plan view showing a step of mounting the first element structure in the method of manufacturing the light-emitting device according to the first embodiment.

Fig. 4J is a plan view showing a step of forming the first cover member in the method of manufacturing the light-emitting device according to the first embodiment.

Fig. 4K is a plan view showing a step of mounting a light emitting device in the method of manufacturing a light emitting module according to the first embodiment.

Fig. 5A is a plan view schematically showing the structure of a light-emitting module including the light-emitting device of the second embodiment.

Fig. 5B is a cross-sectional view taken along line VB-VB of fig. 5A.

Fig. 5C is a sectional view schematically showing the structure of the light-emitting device of the second embodiment.

Fig. 6 is a flowchart of a method for manufacturing a light-emitting device according to a second embodiment.

Fig. 7A is a cross-sectional view showing a step of forming a second cover member in the method of manufacturing a light-emitting device according to the second embodiment.

Fig. 7B is a cross-sectional view showing a step of forming the first cover member in the method of manufacturing the light-emitting device according to the second embodiment.

Fig. 7C is a cross-sectional view showing a step of removing the sheet member in the method of manufacturing the light-emitting device according to the second embodiment.

Fig. 7D is a cross-sectional view showing a step of mounting a light-emitting device in the method of manufacturing a light-emitting module according to the second embodiment.

Fig. 7E is a plan view showing a step of forming the second cover member in the method of manufacturing the light-emitting device according to the second embodiment.

Fig. 7F is a plan view showing a step of forming the first cover member in the method of manufacturing the light-emitting device according to the second embodiment.

Fig. 7G is a plan view showing a step of mounting a light emitting device in the method of manufacturing a light emitting module according to the second embodiment.

Fig. 8A is a plan view schematically showing the structure of a light-emitting module including the light-emitting device according to the third embodiment.

FIG. 8B is a cross-sectional view taken along line VIIIB-VIIIB of FIG. 8A.

Fig. 8C is a cross-sectional view schematically showing the structure of a light-emitting device of the third embodiment.

Fig. 9 is a flowchart of a method for manufacturing a light-emitting device according to a third embodiment.

Fig. 10A is a cross-sectional view showing a step of mounting a light-emitting element in the second element structure preparing step in the method of manufacturing a light-emitting device according to the third embodiment.

Fig. 10B is a cross-sectional view showing a step of fabricating a second element structure in the second element structure preparing step in the method of manufacturing a light-emitting device according to the third embodiment.

Fig. 10C is a cross-sectional view showing a step of forming a housing in the method of manufacturing the light-emitting device according to the third embodiment.

Fig. 10D is a sectional view showing a step of mounting the second element structure in the method of manufacturing the light-emitting device according to the third embodiment.

Fig. 10E is a cross-sectional view showing a step of providing a light transmissive member in the method for manufacturing a light emitting device according to the third embodiment.

Fig. 10F is a cross-sectional view showing a step of forming the first cover member in the method of manufacturing the light-emitting device according to the third embodiment.

Fig. 10G is a sectional view showing a step of removing the sheet member in the method of manufacturing the light-emitting device according to the third embodiment.

Fig. 10H is a cross-sectional view showing a step of mounting a light-emitting device in the method of manufacturing a light-emitting module according to the third embodiment.

Fig. 11A is a plan view schematically showing the structure of a light-emitting module including the light-emitting device according to the fourth embodiment.

FIG. 11B is a cross-sectional view taken along line XIB-XIB of FIG. 11A.

Fig. 11C is a sectional view schematically showing the structure of a light-emitting device according to a fourth embodiment.

Fig. 12 is a flowchart of a method for manufacturing a light-emitting device according to a fourth embodiment.

Fig. 13A is a cross-sectional view schematically showing the structure of a light-emitting module including a light-emitting device according to another embodiment.

Fig. 13B is a plan view schematically showing the structure of a light-emitting module including a light-emitting device according to another embodiment.

Fig. 13C is a plan view schematically showing the structure of a light-emitting module including a light-emitting device according to another embodiment.

Fig. 13D is a plan view schematically showing the structure of a light-emitting module including a light-emitting device according to another embodiment.

Fig. 13E is a plan view schematically showing the structure of a light-emitting module including a light-emitting device according to another embodiment.

Fig. 13F is a plan view schematically showing the structure of a light-emitting module including a light-emitting device according to another embodiment.

Fig. 13G is a plan view schematically showing the structure of a light-emitting module including a light-emitting device according to another embodiment.

Fig. 13H is a plan view schematically showing the structure of a light-emitting module including a light-emitting device according to another embodiment.

Fig. 14A is a plan view schematically showing a structure of a light-emitting module including a light-emitting device according to another embodiment.

Fig. 14B is a cross-sectional view taken along line XIVB-XIVB of fig. 14A.

Fig. 14C is a bottom view schematically showing the structure of the light-emitting device of the embodiment of fig. 14A.

Fig. 15A is a cross-sectional view schematically showing the structure of a light-emitting module according to another embodiment.

Fig. 15B is a flowchart of a method of manufacturing the light emitting module of the embodiment of fig. 15A.

Detailed Description

The embodiments are described below with reference to the drawings. The following embodiments are illustrative of a method for manufacturing a light-emitting device and a method for manufacturing a light-emitting module, and a light-emitting device and a light-emitting module for embodying the technical ideas of the present embodiment, and are not limited to the following. The dimensions, materials, shapes, relative arrangements of the components described in the embodiments, and the like are not intended to limit the scope of the present invention to these unless otherwise specified, but are merely illustrative. In addition, the sizes, positional relationships, and the like of the components shown in the drawings may be exaggerated for clarity of explanation.

First embodiment

Fig. 1A is a perspective view schematically showing the structure of a light-emitting module including the light-emitting device according to the first embodiment. Fig. 1B is a plan view schematically showing the structure of a light-emitting module including the light-emitting device according to the first embodiment. FIG. 1C is a cross-sectional view of the IC-IC line of FIG. 1B. FIG. 1D is a cross-sectional view of the ID-ID line of FIG. 1B. Fig. 1E is a cross-sectional view schematically showing the structure of the light-emitting device of the first embodiment. Fig. 1F is a bottom view schematically showing the structure of the light-emitting device of the first embodiment.

The light-emitting module 200 includes the light-emitting device 100 and the module substrate 80.

[ light-emitting device ]

First, the light-emitting device 100 will be explained.

The light-emitting device 100 includes: a plurality of first element structures 15 including a submount substrate 10, a light-emitting element 20, and a light-transmissive member 30 in this order; and a first covering member 40 that covers the side surfaces of the first element structures 15 and holds the plurality of first element structures 15.

In other words, the light-emitting device 100 mainly includes the submount substrate 10, the light-emitting element 20, the protective element 25, the light transmissive member 30, the first cover member 40, and the frame 50.

Hereinafter, each structure of the light-emitting device 100 will be described.

The submount substrate 10 is a member on which the light emitting element 20 and the protective element 25 are mounted, and includes a wiring for electrically connecting the light emitting device 100 to the outside. The submount substrate 10 is formed in a substantially rectangular shape in a plan view, for example. The sub-mount board 10 includes a base portion 2, a first wiring portion 3, an internal wiring portion 4, and a second wiring portion 5.

The base portion 2 is preferably made of an insulating material, and is preferably made of a material that is less likely to transmit light emitted from the light-emitting element 20, external light, or the like. For example, ceramics such as alumina, aluminum nitride, and mullite, a thermoplastic resin such as PA (polyamide), PPA (polyphthalamide), PPS (polyphenylene sulfide), or a liquid crystal polymer, an epoxy resin, a silicone resin, a modified epoxy resin, a urethane resin, or a phenol resin can be used. Among them, ceramics having excellent heat dissipation properties are preferably used.

In the light-emitting device 100, the distance between the adjacent sub-mount boards 10 is preferably 0.05mm to 0.2 mm. Accordingly, the thickness of the first covering member 40 disposed between the sub-mount boards 10 is 0.05mm to 0.2mm, and therefore, the adjacent sub-mount boards 10 can be bonded to each other in close contact with each other, and the influence of thermal stress can be suppressed.

The first wiring portion 3 is provided on the upper surface of the base portion 2, and is electrically connected to the light emitting element 20 and the protective element 25. The second wiring portion 5 is provided on the lower surface side of the base portion 2, and is electrically connected to an external power supply as an external electrode of the light-emitting device 100. The internal wiring portion 4 is a wiring portion provided in a through hole penetrating the base portion 2, and electrically connects the first wiring portion 3 and the second wiring portion 5. The light-emitting device may not include the protective element 25.

As the first wiring portion 3, the internal wiring portion 4, and the second wiring portion 5, for example, a metal such as Fe, Cu, Ni, Al, Ag, Au, Pt, Ti, W, Pd, or an alloy containing at least one of these metals can be used. The first wiring portion 3, the internal wiring portion 4, and the second wiring portion 5 can be formed by, for example, electroplating, electroless plating, evaporation, sputtering, or the like.

The light emitting element 20 is a semiconductor element which emits light when a voltage is applied. The shape, size, and the like of the light emitting element 20 can be arbitrarily selected. The emission color of the light-emitting element 20 can be selected from emission colors of arbitrary wavelengths according to the application. For example, nitride-based semiconductors (In) can be used as the light-emitting elements 20 of blue (light with a wavelength of 430 to 500 nm) and green (light with a wavelength of 500 to 570 nm)_XAl_YGa_1-X-YN, 0 is less than or equal to X, 0 is less than or equal to Y, X + Y is less than or equal to 1), GaP and the like. As the red-based (light having a wavelength of 610 to 700 nm) light-emitting element 20, GaAlAs, AlInGaP, or the like can be used in addition to the nitride-based semiconductor element.

The light emitting element 20 has positive and negative element electrodes 23 on one surface, and is flip-chip mounted on the submount substrate 10 via a conductive adhesive to the first wiring portion 3. As the conductive adhesive material, for example, eutectic solder, conductive paste, tab or the like may be used.

The protection element 25 is, for example, a zener diode. The protection element 25 has positive and negative element electrodes 27 on one surface, and is flip-chip mounted on the sub-mount substrate 10 via a conductive adhesive material to the first wiring portion 3.

The light transmissive member 30 is a light transmissive member formed of, for example, resin, glass, inorganic material, or the like. The light transmissive member 30 is disposed on the light emitting element 20. The light transmissive member 30 preferably has an upper surface wider than the upper surface of the light emitting element 20.

In the light emitting device 100, the distance between the adjacent light transmissive members 30 exposed on the upper surface of the light emitting device 100 is preferably 0.2mm or less. If the distance between the light transmissive members 30 is 0.2mm or less, for example, when the light emitting device 100 is used in a variable light distribution type headlamp (Adaptive Driving Beam: ADB) of a vehicle, the light source can be reduced in size, and the size of the headlamp lens can be reduced. Therefore, the main lens can be omitted in the optical system. In addition, the loss of light passing through the headlight lens can be reduced. From the viewpoint of further reducing the light source, the distance between the light transmissive members 30 is more preferably 0.1mm or less, and still more preferably 0.05mm or less. The distance between the light transmissive members 30 is preferably 0.03mm or more from the viewpoint of ease of manufacturing the light emitting device 100.

The planar shape of the light transmissive member 30 may be various shapes such as a circle, an ellipse, a square, or a polygon such as a hexagon. Among them, a rectangle such as a square or a rectangle is preferable, and a shape similar to the planar shape of the light emitting element 20 is more preferable.

The light transmissive member 30 may contain a wavelength conversion member. Examples of the wavelength conversion member include a phosphor. Examples of the light transmissive member 30 containing a phosphor include a sintered body of a phosphor and a light transmissive member containing phosphor powder in a resin, glass, ceramic, or other inorganic material. The light transmissive member 30 may have a phosphor-containing resin layer or a phosphor-containing glass layer formed on the surface of a molded body such as a resin, glass, or ceramic. The light transmissive member 30 may contain a filler such as a diffusion material depending on the purpose. In addition, when a filler such as a diffusion material is contained, the light transmissive member 30 may contain a filler such as resin, glass, ceramic, or other inorganic material, or a resin layer containing a filler or a glass layer containing a filler may be formed on the surface of a molded product such as resin, glass, or ceramic.

As the phosphor, a phosphor known in the art can be used. For example, the green-emitting phosphor includes an yttrium-aluminum garnet phosphor (e.g., Y)₃(Al,Ga)₅O₁₂: ce), lutetium-aluminum-garnet phosphor (e.g., Lu)₃(Al,Ga)₅O₁₂: ce), terbium-aluminum garnet phosphor (e.g., Tb)₃(Al,Ga)₅O₁₂: ce-based phosphor and silicate-based phosphor (e.g., (Ba, Sr)₂SiO₄: eu), chlorosilicate based phosphor (e.g., Ca)₈Mg(SiO₄)₄C₁₂：Eu) Beta sialon phosphor (e.g., Si)_6-zAl_zO_zN_8-z: eu (0 < z < 4.2)), SGS-based phosphor (e.g., SrGa₂S₄: eu), and the like. Examples of the phosphor emitting yellow light include α -sialon phosphors (for example, Mz (Si, Al)₁₂(O,N)₁₆(wherein, z is more than 0 and less than or equal to 2, and M is Li, Mg, Ca, Y and lanthanides except La and Ce), and the like. In addition, some of the above green light-emitting phosphors emit yellow light.

For example, the yttrium-aluminum garnet phosphor can emit yellow light by replacing a part of Y with Gd to shift the emission peak wavelength to the long wavelength side. Among them, a fluorescent substance capable of emitting orange light is also included. Examples of the phosphor emitting red light include a nitrogen-containing calcium aluminosilicate (CASN or SCASN) -based phosphor (e.g., (Sr, Ca) AlSiN₃: eu) and BSESN based phosphor (e.g., (Ba, Sr, Ca)₂Si₅N₈: eu), and the like. In addition, manganese-activated fluoride phosphors (represented by the general formula (I) A)₂[M_1-aMn_aF₆]A phosphor represented by the general formula (I) (wherein A is selected from the group consisting of K, Li, Na, Rb, Cs and NH)₄At least one element selected from the group consisting of group IV elements and group VIII elements, and a satisfies 0 < a < 0.2)). As a typical example of the manganese-activated fluoride-based phosphor, there is a phosphor of manganese-activated potassium fluorosilicate (for example, K)₂SiF₆：Mn)。

As the diffusion material, a diffusion material known in the art can be used. For example, barium titanate, titanium oxide, aluminum oxide, silicon oxide, or the like can be used.

When a resin is used as the light transmissive member 30, and when a resin is used as a binder for the fluorescent material or the diffusing material, examples of the resin material include thermosetting resins such as epoxy resin, modified epoxy resin, silicone resin, and modified silicone resin.

The first covering member 40 is provided around the plurality of first element structures 15. The first covering member 40 is preferably made of a resin material. The first covering member 40 is formed by covering the side surfaces of the first element structures 15 with a light-reflective resin, for example, a resin containing a reflective material. That is, the first covering member 40 covers the side surface of the submount substrate 10, the side surface of the light emitting element 20, and the side surface of the light transmissive member 30. The first covering member 40 is also provided between the adjacent first element structures 15, and covers the outer peripheral side surfaces of the plurality of first element structures 15. In addition, when the light emitting device 100 includes the housing 50, the first cover member 40 is provided between the housing 50 and the first element structure 15 and between the first element structures 15 in the housing 50.

As the resin material used for the first covering member 40, for example, a resin material exemplified as a resin material used for the light transmissive member 30 can be cited. Examples of the light reflective material used as the reflective material of the first cover member 40 include titanium oxide, silica, silicon oxide, aluminum oxide, zirconium oxide, magnesium oxide, potassium titanate, zinc oxide, and boron nitride. Among them, titanium oxide having a high refractive index is preferably used from the viewpoint of light reflection.

The frame 50 surrounds the plurality of first element structures 15 and supports the first cover member 40. The frame 50 is formed in a rectangular shape in plan view, for example, and is provided around the plurality of first element structures 15.

The frame 50 can be formed using a frame-shaped member made of metal, alloy, or ceramic. Examples of the metal include Fe, Cu, Ni, Al, Ag, Au, Pt, Ti, W, Pd, and the like. Examples of the alloy include alloys containing at least one of Fe, Cu, Ni, Al, Ag, Au, Pt, Ti, W, Pd, and the like.

In addition, a resin material may be used as the frame. In this case, the metal, alloy, or ceramic member may be embedded in a frame body formed of a resin material, or a part of the frame body may be formed of a resin material and the other part may be formed of a metal, alloy, or ceramic member.

The light-emitting device 100 includes a plurality of first element structures 15. Here, the first element structures 15 in one row of 11 are supported by the first cover member 40. However, the light-emitting device may include 10 or less first element structures 15, or may include 12 or more first element structures 15.

[ light-emitting Module ]

Next, the light emitting module 200 will be explained.

The light-emitting module 200 includes: the light-emitting device 100 described above, and the module board 80 on which the light-emitting device 100 is mounted so as to face the submount board 10.

When the light-emitting device 100 does not include the protection element 25, the protection element 25 is preferably provided on the module substrate 80 side.

The light emitting device 100 is as described above.

The module board 80 is a member on which the light-emitting device 100 is mounted, and electrically connects the light-emitting device 100 to the outside. The module board 80 is formed in a substantially rectangular shape in plan view, for example. The module board 80 includes a board portion 6 and a third wiring portion 7.

Examples of the material of the substrate portion 6 include materials exemplified as the material of the base portion 2 used for the submount substrate 10. Examples of the material of the third wiring portion 7 include those exemplified as the material used for the first wiring portion 3 of the sub-mount board 10 and the like.

The light emitting device 100 is mounted on the upper surface of the module board 80 so that the second wiring portion 5 and the third wiring portion 7 are bonded to each other through the conductive adhesive 8. As the conductive adhesive material 8, for example, eutectic solder, conductive paste, a tab, or the like may be used.

In the light-emitting module 200, since the frame 50 is bonded to the module substrate 80 via the conductive adhesive 8, heat generated by the light-emitting device 100 is dissipated to the module substrate 80 via the frame 50. Therefore, the heat dissipation of the light emitting module 200 is more excellent. The frame 50 may be bonded to the module board 80 with a nonconductive adhesive or may be disposed only on the module board 80 without an adhesive.

[ operation of light emitting Module ]

When the light emitting module 200 is driven, a current is supplied from an external power supply to the light emitting element 20 through the third wiring portion 7, the second wiring portion 5, the internal wiring portion 4, and the first wiring portion 3, and the light emitting element 20 emits light. The light emitted from the light emitting element 20 is extracted to the outside above the light emitting device 100 through the light transmissive member 30. The light entering downward is reflected by the sub-mount board 10, and is extracted to the outside of the light emitting device 100 through the light transmissive member 30. The light entering between the light emitting element 20 and the housing 50 is reflected by the first cover member 40 and the housing 50, and is extracted to the outside of the light emitting device 100 through the light transmissive member 30. The light entering between the light emitting elements 20 is reflected by the first covering member 40, and is extracted to the outside of the light emitting device 100 through the light transmissive member 30. In this case, by narrowing the space between the light transmissive members 30 (for example, 0.2mm or less), the configuration of the optical system can be simplified and reduced in size when the light emitting module 200 is used as a light source of a vehicle headlamp, for example.

Method for manufacturing the first embodiment

Fig. 2 is a flowchart of a method for manufacturing the light-emitting device of the first embodiment. Fig. 3 is a flowchart of a method of manufacturing the light emitting module of the first embodiment. Fig. 4A is a cross-sectional view showing a step of mounting a light-emitting element in the first element structure preparing step of the method of manufacturing a light-emitting device according to the first embodiment. Fig. 4B is a cross-sectional view showing a step of providing a light transmissive member in the first element structure preparing step of the method for manufacturing a light emitting device according to the first embodiment. Fig. 4C is a cross-sectional view showing a step of fabricating a first element structure in the first element structure preparing step in the method of manufacturing a light-emitting device according to the first embodiment. Fig. 4D is a cross-sectional view showing a step of forming a housing in the method of manufacturing the light-emitting device according to the first embodiment. Fig. 4E is a cross-sectional view showing a step of mounting the first element structure in the method of manufacturing the light-emitting device according to the first embodiment. Fig. 4F is a cross-sectional view showing a step of forming the first cover member in the method of manufacturing the light-emitting device according to the first embodiment. Fig. 4G is a cross-sectional view showing a step of removing the sheet member in the method of manufacturing the light-emitting device according to the first embodiment. Fig. 4H is a cross-sectional view showing a step of mounting a light-emitting device in the method of manufacturing a light-emitting module according to the first embodiment. Fig. 4I is a plan view showing a step of mounting the first element structure in the method of manufacturing the light-emitting device according to the first embodiment. Fig. 4J is a plan view showing a step of forming the first cover member in the method of manufacturing the light-emitting device according to the first embodiment. Fig. 4K is a plan view showing a step of mounting a light emitting device in the method of manufacturing a light emitting module according to the first embodiment.

[ method for producing light-emitting device ]

First, an example of a method for manufacturing the light-emitting device 100 will be described.

The method of manufacturing the light emitting device 100 includes: a first element structure preparation step S101 of preparing a plurality of first element structures 15, the first element structures 15 including the submount substrate 10, the light emitting element 20, and the light transmissive member 30 in this order; a frame forming step S102 of forming the frame 50 surrounding the plurality of first element structures 15 on the sheet member 70; a first component structure mounting step S103 of mounting the plurality of first component structures 15 such that the submount substrate 10 faces the sheet member 70; a first covering member forming step S104 of forming the first covering member 40 covering the side surfaces of the first element structures 15 on the sheet member 70; and a sheet member removing step S105 of removing the sheet member 70.

The first element structure body preparation step S101 includes: a collective substrate preparation step S101a of preparing a collective substrate 11 including a plurality of sub-mount regions 12, the sub-mount regions 12 being divided into sub-mount substrates 10 after the collective substrate 11 is divided; a light-emitting element mounting step S101b of mounting the light-emitting elements 20 in the plurality of sub-mount regions 12; a light transmissive member installation step S101c of installing the light transmissive member 30 on each light emitting element 20; and a first element structure body fabrication step S101d of fabricating a plurality of first element structure bodies 15 by dividing the aggregate substrate 11 into sub-mount regions 12.

Note that the material, arrangement, and the like of the respective members are as described in the above description of the light-emitting device 100, and therefore the description thereof is appropriately omitted here.

(first element Structure preparation step)

The first element structure preparing step S101 is a step of preparing a plurality of first element structures 15, and the first element structures 15 include the submount substrate 10, the light emitting element 20, and the light transmissive member 30 in this order.

The step S101 includes an aggregate substrate preparation step S101a, a light emitting element mounting step S101b, an optically transmissive member installation step S101c, and a first element structure fabrication step S101 d.

Collective substrate preparation Process

The collective substrate preparation step S101a is a step of preparing the collective substrate 11 including the plurality of sub-mount regions 12, and the sub-mount regions 12 become the sub-mount substrates 10 after the collective substrate 11 is divided.

The collective substrate 11 is a single substrate including a plurality of sub-mount regions 12 on which the light-emitting elements 20 are mounted. In fig. 4A, the aggregate substrate 11 including four sub-mount regions 12 is illustrated for convenience, but the number of sub-mount regions 12 may be appropriately adjusted.

Light-emitting element mounting process

The light-emitting element mounting step S101b is a step of mounting the light-emitting elements 20 in the plurality of sub-mount regions 12.

In this step S101b, the plurality of light-emitting elements 20 are respectively mounted in each of the plurality of sub-mount regions 12. The light emitting element 20 is flip-chip mounted on the first wiring disposed in the mounting region 12 with the electrode forming surface as a mounting surface by a conductive adhesive material.

In this case, the plurality of protection elements 25 are placed in each of the plurality of sub-mounting regions 12.

Light transmissive Member installing Process

The light transmissive member providing step S101c is a step of providing the light transmissive member 30 on each light emitting element 20.

In this step S101c, for example, the light transmissive member 30 having a predetermined shape is bonded to the upper surface (in other words, the main light extraction surface side) of the light emitting element 20 opposite to the electrode forming surface. When the light transmissive member 30 is bonded to the light emitting element 20, the bonding may be performed by direct bonding or may be performed via a light transmissive bonding member.

First element Structure manufacturing Process

The first element structure forming step S101d is a step of dividing the aggregate substrate 11 into a plurality of first element structures 15 for each sub-mount region 12.

In step S101d, the first element structures 15 are separated into individual pieces by dividing the first element structures 15 at predetermined positions on the collective substrate 11, thereby forming a plurality of first element structures 15.

The method of manufacturing the light-emitting device 100 is manufactured by combining a plurality of first element structures 15 that are singulated. In other words, since the sorting step can be performed after the first element structures 15 are singulated, the first element structures 15 having light emission characteristics in a predetermined range can be sorted from the singulated first element structures 15, and the light-emitting device 100 can be formed by a desired combination. This makes it possible to obtain the light-emitting device 100 of a desired emission color with less color variation.

In the manufacturing process, when a failure occurs in a part of the first element structures 15, only the first element structures 15 having the failure can be discarded before the first element structures 15 are placed on the sheet member 70. In the case of a light-emitting device in which a plurality of light-emitting elements are mounted on one sub-mount substrate, if a failure occurs in one of the components, the entire light-emitting device needs to be discarded. Therefore, the method for manufacturing a light-emitting device according to the present embodiment can reduce the number of parts to be discarded when a defect occurs in the process.

(frame body Forming Process)

The frame forming step S102 is a step of forming the frame 50 surrounding the plurality of first element structures 15 on the sheet member 70.

The frame 50 can be formed by placing a frame-like member made of metal, alloy, or ceramic at a desired position on the sheet member 70, for example.

By using metal, alloy, or ceramic as the frame 50, the occurrence of warpage of the first cover member 40 is suppressed, and the mounting surface of the light emitting device 100 can be formed flat. When a resin material is used for the first cover member 40, although there is a possibility that warpage will occur in the light emitting device 100 due to shrinkage of the resin during curing, the occurrence of warpage can be suppressed by using a non-flexible material for the frame 50. This improves the mountability of the light-emitting device 100 to the module board 80.

Further, by forming the frame 50 before the first component structure mounting step S103, the first component structure 15 can be mounted on the sheet member 70 with reference to the frame 50. This makes it possible to place the first component structure 15 with high accuracy even on the sheet member 70 having no alignment mark for placing the first component structure 15.

(first component Structure mounting step)

The first component structure mounting step S103 is a step of mounting the plurality of first component structures 15 so that the sub-mount board 10 faces the sheet member 70. In other words, the plurality of first element structures 15 are mounted on the sheet member 70 such that the lower surface of the submount substrate 10 (in other words, the surface opposite to the surface on which the light-emitting elements 20 are mounted) is in contact with the upper surface of the sheet member 70. Here, since the first element structures 15 after singulation are mounted on the sheet member 70, for example, when a sheet is used during singulation, the first element structures 15 can be arranged at a distance shorter than the width of the sheet. This enables the light-emitting device 100 to have a narrow light-emitting surface.

In step S103, the plurality of first element structures 15 are placed on the upper surface of the sheet member 70. The first element structure 15 is mounted on the upper surface of the sheet member 70 with the formation surface of the second wiring portion 5 as a mounting surface.

The sheet member 70 is made of a material known in the art, such as a heat-resistant resin sheet.

(first covering Member Forming Process)

The first covering member forming step S104 is a step of forming the first covering member 40 covering the side surfaces of the first element structures 15 on the sheet member 70.

In step S104, the first cover member 40 is formed in the housing 50 so that the side surface of the first element structure 15 is covered with the first cover member 40.

In step S104, the uncured resin material forming the first cover member 40 is disposed between the frame 50 and the first element structures 15 and between the adjacent first element structures 15 by, for example, casting, spraying, or the like. After that, the resin material is cured to form the first covering member 40.

In step S104, the first covering member 40 is provided so as to cover the side surfaces of the first element structure 15 (in other words, the side surfaces of the sub-mount substrate 10, the side surfaces of the light-emitting element 20, and the side surfaces of the light transmissive member 30) and expose the upper surface of the light transmissive member 30. Further, the first covering member 40 may be provided by partially removing the first covering member 40 by grinding, cutting, or the like so as to expose the upper surface of the light transmissive member 30 after being provided to cover the upper surface of the light transmissive member 30.

(sheet member removing step)

The sheet member removing step S105 is a step of removing the sheet member 70.

In step S105, the sheet member 70 on which the first element structure 15 and the like are mounted is peeled off to obtain the light-emitting device 100.

[ method for manufacturing light-emitting Module ]

Next, an example of a method for manufacturing the light emitting module 200 will be described.

The method of manufacturing the light emitting module 200 includes: a light-emitting device preparation step S11 of preparing the light-emitting device 100 by using the method for manufacturing the light-emitting device 100; and a light-emitting device mounting step S12 of mounting the light-emitting device 100 so that the sub-mount board 10 and the module board 80 face each other.

Note that the material, arrangement, and the like of the respective members are as described in the above description of the light-emitting module 200, and therefore the description thereof is appropriately omitted here.

(light-emitting device preparation Process)

The light-emitting device preparation step S11 is a step of preparing the light-emitting device 100 using the above-described method for manufacturing a light-emitting device.

In step S11, the light-emitting device 100 is manufactured by performing the above-described steps S101 to S105.

(light-emitting device mounting step)

The light-emitting device mounting step S12 is a step of mounting the light-emitting device 100 so that the sub-mount board 10 and the module board 80 face each other.

In step S12, the light emitting device 100 is mounted on the upper surface of the module board 80. The light emitting device 100 is mounted on the upper surface of the module board 80 via the conductive adhesive material 8 with the submount board 10 side as a mounting surface.

Second embodiment

Fig. 5A is a plan view schematically showing the structure of a light-emitting module including the light-emitting device of the second embodiment. Fig. 5B is a cross-sectional view taken along line VB-VB of fig. 5A. Fig. 5C is a sectional view schematically showing the structure of the light-emitting device of the second embodiment.

The light-emitting module 200A includes the light-emitting device 100A and the module substrate 80.

[ light-emitting device ]

First, the light-emitting device 100A will be described.

The light-emitting device 100A includes: a plurality of first element structures 15 including a submount substrate 10, a light-emitting element 20, and a light-transmissive member 30 in this order; a second covering member 60 that covers the side surfaces of the sub-mount boards 10 to hold the plurality of first element structures 15; and a first covering member 40 that covers the side surfaces of the light emitting elements 20 and the side surfaces of the light transmissive members 30, holds the plurality of first element structures 15, and has a higher light reflectance with respect to light from the light emitting elements 20 than the second covering member 60.

In other words, the light-emitting device 100A mainly includes the submount substrate 10, the light-emitting element 20, the protective element 25, the light transmissive member 30, the second cover member 60, the first cover member 40, and the frame 50.

Hereinafter, the respective configurations of the light-emitting device 100A will be described with respect to the matters different from those of the light-emitting device 100.

The second covering member 60 is provided around the sub-mount boards 10 of the plurality of first element structures 15. The second cover member 60 is formed by covering the side surface of the sub-mount board 10 with a heat dissipating resin, which is a resin containing a heat dissipating material, for example. The second cover member 60 is provided in the frame 50 at a height from the upper surface of the sub-mount board 10 between the frame 50 and the sub-mount board 10 and between the sub-mount boards 10.

As the resin material of the resin used for the second covering member 60, for example, a resin material exemplified as a resin material used for the light transmissive member 30 can be cited.

Examples of the heat radiating material include silicone for heat radiation, alumina, aluminum nitride, boron nitride, and magnesium oxide.

The material of the second cover member 60 is preferably selected as appropriate so as to have higher heat dissipation than the first cover member 40.

The first covering member 40 is provided on the upper surface of the second covering member 60. The first covering member 40 covers the side surface of the light emitting element 20 and the side surface of the light transmissive member 30. The first covering member 40 is provided inside the housing 50 between the housing 50 and the light emitting elements 20 and the light transmissive member 30, between the light emitting elements 20, and between the light transmissive members 30.

The first cover member 40 is made of a material appropriately selected so that the light reflectance with respect to light from the light emitting element 20 is higher than that of the second cover member 60.

[ light-emitting Module ]

Next, the light-emitting module 200A will be explained.

The light emitting module 200A is the same as the light emitting module 200 of the first embodiment except that the light emitting device 100A is used.

Method for manufacturing second embodiment

Fig. 6 is a flowchart of a method for manufacturing a light-emitting device according to a second embodiment. Fig. 7A is a cross-sectional view showing a step of forming a second cover member in the method of manufacturing a light-emitting device according to the second embodiment. Fig. 7B is a cross-sectional view showing a step of forming the first cover member in the method of manufacturing the light-emitting device according to the second embodiment. Fig. 7C is a cross-sectional view showing a step of removing the sheet member in the method of manufacturing the light-emitting device according to the second embodiment. Fig. 7D is a cross-sectional view showing a step of mounting a light-emitting device in the method of manufacturing a light-emitting module according to the second embodiment. Fig. 7E is a plan view showing a step of forming the second cover member in the method of manufacturing the light-emitting device according to the second embodiment. Fig. 7F is a plan view showing a step of forming the first cover member in the method of manufacturing the light-emitting device according to the second embodiment. Fig. 7G is a plan view showing a step of mounting a light emitting device in the method of manufacturing a light emitting module according to the second embodiment.

[ method for producing light-emitting device ]

First, an example of a method for manufacturing the light-emitting device 100A will be described.

The method for manufacturing the light-emitting device 100A includes: a first element structure preparation step S201 of preparing a plurality of first element structures 15, the first element structures 15 including the submount substrate 10, the light emitting element 20, and the light transmissive member 30 in this order; a frame forming step S202 of forming the frame 50 surrounding the plurality of first element structures 15 on the sheet member 70; a first component structure mounting step S203 of mounting the plurality of first component structures 15 such that the sub-mount board 10 and the sheet member 70 face each other; a second cover member forming step S204 of forming the second cover member 60 covering the side surfaces of the respective sub-mount boards 10 on the sheet member 70; a first cover member forming step S205 of forming the first cover member 40 on the second cover member 60, the first cover member 40 covering the side surfaces of the light emitting elements 20 and the side surfaces of the light transmissive members 30 and having a higher light reflectance with respect to light from the light emitting elements 20 than the second cover member 60; and a sheet member removing step S206, which is a step of removing the sheet member 70.

The first element structure preparation step S201 includes: an aggregate substrate preparation step S201a of preparing an aggregate substrate 11 including a plurality of sub-mount regions 12, the sub-mount regions 12 being divided into sub-mount substrates 10 after the aggregate substrate 11 is divided; a light-emitting-element mounting step S201b of mounting the light-emitting elements 20 on the plurality of sub-mount regions 12; a light transmissive member installation step S201c of installing the light transmissive member 30 on each light emitting element 20; and a first element structure forming step S201d of dividing the aggregate substrate 11 into a plurality of first element structures 15 for each sub-mount region 12.

Note that the material, arrangement, and the like of the respective members are as described in the above description of the light-emitting device 100A, and therefore the description thereof is appropriately omitted here.

(first element Structure preparation step)

The first element structure preparation step S201 is the same as the first element structure preparation step S101 described above.

(frame body Forming Process)

The frame forming step S202 is the same as the frame forming step S102 described above.

(first component Structure mounting step)

The first component structure mounting step S203 is the same as the first component structure mounting step S103 described above.

(second covering Member Forming Process)

The second cover member forming step S204 is a step of forming the second cover member 60 covering the side surfaces of the respective sub-mount boards 10 on the sheet member 70.

In step S204, the second cover member 60 is formed in the housing 50 so that the side surface of the sub-mount board 10 is covered with the second cover member 60.

In step S204, an uncured resin material containing a heat dissipating material is disposed between the frame 50 and the sub-mount boards 10 and between the facing side surfaces of the adjacent sub-mount boards 10, for example, by pouring, spraying, or the like. After that, the resin material is cured to form the second covering member 60.

In this step S204, the second cover member 60 is preferably provided to the height of the upper surface of the sub-mount substrate 10 so as to cover the side surface of the sub-mount substrate 10. The second covering member 60 may cover the upper surface of the mounting substrate 10, but is preferably separated from the light emitting element 20.

(first covering Member Forming Process)

The first covering member forming step S205 is a step of forming the first covering member 40 covering the side surfaces of the light emitting elements 20 and the light transmissive members 30 on the second covering member 60. In step S205, a member having a higher light reflectance with respect to light from the light emitting element 20 than the second cover member 60 is used as the first cover member 40.

In step S205, the first cover member 40 is formed in the housing 50 so that the side surface of the light emitting element 20 and the side surface of the light transmissive member 30 are covered with the first cover member 40.

In step S205, an uncured resin material containing a reflective material is disposed between the frame 50 and the light emitting elements 20 and the light transmissive members 30, between the adjacent light emitting elements 20, and between the adjacent light transmissive members 30, for example, by casting, spraying, or the like. After that, the resin material is cured to form the first covering member 40.

In step S205, the first covering member 40 is provided so as to cover the side surface of the light emitting element 20 and the side surface of the light transmissive member 30 and expose the upper surface of the light transmissive member 30. Further, the first covering member 40 may be provided by partially removing the first covering member 40 by grinding, cutting, or the like so as to expose the upper surface of the light transmissive member 30 after being provided to cover the upper surface of the light transmissive member 30.

(sheet member removing step)

The sheet member removing step S206 is the same as the sheet member removing step S105 described above.

[ method for manufacturing light-emitting Module ]

Next, an example of a method for manufacturing the light-emitting module 200A will be described.

The method for manufacturing the light-emitting module 200A is the same as the method for manufacturing the light-emitting module 200 of the first embodiment, except that the light-emitting device 100A prepared by the method for manufacturing the light-emitting device 100A is used.

Third embodiment

Fig. 8A is a plan view schematically showing the structure of a light-emitting module including the light-emitting device according to the third embodiment. FIG. 8B is a cross-sectional view taken along line VIIIB-VIIIB of FIG. 8A. Fig. 8C is a cross-sectional view schematically showing the structure of a light-emitting device of the third embodiment.

The light-emitting module 200B includes the light-emitting device 100B and the module 80.

[ light-emitting device ]

First, the light-emitting device 100B will be described.

The light-emitting device 100B uses the first element structure 15A instead of the first element structure 15. The width of the sub-mount substrate 10 in the longitudinal direction of the light-emitting device 100B in a plan view is formed narrower than the width of the light transmissive member 30 in the first element structure 15A.

The other points are the same as those of the light emitting device 100 of the first embodiment.

[ light-emitting Module ]

Next, the light emitting module 200B will be explained.

The light emitting module 200B is the same as the light emitting module 200 of the first embodiment except that the light emitting device 100B is used.

Method for manufacturing third embodiment

Fig. 9 is a flowchart of a method for manufacturing a light-emitting device according to a third embodiment. Fig. 10A is a cross-sectional view showing a step of mounting a light-emitting element in the second element structure preparing step in the method of manufacturing a light-emitting device according to the third embodiment. Fig. 10B is a cross-sectional view showing a step of fabricating a second element structure in the second element structure preparing step in the method of manufacturing a light-emitting device according to the third embodiment. Fig. 10C is a cross-sectional view showing a step of forming a housing in the method of manufacturing the light-emitting device according to the third embodiment. Fig. 10D is a sectional view showing a step of mounting the second element structure in the method of manufacturing the light-emitting device according to the third embodiment. Fig. 10E is a cross-sectional view showing a step of providing a light transmissive member in the method for manufacturing a light emitting device according to the third embodiment. Fig. 10F is a cross-sectional view showing a step of forming the first cover member in the method of manufacturing the light-emitting device according to the third embodiment. Fig. 10G is a sectional view showing a step of removing the sheet member in the method of manufacturing the light-emitting device according to the third embodiment. Fig. 10H is a cross-sectional view showing a step of mounting a light-emitting device in the method of manufacturing a light-emitting module according to the third embodiment.

[ method for producing light-emitting device ]

First, an example of a method for manufacturing the light-emitting device 100B will be described.

The method for manufacturing the light-emitting device 100B includes: a second element structure body preparation step S301 of preparing a plurality of second element structure bodies 16, the second element structure bodies 16 being provided with the sub-mount substrate 10 and the light-emitting element 20 in this order; a frame forming step S302 of forming the frame 50 surrounding the plurality of second element structures 16 on the sheet member 70; a second component structure mounting step S303 of mounting the plurality of second component structures 16 so that the sub-mount board 10 faces the sheet member 70; an optical transmissive member providing step S304 of providing the optical transmissive member 30 on each of the light emitting elements 20 after the plurality of second element structures 16 are mounted on the sheet member 70; a first covering material forming step S305 of forming the first covering material 40 on the sheet member 70, the first covering material 40 covering the side surfaces of the second element structures 16 and the light transmissive members 30; and a sheet member removing step S306 of removing the sheet member 70.

The second element structure preparation step S301 includes: an aggregate substrate preparation step S301a of preparing an aggregate substrate 11 including a plurality of sub-mount regions 12, the sub-mount regions 12 being divided into sub-mount substrates 10 after the aggregate substrate 11 is divided; a light-emitting-element mounting step S301b of mounting the light-emitting elements 20 on the plurality of sub-mount regions 12; and a second component structure forming step S301c of dividing the aggregate substrate 11 into a plurality of second component structures 16 for each sub-mount region 12.

Note that the material, arrangement, and the like of the respective members are as described in the above description of the light-emitting device 100B, and therefore the description thereof is appropriately omitted here.

(second device Structure preparation step)

The second element structure preparing step S301 is a step of preparing a plurality of second element structures 16, and the second element structures 16 include the sub-mount substrate 10 and the light-emitting element 20 in this order.

The step S301 includes a collective substrate preparation step S301a, a light emitting element mounting step S301b, and a second element structure fabrication step S301 c.

Collective substrate preparation Process

The collective substrate preparation step S301a is the same as the collective substrate preparation step S101a described above.

Light-emitting element mounting process

The light-emitting element mounting step S301b is the same as the light-emitting element mounting step S101b described above.

Second element Structure manufacturing Process

The second element structure forming step S301c is a step of dividing the aggregate substrate 11 into a plurality of second element structures 16 for each sub-mount region 12.

In step S301c, the second element structures 16 are singulated by dividing at predetermined positions on the aggregate substrate 11 to obtain a plurality of second element structures 16.

(frame body Forming Process)

The frame forming step S302 is a step of forming the frame 50 surrounding the plurality of second element structures 16 on the sheet member 70.

This step S302 is the same as the frame forming step S102 in the first manufacturing method, except that the frame 50 is formed around the region where the second element structure 16 is placed.

(second component Structure mounting step)

The second component structure mounting step S303 is a step of mounting the plurality of second component structures 16 so that the sub-mount board 10 faces the sheet member 70.

This step S303 is the same as the first element structure mounting step S103 in the first manufacturing method, except that the plurality of second element structures 16 are mounted on the upper surface of the sheet member 70.

(light transmitting Member mounting step)

The light transmissive member providing step S304 is a step of providing the light transmissive member 30 on each light emitting element 20 after the plurality of second element structures 16 are mounted on the sheet member 70.

In step S304, for example, the light transmissive member 30 having a predetermined shape is bonded to the upper surface (in other words, the main light extraction surface) of the light emitting element 20. When the light transmissive member 30 is bonded to the light emitting element 20, the bonding may be performed by direct bonding or may be performed via a light transmissive bonding member. The light transmissive member 30 is joined to the light emitting element 20, thereby forming the first element structure 15A.

Here, by providing the light transmissive members 30 having the upper surfaces larger in area than the upper surfaces of the light emitting elements 20 on the respective light emitting elements 20, the distance between the light transmissive members 30 can be made closer to the distance between the second element structures 16 (in other words, between the sub mount boards 10). This enables the light-emitting device 100B to have a narrower light-emitting surface interval.

(first covering Member Forming Process)

The first covering member forming step S305 is a step of forming the first covering member 40 on the sheet member 70, and the first covering member 40 covers the side surfaces of the respective second element structures 16 and the side surfaces of the respective light transmissive members 30. That is, this step S305 is a step of forming the first covering member 40 covering the side surfaces of the first element structures 15A on the sheet member 70.

This step S305 is the same as the first covering member forming step S104 in the first manufacturing method.

(sheet member removing step)

The sheet member removing step S306 is the same as the sheet member removing step S105 described above.

In the method of manufacturing the light-emitting device 100 according to the first embodiment, the light-emitting elements 20 and the light transmissive member 30 are provided on the aggregate substrate 11, and then the aggregate substrate 11 is divided into the sub-mount regions 12. Therefore, the sub-mount substrate 10 has the same width as the light transmissive member 30 or has a larger width than the light transmissive member 30 in a plan view. In this case, in order to shorten the distance between the light transmissive members 30 on the sheet member 70, the distance between the sub mount boards 10 needs to be shortened. That is, the distance between the light transmissive members 30 is limited by the width of the sub-mount board 10.

In contrast, in the method of manufacturing the light-emitting device 100B according to the third embodiment, the light transmissive member 30 is provided after the second element structure 16 is placed on the upper surface of the sheet member 70. Therefore, the width of the submount substrate 10 can be made narrower than the width of the light transmissive member 30 in a plan view. In this case, the distance between the light transmissive members 30 can be shortened by adjusting the width of the light transmissive member 30 on the sheet member 70 regardless of the distance between the sub mount boards 10. Therefore, the distance between the light transmissive members 30 can be adjusted regardless of the width of the sub-mount board 10. Further, the second element structures 16 can be easily mounted on the sheet member 70, and the arrangement accuracy of the second element structures 16 can be improved.

[ method for manufacturing light-emitting Module ]

Next, an example of a method for manufacturing the light-emitting module 200B will be described.

The method for manufacturing the light-emitting module 200B is the same as the method for manufacturing the light-emitting module 200 of the first embodiment, except that the light-emitting device 100B prepared by the method for manufacturing the light-emitting device 100B described above is used.

Fourth embodiment

Fig. 11A is a plan view schematically showing the structure of a light-emitting module including the light-emitting device according to the fourth embodiment. FIG. 11B is a cross-sectional view taken along line XIB-XIB of FIG. 11A. Fig. 11C is a sectional view schematically showing the structure of a light-emitting device according to a fourth embodiment.

The light-emitting module 200C includes a light-emitting device 100C and a module substrate 80.

[ light-emitting device ]

First, the light-emitting device 100C will be described.

The light-emitting device 100C uses the first element structure 15A instead of the first element structure 15. The width of the sub-mount substrate 10 in the longitudinal direction of the light-emitting device 100C in a plan view is formed narrower than the width of the light transmissive member 30 in the first element structure 15A.

The rest of the description is the same as the light-emitting device 100A of the second embodiment.

[ light-emitting Module ]

Next, the light emitting module 200C will be explained.

The light emitting module 200C is the same as the light emitting module 200A of the second embodiment except that the light emitting device 100C is used.

Method for manufacturing fourth embodiment

[ method for producing light-emitting device ]

First, an example of a method for manufacturing the light-emitting device 100C will be described.

The method for manufacturing the light-emitting device 100C includes: a second element structure body preparation step S401 of preparing a plurality of second element structure bodies 16, the second element structure bodies 16 being provided with the sub-mount substrate 10 and the light-emitting element 20 in this order; a frame forming step S402 of forming a frame surrounding the plurality of second element structures 16 on the sheet member 70; a second component structure mounting step S403 of mounting the plurality of second component structures 16 so that the sub-mount board 10 and the sheet member 70 face each other; an optical transmissive member providing step S404 of providing the optical transmissive member 30 on each of the light emitting elements 20 after the plurality of second element structures 16 are mounted on the sheet member 70; a second cover member forming step S405 of forming the second cover member 60 covering the side surfaces of the respective sub-mount boards 10 on the sheet member 70; a first cover member forming step S406 of forming the first cover member 40 on the second cover member 60, the first cover member 40 covering the side surfaces of the light emitting elements 20 and the side surfaces of the light transmissive members 30 and having a higher light reflectance with respect to light from the light emitting elements 20 than the second cover member 60; and a sheet member removing step S407 of removing the sheet member 70.

The second element structure preparation step S401 includes: an aggregate substrate preparation step S401a of preparing an aggregate substrate 11 including a plurality of sub-mount regions 12, the sub-mount regions 12 being divided into sub-mount substrates 10 after the aggregate substrate 11 is divided; a light-emitting element mounting step S401b of mounting the light-emitting elements 20 in the plurality of sub-mount regions 12; and a second component structure forming step S401c of dividing the aggregate substrate 11 into a plurality of second component structures 16 for each sub-mount region 12.

The method for manufacturing the light-emitting device 100C is the same as the method for manufacturing the light-emitting device 100A according to the second embodiment, except that the light-transmissive member 30 is provided on the light-emitting element 20 after the second element structure 16 is placed on the sheet member 70.

[ method for manufacturing light-emitting Module ]

Next, an example of a method for manufacturing the light-emitting module 200C will be described.

The method for manufacturing the light-emitting module 200C is the same as the method for manufacturing the light-emitting module 200 of the first embodiment, except that the light-emitting device 100C prepared by the method for manufacturing the light-emitting device 100C is used.

Although the above-described method for manufacturing a light-emitting device and a light-emitting module, and a light-emitting device and a light-emitting module have been specifically described in the embodiments for carrying out the present invention, the gist of the present invention is not limited to these descriptions, and it is necessary to widely explain the present invention based on the descriptions of the claims. Further, the present invention also includes various modifications and alterations based on the above description.

Other embodiments

Fig. 13A is a cross-sectional view schematically showing the structure of a light-emitting module including a light-emitting device according to another embodiment. Fig. 13B to 13H are plan views schematically showing the structure of a light-emitting module including a light-emitting device according to another embodiment. Fig. 14A is a plan view schematically showing a structure of a light-emitting module including a light-emitting device according to another embodiment. Fig. 14B is a cross-sectional view taken along line XIVB-XIVB of fig. 14A. Fig. 14C is a bottom view schematically showing the structure of the light-emitting device of the embodiment of fig. 14A. Fig. 15A is a cross-sectional view schematically showing the structure of a light-emitting module according to another embodiment. Fig. 15B is a flowchart of a method of manufacturing the light emitting module of the embodiment of fig. 15A.

The light-emitting module 200D and the housing 50A of the light-emitting device 100D use a resin containing a reflective material.

As the resin material of the resin used for the frame 50A, for example, a resin material exemplified as a resin material used for the light transmissive member 30 can be cited. As the light reflecting material used for the reflecting material of the housing 50A, for example, a light reflecting material exemplified as a light reflecting material used for the reflecting material of the first cover member 40 can be cited.

The frame 50A can be formed at a desired position on the sheet member 70 using, for example, a discharge device (resin discharge device) that can continuously discharge liquid resin by air pressure (see japanese patent application laid-open No. 2009-182307).

The housing 50B of the light-emitting module 200E and the light-emitting device 100E is substantially rectangular in plan view, and is formed of a plurality of different members. The frame 50B has bar-like members 51 made of a material having higher rigidity than the first covering member 40 on both long sides of the rectangle, and resin members 52 made of a resin containing a reflective material on both short sides of the rectangle. Specific examples of the rod-like member 51 include a metal, an alloy, and a ceramic.

The frame 50B can be formed, for example, by placing the rod-like member 51 on the long side region of the rectangle and providing the resin member 52 on the short side region of the rectangle. The rod-like member 51 may be provided only on one of the long sides of the rectangle.

The housing 50C of the light-emitting module 200F and the light-emitting device 100F is substantially rectangular in plan view, and both sides of the long side of the rectangle contain metal, alloy, or ceramic. The frame 50C has a bar-shaped member 51 made of a material having higher rigidity than the first covering member 40 placed on the long side of the rectangle, and a resin member 52 made of a resin containing a reflective material is provided in the rectangle so as to cover the bar-shaped member 51.

The rod-like member 51 is placed only on one of the long sides of the rectangle in the housing 50D of the light-emitting module 200G and the light-emitting device 100G. Otherwise, the same as the light-emitting module 200F and the light-emitting device 100F.

In the light emitting device, the bar-shaped member 51 is used for a part of the housing, so that the first cover member 40 can be prevented from being warped when the first cover member 40 is cured. The same applies to curing the second covering member 60.

The plurality of first element structures 15 of the light-emitting module 200H and the light-emitting device 100H are arranged in a matrix. Here, the first element structures 15 are arranged in 3 rows, and 27 first element structures 15 in total are provided in the first row 7, the second row 9, and the third row 11.

The plurality of first element structures 15 of the light-emitting module 200I and the light-emitting device 100I are arranged in a matrix of 2 rows and 11 columns. Here, the first element structures 15 located at both ends of each row are arranged to have a longer distance from the first element structures 15 adjacent in the row direction than the distance between the other first element structures 15 in the row direction.

The light-emitting module 200J and the light-emitting device 100J are obtained by combining the first element structures 15 having different light-emitting surface sizes. Here, the first element structure 15 having a small light emitting surface is arranged in a matrix of 2 rows and 6 columns in the center of the light emitting device 100J. Three first element structures 15 having a large light-emitting surface are arranged in the row direction on both sides of the row direction of the aggregate of the first element structures 15 having a small light-emitting surface. In the light emitting module 200J and the light emitting device 100J, the first element structures 15 having a small light emitting surface are arranged in the central portion, so that a large number of the first element structures 15 can be arranged more densely in the central portion than in the case where the first element structures 15 having a large light emitting surface are arranged. The light emitting module 200J and the light emitting device 100J are configured such that the first element structures 15 are densely arranged in the central portion, and thus, for example, when the light emitting module 200J is used as a light source of a vehicle headlamp, the central portion (mainly on a road) can be irradiated with higher definition.

The first element structures 15 of the light-emitting modules 200K and the light-emitting devices 100K are arranged in 2 rows and are staggered. Here, the first element structures 15 in the first row and the first element structures 15 in the second row are arranged to be shifted in the row direction so that the gap between the first element structures 15 in the first row and the first element structures 15 in the second row is 0 or less in the row direction. Since the light emitting module 200K and the light emitting device 100K can have the gap in the row direction of 0 or less, the light emitting module 200K can be used as a light source of a vehicle headlamp, for example, and can emit light in the lateral direction with higher definition.

In this way, the number of rows and columns of the light emitting module and the light emitting device are not limited, and the number of the first element structures 15 in each column and each row may be adjusted as appropriate according to a desired light distribution pattern. In addition, the combination of the first element structures 15 having different sizes of the light emitting surfaces of the light emitting module and the light emitting device, the arrangement of the first element structures 15, and the like may be appropriately adjusted according to the light distribution pattern.

The light-emitting module 200L includes the light-emitting device 100L and the module substrate 80.

The light-emitting device 100L includes: a plurality of third element structures 17 including the submount substrate 10, the light-emitting element 20, and the light transmissive member 30 in this order; and a first covering member 40 that covers the side surfaces of the third element structures 17 to hold the plurality of third element structures 17. Each of the plurality of third element structures 17 includes a protection element 25.

In other words, the light-emitting device 100L mainly includes the submount substrate 10, the light-emitting element 20, the protective element 25, the light transmissive member 30, and the first covering member 40.

The third element structure 17 includes a red element structure 17a that emits red light, a blue element structure 17b that emits blue light, and a green element structure 17c that emits green light. Here, the third element structures 17 are arranged in 2 rows and 2 columns, the two red element structures 17a are arranged diagonally, and the blue element structures 17b and the green element structures 17c are arranged diagonally.

The third element structure 17 is arranged such that each of the protection elements 25 is positioned outside. Thereby, the four light transmissive members 30 can be arranged in a matrix at narrower intervals.

As the red element structure 17a, for example, there is a red element structure including the blue light emitting element 20 and the light transmissive member 30 containing a red phosphor. The blue element structure 17b includes, for example, a blue light emitting element 20 and a light transmissive member 30 containing a diffusion material. The green element structure 17c includes, for example, a green element structure including a green light-emitting element 20 and a light-transmissive member 30 containing a diffusion material. Alternatively, the green element structure 17c may be, for example, a green element structure including the blue light-emitting element 20 and the light-transmissive member 30 containing a green phosphor.

As the light transmissive member 30 containing the red phosphor and the green phosphor, a light transmissive member in which a resin layer containing the phosphor and a glass layer containing the phosphor are formed on the surface of a glass plate can be used. As the light transmissive member 30 containing a diffusion material, a light transmissive member in which a resin layer containing a diffusion material and a glass layer containing a diffusion material are formed on the surface of a glass plate can be used.

When a plurality of element structures having different emission colors are combined as the third element structure 17, the height of each element structure is set to be the same, so that the first covering member 40 can be prevented from climbing up the upper surface of the light transmissive member 30. In each element structure, when the required amount of the phosphor is different in order to obtain a desired emission color, the difference in thickness of the resin layer due to the presence or absence of the phosphor can be adjusted by the thickness of the glass plate supporting the resin layer.

The light-emitting device 100L described above of the light-emitting module 200L is mounted on the module substrate 80.

The other points are the same as those of the light-emitting device 100 and the light-emitting module 200 of the first embodiment.

In addition, the light-emitting device may include one each of the red element structure 17a, the blue element structure 17b, and the green element structure 17 c. In the light-emitting device, the red element structures 17a, the blue element structures 17b, and the green element structures 17c may be alternately arranged in 1 row or in a matrix. The light-emitting device may include an element structure that emits white light and an element structure that emits amber light. In the light emitting device, the wavelength of the light emitting element 20 to be used, the kind of the phosphor contained in the light transmissive member 30, and the mixing ratio are adjusted, whereby an element structure that emits light of each color can be used. These element structures can be arranged in a desired combination.

The light-emitting module 200M is manufactured by using the module substrate 80 instead of the sheet member 70 as another example of the method of manufacturing the light-emitting module. In other words, the light emitting device is directly formed on the module substrate 80. The light emitting device here may be, for example, a portion of the light emitting module 200M including the first element structure 15, the first cover member 40, and the housing 50A.

In the light-emitting module 200M, the frame 50A using resin is directly bonded to the module substrate 80. The first cover member 40 of the light-emitting module 200M is provided on the module board 80 in the housing 50A, and the side surfaces of the third wiring portions 7 and the side surfaces of the conductive adhesive material 8 are also covered with the first cover member 40. The other matters are the same as those of the light emitting module 200 of the first embodiment.

The method of manufacturing the light emitting module 200M includes: a first element structure body preparation step S501 of preparing a plurality of first element structure bodies 15, the first element structure bodies 15 including the submount substrate 10, the light emitting element 20, and the light transmissive member 30 in this order; a first component structure mounting step S502 of mounting the plurality of first component structures 15 so that the sub-mount board 10 faces the module board 80; a frame forming step S503 of forming a frame 50A surrounding the plurality of first element structures 15 on the module substrate 80; and a first covering member forming step S504 of forming the first covering member 40 covering the side surfaces of the first element structures 15 in the housing 50A.

The first element structure preparing step S501 includes an aggregate substrate preparing step S501a, a light emitting element mounting step S501b, a light transmissive member providing step S501c, and a first element structure forming step S501 d. The first element structure preparation step S501 is the same as the first element structure preparation step S101 described above.

In the first component structure mounting step S502, the plurality of first component structures 15 are mounted on the upper surface of the module substrate 80. The first element structure 15 is mounted on the upper surface of the module board 80 via the conductive adhesive 8 with the formation surface of the second wiring portion 5 as a mounting surface.

In the frame forming step S503, the frame 50A is formed on the module substrate 80.

In the first covering member forming step S504, the first covering member 40 is formed in the frame 50A, and the side surface of the third wiring portion 7, the side surface of the conductive adhesive material 8, and the side surface of the first element structure 15 are covered with the first covering member 40.

Other matters can be performed according to the method for manufacturing the light-emitting module 200 and the light-emitting module 200D.

In the method of manufacturing the light-emitting module 200M, the frame 50A may be formed on the module substrate 80, and then the first component structure 15 may be mounted on the module substrate 80.

In addition, metal, alloy, or ceramic may be used for the frame.

The light-emitting device and the light-emitting module described above may or may not have a housing. In addition, when the housing is provided, the housing may be intermittently disposed along the outer periphery of the light emitting device. The height of the frame may be lower than the height of the first element structure. The submount substrate and the module substrate may be substantially square in a plan view, and the frame may be substantially square in a plan view. The submount, module substrate, and housing may have other shapes.

In addition, the method for manufacturing a light-emitting device and the method for manufacturing a light-emitting module may include other steps between the steps or before and after the steps, within a range that does not adversely affect the steps. For example, a foreign substance removal step of removing foreign substances mixed in during production may be included.

In the first device structure preparation step, after the plurality of light emitting devices 20 are mounted on the submount substrate 10, the light transmissive member 30 is provided on each of the light emitting devices 20. However, the light transmissive member 30 may be mounted on the submount substrate 10 after being provided on the light emitting element 20. After the collective substrate 11 is divided, the light-emitting elements 20 and the light transmissive members 30 may be provided on the sub-mount substrate 10. In the second element structure preparing step, the light emitting elements 20 may be provided on the sub mount board 10 after the collective board 11 is divided.

The light-emitting device 100 according to the first embodiment and the light-emitting device 100A according to the second embodiment may be manufactured by mounting the second element structure 16 on the sheet member 70 and then providing the light-transmissive member 30 on the light-emitting element 20.

In the method for manufacturing a light-emitting device and the method for manufacturing a light-emitting module, the order of some steps is not limited to the above order, and may be reversed. For example, the frame forming step of the above-described method for manufacturing a light-emitting device is performed before the first element structure mounting step or before the second element structure mounting step. However, the frame body forming step may be performed after the first element structure mounting step, before the first cover member forming step, or before the second cover member forming step. The frame body forming step may be performed after the second element structure mounting step, before the first covering member forming step, or before the second covering member forming step. The frame forming step may be performed before the first element structure preparing step or before the second element structure preparing step.

In the case where the second covering member is provided, the sheet member removing step may be performed after the second covering member forming step and before the first covering member forming step.

Industrial applicability of the invention

The light-emitting device and the light-emitting module according to the embodiments of the present disclosure can be used for a variable light distribution type headlamp light source. In addition, the light-emitting device and the light-emitting module according to the embodiments of the present disclosure can be used for various display devices such as a backlight light source of a liquid crystal display, various lighting fixtures, a large-sized display, an advertisement, and a destination guide, and can be further used for an image reading device, a projector device, and the like in a digital camera, a facsimile, a copier, a scanner, and the like.

Description of the reference numerals

2 … base body portion; 3 … a first wiring portion; 4 … internal wiring parts; 5 … second wiring part; 6 … substrate part; 7 … third wiring part; 8 … conductive adhesive material; 10 … submount substrate; 11 … collecting substrates; 12 … sub-mounting areas; 15. 15a … first element structure; 16 … second element structure; 17 … third element structure; 17a … red element structure; 17b … blue element structure; 17c … Green element Structure; 20 … light emitting element; 23 … element electrodes of the light emitting element; 25 … protective element; 27 … element electrodes of the protection element; 30 … light transmissive member; 40 … first cover member; 50. 50A, 50B, 50C, 50D … frame; 51 … rod-shaped members; 52 … resin component; 60 … second cover member; 70 … a sheet member; 80 … module substrate; 100. 100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H, 100I, 100J, 100K, 100L … light-emitting devices; 200. 200A, 200B, 200C, 200D, 200E, 200F, 200G, 200H, 200I, 200J, 200K, 200L, 200M … light-emitting module.

Claims

1. A method for manufacturing a light-emitting device, comprising the steps of:

preparing a plurality of first element structures, each of which includes a submount substrate, a light-emitting element, and a light-transmissive member in this order;

a step of mounting the plurality of first element structures so that the sub-mount substrate faces the sheet member; and

and forming a first covering member on the sheet member, the first covering member covering a side surface of each of the first element structures.

2. A method for manufacturing a light-emitting device, comprising the steps of:

a step of mounting the plurality of first element structures so that the sub-mount board and the sheet member face each other;

forming a second covering member on the sheet member, the second covering member covering a side surface of each of the sub-mount boards; and

and forming a first covering member on the second covering member, the first covering member covering a side surface of each of the light-emitting elements and a side surface of each of the light-transmissive members and having a higher light reflectance with respect to light from the light-emitting elements than the second covering member.

3. The method for manufacturing a light-emitting device according to claim 2,

the second covering member has a higher heat dissipation property than the first covering member.

4. The method for manufacturing a light-emitting device according to claim 1,

the method comprises the following steps: and a step of forming a frame body on the sheet member, the frame body surrounding the plurality of first element structures, the first cover member being formed in the frame body so as to cover a side surface of the first element structure with the first cover member, prior to the step of forming the first cover member on the sheet member.

5. The method for manufacturing a light-emitting device according to claim 2 or 3,

comprises the following procedures; and a step of forming a frame body surrounding the plurality of first element structures on the sheet member before the step of forming the second cover member on the sheet member, wherein the second cover member and the first cover member are formed in the frame body so as to cover a side surface of the submount substrate with the second cover member and cover a side surface of the light-emitting element and a side surface of the light transmissive member with the first cover member.

6. The method for manufacturing a light-emitting device according to claim 4 or 5,

the frame body is rectangular in plan view, and one or both sides of the long side of the rectangle contain metal, alloy, or ceramic.

7. The method for manufacturing a light-emitting device according to claim 4 or 5,

the frame body is metal, alloy or ceramic.

8. The method for manufacturing a light-emitting device according to any one of claims 1 to 7,

the step of preparing a plurality of first element structures includes the steps of:

preparing an aggregate substrate including a plurality of sub-mount regions that are divided into the sub-mount substrates;

placing the light emitting elements on the plurality of sub-mount regions;

a step of providing a light transmissive member on each of the light emitting elements; and

and a step of dividing the aggregate substrate into a plurality of first element structures for each of the sub-mounting regions.

9. A method for manufacturing a light-emitting device, comprising the steps of:

preparing a plurality of second element structures, each of which includes a sub-mount substrate and a light-emitting element in this order;

a step of mounting the plurality of second element structures so that the sub-mount board and the sheet member face each other;

a step of disposing a light-transmissive member on each of the light-emitting elements after the plurality of second element structures are mounted on the sheet member; and

and forming a first covering member on the sheet member, the first covering member covering a side surface of each of the second element structures and a side surface of each of the light transmissive members.

10. A method for manufacturing a light-emitting device, comprising the steps of:

a step of disposing a light-transmissive member on each of the light-emitting elements after the plurality of second element structures are mounted on the sheet member;

11. The method for manufacturing a light-emitting device according to claim 10,

12. The method for manufacturing a light-emitting device according to claim 9,

the method comprises the following steps: and a step of forming a frame body surrounding the plurality of second element structures on the sheet member, prior to the step of forming the first covering member on the sheet member, wherein the first covering member is formed in the frame body so as to cover a side surface of the second element structures and a side surface of the light transmissive member with the first covering member.

13. The method for manufacturing a light-emitting device according to claim 10 or 11,

the method comprises the following steps: and a step of forming a frame body on the sheet member, the frame body surrounding the plurality of second element structures, the second cover member and the first cover member being formed in the frame body so as to cover a side surface of the submount substrate with the second cover member and cover a side surface of the light-emitting element and a side surface of the light-transmissive member with the first cover member, prior to the step of forming the second cover member on the sheet member.

14. The method for manufacturing a light-emitting device according to claim 12 or 13,

the frame body is rectangular in plan view, and one or both sides of the long side of the rectangle contain metal or ceramic.

15. The method for manufacturing a light-emitting device according to claim 12 or 13,

the frame body is metal or ceramic.

16. The method for manufacturing a light-emitting device according to any one of claims 9 to 15,

the step of preparing a plurality of second element structures includes the steps of:

placing the light emitting elements on the plurality of sub-mount regions; and

and a step of dividing the aggregate substrate into a plurality of second element structures for each of the sub-mounting regions.

17. The method for manufacturing a light-emitting device according to any one of claims 1 to 16,

further comprising a step of removing the sheet member.

18. The method for manufacturing a light-emitting device according to any one of claims 1 to 17,

the first covering member is a light-reflective resin.

19. A method for manufacturing a light emitting module, comprising the steps of:

a step of preparing a light-emitting device by using the method for manufacturing a light-emitting device according to any one of claims 1 to 18; and

and a step of mounting the light-emitting device so that the submount substrate and the module substrate face each other.

20. A method for manufacturing a light emitting module, comprising the steps of:

a step of mounting the plurality of first element structures so that the submount substrate and the module substrate face each other;

forming a frame body surrounding the plurality of first element structures on the module substrate; and

and forming a first covering member in the housing, the first covering member covering a side surface of each of the first element structures.

21. A light-emitting device is provided with:

a plurality of first element structures which are provided with a sub-mount substrate, a light-emitting element, and a light-transmissive member in this order; and

and a first covering member that covers a side surface of each of the first element structures to hold the plurality of first element structures.

22. A light-emitting device is provided with:

a plurality of first element structures which are provided with a sub-mount substrate, a light-emitting element, and a light-transmissive member in this order;

a second covering member that covers a side surface of each of the sub-mount boards to hold the plurality of first element structures; and

and a first covering member that covers a side surface of each of the light emitting elements and a side surface of each of the light transmissive members, holds the plurality of first element structures, and has a higher light reflectance with respect to light from the light emitting elements than the second covering member.

23. The light emitting device of claim 22,

24. The light emitting device of claim 21,

the first cover member is disposed in the frame.

25. The light-emitting device according to claim 22 or 23,

the second cover member and the first cover member are disposed in the housing.

26. The light-emitting device according to claim 24 or 25,

27. The light-emitting device according to claim 24 or 25,

the frame body is metal, alloy or ceramic.

28. The light-emitting device according to any one of claims 21 to 26,

the first covering member is a light-reflective resin.

29. A light emitting module is provided with:

the light-emitting device according to any one of claims 21 to 28; and

and a module substrate on which the light emitting device is mounted so as to face the submount substrate.