JP2012160528A - 半導体パッケージ - Google Patents
半導体パッケージ Download PDFInfo
- Publication number
- JP2012160528A JP2012160528A JP2011018144A JP2011018144A JP2012160528A JP 2012160528 A JP2012160528 A JP 2012160528A JP 2011018144 A JP2011018144 A JP 2011018144A JP 2011018144 A JP2011018144 A JP 2011018144A JP 2012160528 A JP2012160528 A JP 2012160528A
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- JP
- Japan
- Prior art keywords
- base member
- heat
- semiconductor element
- semiconductor package
- conductor wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】半導体パッケージ10は、半導体素子12が配置される、絶縁体からなるベース部材14と、ベース部材14に形成されるとともに半導体素子12の正電極及び負電極にそれぞれ接続される導体配線16A、16Bと、ベース部材14に形成され、半導体素子12の絶縁面に接するとともに正電極側の導体配線16Aと負電極側の導体配線16Bの一方に接続される、ベース部材14より高熱伝導性の部材からなる放熱部材18と、を備える。
【選択図】図2
Description
Claims (2)
- 半導体素子を収容する半導体パッケージであって、
前記半導体素子が配置される、絶縁体からなるベース部材と、
前記ベース部材に形成されるとともに前記半導体素子の正電極及び負電極にそれぞれ接続される導体配線と、
前記ベース部材に形成され、前記半導体素子の絶縁面に接するとともに前記正電極側の導体配線と前記負電極側の導体配線の一方に接続される、前記ベース部材より高熱伝導性の部材からなる放熱部材と、
を備えることを特徴とする、半導体パッケージ。 - 請求項1記載の半導体パッケージであって、
前記放熱部材は、前記半導体素子の絶縁面が配置される前記ベース部材の配置面から前記配置面に対向する底面まで貫通する放熱ビアと、前記放熱ビアが貫通する方向とは垂直に延伸するとともに前記正電極側の導体配線と前記負電極側の導体配線の一方及び前記放熱ビアに接続する放熱プレートとを備えることを特徴とする、半導体パッケージ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011018144A JP2012160528A (ja) | 2011-01-31 | 2011-01-31 | 半導体パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011018144A JP2012160528A (ja) | 2011-01-31 | 2011-01-31 | 半導体パッケージ |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2012160528A true JP2012160528A (ja) | 2012-08-23 |
Family
ID=46840828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011018144A Pending JP2012160528A (ja) | 2011-01-31 | 2011-01-31 | 半導体パッケージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2012160528A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150146365A (ko) * | 2014-06-23 | 2015-12-31 | 삼성전기주식회사 | 열전 모듈을 갖는 기판 및 이를 이용한 반도체 패키지 |
JP2016207839A (ja) * | 2015-04-22 | 2016-12-08 | 日機装株式会社 | 光照射装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006128512A (ja) * | 2004-10-29 | 2006-05-18 | Ngk Spark Plug Co Ltd | 発光素子用セラミック基板 |
JP2008288487A (ja) * | 2007-05-21 | 2008-11-27 | Citizen Electronics Co Ltd | 表面実装型発光ダイオード |
JP2010508655A (ja) * | 2006-10-31 | 2010-03-18 | クリー インコーポレイテッド | Ledおよび関連アセンブリの一体化熱拡散器 |
-
2011
- 2011-01-31 JP JP2011018144A patent/JP2012160528A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006128512A (ja) * | 2004-10-29 | 2006-05-18 | Ngk Spark Plug Co Ltd | 発光素子用セラミック基板 |
JP2010508655A (ja) * | 2006-10-31 | 2010-03-18 | クリー インコーポレイテッド | Ledおよび関連アセンブリの一体化熱拡散器 |
JP2008288487A (ja) * | 2007-05-21 | 2008-11-27 | Citizen Electronics Co Ltd | 表面実装型発光ダイオード |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150146365A (ko) * | 2014-06-23 | 2015-12-31 | 삼성전기주식회사 | 열전 모듈을 갖는 기판 및 이를 이용한 반도체 패키지 |
KR102297283B1 (ko) * | 2014-06-23 | 2021-09-03 | 삼성전기주식회사 | 열전 모듈을 갖는 기판 및 이를 이용한 반도체 패키지 |
JP2016207839A (ja) * | 2015-04-22 | 2016-12-08 | 日機装株式会社 | 光照射装置 |
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