CN104854965B - 器件载体和器件载体装置 - Google Patents

器件载体和器件载体装置 Download PDF

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Publication number
CN104854965B
CN104854965B CN201380067199.3A CN201380067199A CN104854965B CN 104854965 B CN104854965 B CN 104854965B CN 201380067199 A CN201380067199 A CN 201380067199A CN 104854965 B CN104854965 B CN 104854965B
Authority
CN
China
Prior art keywords
functional area
substrate
carrier
carrier body
device carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201380067199.3A
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English (en)
Chinese (zh)
Other versions
CN104854965A (zh
Inventor
T.法伊希廷格
A.佩西纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of CN104854965A publication Critical patent/CN104854965A/zh
Application granted granted Critical
Publication of CN104854965B publication Critical patent/CN104854965B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
CN201380067199.3A 2012-12-21 2013-12-12 器件载体和器件载体装置 Expired - Fee Related CN104854965B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012113014.0 2012-12-21
DE102012113014.0A DE102012113014A1 (de) 2012-12-21 2012-12-21 Bauelementträger und Bauelementträgeranordnung
PCT/EP2013/076426 WO2014095587A1 (de) 2012-12-21 2013-12-12 Bauelementträger und bauelementträgeranordnung

Publications (2)

Publication Number Publication Date
CN104854965A CN104854965A (zh) 2015-08-19
CN104854965B true CN104854965B (zh) 2019-01-01

Family

ID=49759327

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380067199.3A Expired - Fee Related CN104854965B (zh) 2012-12-21 2013-12-12 器件载体和器件载体装置

Country Status (6)

Country Link
US (1) US10021776B2 (enExample)
EP (1) EP2936944B1 (enExample)
JP (2) JP6401710B2 (enExample)
CN (1) CN104854965B (enExample)
DE (1) DE102012113014A1 (enExample)
WO (1) WO2014095587A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2838325B1 (en) 2013-08-16 2021-06-16 NGK Insulators, Ltd. Ceramic circuit board and electronic device
EP2838327B1 (en) 2013-08-16 2018-11-14 NGK Insulators, Ltd. Heat dissipating circuit board and electronic device
DE102016107497B4 (de) * 2016-03-24 2020-01-30 Tdk Electronics Ag Multi-LED System und Verfahren zu seiner Herstellung
DE102018115976A1 (de) 2017-07-10 2019-01-10 Osram Opto Semiconductors Gmbh Verfahren zum Bestücken eines Trägers mit Bauelementen, Pigment für das Bestücken eines Trägers mit einem Bauelement und Verfahren zur Herstellung eines Pigments
DE102017126268A1 (de) * 2017-11-09 2019-05-09 Osram Opto Semiconductors Gmbh Träger, Anordnung mit einem Substrat und einem Träger und Verfahren zum Herstellen eines Trägers

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0475223A2 (en) * 1990-08-31 1992-03-18 Nec Corporation Method of fabricating integrated circuit chip package
US5731067A (en) * 1995-06-07 1998-03-24 Denso Corporation Multi-layered substrate
CN101800201A (zh) * 2009-01-22 2010-08-11 三洋电机株式会社 电子元件用封装体和电子部件

Family Cites Families (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50143073A (enExample) * 1974-05-08 1975-11-18
US4943470A (en) * 1985-01-11 1990-07-24 Ngk Spark Plug Co., Ltd. Ceramic substrate for electrical devices
JPS6449247A (en) * 1987-08-19 1989-02-23 Mitsubishi Electric Corp Semiconductor light emitting device
US4922377A (en) * 1987-11-16 1990-05-01 Hitachi, Ltd. Module and a substrate for the module
US5367765A (en) * 1990-08-31 1994-11-29 Nec Corporation Method of fabricating integrated circuit chip package
US5285352A (en) * 1992-07-15 1994-02-08 Motorola, Inc. Pad array semiconductor device with thermal conductor and process for making the same
JPH0758239A (ja) * 1993-06-30 1995-03-03 Matsushita Electric Works Ltd チップキャリア
JP3603354B2 (ja) 1994-11-21 2004-12-22 株式会社デンソー 混成集積回路装置
JP2950290B2 (ja) * 1997-06-27 1999-09-20 日本電気株式会社 高周波集積回路装置およびその製造方法
EP0926729A3 (en) * 1997-12-10 1999-12-08 Mitsubishi Gas Chemical Company, Inc. Semiconductor plastic package and process for the production thereof
JP3635631B2 (ja) 1999-12-20 2005-04-06 株式会社村田製作所 積層セラミック電子部品の製造方法
JP3551876B2 (ja) 2000-01-12 2004-08-11 株式会社村田製作所 積層セラミック電子部品の製造方法
JP3805266B2 (ja) * 2002-02-27 2006-08-02 Ｕｈｔ株式会社 セラミック積層体の製造装置
GB2376207B (en) 2001-05-25 2005-03-30 Kyocera Corp Method of producing ceramic laminates,laminated electronic parts and method of producing the same
JP3527899B2 (ja) 2001-06-28 2004-05-17 京セラ株式会社 積層型電子部品およびその製法
JP3726035B2 (ja) 2001-05-25 2005-12-14 京セラ株式会社 セラミック積層体の製法
JP4663173B2 (ja) 2001-08-03 2011-03-30 京セラ株式会社 セラミック積層体の製法
JP3784293B2 (ja) 2001-09-27 2006-06-07 京セラ株式会社 セラミック積層体の製法
US7222419B2 (en) * 2001-12-19 2007-05-29 Chung-Shan Institute Of Science And Technology Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package
JP2003197459A (ja) 2001-12-26 2003-07-11 Kyocera Corp 積層型電子部品の製法
JP2003209026A (ja) 2002-01-11 2003-07-25 Kyocera Corp 積層型電子部品の製法
JP2004079862A (ja) 2002-08-21 2004-03-11 Kyocera Corp セラミック積層体の製法
JP2004152908A (ja) 2002-10-29 2004-05-27 Kyocera Corp セラミック積層体の製法
US20040134875A1 (en) * 2002-11-22 2004-07-15 Kyocera Corporation Circuit-parts sheet and method of producing a multi-layer circuit board
JP4044830B2 (ja) 2002-11-22 2008-02-06 京セラ株式会社 複合シートの製造方法、並びに積層部品の製造方法
JP2004253579A (ja) * 2003-02-20 2004-09-09 Matsushita Electric Ind Co Ltd 半導体装置
KR100693969B1 (ko) * 2003-03-10 2007-03-12 도요다 고세이 가부시키가이샤 고체 소자 디바이스 및 그 제조 방법
DE10313891A1 (de) * 2003-03-27 2004-10-14 Epcos Ag Elektrisches Vielschichtbauelement
JP4894260B2 (ja) 2003-03-31 2012-03-14 Ｔｄｋ株式会社 内部電極用ペーストおよび電子部品の製造方法
JP2005101367A (ja) * 2003-09-25 2005-04-14 Kyocera Corp 高周波モジュールおよび通信機器
US7507682B2 (en) 2004-02-24 2009-03-24 Kyocera Corporation Method of manufacturing ceramic paste and ceramic multi-layer wiring substrate utilizing the same
DE102004010001A1 (de) * 2004-03-01 2005-09-22 Epcos Ag Elektrisches Bauelement und schaltungsanordnung mit dem Bauelement
JP2006156447A (ja) * 2004-11-25 2006-06-15 Kyocera Corp 発光素子用配線基板ならびに発光装置およびその製造方法
US20080043444A1 (en) 2004-04-27 2008-02-21 Kyocera Corporation Wiring Board for Light-Emitting Element
US7470926B2 (en) * 2004-09-09 2008-12-30 Toyoda Gosei Co., Ltd Solid-state optical device
JP4625972B2 (ja) * 2004-12-06 2011-02-02 スタンレー電気株式会社 表面実装型ｌｅｄ
KR100596602B1 (ko) 2005-03-30 2006-07-04 삼성전기주식회사 적층 세라믹 콘덴서 및 그 제조 방법
JP4915052B2 (ja) * 2005-04-01 2012-04-11 パナソニック株式会社 Ｌｅｄ部品およびその製造方法
US20070200133A1 (en) 2005-04-01 2007-08-30 Akira Hashimoto Led assembly and manufacturing method
JP4915058B2 (ja) * 2005-06-06 2012-04-11 パナソニック株式会社 Ｌｅｄ部品およびその製造方法
JP2007116217A (ja) 2005-10-18 2007-05-10 Hitachi Ltd ミリ波レーダ装置およびそれを用いたミリ波レーダシステム
JP2007123677A (ja) 2005-10-31 2007-05-17 Matsushita Electric Ind Co Ltd 積層セラミック基板の製造方法
TWI306370B (en) * 2006-03-31 2009-02-11 Advanced Semiconductor Eng Coreless thin substrate with embedded circuits in dielectric layer and method for manufacturing the same
WO2008002268A1 (en) * 2006-06-27 2008-01-03 Agency For Science, Technology And Research Ltcc substrate structure
US7999398B2 (en) * 2006-08-03 2011-08-16 Toyoda Gosei Co., Ltd. Solid state device
JP4979299B2 (ja) * 2006-08-03 2012-07-18 豊田合成株式会社 光学装置及びその製造方法
US7919840B2 (en) * 2007-11-20 2011-04-05 International Business Machines Corporation Integrated non-isolated VRM and microprocessor assembly
US8008682B2 (en) * 2008-04-04 2011-08-30 Hong Kong Applied Science And Technology Research Institute Co. Ltd. Alumina substrate and method of making an alumina substrate
DE102008024480A1 (de) * 2008-05-21 2009-12-03 Epcos Ag Elektrische Bauelementanordnung
DE102008024479A1 (de) * 2008-05-21 2009-12-03 Epcos Ag Elektrische Bauelementanordnung
JP2010073767A (ja) * 2008-09-17 2010-04-02 Jtekt Corp 多層回路基板
JP2012503865A (ja) * 2008-09-28 2012-02-09 張義▲輝▼ 交流駆動型発光ダイオードモジュール
JP5151933B2 (ja) * 2008-11-27 2013-02-27 株式会社Ｉｈｉ 電子機器用放熱器
DE102009010179A1 (de) * 2009-02-23 2010-09-02 Osram Gesellschaft mit beschränkter Haftung Leuchtmodul mit Reflektorwand
US8256685B2 (en) * 2009-06-30 2012-09-04 International Business Machines Corporation Compact millimeter wave packages with integrated antennas
US8933556B2 (en) 2010-01-22 2015-01-13 Ibiden Co., Ltd. Wiring board
TWI501380B (zh) * 2010-01-29 2015-09-21 財團法人國家實驗研究院國家晶片系統設計中心 多基板晶片模組堆疊之三維系統晶片結構
EP2381451B1 (en) 2010-04-22 2018-08-01 Epcos AG Method for producing an electrical multi-layer component and electrical multi-layer component
EP2437581A1 (de) * 2010-09-30 2012-04-04 Odelo GmbH Leuchtdiode auf Keramiksubstratbasis
WO2012067203A1 (ja) 2010-11-19 2012-05-24 旭硝子株式会社 発光素子用基板および発光装置
JP2012204754A (ja) * 2011-03-28 2012-10-22 Toppan Printing Co Ltd Ｌｅｄ発光素子用リードフレーム、およびその製造方法、並びにそれを用いたｌｅｄパッケージ
JP2012204783A (ja) * 2011-03-28 2012-10-22 Stanley Electric Co Ltd 発光ダイオード装置
KR101869552B1 (ko) 2011-05-13 2018-06-21 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 자외선 램프
JP5968674B2 (ja) 2011-05-13 2016-08-10 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及びこれを備える紫外線ランプ
JP6010292B2 (ja) * 2011-11-01 2016-10-19 太陽誘電株式会社 弾性波デバイス
CN103999210B (zh) * 2011-12-22 2016-11-02 京瓷株式会社 布线基板以及电子装置
US20130337648A1 (en) * 2012-06-14 2013-12-19 Bridge Semiconductor Corporation Method of making cavity substrate with built-in stiffener and cavity
DE102012108107A1 (de) * 2012-08-31 2014-03-27 Epcos Ag Leuchtdiodenvorrichtung
KR20140039740A (ko) * 2012-09-25 2014-04-02 엘지이노텍 주식회사 발광소자 패키지
DE102012113018A1 (de) * 2012-12-21 2014-06-26 Epcos Ag Verfahren zur Herstellung eines Mehrschichtträgerkörpers

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0475223A2 (en) * 1990-08-31 1992-03-18 Nec Corporation Method of fabricating integrated circuit chip package
US5731067A (en) * 1995-06-07 1998-03-24 Denso Corporation Multi-layered substrate
CN101800201A (zh) * 2009-01-22 2010-08-11 三洋电机株式会社 电子元件用封装体和电子部件

Also Published As

Publication number Publication date
US20150342027A1 (en) 2015-11-26
WO2014095587A1 (de) 2014-06-26
CN104854965A (zh) 2015-08-19
EP2936944A1 (de) 2015-10-28
DE102012113014A1 (de) 2014-06-26
JP2018139317A (ja) 2018-09-06
JP6401710B2 (ja) 2018-10-10
US10021776B2 (en) 2018-07-10
EP2936944B1 (de) 2019-07-24
JP2016500485A (ja) 2016-01-12

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