JP5153950B1 - 発光ダイオード - Google Patents
発光ダイオード Download PDFInfo
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- JP5153950B1 JP5153950B1 JP2012094682A JP2012094682A JP5153950B1 JP 5153950 B1 JP5153950 B1 JP 5153950B1 JP 2012094682 A JP2012094682 A JP 2012094682A JP 2012094682 A JP2012094682 A JP 2012094682A JP 5153950 B1 JP5153950 B1 JP 5153950B1
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- 239000011347 resin Substances 0.000 claims abstract description 161
- 238000007789 sealing Methods 0.000 claims abstract description 68
- 239000006229 carbon black Substances 0.000 claims abstract description 64
- 239000000049 pigment Substances 0.000 claims abstract description 20
- 229920002050 silicone resin Polymers 0.000 claims description 30
- 239000003822 epoxy resin Substances 0.000 claims description 27
- 229920000647 polyepoxide Polymers 0.000 claims description 27
- 239000002245 particle Substances 0.000 claims description 25
- 238000002834 transmittance Methods 0.000 claims description 12
- 239000010410 layer Substances 0.000 description 55
- 239000000975 dye Substances 0.000 description 14
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 13
- 239000003795 chemical substances by application Substances 0.000 description 7
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- 239000000203 mixture Substances 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000000862 absorption spectrum Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 230000002238 attenuated effect Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 235000001630 Pyrus pyrifolia var culta Nutrition 0.000 description 1
- 240000002609 Pyrus pyrifolia var. culta Species 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052946 acanthite Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- XUARKZBEFFVFRG-UHFFFAOYSA-N silver sulfide Chemical compound [S-2].[Ag+].[Ag+] XUARKZBEFFVFRG-UHFFFAOYSA-N 0.000 description 1
- 229940056910 silver sulfide Drugs 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
【解決手段】LEDチップを樹脂封止してなるLEDにおいて、封止樹脂に顔料及び/又は染料を混入してなるLED。前記顔料及び/又は染料が波長400nm〜700nmの可視光を平均的に減少させる黒色染料及び/又は黒色顔料であって、前記LEDチップの発光波長にかかわらず、前記LEDからの発光光量及び/又は発光光度が所望の発光光量及び/又は所望の発光光度に抑制されている。前記顔料及び/又は染料がカーボンブラックである。
【選択図】図2
Description
封止樹脂を構成する二層の樹脂でLEDチップを封止してなるLEDにおいて、
前記二層の樹脂の中の前記LEDチップに近い一層目の樹脂に蛍光体が混入され、前記二層の樹脂の中の他方である二層目の樹脂に顔料を混入してなり、
前記顔料が、波長400nm〜700nmの可視光を平均的に減少させるカーボンブラックであって、
粒径範囲20nm〜3000nmの前記カーボンブラックが、
前記二層目の樹脂に対して0.00005重量%〜0.5重量%の混入割合で混入されていて、
前記LEDチップの発光波長にかかわらず、前記封止樹脂の光の透過率が抑制されて、前記LEDからの発光光量及び/又は発光光度が所望の発光光量及び/又は所望の発光光度に抑制されている
と共に、前記封止樹脂の電気抵抗率が抑制されている
ことを特徴とするLED
である。
前記二層目の樹脂の表面抵抗率が106Ω/□〜1012Ω/□であることを特徴とする請求項1記載のLED
である。
前記一層目の樹脂はシリコーン樹脂であることを特徴とする請求項1又は2記載のLED
である。
前記前記二層目の樹脂はエポキシ樹脂であることを特徴とする請求項3記載のLED
である。
2 PLCCのパッケージ樹脂
3 LEDチップ
4 透明封止樹脂
5 カーボンブラックを混ぜた封止樹脂
6 金ワイヤ
7 二層樹脂封止の時の一層目の樹脂
8 二層樹脂封止の時の二層目の樹脂
9 PLCCのパッケージ樹脂の反射面
10 チップLEDのガラスエポキシ基板部
11 チップLEDの封止樹脂
12 ガラスエポキシ基板に形成した凹部
13 二層樹脂封止の時の一層目の樹脂
14 二層樹脂封止の時の二層目の樹脂
Claims (4)
- 封止樹脂を構成する二層の樹脂でLEDチップを封止してなるLEDにおいて、
前記二層の樹脂の中の前記LEDチップに近い一層目の樹脂に蛍光体が混入され、前記二層の樹脂の中の他方である二層目の樹脂に顔料を混入してなり、
前記顔料が、波長400nm〜700nmの可視光を平均的に減少させるカーボンブラックであって、
粒径範囲20nm〜3000nmの前記カーボンブラックが、
前記二層目の樹脂に対して0.00005重量%〜0.5重量%の混入割合で混入されていて、
前記LEDチップの発光波長にかかわらず、前記封止樹脂の光の透過率が抑制されて、前記LEDからの発光光量及び/又は発光光度が所望の発光光量及び/又は所望の発光光度に抑制されている
と共に、前記封止樹脂の電気抵抗率が抑制されている
ことを特徴とするLED。 - 前記二層目の樹脂の表面抵抗率が106Ω/□〜1012Ω/□であることを特徴とする請求項1記載のLED。
- 前記一層目の樹脂はシリコーン樹脂であることを特徴とする請求項1又は2記載のLED。
- 前記二層目の樹脂はエポキシ樹脂であることを特徴とする請求項3記載のLED。
Priority Applications (1)
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---|---|---|---|
JP2012094682A JP5153950B1 (ja) | 2012-04-18 | 2012-04-18 | 発光ダイオード |
Applications Claiming Priority (1)
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---|---|---|---|
JP2012094682A JP5153950B1 (ja) | 2012-04-18 | 2012-04-18 | 発光ダイオード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5153950B1 true JP5153950B1 (ja) | 2013-02-27 |
JP2013222887A JP2013222887A (ja) | 2013-10-28 |
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JP2012094682A Active JP5153950B1 (ja) | 2012-04-18 | 2012-04-18 | 発光ダイオード |
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---|---|
JP (1) | JP5153950B1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014216329A (ja) * | 2013-04-22 | 2014-11-17 | E&E Japan株式会社 | チップledの製造方法 |
JP2014216642A (ja) * | 2013-08-20 | 2014-11-17 | E&E Japan株式会社 | チップled |
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CN103762292A (zh) * | 2014-01-17 | 2014-04-30 | 桂林电子科技大学 | 一种使用低反光的黑色emc塑封材料达到高反光效果的led封装工艺 |
CN103996788A (zh) * | 2014-05-21 | 2014-08-20 | 广东威创视讯科技股份有限公司 | 一种显示屏用led器件及其制作方法 |
KR102572819B1 (ko) * | 2016-02-23 | 2023-08-30 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광모듈 제조방법 및 표시장치 |
JP2017199748A (ja) * | 2016-04-26 | 2017-11-02 | スタンレー電気株式会社 | 発光装置 |
JP2019046989A (ja) * | 2017-09-04 | 2019-03-22 | スタンレー電気株式会社 | 半導体発光装置及び半導体発光装置の製造方法 |
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JP7098223B2 (ja) * | 2017-09-19 | 2022-07-11 | 株式会社ディスコ | ウェーハの加工方法 |
JP7067269B6 (ja) * | 2018-05-24 | 2023-12-20 | 大日本印刷株式会社 | 自発光型表示体 |
JP7243897B2 (ja) * | 2018-05-24 | 2023-03-22 | 大日本印刷株式会社 | 自発光型表示体 |
JP7372512B2 (ja) | 2018-09-28 | 2023-11-01 | 日亜化学工業株式会社 | 発光装置および発光装置の製造方法 |
JP7438322B2 (ja) * | 2020-02-27 | 2024-02-26 | 富士フイルム株式会社 | 着色組成物、着色硬化膜の製造方法、着色硬化膜、カラーフィルタ、有機el表示装置 |
CN111380814A (zh) * | 2020-04-26 | 2020-07-07 | 天津德高化成新材料股份有限公司 | 一种用于led封装的光学环氧塑封料及其墨色测量方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0578516A (ja) * | 1991-06-28 | 1993-03-30 | Matsushita Electric Ind Co Ltd | 非帯電性包装材用フイラーと非帯電性包装材用樹脂組成物及び非帯電性包装材 |
JPH0748461A (ja) * | 1993-08-05 | 1995-02-21 | Kobe Steel Ltd | 固定パレット用繊維強化複合樹脂材およびその製法 |
JP2001308393A (ja) * | 2000-02-18 | 2001-11-02 | Nichia Chem Ind Ltd | 発光ダイオード |
JP2004128424A (ja) * | 2002-10-07 | 2004-04-22 | Citizen Electronics Co Ltd | 白色発光装置 |
JP2008226909A (ja) * | 2007-03-08 | 2008-09-25 | Toyoda Gosei Co Ltd | 発光装置及び発光装置の製造方法 |
JP2011222574A (ja) * | 2010-04-05 | 2011-11-04 | Stanley Electric Co Ltd | 発光装置およびその製造方法 |
-
2012
- 2012-04-18 JP JP2012094682A patent/JP5153950B1/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0578516A (ja) * | 1991-06-28 | 1993-03-30 | Matsushita Electric Ind Co Ltd | 非帯電性包装材用フイラーと非帯電性包装材用樹脂組成物及び非帯電性包装材 |
JPH0748461A (ja) * | 1993-08-05 | 1995-02-21 | Kobe Steel Ltd | 固定パレット用繊維強化複合樹脂材およびその製法 |
JP2001308393A (ja) * | 2000-02-18 | 2001-11-02 | Nichia Chem Ind Ltd | 発光ダイオード |
JP2004128424A (ja) * | 2002-10-07 | 2004-04-22 | Citizen Electronics Co Ltd | 白色発光装置 |
JP2008226909A (ja) * | 2007-03-08 | 2008-09-25 | Toyoda Gosei Co Ltd | 発光装置及び発光装置の製造方法 |
JP2011222574A (ja) * | 2010-04-05 | 2011-11-04 | Stanley Electric Co Ltd | 発光装置およびその製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014216329A (ja) * | 2013-04-22 | 2014-11-17 | E&E Japan株式会社 | チップledの製造方法 |
JP2014216642A (ja) * | 2013-08-20 | 2014-11-17 | E&E Japan株式会社 | チップled |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |