CN111710794B - 发光装置、模块、电子设备以及发光装置的制造方法 - Google Patents

发光装置、模块、电子设备以及发光装置的制造方法 Download PDF

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Publication number
CN111710794B
CN111710794B CN202010372500.3A CN202010372500A CN111710794B CN 111710794 B CN111710794 B CN 111710794B CN 202010372500 A CN202010372500 A CN 202010372500A CN 111710794 B CN111710794 B CN 111710794B
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light
substrate
layer
adhesive layer
light emitting
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CN111710794A (zh
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千田章裕
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • H10K77/111Flexible substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/121Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/38Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/311Flexible OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/351Thickness
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Devices (AREA)
  • Surgical Instruments (AREA)
  • Led Device Packages (AREA)
CN202010372500.3A 2014-10-17 2015-09-30 发光装置、模块、电子设备以及发光装置的制造方法 Active CN111710794B (zh)

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JP2014-212438 2014-10-17
JP2014212438 2014-10-17
JP2014257197 2014-12-19
JP2014-257197 2014-12-19
PCT/IB2015/057465 WO2016059497A1 (en) 2014-10-17 2015-09-30 Light-emitting device, module, electronic device, and method for manufacturing light-emitting device
CN202010372500.3A CN111710794B (zh) 2014-10-17 2015-09-30 发光装置、模块、电子设备以及发光装置的制造方法
CN201580055728.7A CN106797684B (zh) 2014-10-17 2015-09-30 发光装置、模块、电子设备以及发光装置的制造方法

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JP (6) JP6527067B2 (enExample)
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Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016001526A (ja) * 2014-06-11 2016-01-07 株式会社ジャパンディスプレイ 表示装置
US10656719B2 (en) 2014-09-30 2020-05-19 Apple Inc. Dynamic input surface for electronic devices
KR102472238B1 (ko) 2014-10-17 2022-11-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치, 모듈, 전자 기기, 및 발광 장치의 제작 방법
US9942979B2 (en) * 2014-11-03 2018-04-10 Samsung Electronics Co., Ltd. Flexible printed circuit board
KR102303244B1 (ko) * 2015-04-15 2021-09-17 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
TWI596985B (zh) * 2015-07-22 2017-08-21 億光電子工業股份有限公司 發光裝置
KR102632066B1 (ko) 2015-07-30 2024-02-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치의 제작 방법, 발광 장치, 모듈, 및 전자 기기
JP6854240B2 (ja) * 2015-08-18 2021-04-07 株式会社ホタルクス 有機elデバイス、有機el照明パネル、有機el照明装置および有機elディスプレイ
US10409412B1 (en) 2015-09-30 2019-09-10 Apple Inc. Multi-input element for electronic device
KR102456062B1 (ko) * 2015-10-16 2022-10-18 삼성디스플레이 주식회사 표시 장치
KR102426711B1 (ko) * 2015-11-18 2022-07-29 삼성디스플레이 주식회사 플렉서블 디스플레이 장치
KR102491874B1 (ko) 2015-11-26 2023-01-27 삼성디스플레이 주식회사 디스플레이 장치의 제조 방법 및 그 장치
US10318065B2 (en) 2016-08-03 2019-06-11 Apple Inc. Input device having a dimensionally configurable input area
US10002762B2 (en) * 2016-09-09 2018-06-19 International Business Machines Corporation Multi-angled deposition and masking for custom spacer trim and selected spacer removal
US10871860B1 (en) * 2016-09-19 2020-12-22 Apple Inc. Flexible sensor configured to detect user inputs
KR102555086B1 (ko) * 2016-10-28 2023-07-12 엘지디스플레이 주식회사 유기 발광 표시 장치
CN106486019B (zh) * 2016-10-31 2019-06-11 昆山工研院新型平板显示技术中心有限公司 柔性显示装置及其制造方法
KR102772195B1 (ko) * 2017-02-28 2025-02-26 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
JP6834609B2 (ja) * 2017-03-07 2021-02-24 デクセリアルズ株式会社 画像表示装置の製造方法
WO2018179266A1 (ja) * 2017-03-30 2018-10-04 シャープ株式会社 Elデバイスの製造方法及びelデバイスの製造装置
JP6480989B2 (ja) * 2017-08-03 2019-03-13 Nissha株式会社 成形品、電気製品及び成形品の製造方法
US10732676B2 (en) 2017-09-06 2020-08-04 Apple Inc. Illuminated device enclosure with dynamic trackpad
CN109727530A (zh) * 2017-10-31 2019-05-07 昆山工研院新型平板显示技术中心有限公司 柔性显示模组及柔性显示模组制备方法
CN107978622B (zh) * 2017-11-22 2020-08-11 上海天马有机发光显示技术有限公司 一种阵列基板、显示面板和显示装置
JP2019095646A (ja) * 2017-11-24 2019-06-20 株式会社ジャパンディスプレイ 表示装置、および表示装置の作製方法
KR102524340B1 (ko) * 2018-02-22 2023-04-25 삼성디스플레이 주식회사 플렉서블 표시 장치 및 이의 제조 방법
CN108596083B (zh) * 2018-04-23 2021-03-02 上海天马有机发光显示技术有限公司 一种显示面板和显示装置
KR20210013152A (ko) 2018-05-24 2021-02-03 더 리서치 파운데이션 포 더 스테이트 유니버시티 오브 뉴욕 정전 용량 센서
CN110634852B (zh) * 2018-06-21 2021-06-25 群创光电股份有限公司 半导体装置
US11963425B1 (en) 2018-07-10 2024-04-16 Apple Inc. Electronic devices having displays with curved surfaces
CN109192764B (zh) * 2018-09-11 2021-01-26 京东方科技集团股份有限公司 一种柔性显示面板及其制备方法
CN109659324B (zh) * 2018-12-18 2021-01-15 武汉华星光电半导体显示技术有限公司 一种显示面板及其制作方法
CN109671758A (zh) * 2018-12-18 2019-04-23 武汉华星光电半导体显示技术有限公司 显示面板及其制备方法、显示装置
KR102755456B1 (ko) * 2019-01-04 2025-01-20 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN110703949B (zh) * 2019-10-10 2022-05-13 业成科技(成都)有限公司 绝缘胶保护的改良结构
US11777059B2 (en) 2019-11-20 2023-10-03 Lumileds Llc Pixelated light-emitting diode for self-aligned photoresist patterning
JP7411426B2 (ja) * 2020-01-27 2024-01-11 パイオニア株式会社 発光装置
US11139232B2 (en) * 2020-03-06 2021-10-05 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same
KR20220072003A (ko) * 2020-11-23 2022-06-02 삼성디스플레이 주식회사 표시 장치
KR102856182B1 (ko) * 2021-09-17 2025-09-05 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086356A (ja) * 2001-09-06 2003-03-20 Semiconductor Energy Lab Co Ltd 発光装置及び電子機器
JP2003115388A (ja) * 2001-10-01 2003-04-18 Semiconductor Energy Lab Co Ltd 発光装置及び電子機器、及び有機偏光フィルム
JP2005293946A (ja) * 2004-03-31 2005-10-20 Sanyo Electric Co Ltd 有機el表示装置
JP2009199979A (ja) * 2008-02-25 2009-09-03 Seiko Epson Corp 有機エレクトロルミネッセンス装置およびその製造方法
JP2011018097A (ja) * 2009-07-07 2011-01-27 Seiko Epson Corp 電子機器
JP2011118082A (ja) * 2009-12-02 2011-06-16 Seiko Epson Corp 電気光学装置および電子機器
JP2011243583A (ja) * 2011-08-05 2011-12-01 Semiconductor Energy Lab Co Ltd 発光装置及びその作製方法
JP2013251191A (ja) * 2012-06-01 2013-12-12 Dainippon Printing Co Ltd 有機エレクトロルミネッセンス素子

Family Cites Families (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5189405A (en) 1989-01-26 1993-02-23 Sharp Kabushiki Kaisha Thin film electroluminescent panel
JPH0754746B2 (ja) * 1990-03-14 1995-06-07 株式会社精工舎 El板の封止方法
JP4776766B2 (ja) * 1999-10-26 2011-09-21 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2001155853A (ja) * 1999-11-24 2001-06-08 Toyota Motor Corp 有機el素子の封止方法
JP3533168B2 (ja) * 2000-10-16 2004-05-31 鹿児島日本電気株式会社 液晶表示パネルの製造方法
US6822391B2 (en) * 2001-02-21 2004-11-23 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, electronic equipment, and method of manufacturing thereof
TW548860B (en) 2001-06-20 2003-08-21 Semiconductor Energy Lab Light emitting device and method of manufacturing the same
US7211828B2 (en) 2001-06-20 2007-05-01 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and electronic apparatus
US8415208B2 (en) 2001-07-16 2013-04-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and peeling off method and method of manufacturing semiconductor device
JP4027740B2 (ja) 2001-07-16 2007-12-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
TWI264121B (en) 2001-11-30 2006-10-11 Semiconductor Energy Lab A display device, a method of manufacturing a semiconductor device, and a method of manufacturing a display device
US7649674B2 (en) 2002-06-10 2010-01-19 E Ink Corporation Electro-optic display with edge seal
JP4240276B2 (ja) * 2002-07-05 2009-03-18 株式会社半導体エネルギー研究所 発光装置
JP2004047309A (ja) * 2002-07-12 2004-02-12 Nippon Sheet Glass Co Ltd El素子用封止板、及び該封止板多面取り用マザーガラス基板
CN1669363A (zh) * 2002-07-12 2005-09-14 日本板硝子株式会社 电致发光元件用密封板及其制造方法、和用于制取多个该密封板的基样玻璃基板
JP2004103337A (ja) * 2002-09-06 2004-04-02 Semiconductor Energy Lab Co Ltd 発光装置およびその作製方法
US7015640B2 (en) 2002-09-11 2006-03-21 General Electric Company Diffusion barrier coatings having graded compositions and devices incorporating the same
US20040099926A1 (en) 2002-11-22 2004-05-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device, and light-emitting device, and methods of manufacturing the same
CN1732714B (zh) * 2002-12-26 2011-07-13 株式会社半导体能源研究所 发光装置
US7271076B2 (en) 2003-12-19 2007-09-18 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device
JP2006004650A (ja) * 2004-06-15 2006-01-05 Toshiba Matsushita Display Technology Co Ltd 表示素子及び光学デバイス
US7753751B2 (en) * 2004-09-29 2010-07-13 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating the display device
US7736964B2 (en) 2004-11-22 2010-06-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, and method for manufacturing the same
US7566633B2 (en) 2005-02-25 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP4926426B2 (ja) 2005-08-12 2012-05-09 株式会社半導体エネルギー研究所 電子機器
DE602007013478D1 (de) 2006-02-08 2011-05-12 Semiconductor Energy Lab RFID-Vorrichtung
JP2007220402A (ja) * 2006-02-15 2007-08-30 Konica Minolta Holdings Inc 有機エレクトロルミネッセンス素子の封止方法、有機エレクトロルミネッセンス素子
CN1851925A (zh) * 2006-05-10 2006-10-25 友达光电股份有限公司 有源发光装置及其制造方法
KR100688972B1 (ko) * 2006-06-01 2007-03-08 삼성전자주식회사 표시장치와 이의 제조방법
GB0614341D0 (en) * 2006-07-19 2006-08-30 Plastic Logic Ltd Encapsulation for flexible displays
KR101478810B1 (ko) 2006-07-28 2015-01-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 축전 장치
US8232621B2 (en) 2006-07-28 2012-07-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI421607B (zh) * 2006-08-24 2014-01-01 Creator Technology Bv 可撓性裝置上的滲透阻障
JP2008089884A (ja) * 2006-09-29 2008-04-17 Toshiba Corp 表示素子
JP4245032B2 (ja) 2006-10-03 2009-03-25 セイコーエプソン株式会社 発光装置および電子機器
WO2008115513A1 (en) * 2007-03-19 2008-09-25 White Electronic Designs Corp. Enhanced liquid crystal display system and methods
US7667549B2 (en) 2007-04-26 2010-02-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
JP2009205669A (ja) 2008-01-31 2009-09-10 Semiconductor Energy Lab Co Ltd 半導体装置
TW201002129A (en) * 2008-02-20 2010-01-01 Fuji Electric Holdings Organic el display and manufacturing method thereof
EP2297778A1 (en) 2008-05-23 2011-03-23 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device
KR102112799B1 (ko) 2008-07-10 2020-05-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광장치 및 전자기기
KR101925772B1 (ko) 2008-07-10 2018-12-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 전자 기기
US8629842B2 (en) 2008-07-11 2014-01-14 Samsung Display Co., Ltd. Organic light emitting display device
US20100008068A1 (en) 2008-07-11 2010-01-14 Joo-Young Kim Electron emission device, electron emission type backlight unit including the same and method of fabricating the electron emission device
US8928597B2 (en) 2008-07-11 2015-01-06 Samsung Display Co., Ltd. Organic light emitting display device
US9342176B2 (en) 2008-07-21 2016-05-17 Samsung Display Co., Ltd. Organic light emitting display device
US7758200B2 (en) 2008-08-18 2010-07-20 Wei-Jei Tuan Responsive led module unit
JP5216716B2 (ja) 2008-08-20 2013-06-19 株式会社半導体エネルギー研究所 発光装置及びその作製方法
KR101276750B1 (ko) * 2008-12-04 2013-06-19 엘지디스플레이 주식회사 플렉시블 액정표시장치 및 그 제조방법
KR101938125B1 (ko) 2008-12-17 2019-01-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 전자 기기
JP4736142B2 (ja) 2009-02-18 2011-07-27 株式会社デンソー 高圧ポンプ
JP2010267396A (ja) * 2009-05-12 2010-11-25 Canon Inc 有機発光装置の製造方法
US8766269B2 (en) 2009-07-02 2014-07-01 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, lighting device, and electronic device
JP2011028887A (ja) * 2009-07-22 2011-02-10 Hitachi Displays Ltd 有機el表示装置
KR101174873B1 (ko) * 2009-08-14 2012-08-17 삼성디스플레이 주식회사 유기 발광 디스플레이 장치 및 이를 제조하는 방법
JP5444940B2 (ja) * 2009-08-25 2014-03-19 セイコーエプソン株式会社 電気光学装置、および電子機器
US8593061B2 (en) * 2009-08-25 2013-11-26 Seiko Epson Corporation Electro-optical device and electronic apparatus
JP5560688B2 (ja) * 2009-12-11 2014-07-30 セイコーエプソン株式会社 電気光学装置の製造方法
TWI589042B (zh) * 2010-01-20 2017-06-21 半導體能源研究所股份有限公司 發光裝置,撓性發光裝置,電子裝置,照明設備,以及發光裝置和撓性發光裝置的製造方法
JP6118020B2 (ja) * 2010-12-16 2017-04-19 株式会社半導体エネルギー研究所 発光装置
JP5944925B2 (ja) * 2011-01-28 2016-07-05 ザ ジェネラル ホスピタル コーポレイション 皮膚を再表面化するための方法および装置
JP2012209133A (ja) * 2011-03-30 2012-10-25 Canon Inc 気密容器、画像表示装置及びこれらの製造方法
JP5682422B2 (ja) * 2011-04-01 2015-03-11 株式会社デンソー 有機el装置およびその製造方法
KR20130007208A (ko) 2011-06-30 2013-01-18 한국정보통신주식회사 신용 카드 결제 관리 장치 및 방법
JP5741274B2 (ja) 2011-07-22 2015-07-01 セイコーエプソン株式会社 有機el装置及び電子機器
KR20130060131A (ko) 2011-11-29 2013-06-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 밀봉체, 발광 장치, 전자 기기, 및 조명 장치
JP5907722B2 (ja) * 2011-12-23 2016-04-26 株式会社半導体エネルギー研究所 発光装置の作製方法
JP5781917B2 (ja) * 2011-12-28 2015-09-24 積水化学工業株式会社 バリアフィルム及びデバイス素子封止構造
JP5409830B2 (ja) * 2012-02-21 2014-02-05 株式会社半導体エネルギー研究所 発光装置
KR102079188B1 (ko) 2012-05-09 2020-02-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 전자 기기
KR102173801B1 (ko) 2012-07-12 2020-11-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치, 및 표시 장치의 제작 방법
JP2014022158A (ja) * 2012-07-17 2014-02-03 Nitto Denko Corp 有機elデバイス、および、有機elデバイスの製造方法
JP2014027192A (ja) * 2012-07-30 2014-02-06 Sony Corp 発光素子およびこれを備えた表示装置、並びに電子機器
KR102161078B1 (ko) 2012-08-28 2020-09-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 그 제작 방법
JP5450738B2 (ja) * 2012-08-29 2014-03-26 シャープ株式会社 色変換膜及び該色変換膜を含む有機elデバイス
KR20140063228A (ko) * 2012-11-16 2014-05-27 삼성디스플레이 주식회사 유기 발광 표시 장치
KR101964149B1 (ko) * 2012-11-20 2019-04-02 삼성디스플레이 주식회사 양면 발광형 표시장치
KR102245511B1 (ko) * 2012-12-27 2021-04-28 엘지디스플레이 주식회사 플렉서블 유기 발광 표시 장치 및 플렉서블 유기 발광 표시 장치 제조 방법
JP2014135306A (ja) * 2013-01-08 2014-07-24 Ibiden Co Ltd 発光素子搭載用基板及びその製造方法
JP6201411B2 (ja) * 2013-05-14 2017-09-27 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、及び電子機器
US9831466B2 (en) * 2013-06-29 2017-11-28 Aixtron Se Method for depositing a multi-layer moisture barrier on electronic devices and electronic devices protected by a multi-layer moisture barrier
US9269914B2 (en) 2013-08-01 2016-02-23 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, electronic device, and lighting device
WO2015125046A1 (en) * 2014-02-19 2015-08-27 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and peeling method
JP5728599B2 (ja) 2014-03-14 2015-06-03 株式会社半導体エネルギー研究所 発光装置
CN103985825B (zh) 2014-05-09 2017-10-27 青岛海信电器股份有限公司 曲面显示面板的制备方法、曲面显示面板和显示装置
WO2016002746A1 (ja) * 2014-06-30 2016-01-07 シャープ株式会社 エレクトロルミネッセンス装置
KR102472238B1 (ko) * 2014-10-17 2022-11-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치, 모듈, 전자 기기, 및 발광 장치의 제작 방법
KR102632066B1 (ko) * 2015-07-30 2024-02-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치의 제작 방법, 발광 장치, 모듈, 및 전자 기기

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086356A (ja) * 2001-09-06 2003-03-20 Semiconductor Energy Lab Co Ltd 発光装置及び電子機器
JP2003115388A (ja) * 2001-10-01 2003-04-18 Semiconductor Energy Lab Co Ltd 発光装置及び電子機器、及び有機偏光フィルム
JP2005293946A (ja) * 2004-03-31 2005-10-20 Sanyo Electric Co Ltd 有機el表示装置
JP2009199979A (ja) * 2008-02-25 2009-09-03 Seiko Epson Corp 有機エレクトロルミネッセンス装置およびその製造方法
JP2011018097A (ja) * 2009-07-07 2011-01-27 Seiko Epson Corp 電子機器
JP2011118082A (ja) * 2009-12-02 2011-06-16 Seiko Epson Corp 電気光学装置および電子機器
JP2011243583A (ja) * 2011-08-05 2011-12-01 Semiconductor Energy Lab Co Ltd 発光装置及びその作製方法
JP2013251191A (ja) * 2012-06-01 2013-12-12 Dainippon Printing Co Ltd 有機エレクトロルミネッセンス素子

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