DE102012113014A1 - Bauelementträger und Bauelementträgeranordnung - Google Patents

Bauelementträger und Bauelementträgeranordnung Download PDF

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Publication number
DE102012113014A1
DE102012113014A1 DE102012113014.0A DE102012113014A DE102012113014A1 DE 102012113014 A1 DE102012113014 A1 DE 102012113014A1 DE 102012113014 A DE102012113014 A DE 102012113014A DE 102012113014 A1 DE102012113014 A1 DE 102012113014A1
Authority
DE
Germany
Prior art keywords
substrate
functional area
component carrier
area
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102012113014.0A
Other languages
German (de)
English (en)
Inventor
Thomas Feichtinger
Axel Pecina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Priority to DE102012113014.0A priority Critical patent/DE102012113014A1/de
Priority to CN201380067199.3A priority patent/CN104854965B/zh
Priority to PCT/EP2013/076426 priority patent/WO2014095587A1/de
Priority to JP2015548377A priority patent/JP6401710B2/ja
Priority to EP13803026.7A priority patent/EP2936944B1/de
Priority to US14/654,369 priority patent/US10021776B2/en
Publication of DE102012113014A1 publication Critical patent/DE102012113014A1/de
Priority to JP2018093237A priority patent/JP2018139317A/ja
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
DE102012113014.0A 2012-12-21 2012-12-21 Bauelementträger und Bauelementträgeranordnung Ceased DE102012113014A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE102012113014.0A DE102012113014A1 (de) 2012-12-21 2012-12-21 Bauelementträger und Bauelementträgeranordnung
CN201380067199.3A CN104854965B (zh) 2012-12-21 2013-12-12 器件载体和器件载体装置
PCT/EP2013/076426 WO2014095587A1 (de) 2012-12-21 2013-12-12 Bauelementträger und bauelementträgeranordnung
JP2015548377A JP6401710B2 (ja) 2012-12-21 2013-12-12 コンポーネントキャリア及びコンポーネントキャリアアセンブリ
EP13803026.7A EP2936944B1 (de) 2012-12-21 2013-12-12 Bauelementträger und bauelementträgeranordnung
US14/654,369 US10021776B2 (en) 2012-12-21 2013-12-12 Component carrier and component carrier arrangement
JP2018093237A JP2018139317A (ja) 2012-12-21 2018-05-14 コンポーネントキャリア及びコンポーネントキャリアアセンブリ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102012113014.0A DE102012113014A1 (de) 2012-12-21 2012-12-21 Bauelementträger und Bauelementträgeranordnung

Publications (1)

Publication Number Publication Date
DE102012113014A1 true DE102012113014A1 (de) 2014-06-26

Family

ID=49759327

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102012113014.0A Ceased DE102012113014A1 (de) 2012-12-21 2012-12-21 Bauelementträger und Bauelementträgeranordnung

Country Status (6)

Country Link
US (1) US10021776B2 (enExample)
EP (1) EP2936944B1 (enExample)
JP (2) JP6401710B2 (enExample)
CN (1) CN104854965B (enExample)
DE (1) DE102012113014A1 (enExample)
WO (1) WO2014095587A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017162665A1 (de) * 2016-03-24 2017-09-28 Epcos Ag Multi-led system

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2838325B1 (en) 2013-08-16 2021-06-16 NGK Insulators, Ltd. Ceramic circuit board and electronic device
EP2838327B1 (en) * 2013-08-16 2018-11-14 NGK Insulators, Ltd. Heat dissipating circuit board and electronic device
DE102018115976A1 (de) * 2017-07-10 2019-01-10 Osram Opto Semiconductors Gmbh Verfahren zum Bestücken eines Trägers mit Bauelementen, Pigment für das Bestücken eines Trägers mit einem Bauelement und Verfahren zur Herstellung eines Pigments
DE102017126268A1 (de) * 2017-11-09 2019-05-09 Osram Opto Semiconductors Gmbh Träger, Anordnung mit einem Substrat und einem Träger und Verfahren zum Herstellen eines Trägers

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US7728234B2 (en) * 2006-03-31 2010-06-01 Advanced Semiconductor Engineering, Inc. Coreless thin substrate with embedded circuits in dielectric layers and method for manufacturing the same

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017162665A1 (de) * 2016-03-24 2017-09-28 Epcos Ag Multi-led system
JP2019510377A (ja) * 2016-03-24 2019-04-11 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトＴｄｋ Ｅｌｅｃｔｒｏｎｉｃｓ Ａｇ マルチｌｅｄシステム
US10818641B2 (en) 2016-03-24 2020-10-27 Epcos Ag Multi-LED system

Also Published As

Publication number Publication date
JP2018139317A (ja) 2018-09-06
CN104854965B (zh) 2019-01-01
JP6401710B2 (ja) 2018-10-10
EP2936944B1 (de) 2019-07-24
EP2936944A1 (de) 2015-10-28
CN104854965A (zh) 2015-08-19
US20150342027A1 (en) 2015-11-26
WO2014095587A1 (de) 2014-06-26
US10021776B2 (en) 2018-07-10
JP2016500485A (ja) 2016-01-12

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