CN1098022C - 电路底板激光加工法及其加工装置和二氧化碳激光振荡器 - Google Patents
电路底板激光加工法及其加工装置和二氧化碳激光振荡器 Download PDFInfo
- Publication number
- CN1098022C CN1098022C CN96111476A CN96111476A CN1098022C CN 1098022 C CN1098022 C CN 1098022C CN 96111476 A CN96111476 A CN 96111476A CN 96111476 A CN96111476 A CN 96111476A CN 1098022 C CN1098022 C CN 1098022C
- Authority
- CN
- China
- Prior art keywords
- processing
- circuit substrate
- laser
- laser beam
- pulse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20119495 | 1995-08-07 | ||
JP201194/95 | 1995-08-07 | ||
JP059862/96 | 1996-03-15 | ||
JP8059862A JPH09107168A (ja) | 1995-08-07 | 1996-03-15 | 配線基板のレーザ加工方法、配線基板のレーザ加工装置及び配線基板加工用の炭酸ガスレーザ発振器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1142743A CN1142743A (zh) | 1997-02-12 |
CN1098022C true CN1098022C (zh) | 2003-01-01 |
Family
ID=26400942
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN96111476A Expired - Lifetime CN1098022C (zh) | 1995-08-07 | 1996-08-07 | 电路底板激光加工法及其加工装置和二氧化碳激光振荡器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20030146196A1 (ko) |
JP (1) | JPH09107168A (ko) |
KR (1) | KR100199955B1 (ko) |
CN (1) | CN1098022C (ko) |
TW (1) | TW312082B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103857207A (zh) * | 2012-11-30 | 2014-06-11 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板及其制作方法 |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6861364B1 (en) * | 1999-11-30 | 2005-03-01 | Canon Kabushiki Kaisha | Laser etching method and apparatus therefor |
US6281471B1 (en) * | 1999-12-28 | 2001-08-28 | Gsi Lumonics, Inc. | Energy-efficient, laser-based method and system for processing target material |
US7671295B2 (en) | 2000-01-10 | 2010-03-02 | Electro Scientific Industries, Inc. | Processing a memory link with a set of at least two laser pulses |
US6705914B2 (en) | 2000-04-18 | 2004-03-16 | Matsushita Electric Industrial Co., Ltd. | Method of forming spherical electrode surface for high intensity discharge lamp |
JP4659300B2 (ja) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
CN1301178C (zh) * | 2001-01-31 | 2007-02-21 | 电子科学工业公司 | 半导体中微结构的紫外线激光烧蚀的图案化 |
DE10296376T5 (de) | 2001-04-05 | 2004-04-15 | Mitsubishi Denki K.K. | Kohlenstoffdioxidlaser-Bearbeitungsverfahren von Mehrschichtmaterial |
JP5028722B2 (ja) * | 2001-07-31 | 2012-09-19 | 三菱電機株式会社 | レーザ加工方法及びレーザ加工機 |
DE10145184B4 (de) * | 2001-09-13 | 2005-03-10 | Siemens Ag | Verfahren zum Laserbohren, insbesondere unter Verwendung einer Lochmaske |
US20030155328A1 (en) * | 2002-02-15 | 2003-08-21 | Huth Mark C. | Laser micromachining and methods and systems of same |
ES2285634T3 (es) | 2002-03-12 | 2007-11-16 | Hamamatsu Photonics K. K. | Metodo para dividir un siustrato. |
TWI221791B (en) * | 2002-04-02 | 2004-10-11 | Mitsubishi Electric Corp | Laser processing system and laser processing method |
DE102004014277A1 (de) * | 2004-03-22 | 2005-10-20 | Fraunhofer Ges Forschung | Verfahren zum laserthermischen Trennen von Flachgläsern |
TW200617794A (en) * | 2004-09-14 | 2006-06-01 | Oji Paper Co | Tape with built-in IC chip, production method thereof, and sheet with built-in IC chip |
EP2772333B1 (en) * | 2004-12-30 | 2016-05-18 | Light Matter Interaction Inc. | Apparatus for laser processing a biological material |
CN1939644B (zh) * | 2005-09-30 | 2012-10-17 | 日立比亚机械股份有限公司 | 激光加工方法以及激光加工装置 |
JP5030512B2 (ja) * | 2005-09-30 | 2012-09-19 | 日立ビアメカニクス株式会社 | レーザ加工方法 |
JP2008212999A (ja) | 2007-03-06 | 2008-09-18 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP5553397B2 (ja) * | 2007-07-19 | 2014-07-16 | 日東電工株式会社 | レーザー加工方法 |
RU2526681C2 (ru) * | 2009-01-28 | 2014-08-27 | Олбани Интернешнл Корп. | Ткань для бумагоделательной машины, предназначенная для производства бумажных салфеток и бумажных полотенец, и способ ее изготовления |
WO2010093857A1 (en) * | 2009-02-13 | 2010-08-19 | Videojet Technologies Inc. | Laser parameter adjustment |
US8529991B2 (en) * | 2009-07-31 | 2013-09-10 | Raytheon Canada Limited | Method and apparatus for cutting a part without damaging a coating thereon |
CN101969746B (zh) * | 2010-11-04 | 2012-05-09 | 沪士电子股份有限公司 | 印刷电路板镂空区局部除电镀铜的方法 |
WO2012093471A1 (ja) * | 2011-01-05 | 2012-07-12 | Kondo Kiyoyuki | ビーム加工装置 |
JP5839876B2 (ja) * | 2011-07-27 | 2016-01-06 | 古河電気工業株式会社 | レーザ加工用銅板および該レーザ加工用銅板を用いたプリント基板、並びに銅板のレーザ加工方法 |
JP2014120568A (ja) * | 2012-12-14 | 2014-06-30 | Showa Denko Packaging Co Ltd | 配線基板の表裏導通方法 |
CN103909351A (zh) * | 2013-01-04 | 2014-07-09 | 欣兴电子股份有限公司 | 线路板以及此线路板的激光钻孔方法 |
CN103286456B (zh) * | 2013-05-07 | 2015-07-01 | 大族激光科技产业集团股份有限公司 | 激光切割装置及切割方法 |
JP6110225B2 (ja) * | 2013-06-25 | 2017-04-05 | ビアメカニクス株式会社 | レーザ穴明け加工方法 |
CN103747636A (zh) * | 2013-12-24 | 2014-04-23 | 广州兴森快捷电路科技有限公司 | 镀金线路板引线回蚀的方法 |
JP6134914B2 (ja) * | 2014-09-08 | 2017-05-31 | パナソニックIpマネジメント株式会社 | コンフォーマルマスク材料のレーザ加工方法 |
CN106199830A (zh) * | 2015-05-08 | 2016-12-07 | 中兴通讯股份有限公司 | 光波导的制备方法及装置 |
CN105578771A (zh) * | 2015-12-31 | 2016-05-11 | 广州兴森快捷电路科技有限公司 | 电路板内槽的加工方法 |
JP2020109820A (ja) * | 2019-01-01 | 2020-07-16 | 大船企業日本株式会社 | プリント基板のレーザ加工方法およびプリント基板のレーザ加工機 |
CN112444162B (zh) * | 2019-09-02 | 2023-10-13 | 西安尚道电子科技有限公司 | 一种导电布精度靶板制造方法 |
KR20220062533A (ko) * | 2019-09-13 | 2022-05-17 | 가부시키가이샤 제파 | 회로 성형 부품 및 전자기기 |
CN113099615B (zh) * | 2021-04-01 | 2022-09-06 | 深圳市祺利电子有限公司 | 一种大尺寸线路板钻孔定位方法 |
CN112992880B (zh) * | 2021-04-25 | 2023-08-15 | 江西沃格光电股份有限公司 | 一种Mini-LED背光板通孔的形成方法及电子设备 |
CN114152614A (zh) * | 2021-12-24 | 2022-03-08 | 深圳技师学院(深圳高级技工学校) | 一种覆盖膜激光切割碳化程度的测量方法 |
CN117464170B (zh) * | 2023-12-27 | 2024-04-02 | 武汉铱科赛科技有限公司 | 一种层间电连激光加工方法、设备、装置及系统 |
-
1996
- 1996-03-15 JP JP8059862A patent/JPH09107168A/ja active Pending
- 1996-07-31 US US08/690,140 patent/US20030146196A1/en not_active Abandoned
- 1996-08-05 TW TW085109427A patent/TW312082B/zh not_active IP Right Cessation
- 1996-08-07 CN CN96111476A patent/CN1098022C/zh not_active Expired - Lifetime
- 1996-08-07 KR KR1019960032874A patent/KR100199955B1/ko not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103857207A (zh) * | 2012-11-30 | 2014-06-11 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板及其制作方法 |
CN103857207B (zh) * | 2012-11-30 | 2017-03-01 | 碁鼎科技秦皇岛有限公司 | 电路板及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH09107168A (ja) | 1997-04-22 |
US20030146196A1 (en) | 2003-08-07 |
CN1142743A (zh) | 1997-02-12 |
KR970013540A (ko) | 1997-03-29 |
KR100199955B1 (ko) | 1999-06-15 |
TW312082B (ko) | 1997-08-01 |
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Legal Events
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term |
Granted publication date: 20030101 |
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EXPY | Termination of patent right or utility model |