CN1205627C - 单块陶瓷电子元件及其制造方法，和陶瓷糊浆及其制造方法 - Google Patents
单块陶瓷电子元件及其制造方法，和陶瓷糊浆及其制造方法 Download PDFInfo
- Publication number
- CN1205627C CN1205627C CNB001364227A CN00136422A CN1205627C CN 1205627 C CN1205627 C CN 1205627C CN B001364227 A CNB001364227 A CN B001364227A CN 00136422 A CN00136422 A CN 00136422A CN 1205627 C CN1205627 C CN 1205627C
- Authority
- CN
- China
- Prior art keywords
- ceramic
- mixture
- organic solvent
- mud
- electronic element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 346
- 238000000034 method Methods 0.000 title claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 239000000843 powder Substances 0.000 claims abstract description 89
- 239000003960 organic solvent Substances 0.000 claims abstract description 72
- 239000002002 slurry Substances 0.000 claims abstract description 37
- 239000002131 composite material Substances 0.000 claims abstract description 12
- 238000010304 firing Methods 0.000 claims abstract description 7
- 238000007493 shaping process Methods 0.000 claims abstract 2
- 239000000203 mixture Substances 0.000 claims description 89
- 239000006185 dispersion Substances 0.000 claims description 49
- 238000001704 evaporation Methods 0.000 claims description 46
- 230000008020 evaporation Effects 0.000 claims description 46
- 229920005989 resin Polymers 0.000 claims description 45
- 239000011347 resin Substances 0.000 claims description 45
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 41
- 239000003985 ceramic capacitor Substances 0.000 claims description 33
- 229920002678 cellulose Polymers 0.000 claims description 31
- 229920001577 copolymer Polymers 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 27
- 229920000058 polyacrylate Polymers 0.000 claims description 25
- 238000010276 construction Methods 0.000 claims description 24
- 125000005250 alkyl acrylate group Chemical group 0.000 claims description 23
- 238000009835 boiling Methods 0.000 claims description 21
- 239000000178 monomer Substances 0.000 claims description 20
- 238000002156 mixing Methods 0.000 claims description 19
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 18
- 239000011118 polyvinyl acetate Substances 0.000 claims description 18
- -1 alkyl methacrylate Chemical compound 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 125000004442 acylamino group Chemical group 0.000 claims description 3
- 125000005702 oxyalkylene group Chemical group 0.000 claims 1
- 239000011230 binding agent Substances 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 30
- 230000000052 comparative effect Effects 0.000 description 19
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 17
- 239000003990 capacitor Substances 0.000 description 15
- 238000002360 preparation method Methods 0.000 description 15
- 230000015572 biosynthetic process Effects 0.000 description 14
- 239000004020 conductor Substances 0.000 description 14
- 238000005245 sintering Methods 0.000 description 14
- 238000001035 drying Methods 0.000 description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 13
- 239000002585 base Substances 0.000 description 11
- 238000003475 lamination Methods 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 9
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 9
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 9
- 229940116411 terpineol Drugs 0.000 description 9
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 7
- 125000002947 alkylene group Chemical group 0.000 description 7
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 6
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 6
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 6
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 238000004821 distillation Methods 0.000 description 6
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 6
- UODXCYZDMHPIJE-UHFFFAOYSA-N menthanol Chemical compound CC1CCC(C(C)(C)O)CC1 UODXCYZDMHPIJE-UHFFFAOYSA-N 0.000 description 6
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 6
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 5
- 230000032798 delamination Effects 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000012528 membrane Substances 0.000 description 5
- HXVNBWAKAOHACI-UHFFFAOYSA-N 2,4-dimethyl-3-pentanone Chemical compound CC(C)C(=O)C(C)C HXVNBWAKAOHACI-UHFFFAOYSA-N 0.000 description 4
- YMDRKQVJDIXFSZ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;oxirane Chemical compound C1CO1.CC(=C)C(O)=O YMDRKQVJDIXFSZ-UHFFFAOYSA-N 0.000 description 4
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 206010013786 Dry skin Diseases 0.000 description 4
- 239000001856 Ethyl cellulose Substances 0.000 description 4
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- 238000007334 copolymerization reaction Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- 229920001249 ethyl cellulose Polymers 0.000 description 4
- 235000019325 ethyl cellulose Nutrition 0.000 description 4
- 239000000395 magnesium oxide Substances 0.000 description 4
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 229910001928 zirconium oxide Inorganic materials 0.000 description 4
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 3
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 3
- 230000006837 decompression Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 3
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 3
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000011297 pine tar Substances 0.000 description 3
- 229940068124 pine tar Drugs 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 2
- CCJAYIGMMRQRAO-UHFFFAOYSA-N 2-[4-[(2-hydroxyphenyl)methylideneamino]butyliminomethyl]phenol Chemical compound OC1=CC=CC=C1C=NCCCCN=CC1=CC=CC=C1O CCJAYIGMMRQRAO-UHFFFAOYSA-N 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 239000004567 concrete Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 2
- VQCBHWLJZDBHOS-UHFFFAOYSA-N erbium(iii) oxide Chemical compound O=[Er]O[Er]=O VQCBHWLJZDBHOS-UHFFFAOYSA-N 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- SJIXRGNQPBQWMK-UHFFFAOYSA-N 2-(diethylamino)ethyl 2-methylprop-2-enoate Chemical compound CCN(CC)CCOC(=O)C(C)=C SJIXRGNQPBQWMK-UHFFFAOYSA-N 0.000 description 1
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- QHWIAGPQYKXGQV-UHFFFAOYSA-N 5-methyl-3-(2-methylpropyl)hexan-2-one Chemical compound CC(C)CC(C(C)=O)CC(C)C QHWIAGPQYKXGQV-UHFFFAOYSA-N 0.000 description 1
- GHUXAYLZEGLXDA-UHFFFAOYSA-N 8-azido-5-ethyl-6-phenylphenanthridin-5-ium-3-amine;bromide Chemical compound [Br-].C12=CC(N=[N+]=[N-])=CC=C2C2=CC=C(N)C=C2[N+](CC)=C1C1=CC=CC=C1 GHUXAYLZEGLXDA-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GSYWJWFOKRBGQB-UHFFFAOYSA-N N(=O)OC(C)CCCCCC.C(C(=C)C)(=O)O Chemical compound N(=O)OC(C)CCCCCC.C(C(=C)C)(=O)O GSYWJWFOKRBGQB-UHFFFAOYSA-N 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical class CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- GEZAXHSNIQTPMM-UHFFFAOYSA-N dysprosium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Dy+3].[Dy+3] GEZAXHSNIQTPMM-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 235000019256 formaldehyde Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- 229960004194 lidocaine Drugs 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 230000036244 malformation Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 238000006384 oligomerization reaction Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- UZLYXNNZYFBAQO-UHFFFAOYSA-N oxygen(2-);ytterbium(3+) Chemical compound [O-2].[O-2].[O-2].[Yb+3].[Yb+3] UZLYXNNZYFBAQO-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910003451 terbium oxide Inorganic materials 0.000 description 1
- SCRZPWWVSXWCMC-UHFFFAOYSA-N terbium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Tb+3].[Tb+3] SCRZPWWVSXWCMC-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 229910003454 ytterbium oxide Inorganic materials 0.000 description 1
- 229940075624 ytterbium oxide Drugs 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/62625—Wet mixtures
- C04B35/6264—Mixing media, e.g. organic solvents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/03—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on magnesium oxide, calcium oxide or oxide mixtures derived from dolomite
- C04B35/04—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on magnesium oxide, calcium oxide or oxide mixtures derived from dolomite based on magnesium oxide
- C04B35/053—Fine ceramics
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
- C04B35/111—Fine ceramics
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/26—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on ferrites
- C04B35/2658—Other ferrites containing manganese or zinc, e.g. Mn-Zn ferrites
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
- C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
- C04B35/486—Fine ceramics
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
- C04B35/49—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates
- C04B35/491—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates based on lead zirconates and lead titanates, e.g. PZT
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/56—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides
- C04B35/565—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/584—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
- C04B35/63404—Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C04B35/63416—Polyvinylalcohols [PVA]; Polyvinylacetates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
- C04B35/63404—Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C04B35/63424—Polyacrylates; Polymethacrylates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/636—Polysaccharides or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/636—Polysaccharides or derivatives thereof
- C04B35/6365—Cellulose or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/638—Removal thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
- C04B37/005—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of glass or ceramic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/043—Printed circuit coils by thick film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
- B32B2038/042—Punching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/02—Noble metals
- B32B2311/08—Silver
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/22—Nickel or cobalt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/14—Printing or colouring
- B32B38/145—Printing
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3206—Magnesium oxides or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3262—Manganese oxides, manganates, rhenium oxides or oxide-forming salts thereof, e.g. MnO
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/327—Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3275—Cobalt oxides, cobaltates or cobaltites or oxide forming salts thereof, e.g. bismuth cobaltate, zinc cobaltite
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/327—Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3279—Nickel oxides, nickalates, or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/36—Glass starting materials for making ceramics, e.g. silica glass
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/04—Ceramic interlayers
- C04B2237/06—Oxidic interlayers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/04—Ceramic interlayers
- C04B2237/06—Oxidic interlayers
- C04B2237/064—Oxidic interlayers based on alumina or aluminates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/04—Ceramic interlayers
- C04B2237/06—Oxidic interlayers
- C04B2237/068—Oxidic interlayers based on refractory oxides, e.g. zirconia
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/04—Ceramic interlayers
- C04B2237/08—Non-oxidic interlayers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/04—Ceramic interlayers
- C04B2237/08—Non-oxidic interlayers
- C04B2237/083—Carbide interlayers, e.g. silicon carbide interlayers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/04—Ceramic interlayers
- C04B2237/09—Ceramic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/405—Iron metal group, e.g. Co or Ni
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/407—Copper
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/408—Noble metals, e.g. palladium, platina or silver
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/68—Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Composite Materials (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
制造单块陶瓷电子元件的方法，包括：提供陶瓷淤浆、导电糊和陶瓷糊浆；形成多个复合结构；各个结构包括由陶瓷淤浆成形制成的陶瓷坯料片，由导电糊局部施涂在陶瓷坯料片主表面上从而造成阶梯状区域的形成的内线路元件薄膜，以及用于补偿该阶梯状区域造成的空隙的陶瓷坯料层，所述陶瓷坯料层是将陶瓷糊浆施涂在陶瓷坯料片主表面上未形成元件薄膜的区域，从而基本补偿所述空隙；将复合结构叠合在一起形成叠合物坯料；烧制该叠合物坯料，其中的陶瓷糊浆包括陶瓷粉末、有机溶剂和有机粘合剂。还公开了采用该方法制造的单块陶瓷电子元件；陶瓷糊浆及其制备方法。
Description
技术领域
本发明涉及一种单块陶瓷电子元件及其制造方法，并涉及陶瓷糊浆及其制造方法。更具体地说，本发明涉及的单块陶瓷电子元件包括形成于陶瓷片材之间的内线路元件薄膜，以及用于补偿由内线路元件薄膜形成的阶梯状区域造成的空隙的陶瓷层，形成的各陶瓷层使之形状与相应的薄膜相反；涉及这种电子元件的制造方法；并涉及能有利于形成所述陶瓷层的陶瓷糊浆及其制造方法。
发明背景
当制造单块陶瓷电子元件(如单块陶瓷电容器)时，先形成多块陶瓷坯料片，随后叠合这些坯料片。根据单块陶瓷电子元件所需的性能，在具体的陶瓷坯料片上形成内线路元件薄膜(如导电薄膜或电阻薄膜)，该薄膜可作为电容、电阻、电感器、变阻器、滤波器等的元件。
近年来一直对电子元件(如移动通讯设备)进行小型化并降低重量。例如，当将单块陶瓷电子元件作为电路元件用于这种电子设备中时，必须降低这种电子元件的大小和重量。例如，越来越需要小尺寸和大容量的单块陶瓷电容器。
制备单块陶瓷电容器的常规方法如下：将介电陶瓷粉末、有机粘合剂、增塑剂和有机溶剂混合在一起制得陶瓷淤浆。用刮刀法或类似的方法在支承膜(如聚酯膜，它涂覆硅氧烷树脂作为剥离剂)上将得到的陶瓷淤浆制成数十微米厚的片材，形成陶瓷坯料片，随后干燥该坯料片。
接着，用网印法在陶瓷坯料片的主表面上施涂导电糊，形成相互隔开的多种图案。随后干燥形成的片材，在片材上形成作为内线路元件薄膜的内电极。图7是陶瓷坯料片2部分的平面图，其上面形成有内电极1，如上所述该内电极分布在多个位置。
随后从支承膜上剥离陶瓷坯料片2，将其切割成合适的大小。随后局部如图6所示将预定量的多片坯料叠合在一起。另外，将预定量的不含内电极的陶瓷坯料片叠合在形成的叠合物的相反表面上，形成层叠物坯料3。
沿相对于水平面的垂直方向压制该层叠物坯料3，随后如图8所示将其切割成层叠的小片4，该小片具有合适的尺寸，能用作单独的单块陶瓷电容器。接着从各小片除去粘合剂，烧制形成的小片，随后在小片上形成外电极，从而制得单块陶瓷电容器。
为了减小这种电容器的尺寸并提高其电容量，必须增加叠合的陶瓷坯料片2和内电极1的数量，同时必须降低陶瓷坯料片2的厚度。
但是，当如上所述增加叠合的坯料片和内电极的数量并降低坯料片的厚度时，内电极1会叠加(accumulate)。结果，有内电极1的部分和无内电极的部分(或者沿相对水平面的垂直方向具有相对大量内电极1的部分与沿垂直方向具有较少内电极1的部分)之间的厚度差异更明显。因此，如图8所示，形成的叠合小片4的外形变形，其主表面呈突起状。
当叠合的小片4如图8所示变形时，在压制过程中在无内电极的部分或者沿与水平面垂直方向有较少量电极1的部分会产生较大的应变。另外，陶瓷坯料片2之间的粘性下降，并且会产生结构缺陷(如脱层或微开裂)，这种缺陷是烧制过程中小片内应力造成的。
当叠合小片4如图8所示变形时，内电极1也会有不希望有的形变，从而会导致短路。
上述问题会降低形成的单块陶瓷电容器的可靠性。
为了解决上述问题，例如日本未审定公开专利56-94719、3-74820和9-106925公开了一种方法，如图2所示它在陶瓷坯料片2的无内电极1的区域形成陶瓷坯料层5，从而基本补偿由陶瓷坯料片2上的内电极1造成的阶梯状区域形成的空隙。
如上所述，在形成用于补偿阶梯状区域造成的空隙的陶瓷坯料层5的情况下，当形成如图1部分所示的层叠物坯料3a时，在有电极1的区域和无电极1的区域，或者在沿相对水平面的垂直方向有相对大量的内电极1的区域和沿垂直方向有相对少量电极1的区域之间的厚度差异不明显。因此，如图3所示，形成的叠合小片4a不会如图8所示那样有不希望有的形变。
结果，不会发生上述结构缺陷(如脱层或微开裂)或者由于内电极1的变形导致的短路，从而提高形成的单块陶瓷电容器的可靠性。
上述用于补偿阶梯状区域造成的空隙的陶瓷坯料层5的组成与陶瓷坯料片2的组成相同，坯料层5是将含有介电陶瓷粉末、有机粘合剂、增塑剂和有机溶剂的陶瓷糊浆涂覆在坯料层2上制得的。为了通过网印高精度地制得层5使之厚度(例如2微米或更小)与内电极1的厚度相等，陶瓷粉末必须在陶瓷糊浆中具有高的分散性。
对于上述文献，例如日本未审定专利申请No.3-74820公开了一种陶瓷糊浆的制造方法，其中使用三辊研磨机分散陶瓷粉末。但是，仅使用三辊研磨机难以提高陶瓷粉末的分散性。
日本未审定专利申请No.9-106925公开了用于形成陶瓷坯料片2的陶瓷淤浆是通过混合介电陶瓷粉末、有机粘合剂和具有低沸点的第一有机溶剂而制得的，并将形成的淤浆用于制造陶瓷坯料片2；将该淤浆与沸点高于第一有机溶剂沸点的第二有机溶剂相混合，并加热形成的混合物以从混合物中仅除去第一有机溶剂，制得的陶瓷糊浆用于形成陶瓷坯料层5，以补偿阶梯状区域造成的空隙。
如上所述，当至少通过两个混合步骤制得陶瓷糊浆时，在某种程度上改进了陶瓷粉末的分散性。但是，由于淤浆或糊浆含有有机粘合剂，因此在混合过程中糊浆或淤浆的粘度变高。当使用例如球磨设备时，粘度上升限制了陶瓷粉末分散性的改进。
前面已提到，要求用于形成用来补偿阶梯状区域造成的空隙的陶瓷坯料层5(该层非常薄，厚度等于内电极1的厚度)的陶瓷糊浆中陶瓷粉末具有高的分散性。当降低内电极1的厚度时，陶瓷粉末必须表现出相应更高的分散性。
即使在陶瓷坯料层5中陶瓷粉末的分散性较小，在该层5上的陶瓷坯料片2也会在某种程度上补偿这种低的分散性。但是，当片材2的厚度降低时，该片不能完全补偿这种低的分散性。
因此，随着小尺寸大容量的单块陶瓷电容器的发展，日益需要用于补偿阶梯状区域造成的空隙的陶瓷坯料层5中所含的陶瓷粉末具有高的分散性。
为了在混合过程中提高陶瓷粉末在陶瓷糊浆中的分散性，可降低糊浆的粘度。但是，当增加上述低沸点有机溶剂的量以降低糊浆的粘度时，在分散陶瓷粉末后需要更长时间来除去溶剂。
当通过烧制包括三种不同元件，陶瓷坯料片2、内电极1和弥补由该电极形成的阶梯形区域造成的空隙的陶瓷坯料层5的层叠物坯料3a，制造单块陶瓷电容器时，这三种元件在去粘合然后烧制期间收缩。结果，在电容器中出现由于三种元件的物理性能差异引起的应力，该应力会引起电容器内的结构缺陷。
日本未审定专利申请No.9-106925公开的方法中，在用于形成弥补阶梯形区域造成的空隙的陶瓷坯料层5的陶瓷糊浆中的有机粘合剂与用于形成陶瓷坯料片2的陶瓷糊浆中的有机粘合剂相同。简单地说，将有机粘合剂溶解在同样的有机溶剂中。因此，当陶瓷坯料片2叠合在已经干燥的陶瓷坯料层5上时，干燥后的层5中包含的有机粘合剂被片2中的有机溶剂溶解，因此层5被有机溶剂浸渍。鉴于上面所述，日本未审定专利申请No.9-106925公开的陶瓷糊浆不一定适合非常薄的陶瓷层如用于弥补由阶梯形区域造成的空隙的陶瓷坯料层5的陶瓷糊桨。
上面参照单块陶瓷电容器描述了要解决的问题，但是相同的问题也存在于其它单块陶瓷电子元件中，例如单块电感器中。
发明内容
鉴于上面所述，本发明的目的是提供一种制造能解决所述问题的单块陶瓷电子元件的方法；以及采用这种方法制造的单块陶瓷电子元件。
本发明的另一个目的是提供适合制造非常薄的陶瓷坯料层如上面所述用于补偿阶梯形区域造成的空隙的陶瓷层的陶瓷糊浆；以及制造这种糊浆的方法。
因此，本发明提供一种单块陶瓷电子元件的制造方法。该方法包括下列步骤：
首先，提供陶瓷淤浆、导电糊和陶瓷糊浆；
接着，形成多个复合结构；各个结构包括由陶瓷淤浆制成的陶瓷坯料片，由导电糊局部施涂在陶瓷坯料片主表面上从而造成阶梯状区域而形成的内线路元件薄膜，以及用于补偿该阶梯状区域造成的空隙的陶瓷坯料层，所述陶瓷坯料层是将陶瓷糊浆施涂在陶瓷坯料片主表面上未形成元件薄膜的区域，从而基本补偿所述空隙而形成的；
最后，将复合结构叠合在一起形成叠合物坯料。
随后烧制该叠合物坯料。
在由包括上述基本步骤的单块陶瓷电子元件的制造方法中，用于形成弥补阶梯形区域造成的空隙的陶瓷坯料层的陶瓷糊浆包括陶瓷粉末、有机溶剂和有机粘合剂。本发明的特征在于陶瓷糊浆中的有机粘合剂。
有机粘合剂是通过物理混合两种不同有机粘合剂形成的混合物，如聚乙烯醇缩丁醛和纤维素酯的混合物、聚丙烯酸酯和纤维素酯的混合物、聚乙烯醇缩丁醛和聚乙酸乙烯酯的混合物、或聚乙烯醇缩丁醛和聚丙烯酸酯的混合物；或主要包括丙烯酸烷酯和/或甲基丙烯酸烷酯的共聚物。
当上述主要包括丙烯酸烷酯和/或甲基丙烯酸烷酯的共聚物作为有机粘合剂时，共聚物可包含作为共聚组分的具有羧基烯化氧基(RO)n、羟基、缩水甘油基、氨基或酰氨基的活性单体。
包括有机粘合剂的陶瓷糊浆宜通过下列步骤制备。
陶瓷糊浆的制备方法包括：第一分散步骤，该步骤对含有陶瓷粉末和第一有机溶剂的第一混合物进行初级分散，提供初级分散体；以及第二分散步骤，该步骤对含有有机粘合剂和经第一分散步骤处理的第一混合物的第二混合物进行二级分散，提供二级分散体。应注意有机粘合剂是在第二分散步骤过程中加入的。除了第一有机溶剂外，使用相对蒸发速率小于第一有机溶剂的第二有机溶剂。第二有机溶剂可以在第一分散步骤或第二分散步骤加入。或者，在第一分散步骤加入第二有机溶剂，在第二分散步骤再加入。完成第二分散步骤后，加热第二混合物，从该混合物选择性地除去第一有机溶剂。
本发明中，用于形成陶瓷坯料片的陶瓷淤浆含有的陶瓷粉末组成宜与用于形成弥补阶梯形区域造成的空隙的陶瓷坯料层的陶瓷糊浆中的陶瓷粉末相同。
较好的是，在陶瓷淤浆和陶瓷糊浆中含有介电陶瓷粉末。在这种情况下，当内线路元件薄膜是排列成相互间能产生电容的内电极时，可制得单块陶瓷电容器。
较好的是，在陶瓷淤浆和陶瓷糊浆中含有磁性陶瓷粉末。在这种情况下，当内线路元件薄膜形成钩形导电薄膜时，可制得单块电感器。
本发明还提供用上述方法制得的单块陶瓷电子元件。
本发明还提供如上所述的陶瓷糊浆及其制造方法。
附图说明
下面参照附图的详细描述可更好地理解本发明的其它目的、特征和许多附加优点。附图中
图1是本发明一个实例的部分叠合物坯料3a的剖面示意图，说明感兴趣的单块陶瓷电容器的制造方法；
图2是复合结构6部分的平面图，该结构是用图1所示的单块陶瓷电容器的制造方法制得的；
图3是叠合小片4a的剖面示意图，它是用图1所示的单块陶瓷电容器的制造方法制得的；
图4是本发明另一个实例中，构成用于制造单块电感器的叠合物坯料13的元件分解透视图；
图5是含有叠合片12的单块电感器11的外观透视图，该单块电感器是通过烧制图4所示的叠合物坯料13而制得的；
图6是部分叠合物坯料3的剖面示意图，说明感兴趣的常规单块陶瓷电容器的制造方法；
图7是部分陶瓷坯料片2的平面图，在该坯料片上通过图6所示的单块陶瓷电容器的制造方法形成内电极1；以及
图8叠合小片4的剖面示意图，它是用图6所示的单块陶瓷电容器的制造方法制得的。
具体实施方式
下面以单块陶瓷电容器的制造方法为例说明本发明的一个实例。该制造方法将参照图1至图3进行描述。
为了实施本实例，提供用于形成陶瓷坯料片2的陶瓷淤浆，用于形成内电极1的导电糊，和形成用于补偿构成电极1的阶梯状区域形成的空隙的陶瓷坯料层5的陶瓷糊浆。
陶瓷淤浆是将介电陶瓷粉末、有机粘合剂、增塑剂和沸点相对较低的有机溶剂混合在一起而制得的。使用刮刀法或相似的方法使陶瓷淤浆在支承膜(如聚酯膜，图中未表示)上形成片材，该支承膜涂覆有树脂(如硅氧烷树脂)作为剥离剂，从而得到陶瓷坯料片2。随后，干燥该片材，干燥后陶瓷坯料片2的厚度为数微米。
在陶瓷坯料片2的主表面上形成内电极1，使之分布在多个位置。烧制后各电极的厚度约为1微米。内电极1是例如将导电糊网印施涂在陶瓷坯料片2上，随后干燥该导电糊而形成的。各个内电极1均具有预定的厚度，从而在陶瓷坯料片2上形成由内电极1构成的阶梯状区域造成的空隙。
接着，在陶瓷坯料片2的该主表面的未形成内电极1的区域形成陶瓷坯料层5，以便基本补偿由所述阶梯状区域造成的空隙。陶瓷坯料层5是将陶瓷糊浆网印在陶瓷坯料片2上形成的，使其图案与内电极1相反，随后干燥形成的层5。本发明的特征在于用于形成层5的陶瓷糊浆，该糊浆将在下面详细描述。
在上面描述中，陶瓷坯料层5是在内电极1形成后制得的。但是，该陶瓷坯料层5也可在内电极1形成前制得。
制备多个复合结构6。如图2所示各个复合结构6包括陶瓷坯料片2、内电极1和陶瓷坯料层5，电极和坯料层是如上所述形成在坯料片上的。从支承膜上剥离各个复合结构，随后切割成为合适大小的片。将预定量的片叠合成叠合产物，接着在该产物的相反两个表面叠合不含这种内电极和陶瓷坯料层的陶瓷坯料片，从而形成局部如图1所示的叠合物坯料3a。
沿与水平面垂直的方向压制叠合坯料3a，随后如图3所示将其切割成适当大小的叠合小片4a，使得每块小片均适用于制造单块陶瓷电容器。接着，从叠合小片上除去粘合剂，并烧制形成的小片。随后在小片上形成外电极制得单块陶瓷电容器。
如上所述，在形成陶瓷坯料层5后，在局部如图1所示的叠合物坯料3a中具有电极1的区域和不具有电极1区域(或者在沿与水平面垂直方向具有相对大量内电极1的区域和沿与水平面垂直的方向具有少量电极的区域)之间的厚度无明显差异。因此，如图3所示，叠合小片4a不会发生如图8所示那样的不希望有的变形。结果，在形成的单块陶瓷电容器中不会发生结构缺陷，如脱层或微开裂或者短路。
本发明的特征在于用于形成陶瓷坯料层5的陶瓷糊浆中的有机粘合剂。使用的有机粘合剂的例子包括聚乙烯醇缩丁醛和纤维素酯的混合物、聚丙烯酸酯和纤维素酯的混合物、聚乙烯醇缩丁醛和聚乙酸乙烯酯的混合物、或聚乙烯醇缩丁醛和聚丙烯酸酯的混合物；或主要包括丙烯酸烷酯和/或甲基丙烯酸烷酯的共聚物。
以陶瓷粉末的总量为基准计，有机粘合剂量为1-20％(重量)，较好的为3-10％(重量)。
在作为有机粘合剂的混合物中的聚乙烯醇缩丁醛可通过聚乙烯醇和丁醛间的缩合反应制得。聚乙烯醇缩丁醛产品包括低聚合产物、中等聚合产物和高聚合产物，其中的乙酰基和缩丁醛基量分别为6％(摩尔)或更小和62-82％(摩尔)。在作为本发明陶瓷糊浆中的有机粘合剂混合物中的聚乙烯醇缩丁醛产物宜为中等聚合产物，其中缩丁醛基量约为65％(摩尔)，考虑到聚乙烯醇缩丁醛在有机溶液中的粘度以及通过干燥聚乙烯醇缩丁醛形成的薄膜的韧性。
使用的纤维素酯的例子包括硝化纤维、乙酸纤维素和乙基纤维素。
使用的聚丙烯酸酯的例子包括单一的(甲基)丙烯酸酯单体的聚合物如丙烯酸酯或甲基丙烯酸酯；和两种或多种(甲基)丙烯酸酯单体的共聚物。
使用的聚乙酸乙烯酯可具有任意分子量。
任意确定纤维素酯和聚乙烯醇缩丁醛的混合比。当纤维酯与聚乙烯醇缩丁醛的比值高时，容易进行网印。相反，在聚乙烯醇缩丁醛与纤维素酯比值高的情况，当叠合包含陶瓷坯料层5的陶瓷坯料片2然后压制时，片2和层5彼此紧密接触。为了达到这两种有机粘合剂各自的优点，纤维素酯与聚乙烯醇缩丁醛的混合比较好的在10％(重量)/90％(重量)至90％(重量)/10％(重量)。
也可以任意确定聚丙烯酸酯与纤维素酯的混合比。当聚丙烯酸酯与纤维酯的比值高时，粘合剂的热分解性高。另外，当叠合包含陶瓷坯料层5的陶瓷坯料片2然后压制时，片2和层5彼此紧密接触。相反，当纤维素酯与聚丙烯酸酯的比值高时，容易进行网印。为了达到这两种有机粘合剂各自的优点，聚丙烯酸酯与纤维素酯的混合比较好的在10％(重量)/90％(重量)至90％(重量)/10％(重量)。
也可以任意确定聚乙烯醇缩丁醛和聚乙酸乙烯酯的混合比。当聚乙烯醇缩丁醛与聚乙酸乙烯酯的比值高时，片2和层5彼此紧密接触。相反，在聚乙酸乙烯酯与聚乙烯醇缩丁醛的比值高的情况，容易进行网印，粘合剂的热分解性高。为了达到这两种有机粘合剂各自的优点，聚乙烯醇缩丁醛与聚乙酸乙烯酯的混合比较好的在10％(重量)/90％(重量)至90％(重量)/10％(重量)。
也可以任意确定聚乙烯醇缩丁醛和聚丙烯酸酯的混合比。当这两种有机粘合剂的比值高时，片2和层5彼此紧密接触。为了达到这两种有机粘合剂各自的优点，聚乙烯醇缩丁醛与聚丙烯酸酯的混合比较好的在10％(重量)/90％(重量)至90％(重量)/10％(重量)。
当使用主要包括丙烯酸烷酯和/或甲基丙烯酸烷酯的共聚物作为有机粘合剂时，(甲基)丙烯酸烷酯有C1-C8的烷基为宜。这样的(甲基)丙烯酸烷酯包括丙烯酸甲酯、甲基丙烯酸甲酯、丙烯酸乙酯、甲基丙烯酸乙酯、丙烯酸异丙酯、甲基丙烯酸异丙酯、丙烯酸正丁酯、甲基丙烯酸正丁酯、丙烯酸异丁酯、甲基丙烯酸异丁酯、丙烯酸叔丁酯、甲基丙烯酸叔丁酯、丙烯酸环己酯、甲基丙烯酸环己酯、丙烯酸2-乙基己酯和甲基丙烯酸2-乙基己酯。
当使用上述主要包括丙烯酸烷酯和/或甲基丙烯酸烷酯的共聚物作为有机粘合剂时，该共聚物宜包括含羧基、烯化氧基(RO)n、羟基、缩水甘油基、氨基或酰氨基的活性单体作为共聚组分。
上述含羧基的单体例子包括不饱和羧酸如丙烯酸和甲基丙烯酸；不饱和二官能羧酸如马来酸、衣康酸和富马酸、及其半酯。含羧基单体不限于上述例子，可以是两种或多种物质的混合物，但是该单体较好的是有最简单结构的甲基丙烯酸或丙烯酸。
(甲基)丙烯酸烷酯的烷基中的烯化氧基(RO)n较好的是工业使用的亚甲基氧(methylene oxide)、亚乙基氧(ethylene oxide)或亚丙基氧(propylene oxide)。烯化氧基较好的是n为1-40的烯化氧基。这是因为当n超过40时，共聚物的分子量增加，共聚物在有机溶剂中的溶解度急剧下降。
烷基含有羟基的(甲基)丙烯酸烷酯的例子包括丙烯酸2-羟基乙酯、甲基丙烯酸2-羟基乙酯、丙烯酸2-羟基丁酯和甲基丙烯酸2-羟基丁酯。当烷基的碳原子增加时，共聚物的玻璃化温度下降。这些例子中，优选丙烯酸2-羟基乙酯或甲基丙烯酸2-羟基乙酯，因为它们较好地综合各种性能。
烷基含有缩水甘油基的(甲基)丙烯酸烷酯的例子包括丙烯酸缩水甘油酯和甲基丙烯酸缩水甘油酯。
烷基含有氨基或酰氨基的(甲基)丙烯酸烷酯的例子包括丙烯酸二甲氨基乙酯、甲基丙烯酸二甲氨基乙酯、丙烯酸二乙氨基乙酯、甲基丙烯酸二乙氨基乙酯、丙烯酰胺、N-羟甲基丙烯酰胺和双丙酮丙烯酰胺。
其它可共聚活性单体的例子包括丙烯腈、苯乙烯、乙烯、乙酸乙烯酯和N-乙烯基吡咯烷酮。
对共聚物中上述含有羧基、烯化氧基(RO)n、羟基、缩水甘油基、氨基或酰氨基的活性单体量没有具体的限制，但其量宜约为0.1-50％(摩尔)。
当活性单体量增加至超出上述范围时，共聚物具有亲水性，其在有机溶剂的溶解度改变，因此含有该共聚物的陶瓷糊浆的粘度改变。然而，当共聚物中活性单体量过度增加，该共聚物不能完全溶解在有机溶剂中。
上述活性单体可单独一种，或两种或多种组合加入(甲基)丙烯酸烷酯中。
主要含(甲基)丙烯酸烷酯的共聚物的平均分子量宜为1,000-300,000，10,000-100,000更好。这是因为当分子量小于1,000时，有机粘合剂的凝固性能变弱，粘合剂强度下降，而分子量超过300,000时，共聚物溶液粘度增加，含该共聚物的糊浆难以制备。
主要含(甲基)丙烯酸烷酯的共聚物可通过如下面的方法制备。
在配备搅拌器、温度计、回流冷凝器、滴液漏斗和氮气通入管的1升可分烧瓶中投入甲苯(300克)。在90℃，氮气流中加热甲苯，将原料(150克)和聚合反应引发剂如过氧化苯甲酰(0.5克)放入滴液漏斗，然后耗时2小时，通过漏斗滴加形成的混合物。滴加完毕，形成的反应混合物在回流温度下再加热1小时，然后冷却，得到主要包括(甲基)丙烯酸烷酯的共聚物。
本发明中，用于形成陶瓷坯料层5的陶瓷糊浆、含具备上述特征的有机粘合剂的糊浆宜通过下面的方法制备。
为了制造陶瓷糊浆，进行第一分散步骤，在第一分散步骤中对含有陶瓷粉末和第一有机溶剂的第一混合物进行初级分散，提供初级分散体，以及第二分散步骤，对含有有机粘合剂和经过第一分散步骤处理的第一混合物的第二混合物进行二级分散，提供二级分散体。
在第一分散步骤中，不加入有机粘合剂，因此可在低粘度下对第一混合物进行初级分散，从而可容易地提高陶瓷粉末的分散性。在第一分散步骤中，吸附在陶瓷粉末中的空气被第一有机溶剂所取代，从而用第一有机溶剂充分湿润陶瓷粉末，并且团聚的陶瓷粉末也被细分成颗粒。
在第二分散步骤中，可充分混合有机粘合剂并使之均匀，同时使陶瓷粉末的分散性保持在高的水准，如上所述在第一分散步骤中该分散性得到强化。另外，在第二分散步骤中可进一步粉碎该陶瓷粉末。
在较佳制备方法中，除了第一有机溶剂以外，使用相对蒸发速率低于第一有机溶剂的相对蒸发速率的第二有机溶剂。第二有机溶剂可在第一分散步骤过程中或在第二分散步骤过程中加入。或者，可在第一分散步骤过程中加入第二有机溶剂，并在第二分散步骤过程中进一步加入该溶剂。
在第二分散步骤完成后，加热第二混合物，从该混合物中选择性地除去第一有机溶剂。
如上所述，在完成第二分散步骤后除去第一有机溶剂，从而在第二分散步骤过程中使第二混合物的粘度保持在相对较低的水准。因此，分散性可保持在相对高的水准，并且可增强如上所述在第二分散步骤过程中加入的有机粘合剂的溶解度。
如上所述制得的陶瓷糊浆基本仅含第二有机溶剂，尽管在糊浆中会存在痕量第一有机溶剂。由于第二有机溶剂的相对蒸发速率低于第一有机溶剂的相对蒸发速率，因此可使陶瓷糊浆的干燥速率下降至预定的值或更小。因此，可网印该糊浆而不会产生问题。
在上述较佳制备方法的第一和第二分散步骤中，使用常规的设备(如球磨机)来实施处理，提供分散体。
该制备方法中，可使用各种有机溶剂作为第一或第二有机溶剂。因此，在考虑有机溶剂相对蒸发速率的基础上选择合适的有机溶剂作为第一有机溶剂和第二有机溶剂。
有机溶剂的例子包括酮，如甲乙酮、甲基异丁基酮和丙酮；烃，如甲苯、苯、二甲苯和正己烷；醇，如甲醇、乙醇、异丙醇、丁醇和戊醇；酯，如乙酸乙酯、乙酸丁酯和乙酸异丁酯；酮、酯、烃和醇，如二异丙酮、乙基溶纤剂、丁基溶纤剂、乙酸溶纤剂、甲基溶纤剂乙酸酯、二乙二醇一丁醚、环己醇、松油、二氢萜品醇、异佛尔酮、萜品醇、二丙二醇和邻苯二甲酸二甲酯；氯化烃，如二氯甲烷及其混合物。
在完成二次分散步骤后，为能容易地除去第一有机溶剂，溶剂在20℃的相对蒸发速率为100或更大为佳，更好的为150或更大。本文中，术语“相对蒸发速率”指将乙酸正丁酯(沸点：126.5℃)的蒸发速率定义为100时，相对于乙酸正丁酯的蒸发速率。
相对蒸发速率为100或更大的有机溶剂适合作为第一溶剂，这样的有机溶剂的例子包括甲基乙基酮(相对蒸发速率：465)、甲基异丁基酮(相对蒸发速率：145)、丙酮(相对蒸发速率：720)、甲苯(相对蒸发速率：195)、苯(相对蒸发速率：500)、甲醇(相对蒸发速率：370)、乙醇(相对蒸发速率：203)、异丙醇(相对蒸发速率：205)、乙酸乙酯(相对蒸发速率：525)、乙酸异丁酯(相对蒸发速率：152)、乙酸丁酯(相对蒸发速率：100)、或它们的混合物。
而第二有机溶剂在20℃时的相对蒸发速率宜为50或更小，以进行有效的网印。
相对蒸发速率为50或更小的有机溶剂适合作为第二有机溶剂，这类有机溶剂的例子包括二异丙基酮(相对蒸发速率：49)、甲基溶纤剂乙酸酯(相对蒸发速率：40)、乙酸溶纤剂(相对蒸发速率：24)、丁基溶纤剂(相对蒸发速率：10)、环己醇(相对蒸发速率：10或更小)、松油(相对蒸发速率：10或更小)、二氢萜品醇(相对蒸发速率：10或更小)、异佛尔酮(相对蒸发速率：10或更小)、萜品醇(相对蒸发速率：10或更小)、二丙二醇(相对蒸发速率：10或更小)、邻苯二甲酸二甲酯(相对蒸发速率：10或更小)、二乙二醇一丁醚(相对蒸发速率：40或更小)、或它们的混合物。
根据其沸点，而不是其相对蒸发速率，能更方便地选择第一或第二有机溶剂。许多情况下，当选择第一和第二有机溶剂，使前者的沸点低于后者的沸点时，前者的蒸发速度大于后者的蒸发速度。
前面所述的一些有机溶剂的沸点如下：甲基乙基酮(79.6℃)、甲基异丁基酮(118.0℃)、丙酮(56.1℃)、甲苯(111.0℃)、苯(79.6℃)、甲醇(64.5℃)、乙醇(78.5℃)、异丙醇(82.5℃)、乙酸乙酯(77.1℃)、乙酸异丁酯(118.3℃)、二异丙基酮(143.5℃)、甲基溶纤剂乙酸酯(143℃)、乙酸溶纤剂(156.2℃)、丁基溶纤剂(170.6℃)、环己醇(160℃)、松油(195-225℃)、二氢萜品醇(210℃)、异佛尔酮(215.2℃)、萜品醇(219.0℃)、二丙二醇(231.8℃)、邻苯二甲酸二甲酯(282.4℃)。可根据上面的沸点选择第一和第二有机溶剂。
当根据沸点差选择第一和第二有机溶剂时，第一和第二有机溶剂的沸点差宜为50℃或更大。这是因为当沸点差为50℃或更大时，可以在完成第二分散步骤后，通过加热能选择性和容易地除去第一有机溶剂。
为实施网印法，较好的第二有机溶剂沸点为150℃或更高，约200-250℃更好。当沸点低于150℃时，陶瓷糊浆干燥迅速，印刷线路的网会被糊浆填充，而当沸点高于250℃时，印刷后的膜难以干燥，因此延长了干燥所需的时间。
陶瓷糊浆中所含的陶瓷粉末的组成宜与用于制造陶瓷坯料片2的陶瓷淤浆所含的陶瓷粉末基本相同。这是因为当这些陶瓷粉末具有基本相同的组成时，陶瓷坯料层5和陶瓷坯料片2可以均匀地烧结。
当陶瓷粉末具有基本相同的组成时，粉末含有相同的主要组分。例如，即使粉末含有痕量的不同次要组分如金属氧化物和玻璃时，仍可认为该粉末具有基本相同的组成。当陶瓷坯料片2所包含的陶瓷粉末满足电容器的温度特性时，即由JIS规定的B特性和由EIA规定的X7R特性，如果用于制造陶瓷坯料层5的陶瓷糊浆中包含的陶瓷粉末具有相同的主要组分，并且满足B和X7R特性，则允许这些粉末包含不同的次要组分。
图4所示为本发明另一个实施方案的单块电感器的制造过程。图5是通过该制造方法制得的单块电感器11的外观的透视图。图4是构成制备单块电感器11中的层叠片12的叠合物坯料13的各部件分解透视图。
叠合物坯料13包含多个陶瓷坯料片14、15、16、17、18和19，将片14-19叠加在一起可制得该叠合物坯料。
采用刮刀法或类似的方法，将包含磁性陶瓷粉末的陶瓷淤浆成形为片材，然后干燥，可制得陶瓷坯料片14-19。干燥后陶瓷坯料片14-19的厚度各为例如10-30微米。
片材15-18位于层叠物13的中间部分，在15-18的各片材上，形成钩形导电膜和陶瓷坯料层，可弥补由该膜形成的阶梯状区域造成的空隙。下面描述制备该膜和层的方法。
首先，在陶瓷坯料片15上形成钩形导电膜20。形成的膜20的第一端伸出到片15的边缘。在膜20的第二端形成一通孔导体21。
采用激光或穿孔，在片15上形成可填入导体21的孔。随后，通过网印法在片15上涂布导电糊，然后干燥，形成钩形导电膜20和通孔导体21。
在陶瓷坯料片15的主表面没有形成钩形导电膜的区域，形成陶瓷坯料层22，主要弥补由膜20形成的阶梯状区域造成的空隙。通过网印法，将陶瓷糊浆(本发明的特征在于含磁性陶瓷粉末的糊浆)涂布在片15上，形成陶瓷坯料层22，然后干燥形成的片材。
随后，在陶瓷坯料片16上，按照与上述相同的方式形成钩形导电膜23，通孔导体24和可弥补由膜23形成的阶梯状区域造成的空隙的陶瓷坯料层25。膜23的第一端由插入的通孔导体21连接到膜20的第二端。在膜23的第二端形成通孔导体24。
之后，在陶瓷坯料片17上，按照与上述相同的方式，形成钩形导电膜26、通孔导体27和可弥补由膜26形成的阶梯状区域造成的空隙的陶瓷坯料层28。膜26的第一端由插入的通孔导体24连接到膜23的第二端。在膜26的第二端形成通孔导体27。
如果需要，可重复进行上述陶瓷坯料片16和17的层叠。
随后，在陶瓷坯料片18上，形成钩形导电膜29和弥补由膜29形成的阶梯状区域造成的空隙的陶瓷坯料层30。膜29的第一端由插入的通孔导体27连接到膜26的第二端。形成的膜29的第二端伸出到片18的边缘。
钩形导电膜20、23、26和29干燥后的厚度各约为30微米。
通过将多个复合结构层叠在一起可制得叠合物坯料13，该复合结构包括陶瓷坯料片14-19，钩形导电膜20、23、26和29相继通过插入的通孔导体21、24和27彼此连接，形成多圈的线圈形导体。
图5所示构成单块电感器11的层叠片12可通过烧制叠合物坯料13制得。图4所示的叠合物坯料13用于制造仅一个层叠片12。然而，可形成用于制造多个层叠片的叠合物坯料。这种情况下，形成叠合物坯料后，层叠物切割成片，从而制得许多层叠片。
随后，如图5所示，在层叠片12的相对的两端形成外电极30和31，使外电极30和31分别连接到膜20的第一端和膜29的第二端，制得单块电感器。
陶瓷粉末包含在构成上述(参考图1-3)单块陶瓷电容器的陶瓷坯料片12和陶瓷坯料层5中；陶瓷粉末还包含在构成上述(参考图4和图5)单块电感器11的陶瓷坯料片14-19以及陶瓷坯料层22、25、28和30中。陶瓷粉末的例子包括一种氧化物的陶瓷粉末如氧化铝、氧化锆、氧化镁、氧化钛、钛酸钡、钛酸锆酸铅(lead titanatezirconate)或铁氧体-锰；和非氧化物的陶瓷粉末如碳化硅、氮化硅或氮化铝-氧化铝-氧化硅陶瓷材料(sialon)。使用的陶瓷粉末经粉碎并为球形为佳。粉末的平均粒度较好的为5微米或更小，1微米更好。
当使用含0.1％(重量)或更小的碱金属氧化物杂质的钛酸钡作为陶瓷粉末时，可以在该陶瓷粉末中加入痕量的下列金属氧化物或玻璃组分。
金属氧化物的例子包括氧化铽、氧化镝、氧化钬、氧化铒、氧化镱、氧化锰、氧化钴、氧化镍、和氧化镁。
玻璃组分的例子包括Li2-(SiTi)O2-MO(其中MO指Al2O3或ZrO2)、SiO2-TiO2-MO(其中，MO指BaO、CaO、SrO、MgO、ZnO或MnO)、Li2O-B2O3-(SiTi)O2+MO(其中，MO指Al2O3或ZrO2)、B2O3-Al2O3-MO(其中，MO指BaO、CaO、SrO或MgO)、以及SiO2。
导电糊可用于形成内电极1，构成参考图1-3所述的单块陶瓷电容器；导电糊还用于形成钩形导电膜20、23、26和29以及通孔导体21、24和27，导电膜和通孔导体构成了参考图4和图5所述的单块电感器11。下面描述使用的导电糊。
用于单块陶瓷电容器的导电糊包括铜粉、镍粉、或含Ag/Pd合金(比值为60％(重量)/40％(重量)至10％(重量)/90％(重量))的导电粉末。这类粉末的平均粒度为0.02-3微米，较好的为0.05-0.5微米。使用三辊研磨机捏合该粉末(100重量份)、有机粘合剂(2-20重量份，较好的为5-10重量份)、金属如Ag、Au、Pt、Ti、Si、Ni或Cu的树脂盐作为烧结抑制剂(约0.1-3重量份，较好的为0.5-1重量份，按照还原的金属计)、有机溶剂(约35重量份)，然后在制得的混合物中再加入同样或不同的有机溶剂，控制其粘度，从而制得导电糊。
用于单块电感器11的导电糊包括含Ag或含Ag/Pd合金(比值为80％(重量)/20％(重量)至100％(重量)/0％(重量))的导电粉末。使用三辊研磨机以和上述同样的比例捏合该粉末(100重量份)、有机粘合剂、烧结抑制剂和有机溶剂，然后在制得的混合物中再加入同样或不同的有机溶剂，控制其粘度，从而制得导电糊。
实施例
由试验例更详细地描述本发明。
(试验例1)
试验例1涉及单块陶瓷电容器。试验例1中，制备用于形成弥补阶梯状区域造成的空隙的陶瓷坯料层的陶瓷糊浆时，通过物理混合两种不同的有机粘合剂可形成用于该糊浆的有机粘合剂，即聚乙烯醇缩丁醛和纤维素酯的混合物、聚丙烯酸酯和纤维素酯的混合物、聚乙烯醇缩丁醛和聚乙酸乙烯酯的混合物、或聚乙烯醇缩丁醛和聚丙烯酸酯的混合物。在试验例1中，确定了这样的两种不同有机粘合剂混合物的效果。
1.制备陶瓷粉末
首先，称取碳酸钡(BaCO3)和氧化钛(TiO2)，使其摩尔比值为1∶1，使用球磨进行湿混合，制得的混合物脱水，然后干燥。随后干燥的混合物于1000℃烧结2小时，然后粉碎，制得介电陶瓷粉末。
2.制备陶瓷淤浆和形成陶瓷坯料片
在一个球磨机中放入上面制得的陶瓷粉末(100重量份)、聚乙烯醇缩丁醛(中间聚合产物)(7重量份)、邻苯二甲酸二辛酯(用作增塑剂，3重量份)、甲基乙基酮(30重量份)、乙醇(20重量份)、甲苯(20重量份)、直径1毫米的氧化锆研磨球(600重量份)，湿混合20小时，从而制得陶瓷淤浆。
采用刮刀法，将制得的陶瓷淤浆成形为3微米厚(烧结后为2微米)的陶瓷坯料片。该片材于80℃干燥5分钟。
3.制备导电糊
使用三辊研磨机，捏合金属粉末(Ag/Pd＝70/30，100重量份)、乙基纤维素(4重量份)、醇酸树脂(2重量份)、Ag金属树脂酸盐(3重量份，按照还原为Ag计为17.5重量份)和二甘醇一丁醚乙酸酯(35重量份)，然后在该混合物中加入萜品醇(35重量份)，以控制该混合物的粘度。
4.制备用于形成弥补的阶梯状区域造成的空隙的陶瓷坯料层的陶瓷糊浆
(1)实施例1-19
在一个球磨机中放入上面制得的介电粉末(100重量份)、相对蒸发速率为465的甲基乙基酮(70重量份)和直径1毫米的氧化锆研磨球(600重量份)，湿混合16小时。随后，在球磨机中加入萜品醇(沸点：220℃，相对蒸发速率为10或更小，40重量份)和有机粘合剂(10重量份)，然后制得的混合物再混合16小时，制得陶瓷淤浆混合物。
提供聚乙烯醇缩丁醛、纤维素酯、聚丙烯酸酯或聚乙酸乙烯酯作为上述的有机粘合剂。具体说，使用的聚乙烯醇缩丁醛是含有缩丁醛和乙酰基(分别为70％(摩尔)和5％(摩尔))的中间聚合产物。使用的纤维素酯是含49％乙氧基的乙基纤维素。使用的聚丙烯酸酯是主要含甲基丙烯酸异丁酯的聚合物，其分子量为50,000。
在实施例1-19中，使用按照表1所列出的比值(％(重量))混合的两种不同的有机粘合剂的混合物。
随后，使用蒸发器，使上面制得的陶瓷淤浆混合物在60℃热浴中减压蒸馏2小时。经过蒸馏，从淤浆中完全除去甲基乙基酮，制得陶瓷糊浆。
(2)比较例1
在自动研钵中混合上面制得的介电粉末(100重量份)、萜品醇(沸点：220℃，40重量份)和纤维素酯(乙基纤维素树脂，5重量份)。仅使用表1所列的纤维素酯作为有机粘合剂。使用三辊研磨机捏合制得的混合物，获得陶瓷糊浆。
(3)比较例2-5
在一个球磨机中放入上面制得的介电粉末(100重量份)、甲基乙基酮(70重量份)和直径1毫米的氧化锆研磨球(600重量份)，湿混合16小时。随后，在球磨机中加入萜品醇(沸点：220℃，相对蒸发速率为10或更小，40重量份)和有机粘合剂(10重量份)，然后该混合物再混合16小时，制得陶瓷淤浆混合物。
如表1所示，在比较例2-5中仅使用一种有机粘合剂。
随后，使用蒸发器，使上面制得的陶瓷淤浆混合物在60℃热浴中减压蒸馏2小时。经过蒸馏，从淤浆中完全除去甲基乙基酮，制得陶瓷糊浆。
5.制造单块陶瓷电容器
通过网印法，在上面制造的陶瓷坯料片主表面上施涂导电糊，然后于80℃干燥10分钟，形成内电极。测定内电极的尺寸、形状和位置，以适合下述步骤中制得的层叠片。之后，采用网印法，将实施例1-19和比较例1-5中的各陶瓷糊浆施涂在陶瓷坯料片的主表面上，然后在80℃干燥10分钟，形成弥补阶梯状区域造成的空隙的陶瓷坯料层。内电极和陶瓷坯料层干燥后，厚度为1微米，烧结后为0.5微米。
之后，含内电极的陶瓷坯料片和陶瓷坯料层(200片)层叠在一起，然后层叠产物中夹上数十片没有内电极的陶瓷坯料片，从而形成叠合物坯料。该叠合物坯料于80℃，在1,000kg/cm2压力下热压。
随后，用切刀，将该层叠物切成许多层叠片。测定各片的尺寸，在烧烧结后达到3.2毫米(长)×1.6毫米(宽)×1.6毫米(厚)。
之后，将上面制得的层叠片排列在焙烧耐火架上，其上已分布少量氧化锆粉末，在24小时内，片温从室温上升到250℃，从而除去有机粘合剂。然后，将制得的片置于焙烧炉内，以最高约1300℃温度烧结该片约20小时。
之后，烧结后的各片置于一筒内，抛光该片的侧面。之后，在烧结后片的两对面形成外电极，制造出单块陶瓷电容器样品。
6.评价特性
评价实施例1-19和比较例1-5中的各陶瓷糊浆和单块陶瓷电容器的各种性能。结果列于表1。
表1
| 有机粘合剂(重量％) | 实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例5 | 实施例6 | 实施例7 |
| 聚乙烯醇缩丁醛 | 95 | 90 | 50 | 10 | 5 | - | - |
| 纤维素酯 | 5 | 10 | 50 | 90 | 95 | 95 | 90 |
| 聚丙烯酸酯 | - | - | - | - | - | 5 | 10 |
| 聚乙酸乙烯酯 | - | - | - | - | - | - | - |
| 分散度 | -0.3 | -0.2 | -0.2 | -0.2 | -0.3 | -0.3 | -0.2 |
| 印刷膜厚度(微米) | 3 | 2 | 2 | 2 | 3 | 2 | 3 |
| Ra(微米) | 0.3 | 0.2 | 0.2 | 0.2 | 0.3 | 0.3 | 0.2 |
| 网印性 | △ | ○ | ○ | ○ | ○ | ○ | ○ |
| 片材粘合性 | ○ | ○ | ○ | ○ | △ | △ | ○ |
| 结构缺陷率(％) | 3 | 1 | 1 | 1 | 2 | 2 | 1 |
| 有机粘合剂(重量％) | 实施例8 | 实施例9 | 实施例10 | 实施例11 | 实施例12 | 实施例13 | 实施例14 |
| 聚乙烯醇缩丁醛 | - | - | - | 5 | 10 | 50 | 90 |
| 纤维素酯 | 5 | 10 | 5 | - | - | - | - |
| 聚丙烯酸酯 | 50 | 90 | 95 | - | - | - | - |
| 聚乙酸乙烯酯 | - | - | - | 95 | 90 | 50 | 10 |
| 分散度 | -0.2 | -0.2 | -0.2 | -0.2 | -0.2 | -0.2 | -0.2 |
| 印刷膜厚度(微米) | 3 | 2 | 3 | 3 | 3 | 3 | 3 |
| Ra(微米) | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 |
| 网印性 | ○ | ○ | △ | △ | ○ | ○ | ○ |
| 片材粘合性 | ○ | ○ | ○ | ○ | ○ | ○ | ○ |
| 结构缺陷率(％) | 1 | 1 | 3 | 3 | 1 | 1 | 1 |
| 有机粘合剂(重量％) | 实施例15 | 实施例16 | 实施例17 | 实施例18 | 实施例19 | ||
| 聚乙烯醇缩丁醛 | 95 | 90 | 50 | 10 | 5 | ||
| 纤维素酯 | - | - | - | - | - | ||
| 聚丙烯酸酯 | 5 | 10 | 50 | 90 | 95 | ||
| 聚乙酸乙烯酯 | - | - | - | - | - | ||
| 分散度 | -0.2 | -0.2 | -0.2 | -0.2 | -0.2 | ||
| 印刷膜厚度(微米) | 3 | 2 | 3 | 3 | 3 | ||
| Ra(微米) | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | ||
| 网印法性 | △ | ○ | ○ | ○ | △ | ||
| 片材粘合性 | ○ | ○ | ○ | ○ | ○ | ||
| 结构缺陷率(％) | 3 | 1 | 1 | 1 | 3 | ||
| 有机粘合剂(重量％) | 比较例1 | 比较例2 | 比较例3 | 比较例4 | 比较例5 | ||
| 聚乙烯醇缩丁醛 | - | 100 | - | - | - | ||
| 纤维素酯 | 100 | - | 100 | - | - | ||
| 聚丙烯酸酯 | - | - | - | 100 | - | ||
| 聚乙酸乙烯酯 | - | - | - | - | 100 | ||
| 分散度 | 0 | -0.2 | -0.2 | -0.2 | -0.2 | ||
| 印刷膜厚度(微米) | 3 | 2 | 2 | 2 | 2 | ||
| Ra(微米) | 1.5 | 0.3 | 0.3 | 0.3 | 0.3 | ||
| 网印性 | ○ | △ | ○ | △ | △ | ||
| 片材粘合性 | × | ○ | × | ○ | ○ | ||
| 结构缺陷率(％) | 80 | 3 | 1 | 2 | 3 | ||
下面评价表1所列的性能。
分散度：使用光衍射粒度分布测量装置，测定陶瓷粉末的粒度分布，根据测定数据计算粉末的分散度。简单地说，使用超声波均化器，将上面制得的陶瓷粉末分散于水中，并使颗粒经受超声波直到颗粒减小到其最小尺寸。当颗粒达到其最小尺寸时，记录在D90粒度分布时的粒度作为“粒度的限值”。另外用乙醇稀释陶瓷糊浆，记录在D90粒度分布时的粒度作为“糊浆粒度”。按照下面的公式计算陶瓷粉末的分散度：
分散度＝(糊浆粒度/粒度限值)-1
假设分散度为正值的情况，该值越接近零，粉末的分散性越高。相反，假设分散度为负值的情况，分散度的绝对值越大，粉末的分散性越高。
印刷膜厚度：使用50微米厚的400目不锈钢网，将陶瓷糊浆施涂在96％氧化铝基底上，达到20微米厚，得到的基材于80℃干燥10分钟，形成用于评价的印刷膜。使用由非接触型激光表面粗糙度仪测定的数据，获得膜厚度。
表面粗糙度(Ra)：按照与上述相同的方式，形成用于评价的印刷膜。由非接触型激光表面粗糙度仪测定的数据获得该膜的表面粗糙度(Ra)，即平均波动中心线和粗糙度曲线的偏差平均绝对值。
网印性：网印期间，当易于从网上剥离除去陶瓷糊浆，并且糊浆能连续印刷不出现问题时，评为等级“○”；当糊浆不能连续印刷时，评为等级“×”；当糊浆可以印刷但存在一些问题时，评为等级“△”。
片材粘合性：层叠由该陶瓷糊浆形成的片材，然后于80℃压制。压力上升到1,000kg/cm2(最大)，并测定层叠片材彼此粘合时的压力。当该压力小于300kg/cm2时，评为等级“○”；当压力大于300kg/cm2但小于700kg/cm2时，评为等级“△”；当压力为700kg/cm2或更大时，评为等级“×”。
结构缺陷率：由外观并且在超声显微镜下观察用于制造单块陶瓷电容器的烧结后的片。观察到一些不正常部分时，片经抛光后，可确定片的内部结构缺陷。根据下面的关系可获得结构缺陷率：(有结构缺陷的烧结片的数量/烧结片总数)。
表1清楚地表明，实施例1-19的陶瓷糊浆和电容器与比较例1-5的陶瓷糊浆和电容器相比，具有优良的性能。
比较实施例1-19表明：实施例2-4、7-9、12-14和16-18的陶瓷糊浆和电容器中，糊浆包含的两种不同粘合剂的混合比值在10％(重量)/90％(重量)至90％(重量)/10％(重量)的范围，与实施例1、5、6、10、11、15和19的陶瓷糊浆(糊浆包含的两种不同粘合剂的混合比值在上述范围之外)和电容器相比，具有优良的性能。
比较例2-5的陶瓷糊浆和电容器与比较例1的陶瓷糊浆和电容器相比具有良好的性能。然而，比较例2糊浆(含有聚乙烯醇缩丁醛)与实施例1-3和13-17糊浆(包含聚乙烯醇缩丁醛作为主要组分，为50％(重量)或更大)相比；比较例3糊浆(含有纤维素酯)与实施例3-8的糊浆(包含纤维素酯作为主要组分，为50％(重量)或更大)相比；比较例4的糊浆(含有丙烯酸酯)与实施例8-10和17-19的糊浆(包含丙烯酸酯作为主要组分，为50％(重量)或更大)相比；比较例5的糊浆(含有聚乙酸乙烯酯)与实施例11-13的糊浆(包含聚乙酸乙烯酯作为主要组分，为50％(重量)或更大)相比；表明比较例2-5的陶瓷糊浆与实施例1-19的糊浆，特别是实施例2-4、7-9、12-14和16-18的糊浆相比，在其分散度、印刷膜厚度、表面粗糙度、网印性、片材粘合性或结构缺陷率方面仍有改进的余地。
(试验例2)
试验例2中，制备用于形成弥补由阶梯状区域造成的空隙的陶瓷坯料层的陶瓷糊浆时，这种糊浆中使用的有机粘合剂是主要含丙烯酸烷酯和/或甲基丙烯酸烷酯的共聚物。试验例2中，肯定了这类共聚物的作用。
重复试验例1的过程，不同之处是按照下面所述进行制备用于形成弥补由阶梯状区域造成的空隙的陶瓷坯料层的陶瓷糊浆的第4个步骤，制得单块陶瓷电容器。
(1)实施例20-25
在一个自动研钵中混合上面制得的介电粉末(100重量份)、萜品醇(沸点：220℃，40重量份)和有机粘合剂(5重量份)，使用三辊研磨机捏合上述混合物，制得陶瓷糊浆。
有机粘合剂含有作为主要组分的(甲基)丙烯酸烷酯，和作为共聚组分的活性单体，该活性单体含有羧基、烯化氧基(RO)n、羟基、缩水甘油基、氨基、或酰氨基。
具体而言，如表2所示，在实施例20-25的各例中，使用甲基丙烯酸异丁酯作为(甲基)丙烯酸烷酯单体，各有机粘合剂中该单体的含量为90％(摩尔)。如表所示，实施例20-25的各例中，各有机粘合剂含有10％(摩尔)的不同活性单体。
下面详细描述所述活性单体。如表2所示，在实施例20中使用丙烯酸作为含羧酸单体；实施例21中使用乙烯化氧甲基丙烯酸酯(ethylene oxide methacrylate)作为含烯化氧基的(甲基)丙烯酸烷酯；实施例22中使用甲基丙烯酸2-羟基乙酯作为含羟基的(甲基)丙烯酸烷酯；实施例23中使用甲基丙烯酸缩水甘油酯作为含缩水甘油基的(甲基)丙烯酸烷酯；实施例24中使用甲基丙烯酸二甲氨基乙酯作为含氨基的(甲基)丙烯酸烷酯；实施例25中使用N-羟甲基丙烯酰胺作为含酰氨基的(甲基)丙烯酸烷酯。
(2)实施例26-31
在一个球磨机中放入上面制得的介电粉末(100重量份)、甲基乙基酮(70重量份)和直径1毫米的氧化锆研磨球(600重量份)，湿混合16小时。随后，在球磨机中加入萜品醇(沸点：220℃，40重量份)和有机粘合剂(10重量份)，然后制得的混合物再混合16小时，制得陶瓷淤浆混合物。
如表2所示，实施例26中使用的有机粘合剂与实施例20中的相同；实施例27中使用的有机粘合剂与实施例21中的相同；实施例28中使用的有机粘合剂与实施例22中的相同；实施例29中使用的有机粘合剂与实施例23中的相同；实施例30中使用的有机粘合剂与实施例24中的相同；实施例31中使用的有机粘合剂与实施例25中的相同。
随后，使用蒸发器，使上面制得的陶瓷淤浆混合物在60℃热浴中减压蒸馏2小时。经过蒸馏，从淤浆中完全除去甲基乙基酮，制得陶瓷糊浆。
评价实施例20-31的各例中的陶瓷糊浆和单块陶瓷电容器的各种性能。结果列于表2。
表2
| 有机粘合剂(重量％) | 实施例20 | 实施例21 | 实施例22 | 实施例23 | 实施例24 | 实施例25 |
| 甲基丙烯酸异丁酯 | 90 | 90 | 90 | 90 | 90 | 90 |
| 丙烯酸 | 10 | - | - | - | - | - |
| 乙烯化氧甲基丙烯酸酯 | - | 10 | - | - | - | - |
| 甲基丙烯酸2-羟基乙酯 | - | - | 10 | - | - | - |
| 甲基丙烯酸缩水甘油酯 | - | - | - | 10 | - | - |
| 甲基丙烯酸二甲氨基乙酯 | - | - | - | - | 10 | - |
| N-羟甲基丙烯酰胺 | - | - | - | - | - | 10 |
| 分散度 | 0 | 0 | 0 | 0.1 | 0.1 | 0.1 |
| 印刷膜厚度(微米) | 2 | 2 | 3 | 3 | 3 | 3 |
| Ra(微米) | 1.3 | 1.3 | 1.3 | 1.5 | 1.5 | 1.5 |
| 网印性 | ○ | ○ | ○ | ○ | ○ | ○ |
| 片材粘合性 | ○ | ○ | ○ | ○ | ○ | ○ |
| 结构缺陷率(％) | 30 | 30 | 30 | 35 | 35 | 35 |
| 有机粘合剂(重量％) | 实施例26 | 实施例27 | 实施例28 | 实施例29 | 实施例30 | 实施例31 |
| 甲基丙烯酸异丁酯 | 90 | 90 | 90 | 90 | 90 | 90 |
| 丙烯酸 | 10 | - | - | - | - | - |
| 乙烯化氧甲基丙烯酸酯 | - | 10 | - | - | - | - |
| 甲基丙烯酸2-羟基乙酯 | - | - | 10 | - | - | - |
| 甲基丙烯酸缩水甘油酯 | - | - | - | 10 | - | - |
| 甲基丙烯酸二甲氨基乙酯 | - | - | - | - | 10 | - |
| N-羟甲基丙烯酰胺 | - | - | - | - | - | 10 |
| 分散度 | -0.3 | -0.3 | -0.3 | -0.2 | -0.2 | -0.2 |
| 印刷膜厚度(微米) | 2 | 2 | 3 | 3 | 3 | 3 |
| Ra(微米) | 0.4 | 0.4 | 0.4 | 0.5 | 0.5 | 0.5 |
| 网印性 | ○ | ○ | ○ | ○ | ○ | ○ |
| 片材粘合性 | ○ | ○ | ○ | ○ | ○ | ○ |
| 结构缺陷率(％) | 1 | 1 | 1 | 2 | 2 | 2 |
评价表2所列性能的方法与表1的相同。
表2清楚地表明，实施例20-31的陶瓷糊浆和电容器与表1所示的比较例1的陶瓷糊浆和电容器相比，具有优良的性能。
比较实施例20-31表明：实施例26-31的陶瓷糊浆和电容器，与实施例20-25的陶瓷糊浆和电容器相比，在分散度、表面粗糙度和结构缺陷率方面具有优良的性能。这是因为在实施例26-31中制备陶瓷糊浆时，进行第一和第二分散步骤，在第二分散步骤加入有机粘合剂。
在上述试验例中，在本发明的陶瓷糊浆中加入介电陶瓷粉末。然而，本发明中，陶瓷糊浆的性能不受糊浆中包含的陶瓷粉末电性能的影响。因此，包含磁性陶瓷粉末、绝缘陶瓷粉末或压电陶瓷粉末的陶瓷糊浆显示与含介电陶瓷糊浆相同的性能。
如上所述，本发明的陶瓷糊浆含有通过物理混合两种不同有机粘合剂形成的混合物作为有机粘合剂，如聚乙烯醇缩丁醛和纤维素酯的混合物、聚丙烯酸酯和纤维素酯的混合物、聚乙烯醇缩丁醛和聚乙酸乙烯酯的混合物、或聚乙烯醇缩丁醛和聚丙烯酸酯的混合物。或者，陶瓷糊浆含有一种共聚物作为有机粘合剂，这种共聚物主要含有丙烯酸烷酯和/或甲基丙烯酸烷酯。因此，可增强陶瓷糊浆所包含的陶瓷粉末的分散性，这种糊浆可较好用于形成高精度图案的非常薄的陶瓷坯料层。
根据本发明，由于陶瓷糊浆可用于在陶瓷坯料片的主表面未形成内线路元件薄膜的区域形成陶瓷坯料层，以基本弥补由该膜形成的阶梯状区域造成的空隙，制得的单块陶瓷电子元件没有诸如裂纹和脱层的结构缺陷，具有高的可靠性。
根据本发明，可充分减小单块陶瓷电子元件的尺寸和重量。因此，本发明应用于单块陶瓷电容器时，可有利于减小电容器的尺寸，可有利于提高电容量。另外，本发明应用于单块电感器时，可有利于减小电感器的尺寸，可有利于提高电感量。
本发明中，通过下列步骤制造陶瓷糊浆：第一分散步骤，含陶瓷粉末和第一有机溶剂的第一混合物进行处理，提供初级分散体；第二分散步骤，含有机粘合剂和经第一分散步骤的第一混合物的第二混合物进行处理，提供二级分散体；在第一混合物和/或第二混合物中加入相对蒸发速率小于第一有机溶剂的第二有机溶剂的步骤；通过加热从第二混合物中选择性除去第一有机溶剂的步骤。结果可进一步提高陶瓷糊浆包含的陶瓷粉末的分散性。
制造本发明的单块陶瓷电子元件的方法中，当用于形成陶瓷坯料片的陶瓷淤浆所包含陶瓷粉末的组成与用于形成弥补由阶梯状区域造成的空隙的陶瓷坯料层的陶瓷糊浆所包含陶瓷粉末基本相同时，可均匀烧结该陶瓷坯料片和该陶瓷坯料层。当陶瓷坯料片和陶瓷坯料层均匀烧结时，可防止裂纹和脱层。
Claims (10)
1.一种制造单块陶瓷电子元件的方法，该方法包括下列步骤：
提供陶瓷淤浆、导电糊和陶瓷糊浆；
形成多个复合结构；各个结构包括由陶瓷淤浆成形制成具有主表面的陶瓷坯料片，将导电糊局部施涂在陶瓷坯料片主表面上从而形成内线路元件薄膜的阶梯状区域，将陶瓷糊浆施涂在陶瓷坯料片主表面上未形成元件薄膜的区域从而形成补偿所述阶梯状区域造成的空隙的陶瓷坯料层；
将复合结构叠合在一起形成叠合物坯料；
烧制该叠合物坯料；
其中，所述的陶瓷糊浆包括陶瓷粉末、有机溶剂和有机粘合剂，所述陶瓷淤浆和陶瓷糊浆各自包含相同组成的陶瓷粉末；
所述的有机粘合剂包括选自以下的物质：
(a)聚乙烯醇缩丁醛和纤维素酯的混合物，
(b)聚丙烯酸酯和纤维素酯的混合物，
(c)聚乙烯醇缩丁醛和聚乙酸乙烯酯的混合物，
(d)聚乙烯醇缩丁醛和聚丙烯酸酯的混合物，以及
(e)丙烯酸烷酯和/或甲基丙烯酸烷酯与具有羧基、氧化烯基、羟基、缩水甘油基、氨基或酰氨基的活性单体的共聚物，该共聚物的分子量为1,000～300,000，并含有至少50摩尔％的丙烯酸烷酯和/或甲基丙烯酸烷酯，
作为所述有机粘合剂的混合物的混合比为10∶90～90∶10；以陶瓷粉末的总量为基准计，有机粘合剂的用量为1～20重量％；
提供陶瓷糊浆的方法包括下列步骤：
在不存在有机粘合剂的情况下对含有陶瓷粉末和第一有机溶剂的第一混合物进行分散，提供初级分散体；
对含有有机粘合剂和所述初级分散体的第二混合物进行分散，提供二级分散体；
通过加热二级分散体，从二级分散体中除去第一有机溶剂的步骤；
其中，在第一混合物和/或第二混合物中加入相对蒸发速率小于第一有机溶剂的第二有机溶剂，所述第一有机溶剂的相对蒸发速率至少为100；所述第二有机溶剂的相对蒸发速率小于50，沸点至少为150℃。
2.如权利要求1所述的制造单块陶瓷电子元件的方法，其特征在于，所述的粘合剂包括聚乙烯醇缩丁醛和纤维素酯的混合物。
3.如权利要求1所述的制造单块陶瓷电子元件的方法，其特征在于，所述的粘合剂包括聚丙烯酸酯和纤维素酯的混合物。
4.如权利要求1所述的制造单块陶瓷电子元件的方法，其特征在于，所述的粘合剂包括聚乙烯醇缩丁醛和聚乙酸乙烯酯的混合物。
5.如权利要求1所述的制造单块陶瓷电子元件的方法，其特征在于，所述的粘合剂包括聚乙烯醇缩丁醛和聚丙烯酸酯的混合物。
6.如权利要求1所述的制造单块陶瓷电子元件的方法，其特征在于，作为所述粘合剂的共聚物的分子量为10,000～100,000；以陶瓷粉末的总量为基准计，有机粘合剂的用量为3～10重量％；所述第二有机溶剂的沸点至少为200～250℃。
7.如权利要求1所述的制造单块陶瓷电子元件的方法，其特征在于所述陶瓷淤浆和陶瓷糊浆各自包含的陶瓷粉末是介电陶瓷粉末。
8.如权利要求7所述的制造单块陶瓷电子元件的方法，其特征在于所述内线路元件薄膜是排成相互间产生电容的内电极，所述的单块陶瓷电子元件是单块陶瓷电容器。
9.如权利要求1所述的制造单块陶瓷电子元件的方法，其特征在于所述陶瓷淤浆和陶瓷糊浆各自包含的陶瓷粉末是磁性陶瓷粉末。
10.如权利要求9所述的制造单块陶瓷电子元件的方法，其特征在于所述内线路元件薄膜是排列成钩形导电薄膜，从而在烧制叠合物坯料时形成单块陶瓷电感器。
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35263599 | 1999-12-13 | ||
| JP352635/1999 | 1999-12-13 | ||
| JP2000319522A JP3767362B2 (ja) | 1999-12-13 | 2000-10-19 | 積層型セラミック電子部品の製造方法 |
| JP319522/2000 | 2000-10-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1300090A CN1300090A (zh) | 2001-06-20 |
| CN1205627C true CN1205627C (zh) | 2005-06-08 |
Family
ID=26579673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001364227A Expired - Lifetime CN1205627C (zh) | 1999-12-13 | 2000-12-13 | 单块陶瓷电子元件及其制造方法，和陶瓷糊浆及其制造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6599463B2 (zh) |
| JP (1) | JP3767362B2 (zh) |
| KR (1) | KR100394349B1 (zh) |
| CN (1) | CN1205627C (zh) |
| GB (1) | GB2357280B (zh) |
| TW (1) | TW495779B (zh) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3528669B2 (ja) * | 1999-03-25 | 2004-05-17 | 株式会社村田製作所 | 導体パターンの形成方法並びにセラミック多層基板の製造方法 |
| JP3895911B2 (ja) * | 2000-08-28 | 2007-03-22 | 隆 河東田 | 対サージ防御装置の主構成部材及びその作製方法 |
| US7914755B2 (en) * | 2001-04-12 | 2011-03-29 | Eestor, Inc. | Method of preparing ceramic powders using chelate precursors |
| GB2402103B (en) * | 2001-05-25 | 2005-03-30 | Kyocera Corp | Method of producing ceramic laminates, laminated electronic parts and method of producing the same. |
| US7089659B2 (en) | 2001-05-25 | 2006-08-15 | Kyocera Corporation | Method of producing ceramic laminates |
| JP2003101226A (ja) * | 2001-09-26 | 2003-04-04 | Kyocera Corp | 多層配線基板の製造方法 |
| JP4035988B2 (ja) * | 2001-12-06 | 2008-01-23 | 株式会社デンソー | セラミック積層体及びその製造方法 |
| EP1318531A1 (de) * | 2001-12-06 | 2003-06-11 | D. Hans Ekkehard | Verfahren zur Herstellung von elektronischen Bauteilen sowie elektronisches Bauteil |
| US20030111158A1 (en) * | 2001-12-14 | 2003-06-19 | Murata Manufacturing Co., Ltd. | Method for manufacturing multilayer ceramic electronic element |
| WO2004061879A1 (ja) * | 2002-12-27 | 2004-07-22 | Tdk Corporation | 内部電極を持つ電子部品の製造方法 |
| JP4299833B2 (ja) * | 2003-03-31 | 2009-07-22 | Ｔｄｋ株式会社 | 電極段差吸収用印刷ペーストおよび電子部品の製造方法 |
| DE10326040A1 (de) * | 2003-06-10 | 2004-12-30 | Robert Bosch Gmbh | Verfahren zur Herstellung von keramischen Grünfolien für keramische Bauteile |
| US7638010B2 (en) * | 2003-07-09 | 2009-12-29 | Tdk Corporation | Multilayer ceramic device and the production method thereof |
| US7713896B2 (en) * | 2004-04-14 | 2010-05-11 | Robert Bosch Gmbh | Method for producing ceramic green compacts for ceramic components |
| JP4483508B2 (ja) * | 2004-07-27 | 2010-06-16 | Ｔｄｋ株式会社 | 積層型電子部品の製造方法 |
| JP4654673B2 (ja) * | 2004-11-30 | 2011-03-23 | Ｔｄｋ株式会社 | 印刷用誘電体ペーストの製造方法および積層セラミック部品の製造方法 |
| US20090090452A1 (en) * | 2005-06-29 | 2009-04-09 | Kabushiki Kaisha Toshiba | Process for producing nonflat ceramic substrate |
| US20070193675A1 (en) * | 2006-02-22 | 2007-08-23 | Abhijit Gurav | Process of manufacturing a multilayer device and device manufactured thereby |
| JP4670705B2 (ja) * | 2006-03-31 | 2011-04-13 | Ｔｄｋ株式会社 | 電極段差吸収ペースト及びセラミック電子部品の製造方法 |
| US20070227641A1 (en) * | 2006-04-04 | 2007-10-04 | Skamser Daniel J | Flowable compensation layer for multilayer devices |
| JP2008004768A (ja) * | 2006-06-22 | 2008-01-10 | Tdk Corp | 積層電子部品の製造方法 |
| US7993611B2 (en) * | 2006-08-02 | 2011-08-09 | Eestor, Inc. | Method of preparing ceramic powders using ammonium oxalate |
| US8853116B2 (en) * | 2006-08-02 | 2014-10-07 | Eestor, Inc. | Method of preparing ceramic powders |
| JP2008288332A (ja) * | 2007-05-16 | 2008-11-27 | Tdk Corp | フェライトペースト、及び積層型セラミック部品の製造方法。 |
| US20080283188A1 (en) * | 2007-05-16 | 2008-11-20 | Tdk Corporation | Ferrite paste, and method for manufacturing laminated ceramic component |
| JP5224722B2 (ja) * | 2007-05-17 | 2013-07-03 | 積水化学工業株式会社 | 樹脂組成物、導電ペースト及びセラミックペースト |
| JP5459952B2 (ja) * | 2007-12-25 | 2014-04-02 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | 誘電体セラミックス材料の製造方法 |
| JP5091700B2 (ja) * | 2008-01-30 | 2012-12-05 | 積水化学工業株式会社 | 積層セラミックコンデンサ内部電極用導電ペースト |
| US8178192B2 (en) * | 2008-03-06 | 2012-05-15 | Ngk Insulators, Ltd. | Ceramic green sheet, ceramic green sheet laminate, production method of ceramic green sheet, and production method of ceramic green sheet laminate |
| KR20110123782A (ko) * | 2009-02-27 | 2011-11-15 | 에스톨, 인코포레이티드 | 산화물 분말의 습식 화학 공침을 위한 반응 튜브 및 열수 처리 방법 |
| US20100285316A1 (en) * | 2009-02-27 | 2010-11-11 | Eestor, Inc. | Method of Preparing Ceramic Powders |
| JP5558188B2 (ja) * | 2010-04-26 | 2014-07-23 | 京セラ株式会社 | セラミックグリーンシートおよびその製造方法 |
| JP5077393B2 (ja) * | 2010-06-15 | 2012-11-21 | Ｔｄｋ株式会社 | セラミック電子部品およびその製造方法 |
| WO2012011359A1 (ja) | 2010-07-22 | 2012-01-26 | 日本碍子株式会社 | 成形体、及び、成形体の製造方法 |
| KR101288154B1 (ko) | 2010-12-06 | 2013-07-18 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 적층 세라믹 전자부품 제조방법 |
| US10170645B2 (en) * | 2011-11-04 | 2019-01-01 | Heraeus Precious Metals North America Conshohocken Llc | Organic vehicle for electroconductive paste |
| EP2644744A1 (en) * | 2012-03-29 | 2013-10-02 | Atotech Deutschland GmbH | Method for promoting adhesion between dielectric substrates and metal layers |
| DE102012113018A1 (de) * | 2012-12-21 | 2014-06-26 | Epcos Ag | Verfahren zur Herstellung eines Mehrschichtträgerkörpers |
| JP2014141394A (ja) * | 2012-12-26 | 2014-08-07 | Murata Mfg Co Ltd | セラミックグリーンシートおよびその製造方法 |
| US8808613B1 (en) * | 2013-03-15 | 2014-08-19 | Ibiden Co., Ltd. | Method for manufacturing aluminum-titanate-based ceramic honeycomb structure |
| US20140261971A1 (en) * | 2013-03-15 | 2014-09-18 | Solid State Ceramics, Inc. | Method of manufacturing Multilayer Piezoelectric Devices |
| EP2980047B1 (en) * | 2013-03-29 | 2020-04-15 | Sekisui Chemical Co., Ltd. | Binder for manufacturing inorganic sintered body |
| MY182641A (en) | 2014-01-17 | 2021-01-27 | Shoei Chemical Ind Co | Method for producing binder resin, method for producing resin composition, binder resin, and resin composition |
| US10293578B2 (en) | 2014-12-08 | 2019-05-21 | Solutia Inc. | Polyvinyl acetal and cellulose ester multilayer interlayers |
| US10364345B2 (en) * | 2014-12-08 | 2019-07-30 | Solutia Inc. | Monolithic interlayers of cellulose ester polyvinyl acetal polymer blends |
| JP6468021B2 (ja) * | 2015-03-20 | 2019-02-13 | 株式会社リコー | 立体造形用粉末材料、及び立体造形用材料セット、並びに、立体造形物、立体造形物の製造方法及び製造装置 |
| KR101847362B1 (ko) * | 2015-07-22 | 2018-04-09 | 소에이 가가쿠 고교 가부시키가이샤 | 무기 입자 분산 페이스트용의 바인더 수지 및 무기 입자 분산 페이스트 |
| KR101762032B1 (ko) * | 2015-11-27 | 2017-07-26 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 제조 방법 |
| ES2640930B1 (es) * | 2016-05-05 | 2018-06-15 | Universidad De Castilla La Mancha | Procedimiento para la obtención de una barbotina cerámica para la fabricación de hilos para impresión 3d-fdm, barbotina que se obtiene e hilos cerámicos |
| JP6881039B2 (ja) * | 2017-06-01 | 2021-06-02 | 株式会社村田製作所 | セラミックグリーンシート、セラミックグリーンシートの製造方法、および電子部品の製造方法 |
| JP7086348B2 (ja) * | 2018-08-08 | 2022-06-20 | 日油株式会社 | ペースト組成物 |
| KR20200040429A (ko) * | 2018-10-10 | 2020-04-20 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
| CN110534637A (zh) * | 2019-08-22 | 2019-12-03 | 东莞东阳光科研发有限公司 | 一种叠层共烧结压电陶瓷器件及所用的补偿胶水浆料 |
| CN112028615A (zh) * | 2020-09-18 | 2020-12-04 | 深圳振华富电子有限公司 | 低温共烧陶瓷材料、叠层片式电感器及其制备方法 |
| CN113004833B (zh) * | 2021-02-10 | 2022-07-05 | 浙江新纳陶瓷新材有限公司 | 一种丝网印刷用胶水及其在制备smd陶瓷封装基座中的应用 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2966719A (en) * | 1954-06-15 | 1961-01-03 | American Lava Corp | Manufacture of ceramics |
| GB1274211A (en) * | 1968-04-03 | 1972-05-17 | Atomic Energy Authority Uk | Improvements in or relating to the production of refractory artefacts |
| DE2727364A1 (de) * | 1977-06-16 | 1979-01-04 | Siemens Ag | Verfahren zur herstellung von keramiksubstraten |
| JPS60221358A (ja) | 1984-04-13 | 1985-11-06 | 日本碍子株式会社 | 電気絶縁体用セラミック組成物 |
| JPS60250686A (ja) | 1984-05-25 | 1985-12-11 | 日本碍子株式会社 | セラミツク配線基板の製造方法 |
| JPS61278195A (ja) * | 1985-06-03 | 1986-12-09 | 株式会社日立製作所 | 多層回路基板及びその製造方法 |
| DE3785750T2 (de) * | 1987-02-28 | 1993-09-02 | Taiyo Yuden Kk | Elektrische widerstaende, elektrische widerstandspaste und herstellungsverfahren. |
| JPH05213670A (ja) * | 1991-04-29 | 1993-08-24 | Tam Ceramics Inc | 極微粒子の粒度のチタン酸バリウムを使用する高温焼成のｘ７ｒ誘電セラミック組成物 |
| KR940009647B1 (ko) | 1991-11-21 | 1994-10-15 | 삼성전자 주식회사 | 고체 촬상소자의 제조방법 |
| US5439636A (en) * | 1992-02-18 | 1995-08-08 | International Business Machines Corporation | Large ceramic articles and method of manufacturing |
| DE69514987T2 (de) * | 1994-11-09 | 2000-06-29 | Ngk Insulators, Ltd. | Keramische Grünfolie und Verfahren zur Herstellung keramisches Substrat |
| DE4443365A1 (de) | 1994-12-06 | 1996-06-13 | Philips Patentverwaltung | Brenn- und Sinterverfahren für ein keramisches elektronisches Bauteil |
| JP3103296B2 (ja) * | 1995-06-30 | 2000-10-30 | ティーディーケイ株式会社 | 誘電体磁器およびその製造方法ならびにこれを用いた電子部品 |
| JPH09106925A (ja) | 1995-10-13 | 1997-04-22 | Mitsubishi Materials Corp | 積層セラミックコンデンサの製造方法 |
| JPH10335143A (ja) * | 1997-06-04 | 1998-12-18 | Murata Mfg Co Ltd | 積層型インダクタ |
| JPH11154805A (ja) | 1997-09-22 | 1999-06-08 | Tdk Corp | 積層セラミック部品 |
| US6274080B1 (en) * | 1998-08-21 | 2001-08-14 | Rohm And Haas Company | Method for preparing ceramic compositions |
-
2000
- 2000-10-19 JP JP2000319522A patent/JP3767362B2/ja not_active Expired - Lifetime
- 2000-11-30 GB GB0029279A patent/GB2357280B/en not_active Expired - Lifetime
- 2000-12-08 TW TW089126227A patent/TW495779B/zh not_active IP Right Cessation
- 2000-12-12 KR KR10-2000-0075498A patent/KR100394349B1/ko active IP Right Grant
- 2000-12-13 US US09/735,879 patent/US6599463B2/en not_active Expired - Lifetime
- 2000-12-13 CN CNB001364227A patent/CN1205627C/zh not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP3767362B2 (ja) | 2006-04-19 |
| GB2357280A (en) | 2001-06-20 |
| TW495779B (en) | 2002-07-21 |
| GB2357280B (en) | 2002-02-06 |
| JP2001232617A (ja) | 2001-08-28 |
| US20010006451A1 (en) | 2001-07-05 |
| CN1300090A (zh) | 2001-06-20 |
| KR100394349B1 (ko) | 2003-08-09 |
| KR20010062347A (ko) | 2001-07-07 |
| GB0029279D0 (en) | 2001-01-17 |
| US6599463B2 (en) | 2003-07-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1205627C (zh) | 单块陶瓷电子元件及其制造方法，和陶瓷糊浆及其制造方法 | |
| CN1300089A (zh) | 单块陶瓷电子元件及其制造方法和陶瓷糊浆及其制造方法 | |
| CN1308978C (zh) | 制造陶瓷叠层制品的方法,叠层电子元件及其制造方法 | |
| CN1798711A (zh) | 电极台阶高差消解用印刷糊料及电子部件的制造方法 | |
| CN1238860C (zh) | 导电糊、迭层陶瓷电子器件制造方法及迭层陶瓷电子器件 | |
| CN1305087C (zh) | 叠层陶瓷电容器及其制备方法 | |
| CN1741212A (zh) | 剥离层用糊料及层压型电子部件的制造方法 | |
| CN1241721C (zh) | 制备陶瓷糊浆、陶瓷坯料片和制造单块陶瓷电子元件方法 | |
| CN101065204A (zh) | 导电性粒子的制造方法、导电性糊料及电子部件的制造方法 | |
| CN1444240A (zh) | 陶瓷电子元件及其制造方法 | |
| CN1799109A (zh) | 内部电极用糊料及电子部件的制造方法 | |
| CN1196152C (zh) | 陶瓷生片制造方法及多层陶瓷电子部件制造方法 | |
| CN1812024A (zh) | 剥离层用糊剂的制造方法以及层压型电子部件的制造方法 | |
| CN1776844A (zh) | 电介体陶瓷组合物和电子部件 | |
| CN1432548A (zh) | 介电陶瓷组合物和电子器件 | |
| CN101066867A (zh) | 电子部件、电介质陶瓷组合物及其制造方法 | |
| CN1505072A (zh) | 介电陶瓷及其制造方法和叠层陶瓷电容器 | |
| CN1993785A (zh) | 电子部件、叠层陶瓷电容器及其制备方法 | |
| CN1809598A (zh) | 涂膏用粘合树脂 | |
| CN1841597A (zh) | 叠层陶瓷电子部件的制造方法 | |
| CN1768017A (zh) | 生片材用涂料及其制造方法、生片材及其制造方法、及电子部件的制造方法 | |
| CN1848317A (zh) | 电子部件 | |
| CN101076871A (zh) | 电子部件、叠层陶瓷电容器及其制造方法 | |
| CN101030480A (zh) | 叠层型陶瓷电子部件的制造方法 | |
| CN1179912C (zh) | 介电陶瓷组合物、电子器件及其生产方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20050608 |