CN107598909B - 基板处理设备 - Google Patents

基板处理设备 Download PDF

Info

Publication number
CN107598909B
CN107598909B CN201710826869.5A CN201710826869A CN107598909B CN 107598909 B CN107598909 B CN 107598909B CN 201710826869 A CN201710826869 A CN 201710826869A CN 107598909 B CN107598909 B CN 107598909B
Authority
CN
China
Prior art keywords
substrate
handling
arm
axis
rotation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710826869.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN107598909A (zh
Inventor
A.克鲁皮舍夫
U.吉尔克里斯特
R.T.卡夫尼
D.巴布斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Borucos Automation Usa Co ltd
Borukos Automation Holding Co ltd
Original Assignee
Borucos Automation Usa Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Borucos Automation Usa Co ltd filed Critical Borucos Automation Usa Co ltd
Priority to CN201710826869.5A priority Critical patent/CN107598909B/zh
Publication of CN107598909A publication Critical patent/CN107598909A/zh
Application granted granted Critical
Publication of CN107598909B publication Critical patent/CN107598909B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Program-controlled manipulators
    • B25J9/02Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041Cylindrical coordinate type
    • B25J9/042Cylindrical coordinate type comprising an articulated arm
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00Manipulators not otherwise provided for
    • B25J11/0095Manipulators transporting wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00Arms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • B65G47/904Devices for picking-up and depositing articles or materials provided with rotary movements only
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0451Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0451Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0451Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302Mechanical parts of transfer devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02Articles
    • B65G2201/0214Articles of special size, shape or weigh
    • B65G2201/022Flat

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CN201710826869.5A 2012-02-10 2013-02-11 基板处理设备 Active CN107598909B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710826869.5A CN107598909B (zh) 2012-02-10 2013-02-11 基板处理设备

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US201261597507P 2012-02-10 2012-02-10
US61/597507 2012-02-10
US201261660900P 2012-06-18 2012-06-18
US61/660900 2012-06-18
US201261662690P 2012-06-21 2012-06-21
US61/662690 2012-06-21
CN201710826869.5A CN107598909B (zh) 2012-02-10 2013-02-11 基板处理设备
PCT/US2013/025513 WO2013120054A1 (en) 2012-02-10 2013-02-11 Substrate processing apparatus
CN201380019263.0A CN104349872B (zh) 2012-02-10 2013-02-11 基板处理设备

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201380019263.0A Division CN104349872B (zh) 2012-02-10 2013-02-11 基板处理设备

Publications (2)

Publication Number Publication Date
CN107598909A CN107598909A (zh) 2018-01-19
CN107598909B true CN107598909B (zh) 2024-01-30

Family

ID=48948087

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201710826869.5A Active CN107598909B (zh) 2012-02-10 2013-02-11 基板处理设备
CN201380019263.0A Active CN104349872B (zh) 2012-02-10 2013-02-11 基板处理设备

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201380019263.0A Active CN104349872B (zh) 2012-02-10 2013-02-11 基板处理设备

Country Status (6)

Country Link
US (3) US12142511B2 (https=)
JP (4) JP6843493B2 (https=)
KR (3) KR20230067705A (https=)
CN (2) CN107598909B (https=)
TW (3) TWI725303B (https=)
WO (1) WO2013120054A1 (https=)

Families Citing this family (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2008316467A1 (en) * 2007-10-24 2009-04-30 Oc Oerlikon Balzers Ag Method for manufacturing workpieces and apparatus
US9048344B2 (en) 2008-06-13 2015-06-02 Kateeva, Inc. Gas enclosure assembly and system
US12018857B2 (en) 2008-06-13 2024-06-25 Kateeva, Inc. Gas enclosure assembly and system
US11975546B2 (en) 2008-06-13 2024-05-07 Kateeva, Inc. Gas enclosure assembly and system
US12064979B2 (en) 2008-06-13 2024-08-20 Kateeva, Inc. Low-particle gas enclosure systems and methods
US8383202B2 (en) 2008-06-13 2013-02-26 Kateeva, Inc. Method and apparatus for load-locked printing
US10434804B2 (en) 2008-06-13 2019-10-08 Kateeva, Inc. Low particle gas enclosure systems and methods
US8899171B2 (en) 2008-06-13 2014-12-02 Kateeva, Inc. Gas enclosure assembly and system
US10224232B2 (en) 2013-01-18 2019-03-05 Persimmon Technologies Corporation Robot having two arms with unequal link lengths
CN111489987A (zh) * 2013-03-15 2020-08-04 应用材料公司 基板沉积系统、机械手移送设备及用于电子装置制造的方法
KR102482948B1 (ko) 2013-08-26 2022-12-29 브룩스 오토메이션 인코퍼레이티드 기판 이송 장치
US10424498B2 (en) 2013-09-09 2019-09-24 Persimmon Technologies Corporation Substrate transport vacuum platform
JP2016537805A (ja) * 2013-09-26 2016-12-01 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 基板処理のための混合プラットフォームの装置、システム、及び方法
JP6466955B2 (ja) * 2013-11-04 2019-02-06 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 側面数増強対応移送チャンバ、半導体デバイスの製造処理ツール及び処理方法
CN105900258A (zh) 2013-12-26 2016-08-24 科迪华公司 电子装置的热加工
KR20220044392A (ko) * 2014-01-17 2022-04-07 브룩스 오토메이션 인코퍼레이티드 기판 이송 장치
KR102050152B1 (ko) 2014-01-21 2020-01-08 카티바, 인크. 전자 장치 인캡슐레이션을 위한 기기 및 기술
WO2015112538A1 (en) 2014-01-21 2015-07-30 Persimmon Technologies, Corp. Substrate transport vacuum platform
KR102390045B1 (ko) * 2014-04-30 2022-04-22 카티바, 인크. 가스 쿠션 장비 및 기판 코팅 기술
CN105097623A (zh) * 2014-05-07 2015-11-25 盛美半导体设备(上海)有限公司 晶圆装载端口结构
EP3258762B1 (en) * 2015-02-12 2019-12-04 FUJI Corporation Component supply device
US10131020B2 (en) * 2015-03-10 2018-11-20 James P. Sullivan Part orienter with removable rotating fixture
US9889567B2 (en) * 2015-04-24 2018-02-13 Applied Materials, Inc. Wafer swapper
KR102587203B1 (ko) * 2015-07-13 2023-10-10 브룩스 오토메이션 인코퍼레이티드 온 더 플라이 자동 웨이퍼 센터링 방법 및 장치
US10515834B2 (en) * 2015-10-12 2019-12-24 Lam Research Corporation Multi-station tool with wafer transfer microclimate systems
US20170125269A1 (en) * 2015-10-29 2017-05-04 Aixtron Se Transfer module for a multi-module apparatus
JP6700130B2 (ja) * 2016-07-12 2020-05-27 東京エレクトロン株式会社 接合システム
US11167434B2 (en) * 2016-08-30 2021-11-09 HighRes Biosolutions, Inc. Robotic processing system
US10159169B2 (en) * 2016-10-27 2018-12-18 Applied Materials, Inc. Flexible equipment front end module interfaces, environmentally-controlled equipment front end modules, and assembly methods
US10651067B2 (en) 2017-01-26 2020-05-12 Brooks Automation, Inc. Method and apparatus for substrate transport apparatus position compensation
JP7196101B2 (ja) * 2017-02-15 2022-12-26 パーシモン テクノロジーズ コーポレイション 複数のエンドエフェクタを備えた材料取り扱いロボット
EP3596752B1 (en) 2017-03-15 2025-01-08 Lam Research Corporation Reduced footprint platform architecture with linear vacuum transfer module
US10420109B2 (en) * 2017-04-13 2019-09-17 Futurewei Technologies, Inc. System and method for providing explicit feedback in communications systems with multi-point connectivity
JP6881010B2 (ja) * 2017-05-11 2021-06-02 東京エレクトロン株式会社 真空処理装置
DE102018100003B4 (de) * 2017-08-08 2020-03-12 Taiwan Semiconductor Manufacturing Co., Ltd. Methodologie zum automatischen Anlernen eines EFEM-Roboters
US10861723B2 (en) * 2017-08-08 2020-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. EFEM robot auto teaching methodology
US11020852B2 (en) * 2017-10-05 2021-06-01 Brooks Automation, Inc. Substrate transport apparatus with independent accessory feedthrough
US10155309B1 (en) * 2017-11-16 2018-12-18 Lam Research Corporation Wafer handling robots with rotational joint encoders
JP7326275B2 (ja) 2017-12-01 2023-08-15 アプライド マテリアルズ インコーポレイテッド エッチング選択性の高いアモルファスカーボン膜
GB2570510A (en) * 2018-01-30 2019-07-31 Pragmatic Printing Ltd System and method for manufacturing plurality of integrated circuits
KR102706036B1 (ko) 2018-02-15 2024-09-11 램 리써치 코포레이션 기판 이송 챔버 이동
US11574830B2 (en) * 2018-03-16 2023-02-07 Brooks Automation Us, Llc Substrate transport apparatus
US10943805B2 (en) 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
US11535460B2 (en) * 2018-05-31 2022-12-27 Brooks Automation Us, Llc Substrate processing apparatus
TWI828710B (zh) * 2018-06-18 2024-01-11 美商蘭姆研究公司 基板處理系統及基板處理方法
CN112840447B (zh) 2018-10-04 2025-11-21 应用材料公司 运输系统
US11850742B2 (en) 2019-06-07 2023-12-26 Applied Materials, Inc. Dual robot including splayed end effectors and systems and methods including same
KR102696424B1 (ko) * 2019-07-12 2024-08-16 어플라이드 머티어리얼스, 인코포레이티드 동시 기판 이송을 위한 로봇
JP7458718B2 (ja) * 2019-07-19 2024-04-01 株式会社Screenホールディングス 基板処理装置および基板搬送方法
KR102790235B1 (ko) * 2019-08-14 2025-04-01 어플라이드 머티어리얼스, 인코포레이티드 경로 스위칭 조립체, 이를 갖는 챔버 및 기판 프로세싱 시스템, 및 이들을 위한 방법들
US11569111B2 (en) * 2019-12-02 2023-01-31 Brooks Automation Us, Llc Substrate processing apparatus
US11049740B1 (en) 2019-12-05 2021-06-29 Applied Materials, Inc. Reconfigurable mainframe with replaceable interface plate
WO2021156985A1 (ja) * 2020-02-05 2021-08-12 株式会社安川電機 搬送システム、搬送方法および搬送装置
TWI894199B (zh) * 2020-02-05 2025-08-21 美商布魯克斯自動機械美國公司 基材處理設備及其使用方法
US12046499B2 (en) * 2020-02-05 2024-07-23 Brooks Automation Us, Llc Substrate processing apparatus
US20230139939A1 (en) * 2020-02-17 2023-05-04 Jabil Inc. Apparatus, system and method for providing self extracting grips for an end effector
JP7724227B2 (ja) 2020-02-27 2025-08-15 ラム リサーチ コーポレーション 放射状ガスカーテンおよび/または内部容積制御を備えたウエハハンドリングロボット
JP7511380B2 (ja) * 2020-05-01 2024-07-05 東京エレクトロン株式会社 処理システム
JP7759192B2 (ja) * 2020-05-12 2025-10-23 エーエスエム・アイピー・ホールディング・ベー・フェー 高スループットマルチチャンバ基材処理システム
US11521870B2 (en) 2020-07-08 2022-12-06 Applied Materials, Inc. Annealing chamber
KR20230078686A (ko) * 2020-09-01 2023-06-02 퍼시몬 테크놀로지스 코포레이션 자기적으로 안내되는 엔드-이펙터들을 가지는 재료-핸들링 로봇
US11602064B2 (en) 2020-09-01 2023-03-07 Applied Materials, Inc. Dynamic electrical and fluid delivery system with indexing motion for batch processing chambers
KR20220042646A (ko) 2020-09-28 2022-04-05 현대중공업지주 주식회사 기판이송장치
US12076859B2 (en) * 2020-10-14 2024-09-03 Applied Materials, Inc. Infinite rotation of vacuum robot linkage through timing belt with isolated environment
KR20220053854A (ko) * 2020-10-23 2022-05-02 피코앤테라(주) 이에프이엠
US11955364B2 (en) * 2021-01-22 2024-04-09 Kimball Electronics Indiana, Inc. Telescoping linear extension robot
TWI745266B (zh) * 2021-05-31 2021-11-01 博斯科技股份有限公司 反應爐冷卻系統及其方法
US12506024B2 (en) * 2021-07-08 2025-12-23 Applied Materials, Inc. Method and mechanism for contact-free process chamber characterization
JP7730710B2 (ja) * 2021-10-04 2025-08-28 ニデックインスツルメンツ株式会社 製造システム
KR20230111438A (ko) 2022-01-18 2023-07-25 삼성전자주식회사 반도체 기판 처리 장치
US12046501B2 (en) * 2022-10-06 2024-07-23 Kawasaki Jukogyo Kabushiki Kaisha Substrate handling apparatus and method of handling substrate
US20240278437A1 (en) * 2023-02-16 2024-08-22 Samsung Electronics Co., Ltd. Substrate processing apparatus
US20240379396A1 (en) * 2023-05-10 2024-11-14 Brooks Automation US, LLC. Substrate processing apparatus
KR102620088B1 (ko) * 2023-05-12 2024-01-02 에이피티씨 주식회사 기판 이송 장치
CN119340236A (zh) * 2023-07-21 2025-01-21 北京北方华创微电子装备有限公司 半导体工艺腔室、半导体工艺设备和半导体工艺方法
KR102638655B1 (ko) * 2023-08-07 2024-02-20 에이피티씨 주식회사 멀티 층 efem을 포함하는 기판 이송 장치
CN116985159A (zh) * 2023-08-22 2023-11-03 上海广川科技有限公司 一种手臂可升降的机械手
WO2025054493A1 (en) * 2023-09-08 2025-03-13 Brooks Automation Us, Llc Compartmental link substrate transport apparatus
WO2025054513A1 (en) * 2023-09-08 2025-03-13 Brooks Automation Us, Llc Buffer for substrate transport apparatus and substrate transport apparatus including the buffer
CN117067189A (zh) * 2023-09-27 2023-11-17 上海广川科技有限公司 一种手臂可升降的机械手
WO2025259930A1 (en) * 2024-06-14 2025-12-18 Brooks Automation Us, Llc Robotic transport for handling multiple payload types
CN119495630B (zh) * 2025-01-17 2025-04-25 素珀电子科技(上海)有限公司 基板传送设备
CN120199707B (zh) * 2025-04-09 2025-11-18 长园半导体设备(珠海)有限公司 Tcb工艺的z轴移载平台、位移装置及其键合设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001147910A (ja) * 1999-11-19 2001-05-29 Nec Soft Ltd 分散バッチジョブ処理継続方式およびその記録媒体
CN1411960A (zh) * 2001-10-17 2003-04-23 日本伺服株式会社 多关节工业机器人
US6737826B2 (en) * 2001-07-13 2004-05-18 Brooks Automation, Inc. Substrate transport apparatus with multiple independent end effectors
JP2008016815A (ja) * 2006-07-04 2008-01-24 Psk Inc 基板搬送装置及びこの基板搬送装置を用いた基板処理設備
JP2011061141A (ja) * 2009-09-14 2011-03-24 Disco Abrasive Syst Ltd 搬送機構および加工装置
JP2011230256A (ja) * 2010-04-28 2011-11-17 Nidec Sankyo Corp 産業用ロボット

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302671A (ja) * 1993-04-16 1994-10-28 Sony Corp 真空装置
WO1994023911A1 (en) * 1993-04-16 1994-10-27 Brooks Automation, Inc. Articulated arm transfer device
US5765444A (en) * 1995-07-10 1998-06-16 Kensington Laboratories, Inc. Dual end effector, multiple link robot arm system with corner reacharound and extended reach capabilities
US5789890A (en) 1996-03-22 1998-08-04 Genmark Automation Robot having multiple degrees of freedom
TW372926B (en) * 1996-04-04 1999-11-01 Applied Materials Inc Method and system of processing semiconductor workpieces and robot for use in said system
KR100265287B1 (ko) 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
JPH11300663A (ja) * 1998-04-24 1999-11-02 Mecs Corp 薄型基板搬送装置
JPH11330199A (ja) * 1998-05-18 1999-11-30 Sony Corp 真空プロセス装置
JP2000072248A (ja) 1998-08-27 2000-03-07 Rorze Corp 基板搬送装置
US6256555B1 (en) 1998-12-02 2001-07-03 Newport Corporation Robot arm with specimen edge gripping end effector
US6485250B2 (en) 1998-12-30 2002-11-26 Brooks Automation Inc. Substrate transport apparatus with multiple arms on a common axis of rotation
US6634851B1 (en) * 1999-01-15 2003-10-21 Asyst Technologies, Inc. Workpiece handling robot
JP2000308984A (ja) 1999-04-23 2000-11-07 Murata Mach Ltd スカラーアームとこれを用いた搬送装置
US6440261B1 (en) 1999-05-25 2002-08-27 Applied Materials, Inc. Dual buffer chamber cluster tool for semiconductor wafer processing
US6297611B1 (en) 2000-07-06 2001-10-02 Genmark Automation Robot having independent end effector linkage motion
US20020061248A1 (en) * 2000-07-07 2002-05-23 Applied Materials, Inc. High productivity semiconductor wafer processing system
JP2002158272A (ja) * 2000-11-17 2002-05-31 Tatsumo Kk ダブルアーム基板搬送装置
US6852194B2 (en) 2001-05-21 2005-02-08 Tokyo Electron Limited Processing apparatus, transferring apparatus and transferring method
JP2008034858A (ja) * 2001-05-21 2008-02-14 Tokyo Electron Ltd 処理装置
TW550151B (en) * 2001-07-13 2003-09-01 Brooks Automation Inc Substrate transport apparatus with multiple independent end effectors
JP3755744B2 (ja) * 2001-08-02 2006-03-15 株式会社安川電機 基板搬送用ロボット
US7891935B2 (en) * 2002-05-09 2011-02-22 Brooks Automation, Inc. Dual arm robot
US7578649B2 (en) * 2002-05-29 2009-08-25 Brooks Automation, Inc. Dual arm substrate transport apparatus
JP4294984B2 (ja) * 2003-03-19 2009-07-15 東京エレクトロン株式会社 基板搬送装置及び基板処理装置
KR100583727B1 (ko) * 2004-01-07 2006-05-25 삼성전자주식회사 기판 제조 장치 및 이에 사용되는 기판 이송 모듈
JP2004207750A (ja) 2004-02-12 2004-07-22 Dainippon Screen Mfg Co Ltd 基板処理装置
US6987272B2 (en) 2004-03-05 2006-01-17 Axcelis Technologies, Inc. Work piece transfer system for an ion beam implanter
US8376685B2 (en) 2004-06-09 2013-02-19 Brooks Automation, Inc. Dual scara arm
JP2006205264A (ja) 2005-01-25 2006-08-10 Jel:Kk 基板搬送装置
TWI318195B (en) * 2005-05-26 2009-12-11 Advanced Display Proc Eng Co System for manufacturing flat-panel display
JP4925650B2 (ja) 2005-11-28 2012-05-09 東京エレクトロン株式会社 基板処理装置
US8220354B2 (en) * 2006-06-28 2012-07-17 Genmark Automation, Inc. Belt-driven robot having extended Z-axis motion
TWI398335B (zh) 2006-11-27 2013-06-11 日本電產三協股份有限公司 Workpiece conveying system
JP2008135630A (ja) 2006-11-29 2008-06-12 Jel:Kk 基板搬送装置
US9105673B2 (en) 2007-05-09 2015-08-11 Brooks Automation, Inc. Side opening unified pod
KR100850436B1 (ko) * 2007-06-20 2008-08-05 주식회사 싸이맥스 반도체 제조설비
KR100957225B1 (ko) 2007-11-07 2010-05-11 세메스 주식회사 기판 처리 장치 및 방법
JP5387412B2 (ja) * 2007-11-21 2014-01-15 株式会社安川電機 搬送ロボット、筐体、半導体製造装置およびソータ装置
JP4746027B2 (ja) * 2007-12-10 2011-08-10 川崎重工業株式会社 基板搬送方法
JP5294681B2 (ja) * 2008-04-28 2013-09-18 東京エレクトロン株式会社 基板処理装置及びその基板搬送方法
JP5139253B2 (ja) 2008-12-18 2013-02-06 東京エレクトロン株式会社 真空処理装置及び真空搬送装置
KR101778519B1 (ko) * 2009-01-11 2017-09-15 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스 제조시에 기판을 이송하기 위한 로봇 시스템, 장치 및 방법
KR101689550B1 (ko) * 2009-01-11 2016-12-26 어플라이드 머티어리얼스, 인코포레이티드 기판들을 운반하기 위한 정전기 엔드 이펙터 장치, 시스템들 및 방법들
JP2011020188A (ja) 2009-07-14 2011-02-03 Seiko Epson Corp ロボット装置およびロボット装置の制御方法
JP2011077399A (ja) 2009-09-30 2011-04-14 Tokyo Electron Ltd 被処理体の搬送方法及び被処理体処理装置
US8459922B2 (en) * 2009-11-13 2013-06-11 Brooks Automation, Inc. Manipulator auto-teach and position correction system
JP2011119556A (ja) * 2009-12-07 2011-06-16 Yaskawa Electric Corp 水平多関節ロボットおよびそれを備えた搬送装置
JP5755844B2 (ja) * 2010-05-31 2015-07-29 株式会社ダイヘン ワーク搬送システム
US9076829B2 (en) * 2011-08-08 2015-07-07 Applied Materials, Inc. Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing
US10569430B2 (en) 2011-09-16 2020-02-25 Persimmon Technologies Corporation Low variability robot

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001147910A (ja) * 1999-11-19 2001-05-29 Nec Soft Ltd 分散バッチジョブ処理継続方式およびその記録媒体
US6737826B2 (en) * 2001-07-13 2004-05-18 Brooks Automation, Inc. Substrate transport apparatus with multiple independent end effectors
CN1411960A (zh) * 2001-10-17 2003-04-23 日本伺服株式会社 多关节工业机器人
JP2008016815A (ja) * 2006-07-04 2008-01-24 Psk Inc 基板搬送装置及びこの基板搬送装置を用いた基板処理設備
JP2011061141A (ja) * 2009-09-14 2011-03-24 Disco Abrasive Syst Ltd 搬送機構および加工装置
JP2011230256A (ja) * 2010-04-28 2011-11-17 Nidec Sankyo Corp 産業用ロボット

Also Published As

Publication number Publication date
TW201839895A (zh) 2018-11-01
JP2023113831A (ja) 2023-08-16
JP2021010011A (ja) 2021-01-28
JP2015508236A (ja) 2015-03-16
US20160329234A1 (en) 2016-11-10
KR20220019075A (ko) 2022-02-15
CN104349872B (zh) 2017-10-13
KR102096074B1 (ko) 2020-04-01
KR20160098524A (ko) 2016-08-18
US20150013910A1 (en) 2015-01-15
JP2016219831A (ja) 2016-12-22
KR20230067705A (ko) 2023-05-16
TWI725303B (zh) 2021-04-21
CN104349872A (zh) 2015-02-11
CN107598909A (zh) 2018-01-19
KR102529273B1 (ko) 2023-05-04
JP7292249B2 (ja) 2023-06-16
US12142511B2 (en) 2024-11-12
US20250069939A1 (en) 2025-02-27
WO2013120054A1 (en) 2013-08-15
JP6325612B2 (ja) 2018-05-16
JP6843493B2 (ja) 2021-03-17
TW201349376A (zh) 2013-12-01
TWI629743B (zh) 2018-07-11
TW202203356A (zh) 2022-01-16

Similar Documents

Publication Publication Date Title
CN107598909B (zh) 基板处理设备
KR102359364B1 (ko) 기판 프로세싱 장치
JP6594304B2 (ja) 処理装置
CN101048861B (zh) 基于升降机的工具装载和缓冲系统
TWI486999B (zh) 基板處理裝置
TWI446477B (zh) 傳輸及處理基板用裝置及方法
JP4712379B2 (ja) 基板処理装置
US8944738B2 (en) Stacked process modules for a semiconductor handling system
US7458763B2 (en) Mid-entry load lock for semiconductor handling system
US20100054897A1 (en) Reduced capacity carrier, transport, load port, buffer system
CN106463438A (zh) 基板运输设备
CN107112264A (zh) 晶片对准器
CN112470266A (zh) 衬底输送设备

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20220308

Address after: Massachusetts

Applicant after: Borukos automation Holding Co.,Ltd.

Address before: Massachusetts

Applicant before: BROOKS AUTOMATION, Inc.

Effective date of registration: 20220308

Address after: Massachusetts

Applicant after: Borucos automation USA Co.,Ltd.

Address before: Massachusetts

Applicant before: Borukos automation Holding Co.,Ltd.

TA01 Transfer of patent application right
GR01 Patent grant
GR01 Patent grant