CN104854965B - 器件载体和器件载体装置 - Google Patents

器件载体和器件载体装置 Download PDF

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Publication number
CN104854965B
CN104854965B CN201380067199.3A CN201380067199A CN104854965B CN 104854965 B CN104854965 B CN 104854965B CN 201380067199 A CN201380067199 A CN 201380067199A CN 104854965 B CN104854965 B CN 104854965B
Authority
CN
China
Prior art keywords
functional area
substrate
carrier
carrier body
device carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201380067199.3A
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English (en)
Chinese (zh)
Other versions
CN104854965A (zh
Inventor
T.法伊希廷格
A.佩西纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of CN104854965A publication Critical patent/CN104854965A/zh
Application granted granted Critical
Publication of CN104854965B publication Critical patent/CN104854965B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
CN201380067199.3A 2012-12-21 2013-12-12 器件载体和器件载体装置 Expired - Fee Related CN104854965B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012113014.0 2012-12-21
DE102012113014.0A DE102012113014A1 (de) 2012-12-21 2012-12-21 Bauelementträger und Bauelementträgeranordnung
PCT/EP2013/076426 WO2014095587A1 (de) 2012-12-21 2013-12-12 Bauelementträger und bauelementträgeranordnung

Publications (2)

Publication Number Publication Date
CN104854965A CN104854965A (zh) 2015-08-19
CN104854965B true CN104854965B (zh) 2019-01-01

Family

ID=49759327

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380067199.3A Expired - Fee Related CN104854965B (zh) 2012-12-21 2013-12-12 器件载体和器件载体装置

Country Status (6)

Country Link
US (1) US10021776B2 (enExample)
EP (1) EP2936944B1 (enExample)
JP (2) JP6401710B2 (enExample)
CN (1) CN104854965B (enExample)
DE (1) DE102012113014A1 (enExample)
WO (1) WO2014095587A1 (enExample)

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Publication number Priority date Publication date Assignee Title
EP2838325B1 (en) * 2013-08-16 2021-06-16 NGK Insulators, Ltd. Ceramic circuit board and electronic device
EP2838327B1 (en) 2013-08-16 2018-11-14 NGK Insulators, Ltd. Heat dissipating circuit board and electronic device
DE102016107497B4 (de) 2016-03-24 2020-01-30 Tdk Electronics Ag Multi-LED System und Verfahren zu seiner Herstellung
DE102018115976A1 (de) * 2017-07-10 2019-01-10 Osram Opto Semiconductors Gmbh Verfahren zum Bestücken eines Trägers mit Bauelementen, Pigment für das Bestücken eines Trägers mit einem Bauelement und Verfahren zur Herstellung eines Pigments
DE102017126268A1 (de) * 2017-11-09 2019-05-09 Osram Opto Semiconductors Gmbh Träger, Anordnung mit einem Substrat und einem Träger und Verfahren zum Herstellen eines Trägers

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Also Published As

Publication number Publication date
US10021776B2 (en) 2018-07-10
CN104854965A (zh) 2015-08-19
US20150342027A1 (en) 2015-11-26
WO2014095587A1 (de) 2014-06-26
JP2016500485A (ja) 2016-01-12
EP2936944B1 (de) 2019-07-24
EP2936944A1 (de) 2015-10-28
JP2018139317A (ja) 2018-09-06
JP6401710B2 (ja) 2018-10-10
DE102012113014A1 (de) 2014-06-26

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Address after: Munich, Germany

Patentee after: TDK Electronics Co.,Ltd.

Address before: Munich, Germany

Patentee before: EPCOS AG

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190101