JP6401710B2 - コンポーネントキャリア及びコンポーネントキャリアアセンブリ - Google Patents

コンポーネントキャリア及びコンポーネントキャリアアセンブリ Download PDF

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Publication number
JP6401710B2
JP6401710B2 JP2015548377A JP2015548377A JP6401710B2 JP 6401710 B2 JP6401710 B2 JP 6401710B2 JP 2015548377 A JP2015548377 A JP 2015548377A JP 2015548377 A JP2015548377 A JP 2015548377A JP 6401710 B2 JP6401710 B2 JP 6401710B2
Authority
JP
Japan
Prior art keywords
substrate
component carrier
functional
component
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2015548377A
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English (en)
Japanese (ja)
Other versions
JP2016500485A (ja
Inventor
ファイヒティンガー、トーマス
ペチナ、アクセル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of JP2016500485A publication Critical patent/JP2016500485A/ja
Application granted granted Critical
Publication of JP6401710B2 publication Critical patent/JP6401710B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP2015548377A 2012-12-21 2013-12-12 コンポーネントキャリア及びコンポーネントキャリアアセンブリ Expired - Fee Related JP6401710B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012113014.0 2012-12-21
DE102012113014.0A DE102012113014A1 (de) 2012-12-21 2012-12-21 Bauelementträger und Bauelementträgeranordnung
PCT/EP2013/076426 WO2014095587A1 (de) 2012-12-21 2013-12-12 Bauelementträger und bauelementträgeranordnung

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018093237A Division JP2018139317A (ja) 2012-12-21 2018-05-14 コンポーネントキャリア及びコンポーネントキャリアアセンブリ

Publications (2)

Publication Number Publication Date
JP2016500485A JP2016500485A (ja) 2016-01-12
JP6401710B2 true JP6401710B2 (ja) 2018-10-10

Family

ID=49759327

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015548377A Expired - Fee Related JP6401710B2 (ja) 2012-12-21 2013-12-12 コンポーネントキャリア及びコンポーネントキャリアアセンブリ
JP2018093237A Pending JP2018139317A (ja) 2012-12-21 2018-05-14 コンポーネントキャリア及びコンポーネントキャリアアセンブリ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018093237A Pending JP2018139317A (ja) 2012-12-21 2018-05-14 コンポーネントキャリア及びコンポーネントキャリアアセンブリ

Country Status (6)

Country Link
US (1) US10021776B2 (enExample)
EP (1) EP2936944B1 (enExample)
JP (2) JP6401710B2 (enExample)
CN (1) CN104854965B (enExample)
DE (1) DE102012113014A1 (enExample)
WO (1) WO2014095587A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2838325B1 (en) 2013-08-16 2021-06-16 NGK Insulators, Ltd. Ceramic circuit board and electronic device
EP2838327B1 (en) * 2013-08-16 2018-11-14 NGK Insulators, Ltd. Heat dissipating circuit board and electronic device
DE102016107497B4 (de) * 2016-03-24 2020-01-30 Tdk Electronics Ag Multi-LED System und Verfahren zu seiner Herstellung
DE102018115976A1 (de) * 2017-07-10 2019-01-10 Osram Opto Semiconductors Gmbh Verfahren zum Bestücken eines Trägers mit Bauelementen, Pigment für das Bestücken eines Trägers mit einem Bauelement und Verfahren zur Herstellung eines Pigments
DE102017126268A1 (de) * 2017-11-09 2019-05-09 Osram Opto Semiconductors Gmbh Träger, Anordnung mit einem Substrat und einem Träger und Verfahren zum Herstellen eines Trägers

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Also Published As

Publication number Publication date
JP2018139317A (ja) 2018-09-06
DE102012113014A1 (de) 2014-06-26
CN104854965B (zh) 2019-01-01
EP2936944B1 (de) 2019-07-24
EP2936944A1 (de) 2015-10-28
CN104854965A (zh) 2015-08-19
US20150342027A1 (en) 2015-11-26
WO2014095587A1 (de) 2014-06-26
US10021776B2 (en) 2018-07-10
JP2016500485A (ja) 2016-01-12

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