CN103857207A - 电路板及其制作方法 - Google Patents
电路板及其制作方法 Download PDFInfo
- Publication number
- CN103857207A CN103857207A CN201210502222.4A CN201210502222A CN103857207A CN 103857207 A CN103857207 A CN 103857207A CN 201210502222 A CN201210502222 A CN 201210502222A CN 103857207 A CN103857207 A CN 103857207A
- Authority
- CN
- China
- Prior art keywords
- conducting wire
- layer
- blind hole
- conductive
- wire layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 20
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 303
- 230000004888 barrier function Effects 0.000 description 14
- 238000007747 plating Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 5
- 238000000608 laser ablation Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
Images
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
电路板 | 100 |
芯层电路基板 | 110 |
绝缘层 | 111 |
第一导电线路层 | 112 |
第一导电垫 | 1122 |
第五导电线路层 | 113 |
第一介电层 | 120 |
第二导电线路层 | 130 |
第二导电线路 | 1301 |
激光连接垫 | 1302 |
泪滴设计 | 1304 |
第四介电层 | 140 |
第六导电线路层 | 150 |
第二介电层 | 161 |
第一盲孔 | 1611 |
电镀金属层 | 1612 |
第一导电盲孔 | 163 |
第五介电层 | 162 |
第一导电种子层 | 171 |
第二导电种子层 | 172 |
第三导电线路层 | 181 |
导电孔环 | 1811 |
第三导电线路 | 1812 |
第七导电线路层 | 182 |
第三介电层 | 191 |
第六介电层 | 192 |
第二盲孔 | 1911 |
第二导电盲孔 | 1912 |
第四导电线路层 | 1011 |
第八导电线路层 | 1012 |
第一防焊层 | 1021 |
第二防焊层 | 1022 |
第一开口 | 1023 |
第二开口 | 1024 |
保护层 | 1030 |
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210502222.4A CN103857207B (zh) | 2012-11-30 | 2012-11-30 | 电路板及其制作方法 |
TW101146772A TWI463929B (zh) | 2012-11-30 | 2012-12-12 | 電路板及其製作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210502222.4A CN103857207B (zh) | 2012-11-30 | 2012-11-30 | 电路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103857207A true CN103857207A (zh) | 2014-06-11 |
CN103857207B CN103857207B (zh) | 2017-03-01 |
Family
ID=50864275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210502222.4A Active CN103857207B (zh) | 2012-11-30 | 2012-11-30 | 电路板及其制作方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN103857207B (zh) |
TW (1) | TWI463929B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI620475B (zh) * | 2015-01-12 | 2018-04-01 | 南亞電路板股份有限公司 | 印刷電路板及其製作方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1098022C (zh) * | 1995-08-07 | 2003-01-01 | 三菱电机株式会社 | 电路底板激光加工法及其加工装置和二氧化碳激光振荡器 |
US20080236881A1 (en) * | 2007-03-27 | 2008-10-02 | Shinji Tanaka | Multilayer printed wiring board and method for manufacturing the same |
CN202178922U (zh) * | 2011-08-15 | 2012-03-28 | 汕头超声印制板(二厂)有限公司 | 一种印制电路板叠孔结构 |
CN202183910U (zh) * | 2011-08-15 | 2012-04-04 | 汕头超声印制板(二厂)有限公司 | 印制电路板叠孔结构 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6674017B1 (en) * | 1998-12-24 | 2004-01-06 | Ngk Spark Plug Co., Ltd. | Multilayer-wiring substrate and method for fabricating same |
JP2003332752A (ja) * | 2002-05-14 | 2003-11-21 | Shinko Electric Ind Co Ltd | メタルコア基板およびその製造方法 |
-
2012
- 2012-11-30 CN CN201210502222.4A patent/CN103857207B/zh active Active
- 2012-12-12 TW TW101146772A patent/TWI463929B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1098022C (zh) * | 1995-08-07 | 2003-01-01 | 三菱电机株式会社 | 电路底板激光加工法及其加工装置和二氧化碳激光振荡器 |
US20080236881A1 (en) * | 2007-03-27 | 2008-10-02 | Shinji Tanaka | Multilayer printed wiring board and method for manufacturing the same |
CN202178922U (zh) * | 2011-08-15 | 2012-03-28 | 汕头超声印制板(二厂)有限公司 | 一种印制电路板叠孔结构 |
CN202183910U (zh) * | 2011-08-15 | 2012-04-04 | 汕头超声印制板(二厂)有限公司 | 印制电路板叠孔结构 |
Also Published As
Publication number | Publication date |
---|---|
CN103857207B (zh) | 2017-03-01 |
TW201422080A (zh) | 2014-06-01 |
TWI463929B (zh) | 2014-12-01 |
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20161205 Address after: No. 18, Tengfei Road, Qinhuangdao Economic & Technological Development Zone, Hebei, China Applicant after: Qi Ding Technology Qinhuangdao Co.,Ltd. Applicant after: Zhen Ding Technology Co.,Ltd. Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Applicant before: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co.,Ltd. Applicant before: Zhen Ding Technology Co.,Ltd. |
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GR01 | Patent grant | ||
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20221118 Address after: No. 18-2, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province Patentee after: Liding semiconductor technology Qinhuangdao Co.,Ltd. Patentee after: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: No.18, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province 066004 Patentee before: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
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Effective date of registration: 20240226 Address after: 18-2 Tengfei Road, Economic and Technological Development Zone, Qinhuangdao City, Hebei Province Patentee after: Liding semiconductor technology Qinhuangdao Co.,Ltd. Country or region after: China Patentee after: Zhen Ding Technology Co.,Ltd. Country or region after: Taiwan, China Address before: 066004 No. 18-2, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province Patentee before: Liding semiconductor technology Qinhuangdao Co.,Ltd. Country or region before: China Patentee before: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. Country or region before: Taiwan, China |