CN1051747C - 二氧化硅的甲硅烷基化方法以及由此制得的产品及其应用 - Google Patents
二氧化硅的甲硅烷基化方法以及由此制得的产品及其应用 Download PDFInfo
- Publication number
- CN1051747C CN1051747C CN95106688A CN95106688A CN1051747C CN 1051747 C CN1051747 C CN 1051747C CN 95106688 A CN95106688 A CN 95106688A CN 95106688 A CN95106688 A CN 95106688A CN 1051747 C CN1051747 C CN 1051747C
- Authority
- CN
- China
- Prior art keywords
- silica
- dioxide
- fine silicon
- weight
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 72
- 238000006884 silylation reaction Methods 0.000 title abstract description 32
- 230000008569 process Effects 0.000 title abstract description 27
- 229910052809 inorganic oxide Inorganic materials 0.000 title abstract description 6
- 239000007788 liquid Substances 0.000 claims abstract description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 392
- 239000000377 silicon dioxide Substances 0.000 claims description 183
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 96
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 52
- 239000000203 mixture Substances 0.000 claims description 50
- 230000008719 thickening Effects 0.000 claims description 46
- 229910052799 carbon Inorganic materials 0.000 claims description 43
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 40
- 235000012239 silicon dioxide Nutrition 0.000 claims description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 36
- 238000004438 BET method Methods 0.000 claims description 35
- 239000003153 chemical reaction reagent Substances 0.000 claims description 35
- 125000005375 organosiloxane group Chemical group 0.000 claims description 11
- 239000007789 gas Substances 0.000 claims description 10
- 150000001282 organosilanes Chemical class 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000011164 primary particle Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- 239000003921 oil Substances 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 239000006096 absorbing agent Substances 0.000 claims description 2
- 238000012545 processing Methods 0.000 claims description 2
- 229960001866 silicon dioxide Drugs 0.000 claims 18
- 150000001721 carbon Chemical group 0.000 claims 3
- 229910014307 bSiO Inorganic materials 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 abstract description 46
- 229910021485 fumed silica Inorganic materials 0.000 abstract description 28
- 239000000443 aerosol Substances 0.000 abstract description 8
- -1 polydimethylsiloxanes Polymers 0.000 description 56
- 230000000694 effects Effects 0.000 description 42
- 150000003961 organosilicon compounds Chemical class 0.000 description 28
- 229920004482 WACKER® Polymers 0.000 description 25
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 24
- 229920005989 resin Polymers 0.000 description 24
- 239000011347 resin Substances 0.000 description 24
- 238000003860 storage Methods 0.000 description 24
- 238000006243 chemical reaction Methods 0.000 description 21
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 20
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 20
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 19
- 238000001035 drying Methods 0.000 description 18
- 239000004205 dimethyl polysiloxane Substances 0.000 description 17
- 238000001179 sorption measurement Methods 0.000 description 16
- 239000006185 dispersion Substances 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- 239000004814 polyurethane Substances 0.000 description 11
- 125000005372 silanol group Chemical group 0.000 description 11
- 239000004593 Epoxy Chemical group 0.000 description 10
- 150000001298 alcohols Chemical class 0.000 description 10
- 239000011261 inert gas Substances 0.000 description 10
- 239000000243 solution Substances 0.000 description 9
- 238000004458 analytical method Methods 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 238000012856 packing Methods 0.000 description 8
- 229920002635 polyurethane Polymers 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 229920001296 polysiloxane Polymers 0.000 description 7
- 239000006254 rheological additive Substances 0.000 description 7
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 238000011282 treatment Methods 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 238000000746 purification Methods 0.000 description 5
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 229920001567 vinyl ester resin Polymers 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical group CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 238000000889 atomisation Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 125000001183 hydrocarbyl group Chemical group 0.000 description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 4
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- 238000010626 work up procedure Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 150000002148 esters Chemical group 0.000 description 3
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 3
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 239000003586 protic polar solvent Substances 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- 238000000197 pyrolysis Methods 0.000 description 3
- 229920002545 silicone oil Polymers 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000002562 thickening agent Substances 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- 125000006043 5-hexenyl group Chemical group 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- 238000004566 IR spectroscopy Methods 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000002877 alkyl aryl group Chemical group 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 125000004803 chlorobenzyl group Chemical group 0.000 description 2
- 125000000068 chlorophenyl group Chemical group 0.000 description 2
- 239000008199 coating composition Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- QHBMMABVNRSRHW-UHFFFAOYSA-N dichloro-methyl-octylsilane Chemical compound CCCCCCCC[Si](C)(Cl)Cl QHBMMABVNRSRHW-UHFFFAOYSA-N 0.000 description 2
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 2
- 229940008099 dimethicone Drugs 0.000 description 2
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 239000000706 filtrate Substances 0.000 description 2
- 238000004817 gas chromatography Methods 0.000 description 2
- 125000001188 haloalkyl group Chemical group 0.000 description 2
- 125000003106 haloaryl group Chemical group 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- LIKBJVNGSGBSGK-UHFFFAOYSA-N iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Fe+3].[Fe+3] LIKBJVNGSGBSGK-UHFFFAOYSA-N 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 238000009533 lab test Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- GEYXPJBPASPPLI-UHFFFAOYSA-N manganese(iii) oxide Chemical compound O=[Mn]O[Mn]=O GEYXPJBPASPPLI-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 2
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 229920001290 polyvinyl ester Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 125000005023 xylyl group Chemical group 0.000 description 2
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- BSDNXXNSWCHJST-UHFFFAOYSA-N C(CCCCCCCCCCCCCCCCC)[SiH2]OOC Chemical compound C(CCCCCCCCCCCCCCCCC)[SiH2]OOC BSDNXXNSWCHJST-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical class [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- RQVFGTYFBUVGOP-UHFFFAOYSA-N [acetyloxy(dimethyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(C)OC(C)=O RQVFGTYFBUVGOP-UHFFFAOYSA-N 0.000 description 1
- TVJPBVNWVPUZBM-UHFFFAOYSA-N [diacetyloxy(methyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(OC(C)=O)OC(C)=O TVJPBVNWVPUZBM-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 238000009388 chemical precipitation Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 230000001687 destabilization Effects 0.000 description 1
- 230000000368 destabilizing effect Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 150000001354 dialkyl silanes Chemical class 0.000 description 1
- YLJJAVFOBDSYAN-UHFFFAOYSA-N dichloro-ethenyl-methylsilane Chemical compound C[Si](Cl)(Cl)C=C YLJJAVFOBDSYAN-UHFFFAOYSA-N 0.000 description 1
- GYWBHBXGYTYXRG-UHFFFAOYSA-N dichloro-methyl-octadecylsilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](C)(Cl)Cl GYWBHBXGYTYXRG-UHFFFAOYSA-N 0.000 description 1
- 125000006266 dimethyl hydroxy methyl group Chemical group [H]OC(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 229920006241 epoxy vinyl ester resin Polymers 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 description 1
- CVZTYTBFQPBMFS-UHFFFAOYSA-N ethoxy(prop-2-enyl)silane Chemical compound CCO[SiH2]CC=C CVZTYTBFQPBMFS-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000007792 gaseous phase Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 150000002576 ketones Chemical group 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- 239000012022 methylating agents Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- 239000006199 nebulizer Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011527 polyurethane coating Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000011085 pressure filtration Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001698 pyrogenic effect Effects 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 238000002336 sorption--desorption measurement Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 125000005389 trialkylsiloxy group Chemical group 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/12—Water-insoluble compounds
- C11D3/124—Silicon containing, e.g. silica, silex, quartz or glass beads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
- B01D19/02—Foam dispersion or prevention
- B01D19/04—Foam dispersion or prevention by addition of chemical substances
- B01D19/0404—Foam dispersion or prevention by addition of chemical substances characterised by the nature of the chemical substance
- B01D19/0409—Foam dispersion or prevention by addition of chemical substances characterised by the nature of the chemical substance compounds containing Si-atoms
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B13/00—Oxygen; Ozone; Oxides or hydroxides in general
- C01B13/14—Methods for preparing oxides or hydroxides in general
- C01B13/145—After-treatment of oxides or hydroxides, e.g. pulverising, drying, decreasing the acidity
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
- C09C1/3081—Treatment with organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/12—Treatment with organosilicon compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/43—Thickening agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/67—Particle size smaller than 100 nm
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/32—Materials not provided for elsewhere for absorbing liquids to remove pollution, e.g. oil, gasoline, fat
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Environmental & Geological Engineering (AREA)
- Public Health (AREA)
- Nanotechnology (AREA)
- Toxicology (AREA)
- Dispersion Chemistry (AREA)
- Silicon Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Oxygen, Ozone, And Oxides In General (AREA)
- Developing Agents For Electrophotography (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Paper (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEP4419234.7 | 1994-06-01 | ||
| DE4419234A DE4419234A1 (de) | 1994-06-01 | 1994-06-01 | Verfahren zur Silylierung von anorganischen Oxiden |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1121044A CN1121044A (zh) | 1996-04-24 |
| CN1051747C true CN1051747C (zh) | 2000-04-26 |
Family
ID=6519579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN95106688A Expired - Lifetime CN1051747C (zh) | 1994-06-01 | 1995-06-01 | 二氧化硅的甲硅烷基化方法以及由此制得的产品及其应用 |
Country Status (15)
| Country | Link |
|---|---|
| US (2) | US5686054A (enExample) |
| EP (1) | EP0686676B1 (enExample) |
| JP (1) | JP2918092B2 (enExample) |
| CN (1) | CN1051747C (enExample) |
| AT (1) | ATE169948T1 (enExample) |
| AU (1) | AU669647B2 (enExample) |
| BR (1) | BR9502619A (enExample) |
| CA (1) | CA2149821C (enExample) |
| DE (2) | DE4419234A1 (enExample) |
| ES (1) | ES2121261T3 (enExample) |
| FI (1) | FI116832B (enExample) |
| NO (1) | NO316383B1 (enExample) |
| RU (1) | RU2137712C1 (enExample) |
| TW (1) | TW311904B (enExample) |
| UA (1) | UA43328C2 (enExample) |
Families Citing this family (128)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6191122B1 (en) | 1996-03-29 | 2001-02-20 | DEGUSSA HüLS AKTIENGESELLSCHAFT | Partially hydrophobic precipitated silicas |
| IN191468B (enExample) * | 1996-03-29 | 2003-12-06 | Degussa | |
| DE19742761A1 (de) * | 1997-09-27 | 1999-04-01 | Gerd Dr Rossmy | An ihrer Oberfläche anisotrop verteilte überwiegend hydrophile und überwiegend hydrophobe Domänen aufweisende amphiphile Teilchen oder Moleküle |
| DE19756831A1 (de) | 1997-12-19 | 1999-07-01 | Wacker Chemie Gmbh | Siliciumdioxid, das an seiner Oberfläche teil- oder vollständig silylierte Polykieselsäureketten trägt |
| DE19757210A1 (de) * | 1997-12-22 | 1999-07-01 | Degussa | Hydrophobierte, pyrogen hergestellte Oxide |
| US6159540A (en) * | 1998-01-15 | 2000-12-12 | Cabot Corporation | Polyfunctional organosilane treatment of silica |
| DE69915590T2 (de) * | 1998-01-15 | 2004-08-05 | Cabot Corp., Boston | Verfahren zur herstellung von organisch modifizierter kieselgel |
| WO1999036480A1 (en) * | 1998-01-15 | 1999-07-22 | Cabot Corporation | Method of preparing treated silica |
| US5981131A (en) * | 1998-07-27 | 1999-11-09 | Mitsubishi Chemical America, Inc. | Electrostatic toner composition to enhance copy quality by rejection of ghosting and method of manufacturing same |
| US6383466B1 (en) * | 1998-12-28 | 2002-05-07 | Battelle Memorial Institute | Method of dehydroxylating a hydroxylated material and method of making a mesoporous film |
| US6174926B1 (en) | 1999-01-13 | 2001-01-16 | Cabot Corporation | Method of preparing organically modified silica |
| RU2152967C1 (ru) * | 1999-04-27 | 2000-07-20 | Акционерное общество "Российская инновационная топливно-энергетическая компания" | Способ получения гидрофобного, органофильного кремнезема |
| GB9927431D0 (en) * | 1999-11-22 | 2000-01-19 | Ciba Sc Holding Ag | Casting resin and process for the fabrication of resin molds |
| GB2357497A (en) * | 1999-12-22 | 2001-06-27 | Degussa | Hydrophobic silica |
| DE19963187B4 (de) * | 1999-12-27 | 2006-10-26 | Deutsche Amphibolin-Werke Von Robert Murjahn Gmbh & Co. Kg | Wässriges Beschichtungsmaterial mit schmutz- und wasserabweisender Wirkung, Verfahren zu seiner Herstellung und dessen Verwendung |
| ATE315068T1 (de) * | 2000-02-29 | 2006-02-15 | Feron Aluminium | Verfahren zur herstellung eines schichtwerkstoffs und so erhaltener schichtwerkstoff |
| US20010036437A1 (en) * | 2000-04-03 | 2001-11-01 | Andreas Gutsch | Nanoscale pyrogenic oxides |
| DE50005683D1 (de) | 2000-04-11 | 2004-04-22 | Degussa | Streichfarben für Inkjet-Medien |
| DE10109484A1 (de) * | 2001-02-28 | 2002-09-12 | Degussa | Oberflächenmodifizierte, dotierte, pyrogen hergestellte Oxide |
| US6861115B2 (en) * | 2001-05-18 | 2005-03-01 | Cabot Corporation | Ink jet recording medium comprising amine-treated silica |
| ATE330256T1 (de) * | 2001-07-11 | 2006-07-15 | Seiko Epson Corp | Nichtmagnetischer einkomponententoner, herstellungsmethode und bildaufzeichungsapparat |
| DE10138492A1 (de) * | 2001-08-04 | 2003-02-13 | Degussa | Hydrophobe, nicht getemperte Fällungskieselsäure mit hohem Weißgrad |
| DE10145162A1 (de) * | 2001-09-13 | 2003-04-10 | Wacker Chemie Gmbh | Kieselsäure mit geringem Gehalt an Kieselsäure-Silanolgruppen |
| DE10150274A1 (de) | 2001-10-12 | 2003-04-30 | Wacker Chemie Gmbh | Kieselsäure mit homogener Silyliermittelschicht |
| JP3886363B2 (ja) * | 2001-11-14 | 2007-02-28 | 電気化学工業株式会社 | 疎水性シリカ微粉体の製造方法 |
| DE10211313A1 (de) | 2002-03-14 | 2003-10-02 | Wacker Chemie Gmbh | Mehrfachemulsionen |
| DE10239425A1 (de) * | 2002-08-28 | 2004-03-11 | Degussa Ag | Lackformulierungen |
| DE10260323A1 (de) * | 2002-12-20 | 2004-07-08 | Wacker-Chemie Gmbh | Wasserbenetzbare silylierte Metalloxide |
| EP1597198B1 (de) * | 2003-02-20 | 2009-04-29 | Wacker Chemie AG | Verfahren zur stabilisierung von dispersionen |
| US7241704B1 (en) | 2003-03-31 | 2007-07-10 | Novellus Systems, Inc. | Methods for producing low stress porous low-k dielectric materials using precursors with organic functional groups |
| US7208389B1 (en) | 2003-03-31 | 2007-04-24 | Novellus Systems, Inc. | Method of porogen removal from porous low-k films using UV radiation |
| US7176144B1 (en) | 2003-03-31 | 2007-02-13 | Novellus Systems, Inc. | Plasma detemplating and silanol capping of porous dielectric films |
| US7265061B1 (en) | 2003-05-09 | 2007-09-04 | Novellus Systems, Inc. | Method and apparatus for UV exposure of low dielectric constant materials for porogen removal and improved mechanical properties |
| DE10330020A1 (de) * | 2003-07-03 | 2005-01-20 | Degussa Ag | Hochgefüllte Silan-Zubereitung |
| US7169375B2 (en) * | 2003-08-29 | 2007-01-30 | General Electric Company | Metal oxide nanoparticles, methods of making, and methods of use |
| DE10342828A1 (de) * | 2003-09-17 | 2005-04-14 | Degussa Ag | Hochreines, pyrogen hergestelltes Siliciumdioxid |
| DE10343411B4 (de) * | 2003-09-19 | 2009-07-23 | Gallus Druckmaschinen Gmbh | Rotationsdruckmaschine und Verfahren zum freien Zugänglichmachen eines Druckzylinders oder eines Linearführungs-Zylinders |
| US7390537B1 (en) | 2003-11-20 | 2008-06-24 | Novellus Systems, Inc. | Methods for producing low-k CDO films with low residual stress |
| US20050205102A1 (en) * | 2004-01-30 | 2005-09-22 | Philip Morris Usa Inc. | Method of making surface modified silica gel |
| US7341761B1 (en) | 2004-03-11 | 2008-03-11 | Novellus Systems, Inc. | Methods for producing low-k CDO films |
| US7094713B1 (en) | 2004-03-11 | 2006-08-22 | Novellus Systems, Inc. | Methods for improving the cracking resistance of low-k dielectric materials |
| US7381662B1 (en) | 2004-03-11 | 2008-06-03 | Novellus Systems, Inc. | Methods for improving the cracking resistance of low-k dielectric materials |
| DE102004014704A1 (de) * | 2004-03-25 | 2005-10-13 | Wacker-Chemie Gmbh | Partikelstabilisierte Emulsionen |
| US7781351B1 (en) | 2004-04-07 | 2010-08-24 | Novellus Systems, Inc. | Methods for producing low-k carbon doped oxide films with low residual stress |
| US7253125B1 (en) | 2004-04-16 | 2007-08-07 | Novellus Systems, Inc. | Method to improve mechanical strength of low-k dielectric film using modulated UV exposure |
| US7622400B1 (en) | 2004-05-18 | 2009-11-24 | Novellus Systems, Inc. | Method for improving mechanical properties of low dielectric constant materials |
| DE102004039212A1 (de) * | 2004-08-12 | 2006-03-02 | Wacker-Chemie Gmbh | Rheologiesteuerung von Pickering-Emulsion durch Elektrolyte |
| US7326444B1 (en) | 2004-09-14 | 2008-02-05 | Novellus Systems, Inc. | Methods for improving integration performance of low stress CDO films |
| US9659769B1 (en) | 2004-10-22 | 2017-05-23 | Novellus Systems, Inc. | Tensile dielectric films using UV curing |
| US7790633B1 (en) | 2004-10-26 | 2010-09-07 | Novellus Systems, Inc. | Sequential deposition/anneal film densification method |
| US7695765B1 (en) | 2004-11-12 | 2010-04-13 | Novellus Systems, Inc. | Methods for producing low-stress carbon-doped oxide films with improved integration properties |
| US7166531B1 (en) | 2005-01-31 | 2007-01-23 | Novellus Systems, Inc. | VLSI fabrication processes for introducing pores into dielectric materials |
| US7510982B1 (en) | 2005-01-31 | 2009-03-31 | Novellus Systems, Inc. | Creation of porosity in low-k films by photo-disassociation of imbedded nanoparticles |
| DE102005006870A1 (de) * | 2005-02-14 | 2006-08-24 | Byk-Chemie Gmbh | Oberflächenmodifizierte Nanopartikel, Verfahren zu ihrer Herstellung und ihre Verwendung |
| DE102005007753A1 (de) * | 2005-02-18 | 2006-08-31 | Wacker Chemie Ag | Partikel mit geringer spezifischer Oberfläche und hoher Verdickungswirkung |
| DE102005012409A1 (de) | 2005-03-17 | 2006-09-21 | Wacker Chemie Ag | Wäßrige Dispersionen teilhydrophober Kieselsäuren |
| US8137465B1 (en) | 2005-04-26 | 2012-03-20 | Novellus Systems, Inc. | Single-chamber sequential curing of semiconductor wafers |
| US8980769B1 (en) | 2005-04-26 | 2015-03-17 | Novellus Systems, Inc. | Multi-station sequential curing of dielectric films |
| US8889233B1 (en) | 2005-04-26 | 2014-11-18 | Novellus Systems, Inc. | Method for reducing stress in porous dielectric films |
| US8282768B1 (en) | 2005-04-26 | 2012-10-09 | Novellus Systems, Inc. | Purging of porogen from UV cure chamber |
| US8454750B1 (en) | 2005-04-26 | 2013-06-04 | Novellus Systems, Inc. | Multi-station sequential curing of dielectric films |
| DE102005035442A1 (de) | 2005-07-28 | 2007-05-16 | Wacker Chemie Ag | Stabilisierte HDK-Suspensionen zur Verstärkung von Reaktivharzen |
| US7892985B1 (en) | 2005-11-15 | 2011-02-22 | Novellus Systems, Inc. | Method for porogen removal and mechanical strength enhancement of low-k carbon doped silicon oxide using low thermal budget microwave curing |
| US9308520B2 (en) | 2005-12-16 | 2016-04-12 | Akzo Nobel N.V. | Silica based material |
| CA2633444C (en) * | 2005-12-16 | 2012-07-17 | Akzo Nobel N.V. | Organo-modified silica based material |
| US7381644B1 (en) | 2005-12-23 | 2008-06-03 | Novellus Systems, Inc. | Pulsed PECVD method for modulating hydrogen content in hard mask |
| US8110493B1 (en) | 2005-12-23 | 2012-02-07 | Novellus Systems, Inc. | Pulsed PECVD method for modulating hydrogen content in hard mask |
| WO2007084245A2 (en) * | 2006-01-19 | 2007-07-26 | Dow Corning Corporation | Systems and methods for functionalizing particulates silane-containing materials |
| US7923376B1 (en) | 2006-03-30 | 2011-04-12 | Novellus Systems, Inc. | Method of reducing defects in PECVD TEOS films |
| DE102006014875A1 (de) | 2006-03-30 | 2007-10-04 | Wacker Chemie Ag | Partikel mit strukturierter Oberfläche |
| US7527838B2 (en) * | 2006-04-06 | 2009-05-05 | Momentive Performance Materials Inc. | Architectural unit possessing translucent silicone rubber component |
| DE102006017592A1 (de) * | 2006-04-13 | 2007-10-18 | Wacker Chemie Ag | Rheologiesteuerung stark basischer Flüssigkeiten |
| EP2049603B1 (de) * | 2006-08-06 | 2013-09-04 | Byk-Chemie GmbH | Mit polysiloxan oberflächenmodifizierte partikel und herstellungsverfahren |
| CN101522821B (zh) * | 2006-08-06 | 2013-07-03 | 比克化学股份有限公司 | 用聚硅氧烷表面改性的颗粒和其生产方法 |
| JP5133993B2 (ja) * | 2006-09-01 | 2013-01-30 | キャボット コーポレイション | 表面処理された金属酸化物粒子 |
| US20080070146A1 (en) | 2006-09-15 | 2008-03-20 | Cabot Corporation | Hydrophobic-treated metal oxide |
| US8202502B2 (en) | 2006-09-15 | 2012-06-19 | Cabot Corporation | Method of preparing hydrophobic silica |
| US8435474B2 (en) | 2006-09-15 | 2013-05-07 | Cabot Corporation | Surface-treated metal oxide particles |
| US8455165B2 (en) | 2006-09-15 | 2013-06-04 | Cabot Corporation | Cyclic-treated metal oxide |
| US7851232B2 (en) | 2006-10-30 | 2010-12-14 | Novellus Systems, Inc. | UV treatment for carbon-containing low-k dielectric repair in semiconductor processing |
| US10037905B2 (en) | 2009-11-12 | 2018-07-31 | Novellus Systems, Inc. | UV and reducing treatment for K recovery and surface clean in semiconductor processing |
| US8465991B2 (en) * | 2006-10-30 | 2013-06-18 | Novellus Systems, Inc. | Carbon containing low-k dielectric constant recovery using UV treatment |
| US7906174B1 (en) | 2006-12-07 | 2011-03-15 | Novellus Systems, Inc. | PECVD methods for producing ultra low-k dielectric films using UV treatment |
| US20080145545A1 (en) * | 2006-12-15 | 2008-06-19 | Bret Ja Chisholm | Metal oxide and sulfur-containing coating compositions, methods of use, and articles prepared therefrom |
| DE102006061057A1 (de) * | 2006-12-22 | 2008-06-26 | Wacker Chemie Ag | Organofunktionelle Silikonharzschichten auf Metalloxiden |
| US8242028B1 (en) | 2007-04-03 | 2012-08-14 | Novellus Systems, Inc. | UV treatment of etch stop and hard mask films for selectivity and hermeticity enhancement |
| DE102007024963A1 (de) | 2007-05-30 | 2008-12-04 | Wacker Polymer Systems Gmbh & Co. Kg | Verfahren zur Herstellung von dämmenden Beschichtungen |
| US7622162B1 (en) | 2007-06-07 | 2009-11-24 | Novellus Systems, Inc. | UV treatment of STI films for increasing tensile stress |
| US8501856B2 (en) * | 2007-07-13 | 2013-08-06 | Momentive Performance Materials Inc. | Curable silicon-containing compositions possessing high translucency |
| DE102007033448A1 (de) | 2007-07-18 | 2009-01-22 | Wacker Chemie Ag | Hochdisperse Metalloxide mit einer hohen positiven Oberflächenladung |
| DE102007035955A1 (de) * | 2007-07-30 | 2009-02-05 | Evonik Degussa Gmbh | Oberflächenmodifizierte, pyrogen hergestellte Kieselsäuren |
| DE102007035956A1 (de) * | 2007-07-30 | 2009-02-05 | Evonik Degussa Gmbh | Oberflächenmodifizierte, pyrogen hergestellte Kieselsäuren |
| US8211510B1 (en) | 2007-08-31 | 2012-07-03 | Novellus Systems, Inc. | Cascaded cure approach to fabricate highly tensile silicon nitride films |
| DE102007055879A1 (de) * | 2007-12-19 | 2009-06-25 | Wacker Chemie Ag | Hydrophobierung von Kieselsäuren und oxidierenden Bedingungen |
| DE102008041466A1 (de) | 2008-08-22 | 2010-02-25 | Wacker Chemie Ag | Wäßrige Dispersionen hydrophober Kieselsäuren |
| US9050623B1 (en) | 2008-09-12 | 2015-06-09 | Novellus Systems, Inc. | Progressive UV cure |
| FR2937338B1 (fr) * | 2008-10-17 | 2013-03-22 | Biomerieux Sa | Milieu reactionnel pour la detection et/ou l'identification de bacteries du genre legionella |
| DE102008054592A1 (de) | 2008-12-12 | 2010-06-17 | Wacker Chemie Ag | Pyrogene Kieselsäure hergestellt in einer Produktions-Anlage mit kleiner Kapazität |
| JP5730279B2 (ja) * | 2009-03-18 | 2015-06-03 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | 修飾シリカ粒子およびそれらを含む防塵ポリマー組成物 |
| JP4893836B2 (ja) * | 2010-01-29 | 2012-03-07 | オムロン株式会社 | 一液性エポキシ樹脂組成物およびその利用 |
| FR2979107A1 (fr) * | 2011-08-16 | 2013-02-22 | Bluestar Silicones France | Procede de preparation d'une silice greffee par un compose organosilicie |
| DE102011084048A1 (de) | 2011-10-05 | 2013-04-11 | Wacker Chemie Ag | Polymerpulver enthaltende Baustofftrockenformulierungen |
| DE102012203826A1 (de) | 2012-03-12 | 2013-09-12 | Wacker Chemie Ag | Verfahren zur Oberflächenmodifikation von partikulären Feststoffen |
| WO2013156337A1 (en) * | 2012-04-20 | 2013-10-24 | Evonik Degussa Gmbh | Reinforced epoxy resin adhesive |
| EP2781558B1 (de) | 2013-03-19 | 2016-12-14 | Evonik Degussa GmbH | Modifizierte kieselsäure enthaltende zusammensetzung und diese zusammensetzung enthaltender silikonkautschuk |
| DE102013224210A1 (de) | 2013-11-27 | 2015-05-28 | Wacker Chemie Ag | Silanisierte hochhydrophobe Kieselsäuren |
| DE102013224206A1 (de) * | 2013-11-27 | 2015-05-28 | Wacker Chemie Ag | Oberflächenmodifizierte partikuläre Metalloxide |
| DE102013226494A1 (de) | 2013-12-18 | 2015-06-18 | Wacker Chemie Ag | Modifizierung der Oberflächen von Metalloxiden mittels kettenartiger Strukturen |
| FR3020766B1 (fr) * | 2014-05-07 | 2020-05-08 | Pylote | Particules inorganiques individualisees |
| DE102015214883A1 (de) | 2015-08-04 | 2017-02-09 | Wacker Chemie Ag | Verfahren zur Herstellung von Formkörpern |
| DE102015216505A1 (de) | 2015-08-28 | 2017-03-02 | Wacker Chemie Ag | Silica Formkörper mit geringer thermischer Leitfähigkeit |
| WO2017081028A1 (de) | 2015-11-09 | 2017-05-18 | Wacker Chemie Ag | Siliconzusammensetzungen zur herstellung elastomerer formteile mittels ballistischer verfahren |
| EP3322581B1 (de) | 2015-11-26 | 2019-01-02 | Wacker Chemie AG | Hochviskose siliconzusammensetzungen zur herstellung elastomerer formteile mittels ballistischer generativer verfahren |
| WO2018036640A1 (de) | 2016-08-26 | 2018-03-01 | Wacker Chemie Ag | Verfahren zur herstellung von formkörpern |
| US9847221B1 (en) | 2016-09-29 | 2017-12-19 | Lam Research Corporation | Low temperature formation of high quality silicon oxide films in semiconductor device manufacturing |
| KR102123926B1 (ko) | 2017-02-23 | 2020-06-18 | 와커 헤미 아게 | 왁스로 제조된 지지 재료를 사용하여 성형체를 제조하기 위한 생성 방법 |
| DE102017209782A1 (de) | 2017-06-09 | 2018-12-13 | Evonik Degussa Gmbh | Verfahren zur Wärmedämmung eines evakuierbaren Behälters |
| WO2019170264A1 (de) | 2018-03-05 | 2019-09-12 | Evonik Degussa Gmbh | Verfahren zur herstellung eines aerogelmaterials |
| CN111886124A (zh) | 2018-03-28 | 2020-11-03 | 瓦克化学股份公司 | 用于生产模制体的生成性方法 |
| CN112638490B (zh) | 2018-06-15 | 2023-01-03 | 格雷斯公司 | 消泡剂活性物质、其制造方法和消泡制剂 |
| MX2021000623A (es) | 2018-07-17 | 2021-04-13 | Evonik Operations Gmbh | Composicion de aislamiento termico a base de granulados de silice, procesos para su preparacion y usos de la misma. |
| EP3597615A1 (en) | 2018-07-17 | 2020-01-22 | Evonik Operations GmbH | Granular mixed oxide material and thermal insulating composition on its basis |
| MX2021000626A (es) | 2018-07-18 | 2021-03-25 | Evonik Operations Gmbh | Procedimiento de hidrofobizacion de cuerpos de material de aislamiento conformados a base de silice a presion ambiental. |
| JP6792682B1 (ja) * | 2019-09-02 | 2020-11-25 | 株式会社トクヤマ | 金属酸化物粉末の薬剤処理方法及び製造方法 |
| KR102057036B1 (ko) * | 2019-10-04 | 2019-12-18 | 박희대 | 소수성 나노실리카가 배합된 접착력이 우수한 열가소성 핫멜트 필름 |
| WO2021144170A1 (en) | 2020-01-14 | 2021-07-22 | Evonik Operations Gmbh | Silica-based hydrophobic granular material with an increased polarity |
| PL3877332T3 (pl) | 2020-01-14 | 2022-07-11 | Evonik Operations Gmbh | Krzemionka koloidalna o zmodyfikowanej aktywności powierzchniowej |
| JP7707308B2 (ja) * | 2021-03-05 | 2025-07-14 | ワッカー ケミー アクチエンゲゼルシャフト | シロキサンで官能化されたシリカ |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86106689A (zh) * | 1985-09-25 | 1987-05-27 | 默克专利股份公司 | 球形二氧化硅粒子 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1163784C2 (de) * | 1962-03-30 | 1973-05-03 | Degussa | Verfahren zur Oberflaechenbehandlung von hochdispersen Oxyden |
| US3635743A (en) * | 1969-01-06 | 1972-01-18 | Gen Electric | Reinforcing silica filler |
| GB1348372A (en) * | 1970-02-16 | 1974-03-13 | Ici Ltd | Foam-compatible powder compositions |
| US3963627A (en) * | 1970-02-16 | 1976-06-15 | Imperial Chemical Industries Limited | Surface treatment of particulate solids |
| US3830738A (en) * | 1970-02-16 | 1974-08-20 | Ici Ltd | Surface treatment of particulate solids |
| DE2344388B2 (de) * | 1973-09-03 | 1978-06-22 | Elektroschmelzwerk Kempten Gmbh, 8000 Muenchen | Verfahren zum Herstellen von hydrophobem Siliciumdioxyd |
| US4036933A (en) * | 1974-01-18 | 1977-07-19 | Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler | Highly-active, finely divided super-dry silicon dioxide |
| DE2403783C2 (de) * | 1974-01-26 | 1982-10-21 | Bayer Ag, 5090 Leverkusen | Verfahren zur Herstellung hydrophobierter pyrogener Kieselsäure |
| DE2513608C2 (de) * | 1975-03-27 | 1982-08-05 | Degussa Ag, 6000 Frankfurt | Verfahren zur Hydrophobierung von Kieselsäuren und Silikaten mit Organosilanen |
| DE2620737C2 (de) * | 1976-05-11 | 1982-07-29 | Wacker-Chemie GmbH, 8000 München | Verfahren zum Herstellen von hochdispersem Siliciumdioxid |
| DE2728490C2 (de) * | 1977-06-24 | 1981-09-17 | Degussa Ag, 6000 Frankfurt | Verfahren zur Hydrophobierung von Kieselsäure |
| DE3211431A1 (de) * | 1982-03-27 | 1983-09-29 | Degussa Ag, 6000 Frankfurt | Verfahren zur hydrophobierung von pyrogen hergestelltem siliciumdioxid |
| DE3707226A1 (de) * | 1987-03-06 | 1988-09-15 | Wacker Chemie Gmbh | Verfahren zur herstellung von hochdispersem metalloxid mit ammoniumfunktionellem organopolysiloxan modifizierter oberflaeche als positiv steuerndes ladungsmittel fuer toner |
| US5614177A (en) * | 1987-11-04 | 1997-03-25 | Rhone-Poulenc Chimie | Dentifrice-compatible silica particulates |
| SU1528780A1 (ru) * | 1987-11-11 | 1989-12-15 | Калушское Производственное Объединение "Хлорвинил" Им.60-Летия Великой Октябрьской Революции | Способ получени привитых полиорганосилоксанов на неорганическом наполнителе |
| JPH0657337B2 (ja) * | 1988-11-18 | 1994-08-03 | キヤボツト コーポレーシヨン | 低嵩密度材料連続処理方法 |
| US5153030A (en) * | 1988-11-18 | 1992-10-06 | Cabot Corporation | Continuous treatment process for particulate material |
| DE3913938A1 (de) * | 1989-04-27 | 1990-10-31 | Degussa | Presslinge auf basis von pyrogen hergestelltem titandioxid, verfahren zu ihrer herstellung sowie ihre verwendung |
| DE3919940A1 (de) * | 1989-06-19 | 1990-12-20 | Merck Patent Gmbh | Dispersionen kugelfoermiger anorganischer partikel |
| JPH0616971A (ja) * | 1992-06-30 | 1994-01-25 | Nippon Shirika Kogyo Kk | 塗料の耐アルカリ性を改良する方法 |
| DE4221716A1 (de) * | 1992-07-02 | 1994-01-05 | Wacker Chemie Gmbh | Verfahren zur Hydrophobierung von pyrogen hergestelltem Siliciumdioxid |
| JP3146679B2 (ja) * | 1992-08-31 | 2001-03-19 | 三菱マテリアル株式会社 | 疎水性金属酸化物粉体 |
| JP3318997B2 (ja) * | 1993-02-03 | 2002-08-26 | 三菱マテリアル株式会社 | 疎水性シリカ粉体、その製法および電子写真用現像剤 |
-
1994
- 1994-06-01 DE DE4419234A patent/DE4419234A1/de not_active Withdrawn
-
1995
- 1995-04-18 TW TW084103815A patent/TW311904B/zh active
- 1995-05-16 US US08/442,452 patent/US5686054A/en not_active Expired - Lifetime
- 1995-05-19 CA CA002149821A patent/CA2149821C/en not_active Expired - Fee Related
- 1995-05-30 AU AU20375/95A patent/AU669647B2/en not_active Ceased
- 1995-05-30 FI FI952622A patent/FI116832B/fi active IP Right Grant
- 1995-05-31 NO NO19952158A patent/NO316383B1/no unknown
- 1995-05-31 RU RU95109149A patent/RU2137712C1/ru not_active IP Right Cessation
- 1995-05-31 JP JP7134467A patent/JP2918092B2/ja not_active Expired - Lifetime
- 1995-05-31 BR BR9502619A patent/BR9502619A/pt not_active IP Right Cessation
- 1995-05-31 UA UA95058463A patent/UA43328C2/uk unknown
- 1995-06-01 EP EP95108429A patent/EP0686676B1/de not_active Expired - Lifetime
- 1995-06-01 AT AT95108429T patent/ATE169948T1/de not_active IP Right Cessation
- 1995-06-01 CN CN95106688A patent/CN1051747C/zh not_active Expired - Lifetime
- 1995-06-01 ES ES95108429T patent/ES2121261T3/es not_active Expired - Lifetime
- 1995-06-01 DE DE59503235T patent/DE59503235D1/de not_active Expired - Lifetime
-
1997
- 1997-06-18 US US08/878,338 patent/US5851715A/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86106689A (zh) * | 1985-09-25 | 1987-05-27 | 默克专利股份公司 | 球形二氧化硅粒子 |
Also Published As
| Publication number | Publication date |
|---|---|
| AU669647B2 (en) | 1996-06-13 |
| EP0686676A1 (de) | 1995-12-13 |
| NO316383B1 (no) | 2004-01-19 |
| TW311904B (enExample) | 1997-08-01 |
| JPH07330324A (ja) | 1995-12-19 |
| ATE169948T1 (de) | 1998-09-15 |
| CA2149821C (en) | 2000-05-16 |
| US5686054A (en) | 1997-11-11 |
| US5851715A (en) | 1998-12-22 |
| NO952158D0 (no) | 1995-05-31 |
| RU95109149A (ru) | 1997-06-20 |
| EP0686676B1 (de) | 1998-08-19 |
| CN1121044A (zh) | 1996-04-24 |
| JP2918092B2 (ja) | 1999-07-12 |
| FI116832B (fi) | 2006-03-15 |
| DE59503235D1 (de) | 1998-09-24 |
| ES2121261T3 (es) | 1998-11-16 |
| UA43328C2 (uk) | 2001-12-17 |
| FI952622L (fi) | 1995-12-02 |
| CA2149821A1 (en) | 1995-12-02 |
| RU2137712C1 (ru) | 1999-09-20 |
| NO952158L (no) | 1995-12-04 |
| FI952622A0 (fi) | 1995-05-30 |
| AU2037595A (en) | 1996-01-04 |
| DE4419234A1 (de) | 1995-12-07 |
| BR9502619A (pt) | 1996-01-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1051747C (zh) | 二氧化硅的甲硅烷基化方法以及由此制得的产品及其应用 | |
| KR0159835B1 (ko) | 무기산화물의 실릴화 방법 | |
| CN100337914C (zh) | 含水二氧化硅分散液 | |
| CA2536441C (en) | Surface-modified nanoparticles, their preparation and use | |
| CN102027074B (zh) | 表面改性的二氧化硅颗粒 | |
| JP4982427B2 (ja) | 金属酸化物粒子の表面改質剤及びそれを使用した金属酸化物粒子の表面改質方法 | |
| CN101094888B (zh) | 反应性硅酸悬浮液 | |
| RU2606224C2 (ru) | Кроющая композиция на основе алкида | |
| CN1816590A (zh) | 具有高填料含量的硅烷制剂 | |
| CN105992802B (zh) | 表面改性的颗粒金属氧化物 | |
| KR20170068550A (ko) | 표면 수식 금속 산화물 입자 분산액 및 그 제조 방법, 표면 수식 금속 산화물 입자-실리콘 수지 복합 조성물, 표면 수식 금속 산화물 입자-실리콘 수지 복합체, 광학 부재, 및 발광 장치 | |
| JPH05221640A (ja) | 疎水性酸化チタン微粒子の製造方法 | |
| CN1678695A (zh) | 二氧化硅 | |
| JP5541864B2 (ja) | 変性ナノ粒子 | |
| CN115397775B (zh) | 表面改性二氧化硅粒子的有机溶剂分散溶胶的制造方法 | |
| US20240116764A1 (en) | Fumed silica powder with reduced silanol group density | |
| CN101069133A (zh) | 在宽pH范围内具有永久正表面电荷的金属氧化物 | |
| JP2010215917A (ja) | 耐引掻き性および／または耐摩性被覆のための高充填性ペースト状の珪素有機ナノおよび／またはミクロハイブリッドカプセルを含有する組成物、その製造方法および使用 | |
| JP6564551B1 (ja) | 表面改質チタン酸バリウム粒子材料、チタン酸バリウム含有樹脂組成物、及びチタン酸バリウム分散液 | |
| JP2010043159A (ja) | 酸化チタン分散液の製造方法及び酸化チタン膜 | |
| JPH09176512A (ja) | 環状ポリシロキサンで処理された粒状無機酸化物 | |
| JP4227802B2 (ja) | 光触媒分散トナー | |
| JPH10306234A (ja) | 有機修飾された無機粉末とその製造方法および用途 | |
| KR20160075691A (ko) | 실란화된 고 소수성 규산 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20150601 Granted publication date: 20000426 |