KR100655252B1 - 백색 발광 장치 - Google Patents

백색 발광 장치 Download PDF

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Publication number
KR100655252B1
KR100655252B1 KR1020030069507A KR20030069507A KR100655252B1 KR 100655252 B1 KR100655252 B1 KR 100655252B1 KR 1020030069507 A KR1020030069507 A KR 1020030069507A KR 20030069507 A KR20030069507 A KR 20030069507A KR 100655252 B1 KR100655252 B1 KR 100655252B1
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KR
South Korea
Prior art keywords
light emitting
emitting device
white light
recess
cover member
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Expired - Fee Related
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KR1020030069507A
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English (en)
Korean (ko)
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KR20040031661A (ko
Inventor
노구치가츠히코
호리우치메구미
Original Assignee
가부시키가이샤 시티즌 덴시
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Publication of KR20040031661A publication Critical patent/KR20040031661A/ko
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Publication of KR100655252B1 publication Critical patent/KR100655252B1/ko
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/8506Containers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8514Wavelength conversion means characterised by their shape, e.g. plate or foil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Luminescent Compositions (AREA)
KR1020030069507A 2002-10-07 2003-10-07 백색 발광 장치 Expired - Fee Related KR100655252B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002294326A JP4280050B2 (ja) 2002-10-07 2002-10-07 白色発光装置
JPJP-P-2002-00294326 2002-10-07

Publications (2)

Publication Number Publication Date
KR20040031661A KR20040031661A (ko) 2004-04-13
KR100655252B1 true KR100655252B1 (ko) 2006-12-08

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030069507A Expired - Fee Related KR100655252B1 (ko) 2002-10-07 2003-10-07 백색 발광 장치

Country Status (6)

Country Link
US (1) US7180240B2 (enExample)
EP (1) EP1408559A3 (enExample)
JP (1) JP4280050B2 (enExample)
KR (1) KR100655252B1 (enExample)
CN (1) CN1310345C (enExample)
TW (1) TWI236159B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101121745B1 (ko) 2010-03-31 2012-03-22 (주)포인트엔지니어링 광소자 디바이스 및 그 제조 방법
KR101878270B1 (ko) * 2011-09-15 2018-07-13 엘지이노텍 주식회사 광여기 판을 포함하는 조명 장치 및 광여기 테이프

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JP4788109B2 (ja) * 2003-10-28 2011-10-05 パナソニック電工株式会社 半導体発光装置及びその製造方法
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TWI244226B (en) 2004-11-05 2005-11-21 Chen Jen Shian Manufacturing method of flip-chip light-emitting device
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JP4485856B2 (ja) * 2004-06-10 2010-06-23 スタンレー電気株式会社 大電力用ledランプ
USD512029S1 (en) * 2004-06-28 2005-11-29 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
JP4996463B2 (ja) * 2004-06-30 2012-08-08 クリー インコーポレイテッド 発光デバイスをパッケージするためのチップスケール方法およびチップスケールにパッケージされた発光デバイス
US20060006791A1 (en) * 2004-07-06 2006-01-12 Chia Chee W Light emitting diode display that does not require epoxy encapsulation of the light emitting diode
JP2006049442A (ja) 2004-08-02 2006-02-16 Sharp Corp 半導体発光装置およびその製造方法
US7256057B2 (en) * 2004-09-11 2007-08-14 3M Innovative Properties Company Methods for producing phosphor based light sources
TWD110646S1 (zh) * 2004-10-19 2006-05-01 羅姆電子股份有限公司 發光二極體
TWD110647S1 (zh) * 2004-10-19 2006-05-01 羅姆電子股份有限公司 發光二極體
USD521946S1 (en) * 2004-10-19 2006-05-30 Rohm Co., Ltd. Light emitting diode
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USD521950S1 (en) * 2004-10-19 2006-05-30 Rohm Co., Ltd. Light emitting diode
TWD110644S1 (zh) * 2004-10-19 2006-05-01 羅姆電子股份有限公司 發光二極體
USD544847S1 (en) * 2004-10-19 2007-06-19 Rohm Co., Ltd. Light emitting diode
USD521463S1 (en) * 2004-10-19 2006-05-23 Rohm Co., Ltd. Light emitting diode
USD536308S1 (en) * 2004-10-19 2007-02-06 Rohm Co., Ltd. Light emitting diode
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KR100867515B1 (ko) * 2004-12-06 2008-11-07 삼성전기주식회사 발광소자 패키지
KR100580753B1 (ko) 2004-12-17 2006-05-15 엘지이노텍 주식회사 발광소자 패키지
JP4591071B2 (ja) * 2004-12-20 2010-12-01 日亜化学工業株式会社 半導体装置
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KR100807015B1 (ko) * 2005-08-16 2008-02-25 가부시끼가이샤 도시바 발광 장치
JP2007073575A (ja) * 2005-09-05 2007-03-22 Matsushita Electric Ind Co Ltd 半導体発光装置
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JP4749870B2 (ja) * 2006-01-24 2011-08-17 新光電気工業株式会社 発光装置の製造方法
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JP5956937B2 (ja) * 2006-02-03 2016-07-27 日立化成株式会社 光半導体素子搭載用パッケージ基板の製造方法
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KR101121745B1 (ko) 2010-03-31 2012-03-22 (주)포인트엔지니어링 광소자 디바이스 및 그 제조 방법
KR101878270B1 (ko) * 2011-09-15 2018-07-13 엘지이노텍 주식회사 광여기 판을 포함하는 조명 장치 및 광여기 테이프

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CN1497747A (zh) 2004-05-19
JP2004128424A (ja) 2004-04-22
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JP4280050B2 (ja) 2009-06-17
TWI236159B (en) 2005-07-11
TW200414568A (en) 2004-08-01
EP1408559A3 (en) 2006-07-05
US20040070338A1 (en) 2004-04-15
US7180240B2 (en) 2007-02-20
KR20040031661A (ko) 2004-04-13

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